KR20130079371A - 난연성 폴리아미드 수지 조성물 및 그것을 포함하는 물품 - Google Patents

난연성 폴리아미드 수지 조성물 및 그것을 포함하는 물품 Download PDF

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Publication number
KR20130079371A
KR20130079371A KR1020127028206A KR20127028206A KR20130079371A KR 20130079371 A KR20130079371 A KR 20130079371A KR 1020127028206 A KR1020127028206 A KR 1020127028206A KR 20127028206 A KR20127028206 A KR 20127028206A KR 20130079371 A KR20130079371 A KR 20130079371A
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KR
South Korea
Prior art keywords
polyamide
weight percent
resin composition
polyamide resin
macm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127028206A
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English (en)
Korean (ko)
Inventor
웨이 더블유. 장
난지안 선
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20130079371A publication Critical patent/KR20130079371A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34922—Melamine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020127028206A 2010-03-30 2011-03-28 난연성 폴리아미드 수지 조성물 및 그것을 포함하는 물품 Withdrawn KR20130079371A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201010139970.1 2010-03-30
CN2010101399701A CN102206411B (zh) 2010-03-30 2010-03-30 阻燃性聚酰胺树脂组合物及包含该组合物的制品
PCT/US2011/030146 WO2011126794A2 (en) 2010-03-30 2011-03-28 Flame resistant polyamide resin composition and articles comrpising the same

Publications (1)

Publication Number Publication Date
KR20130079371A true KR20130079371A (ko) 2013-07-10

Family

ID=44695489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127028206A Withdrawn KR20130079371A (ko) 2010-03-30 2011-03-28 난연성 폴리아미드 수지 조성물 및 그것을 포함하는 물품

Country Status (6)

Country Link
US (1) US20130203910A1 (https=)
EP (1) EP2553020B1 (https=)
JP (1) JP5819932B2 (https=)
KR (1) KR20130079371A (https=)
CN (1) CN102206411B (https=)
WO (1) WO2011126794A2 (https=)

