KR20130036879A - Apparatus for peeling protecting film of substrate, and method for peeling protecting film of substrate - Google Patents

Abstract

PURPOSE: A film separating device for a substrate and a film separating method for the same are provided to secure the reliability of a removing process by efficiently and accurately removing a protective film. CONSTITUTION: A clamping unit(110) fixes an end in which a protection film is unattached. An adsorption rotary unit(120) vacuum-absorbs the end of the protective film for fixing. The protective film is positioned at the end side of a substrate. A movable separating unit(130) fixes the end with the rotation of the rotary unit. The movable separating unit moves to the opposite side of the end for removing the protective film.

Description

A film peeling apparatus of a board | substrate and a film peeling method of a board | substrate {APPARATUS FOR PEELING PROTECTING FILM OF SUBSTRATE, AND METHOD FOR PEELING PROTECTING FILM OF SUBSTRATE}

The present invention relates to a film peeling apparatus of a substrate and a film peeling method of a substrate, and more particularly, to remove the protective film adhered to both sides of the substrate accurately and efficiently to reduce the reliability and manufacturing cost and to form a thin plate thickness It is related with the film peeling apparatus of the board | substrate applicable to the protective film peeling process of the board | substrate of this, and the film peeling method of a board | substrate.

In general, a printed circuit board (PCB) prints the wiring of a circuit required for a thin plate made of epoxy or phenol resin with copper foil, connects each electronic device, and applies power. It means a substrate that can operate the circuit. The design of the printed circuit board is directly related to the operation, performance, lifespan, and reliability of the product, and thus plays a very important role in the manufacture of electronic products.

In particular, technological developments are being made radically in many fields of portable electronic products, and as the trend changes, the demand for multilayer substrates increases, and there is a demand for high integration and ultra-thin substrates.

In the manufacturing process of the printed circuit board (PCB), the insulating layer is laminated to form the outer layer circuit after the inner layer circuit is formed in the manufacturing process, and after laminating the insulating layer, the laminated protective film is removed to protect the insulating layer attached to the upper and lower surfaces. do.

However, in the related art, since the operator directly peels the protective film from the printed circuit board in order to peel the protective film attached to the upper and lower surfaces of the printed circuit board (PCB) to protect the substrate surface, the efficiency of the work is reduced and the work efficiency is reduced. There is a problem that it was not effective. In particular, the flexible printed circuit board (FPCB) among the printed circuit board (PCB) has a thin material and is flexible, so that when the protective film is attached to the surface of the substrate, the protective film is firmly attached when it is made by hand. It is difficult to cause damage such as folding or scratching of the flexible printed circuit board (FPCB).

On the other hand, as a technique for removing a printed circuit board protective film, a technique using an adhesive tape has been provided, but in the case of the protective film removing device according to the prior art in the longitudinal direction before and after removing the protective film from the printed circuit board Since the adhesive tape is formed by attaching and removing the adhesive tape, a large amount of tape is consumed because the adhesive tape attached to the printed circuit board protection film must be attached in the longitudinal direction before and after. Therefore, there is a problem that the maintenance and repair of the equipment is difficult due to the problem that the consumption of the adhesive tape is very large.

Another problem of the printed circuit board protective film removing device using the adhesive tape according to the prior art as described above is that when the protective film is removed from the printed circuit board, a wider range of the tip portion of the protective film is peeled off from the printed circuit board tip. There is a problem that the error occurrence rate due to the removal of the protective film is high.

Referring to Figures 1 and 2 attached to the film peeling apparatus of the conventional substrate for automatically removing the printed circuit board protective film in order to improve the problems as described above are as follows.

1 and 2 is a schematic view showing a protective film peeling apparatus of a substrate according to the prior art, Figure 1 is a view showing a process of clamping the end of the protective film, Figure 2 is pulling the protective film to remove Figure showing the process.

1 and 2, a protective film peeling apparatus of a conventional printed circuit board includes a clamp 10 for fixing an upper end portion of a substrate 1, such as a printed circuit board, and a substrate (not shown) by the clamp 10. 1 and 2, the front and rear cylinders 20 for peeling the upper end of the protective film 2 by attaching and pulling the upper ends of the protective film 2 attached to both sides of the substrate 1 in a fixed state, The stripper 30 which picks up the upper end of the protective film 2 peeled from the substrate 1 by a cylinder 20 in a tongs manner and moves downward to peel the protective film 2 from the substrate 1. It may be configured to include).

Here, the stripper 30 may be provided on the movement guide shaft 40 to be rotatable and up and down reciprocating movement.

However, the protective film peeling apparatus of the conventional substrate configured as described above, when the substrate 1 to be peeled off the protective film 2 is a thin plate, the stripper (30) when the shift or bending to the left or right occurs There is a problem that can not be applied to the peeling of the thin plate-like substrate with the thickness of the substrate 1 together with the upper end of the protective film (2). Substantially less than 0.1T thick substrate has a problem that it is difficult to remove the protective film using a protective film peeling device of the conventional substrate.

In addition, the protective film peeling apparatus of the conventional substrate, the stripper 30 of the substrate 1 when removing the protective film 2 of the substrate 1 while moving downward along the movement guide shaft 40 There was a problem in that the accuracy and reliability of the protective film removal process is inferior because it is difficult to provide an equal peel force on both sides, and accordingly, there is a problem in that the cost required for the process is increased.

The present invention has been made to solve the above problems, the present invention is to remove the protective film attached to both sides of the substrate accurately and efficiently to reduce the reliability and manufacturing cost of the substrate film peeling apparatus and the film of the substrate It aims at providing the peeling method.

Another object of the present invention is to provide a film peeling apparatus for a substrate and a film peeling method for a substrate that can be applied to a thin plate-like substrate.

In order to achieve the above object, the present invention provides a film peeling apparatus for removing a protective film provided on a substrate from the substrate, the clamping unit for fixing the end of the substrate is not attached to the protective film; An adsorption rotating unit which vacuum-adsorbs and fixes an end portion of the protective film positioned at an end side of the substrate; And a moving peeling unit which rotates the adsorption rotating unit to move to the opposite side of the end of the substrate while fixing the end of the protective film to remove the protective film.

The clamping unit is; It may include a clamp body which is moved from the outside of the end of the substrate to the inside, and a clamping portion protruding from the clamp body to the end of the substrate a plurality of sides and tightly fixed to both sides of the end of the substrate.

The adsorption rotating unit is; It may be configured to include a vacuum pipe having a suction unit for suctioning the end of the protective film, and a drive member for rotating the vacuum pipe.

In this case, the driving member may be configured to include a driving motor connected to the vacuum pipe and the power transmission member to transmit rotational force to the vacuum pipe.

In addition, the surface of the vacuum pipe may be coated with silicon.

The moving peeling unit may include a moving plate provided with the adsorption rotating unit and moved to the opposite side of the end of the substrate in a state in which the adsorption rotating unit fixes the end of the protective film.

On the other hand, the film peeling apparatus of the substrate; When the adsorption rotation unit is rotated to expose the inner surface of the end of the protective film, it may be configured to further include a holding unit for holding the exposed inner surface of the protective film.

The film peeling apparatus of the substrate may further include a dust collecting unit in which the protective film removed from the substrate is collected.

As another aspect for achieving the above object, the present invention is a film peeling method for removing a protective film provided on a substrate from the substrate, the fixing of the end of the substrate is not attached to the protective film by a clamping unit step; Vacuum suction and fixing an end of the protective film positioned at an end side of the substrate by an adsorption rotating unit; Rotating the adsorption rotating unit to expose an end inner surface of the protective film; And removing the protective film from the substrate by moving the moving peeling unit to an opposite side of the end of the substrate.

The film peeling method of the substrate; It is performed after the step of exposing the end inner surface of the protective film, it may be configured to further comprise the step of holding the exposed end of the protective film.

The film peeling method of the substrate; It is performed after the step of removing the protective film, it may be configured to further comprise the step of collecting the removed protective film in the dust collecting unit.

As explained above, according to the film peeling apparatus of the board | substrate and the film peeling method of the board | substrate which concerns on this invention, by providing the peeling force of a protective film evenly on both sides of a board | substrate in the state which fixed the edge of a protective film by vacuum-suctioning, By removing the protective film attached to both sides of the substrate accurately and efficiently, there is an advantage that can reduce the reliability and manufacturing cost of the protective film removal process of the substrate.

In addition, according to the film peeling apparatus of the substrate and the film peeling method of the substrate according to the present invention, by providing the peeling force evenly to the protective film without bias from both sides of the substrate, the protection of the thin plate-like substrate having a thickness of 0.1T or less There is an advantage applicable to a film peeling process.

1 and 2 is a schematic view showing a protective film peeling apparatus of a substrate according to the prior art,
1 is a view showing a process of clamping the end of the protective film,
2 is a view showing a process of pulling out and removing the protective film.
3 to 5 is a schematic view showing a film peeling apparatus of a substrate according to the present invention,
3 is a view showing a process of fixing the end of the protective film by the adsorption fixing unit,
4 is a view showing a process of exposing the end of the protective film by rotating the adsorption fixing unit in a state where the end of the substrate is fixed by the clamping unit,
FIG. 5 is a view illustrating a process of removing a protective film from a substrate by moving a moving peeling unit while fixing an end portion of the protective film exposed by the holding unit.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The embodiments may be provided to make the disclosure of the present invention complete, and to fully inform the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout the specification.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is to be understood that the terms 'comprise', and / or 'comprising' as used herein may be used to refer to the presence or absence of one or more other components, steps, operations, and / Or additions.

In addition, the embodiments described herein will be described with reference to cross-sectional views and / or plan views, which are ideal illustrations of the present invention. In the drawings, the thicknesses of the films and regions are exaggerated for an effective description of the technical content. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include variations in forms generated by the manufacturing process. For example, the etched area shown at right angles may be rounded or may have a shape with a certain curvature. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, a preferred embodiment of the film peeling apparatus and the film peeling method of the substrate according to the present invention with reference to the accompanying Figures 3 to 5 will be described in detail.

3 to 5 is a schematic view showing a film peeling apparatus of a substrate according to the present invention, Figure 3 is a view showing a process of fixing the end of the protective film with an adsorption fixing unit, Figure 4 is a clamping unit substrate FIG. 5 is a view illustrating a process of exposing an end portion of a protective film by rotating an adsorption fixing unit while fixing an end portion of the protective film. A diagram illustrating a process of removing a film.

First, referring to FIGS. 3 to 5, one embodiment of the film peeling apparatus of the substrate according to the present invention removes the protective film 102 provided on the substrate 101 such as a printed circuit board from the substrate 101. As a film peeling apparatus of the substrate for the purpose, it can be configured to include a clamping unit 110, a suction rotating unit 120, and a moving peeling unit 130.

The clamping unit 110 may be provided to be movable upward and downward from an upper end of the substrate 101, and may fix an end portion of the substrate 101 to which the protection film 102 is not attached.

Here, the clamping unit 110, the clamp body 111 is moved from the outside of the upper end of the substrate 101 to the inside, and the plurality of protruding from the clamp body 111 toward the upper end of the substrate 101 It may be configured to include a clamping portion 112 in close contact with both sides of the upper end of the substrate 101 to secure the upper end of the substrate 101.

That is, an insulating layer 103 such as ABF may be interposed between the substrate 101 and the protective film 102. In this case, the insulating layer 103 is deleted at an upper end of the substrate 101. The clamping unit 112 of the clamping unit 110 enters between the upper end of the substrate 101 and the upper end of the protective film 102 where the insulating layer 103 is removed, and thus the upper end of the substrate 101. Can be clamped

Accordingly, the clamping unit 110 may clamp and fix only the upper end of the substrate 101 from which the insulating layer 103 has been removed without interfering with the protective film 102.

The adsorption rotation unit 120 is provided to be movable from both sides of the substrate 101 to the left and right, and can be fixed by vacuum suction the upper end of the protective film 102 attached to both sides of the substrate 101 have.

Here, the adsorption rotation unit 120, the vacuum pipe 121 having a suction portion 121a for vacuum suction of the upper end of the protective film 102, and the drive member for rotating the vacuum pipe 121 And 122.

In this case, the driving member 122 may be configured to include a driving motor connected to the vacuum pipe 121 and a power transmission member 123 such as a belt or a chain to transmit rotational force to the vacuum pipe 121. Can be.

In addition, the surface of the vacuum pipe 121 may be provided with a coating layer 121b coated with silicon, so that the upper end of the protective film 102 on the surface of the vacuum pipe 121, the coating layer 121b Through the vacuum pipe 121 can be more closely contacted and fixed through.

The moving peeling unit 130 may be mounted with the adsorption rotating unit 120, and may be configured as a moving plate provided to reciprocate up and down on both sides of the substrate 101.

That is, the moving peeling unit 130 may be configured in the form of a moving plate provided to reciprocally move left and right or up and down on both sides of the substrate 101 in the state where the adsorption rotation unit 120 is mounted.

Accordingly, the moving peeling unit 130 may be moved left and right at the upper end of the substrate 101 in order to suck the upper end of the protective film 102, the adsorption rotation unit 120, the adsorption rotation The unit 120 vacuum-adsorbs the upper end of the protective film 102 and rotates the predetermined angle to fix the upper end of the protective film 102 to the opposite side of the upper end of the substrate 101 together with the adsorption rotating unit 120. That is, the protective film 102 may be removed by moving downward.

Here, the film peeling apparatus of the substrate according to the present embodiment, when the adsorption rotation unit 120 rotates to expose the inner end surface of the protective film 102, the exposed inner surface of the protective film 102 It may be configured to further include a holding unit 140 for holding.

In this case, the holding unit 140 may be configured as a cylinder having a moving rod movable upward and downward from the suction rotating unit 120, that is, the vacuum pipe 121.

Therefore, the vacuum pipe 121 is in close contact with the inner surface of the protective film 102 exposed by the vacuum adsorption and rotation can improve the fixing force of the protective film 102, accordingly the vacuum adsorption unit ( When the protective film 102 is peeled off while the 120 and the mobile peeling unit 130 move downward from both sides of the substrate 101, the protective film 102 is more accurate from the substrate 101. Allow it to peel evenly.

On the other hand, although not shown in detail, the film peeling apparatus of the substrate according to the present embodiment, the dust collecting unit which is provided below the substrate 101, the protective film 102 is removed from the substrate 101 is collected It may be configured to include, the dust collecting unit may be made of a tray that is open at the top of the protective film 102 is accommodated therein.

Next, the protective film peeling process by the film peeling apparatus of the substrate according to the present embodiment configured as described above in more detail as follows.

First, as shown in FIG. 3, the upper end portion of the substrate 101 that is not attached to the protective film 102 in the state in which the upper end portion of the protective film 102 is vacuum-adsorbed by the adsorption rotation unit 120. It is fixed by the clamping unit (110).

Of course, after fixing the upper end of the substrate 101 with the clamping unit 110, the upper end of the protective film 102 by the suction rotation unit 120 may be vacuum suction.

In addition, the protection film is rotated by rotating the vacuum pipe 121 by the driving force of the adsorption rotation unit 120, that is, the driving member 122 in a state where the upper end of the substrate 101 is fixed by the clamping unit 110. The inner side of the upper end of 102 is exposed.

Next, the inner surface of the upper end of the protective film 102 exposed by the vacuum pipe 121 by the holding unit 140 is fixed together with the vacuum pipe 121.

Thereafter, the protective film 102 is removed from the substrate 101 while moving the moving peeling unit 130 downward.

In this case, the protective film 102 removed from the substrate 101 may be collected in the dust collecting unit installed below the substrate 101.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other states known in the art, and the specific fields of application and uses of the invention are required. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

101: substrate 102: protective film
103: insulating layer 110: clamping unit
111: clamp body 112: clamping portion
120: adsorption rotary unit 121: vacuum pipe
121a: suction part 121b: coating layer
122: drive member 123: power transmission member
130: moving peeling unit 140: holding unit

Claims (11)

A film peeling apparatus for removing a protective film provided on a substrate from the substrate,
A clamping unit to fix an end portion of the substrate to which the protective film is not attached;
An adsorption rotating unit which vacuum-adsorbs and fixes an end portion of the protective film positioned at an end side of the substrate; And
A moving peeling unit which rotates the adsorption rotating unit to move to the opposite side of the end of the substrate while fixing the end of the protective film to remove the protective film;
The film peeling apparatus of the board | substrate containing.
The method of claim 1,
The clamping unit is;
And a clamping body moving outwardly from an end portion of the substrate to an inner side, and a clamping portion protruding from the clamp body toward the end portion of the substrate to be fixed to both sides of the end portion of the substrate.
The method of claim 1,
The adsorption rotating unit is;
The film peeling apparatus of the board | substrate comprised with the vacuum pipe which has the suction part which vacuum-sucks the edge part of the said protective film, and the drive member for rotating the said vacuum pipe.
The method of claim 3,
The driving member, the film peeling apparatus of the substrate comprising a drive motor connected to the vacuum pipe and the power transmission member for transmitting a rotational force to the vacuum pipe.
The method of claim 3,
The film peeling apparatus of the board | substrate by which the surface of the said vacuum pipe is coated with silicon.
The method of claim 1,
And the moving peeling unit is provided with the suction rotating unit and includes a moving plate which is moved to an opposite side of the substrate in a state in which the suction rotating unit fixes the end of the protective film.
The method according to claim 6,
And a holding unit for holding the exposed inner side of the protective film when the suction rotating unit rotates to expose the inner side of the end of the protective film.
The method of claim 1,
And a dust collecting unit in which the protective film removed from the substrate is collected.
As a film peeling method for removing a protective film provided on a substrate from the substrate,
Fixing an end of the substrate to which the protective film is not attached by a clamping unit;
Vacuum suction and fixing an end of the protective film positioned at an end side of the substrate by an adsorption rotating unit;
Rotating the adsorption rotating unit to expose an end inner surface of the protective film; And
Removing the protective film from the substrate by moving the moving peeling unit opposite the end of the substrate;
The film peeling method of the board | substrate containing.
10. The method of claim 9,
The film peeling method of the substrate which is performed after exposing the inner side of the end of the protective film, and further comprising holding the exposed end of the protective film.
10. The method of claim 9,
After the step of removing the protective film, the film peeling method of the substrate further comprises the step of collecting the removed protective film in the dust collecting unit.

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