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WO2013014144A1 (en) 2011-07-27 2013-01-31 Dsm Ip Assets B.V. Flame retardant polyamide composition
JP5902903B2 (ja) * 2011-09-21 2016-04-13 ユニチカ株式会社 ポリアミド樹脂組成物およびそれを成形してなる成形体
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CN103073877B (zh) * 2012-09-17 2015-02-25 天津金发新材料有限公司 一种低吸水率聚酰胺组合物及其制品
FR2999593A1 (fr) * 2012-12-19 2014-06-20 Solvay Specialty Polymers Usa Composants de dispositifs electroniques portables
EP2746340B1 (de) * 2012-12-21 2014-12-24 Ems-Patent Ag Flammgeschützte Polyamid-Formmasse und deren Verwendung
CN104177821B (zh) * 2013-05-27 2017-09-08 杜邦公司 具有改善的抗冲击性的阻燃性聚酰胺组合物
CN104250440A (zh) * 2013-06-28 2014-12-31 杜邦公司 阻燃的聚合物组合物
EP2878630B1 (de) * 2013-11-28 2019-11-20 LANXESS Deutschland GmbH Polyamidzusammensetzungen
JP6595514B2 (ja) * 2014-06-20 2019-10-23 ローディア オペレーションズ ポリアミド成形組成物、それらから得られる成形品、およびそれらの使用
EP3006507B1 (de) * 2014-10-10 2018-12-19 Ems-Patent Ag Verstärkte polyamidformmassen sowie daraus hergestellte spritzgussteile
EP3233406B1 (en) 2014-12-17 2019-08-07 DSM IP Assets B.V. Plastic material for industrial former
EP3135730A1 (de) * 2015-08-27 2017-03-01 Basf Se Polyamide mit niedrigem kristallisationspunkt und geringer schwindung
JP6134035B2 (ja) * 2016-05-11 2017-05-24 エムス−パテント アクチエンゲゼルシャフト ポリアミド成形材料、それらの使用、およびそれらから製造された成形品
CN106046781B (zh) * 2016-07-12 2019-01-04 江门市德众泰工程塑胶科技有限公司 用于电镀处理的芳香族聚酰胺复合物及其制备方法
US10233309B2 (en) * 2016-08-08 2019-03-19 Innovative Plastics And Molding Inc. Cellulose fiber thermoplastic composition having a cosmetic appearance and molding thereof
CN106366657B (zh) * 2016-10-12 2019-06-14 广东中塑新材料有限公司 高耐热高流动尼龙复合材料及其制备方法
CN106633844B (zh) * 2016-10-12 2019-01-18 广东中塑新材料有限公司 高耐热高流动共聚酰胺6t复合材料及其制备方法
CN106519664B (zh) * 2016-10-12 2019-04-23 广东中塑新材料有限公司 高耐热高流动共聚酰胺复合材料及其制备方法
CN106519652B (zh) * 2016-10-12 2019-06-14 广东中塑新材料有限公司 高耐热高流动聚酰胺复合材料及其制备方法
CN108003548A (zh) * 2016-10-27 2018-05-08 金发科技股份有限公司 聚酰胺作为流动促进剂在提高增强芳族乙烯基共聚物组合物光泽度的用途
CN106566159A (zh) * 2016-10-27 2017-04-19 沈丽媛 聚酰胺作为流动促进剂在提高增强asa组合物光泽度的用途
CN106479174B (zh) * 2016-11-08 2019-04-23 广东中塑新材料有限公司 阻燃增强共聚酰胺6t复合材料及其制备方法
CN106519665B (zh) * 2016-11-08 2019-04-23 广东中塑新材料有限公司 阻燃增强聚酰胺复合材料及其制备方法
CN106519654B (zh) * 2016-11-08 2019-06-14 广东中塑新材料有限公司 无卤阻燃增强聚酰胺复合材料及其制备方法
CN106497043B (zh) * 2016-11-08 2019-04-23 广东中塑新材料有限公司 阻燃增强共聚酰胺复合材料及其制备方法
CN106633853B (zh) * 2016-12-05 2019-03-22 广东中塑新材料有限公司 激光直接成型共聚酰胺复合材料及其制备方法
CN106633858B (zh) * 2017-01-10 2019-01-04 江门市德众泰工程塑胶科技有限公司 一种聚酰胺树脂复合材料及其制备方法和应用
EP3604447B1 (en) * 2017-03-30 2023-08-16 Asahi Kasei Kabushiki Kaisha Polyamide composition and molded article
JP7055365B2 (ja) * 2017-06-09 2022-04-18 ユニチカ株式会社 ポリアミド樹脂組成物およびそれを成形してなる成形体
JP7280146B2 (ja) * 2018-09-28 2023-05-23 旭化成株式会社 ポリアミド組成物及びその製造方法、並びに、成形品
WO2020184270A1 (ja) * 2019-03-12 2020-09-17 三井化学株式会社 難燃性ポリアミド樹脂組成物
KR102081154B1 (ko) * 2019-09-06 2020-02-25 한국엔지니어링플라스틱 주식회사 반도체 트레이용 폴리아미드 수지 조성물
US20210277196A1 (en) * 2020-03-05 2021-09-09 Solvay Specialty Polymers Usa, Llc Thermoplastic composites and corresponding fabrication methods and articles
WO2021181362A1 (en) * 2020-03-13 2021-09-16 Inv Nylon Chemicals Americas, Llc Thermoplastic resins for network applications
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EP4204207A1 (en) 2020-08-26 2023-07-05 Basf Se Polyamide filaments for use in 3d printing
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CN118006109B (zh) * 2023-12-25 2025-10-21 金发科技股份有限公司 一种聚苯醚树脂组合物及其制备方法和应用
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160054310A (ko) * 2014-11-06 2016-05-16 삼성에스디아이 주식회사 고강성 난연 수지 조성물

Also Published As

Publication number Publication date
JP5819932B2 (ja) 2015-11-24
US20130203910A1 (en) 2013-08-08
WO2011126794A3 (en) 2012-02-02
JP2013523958A (ja) 2013-06-17
EP2553020A2 (en) 2013-02-06
EP2553020B1 (en) 2014-10-22
EP2553020A4 (en) 2013-10-09
CN102206411A (zh) 2011-10-05
CN102206411B (zh) 2013-08-21
WO2011126794A2 (en) 2011-10-13
WO2011126794A4 (en) 2012-03-22

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PA0105 International application

Patent event date: 20121029

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid