KR20130017568A

KR20130017568A - Led lamp having improved heat dissipation characteristics and method thereof

Info

Publication number: KR20130017568A
Application number: KR1020110080069A
Authority: KR
Inventors: 김인겸; 강원구; 이남준; 김진수
Original assignee: 주식회사 캠프넷
Priority date: 2011-08-11
Filing date: 2011-08-11
Publication date: 2013-02-20

Abstract

The present invention includes a heat sink, a thermally conductive tape mounted on the heat sink, a thermally conductive tape, a PCB substrate having a plurality of perforated holes formed therein, and an LED inserted into the hole and soldered to the back surface of the PCB substrate to be bonded to the PCB substrate. The present invention relates to a piezoelectric generator.

Description

LED lighting with improved heat dissipation and its method {LED LAMP HAVING IMPROVED HEAT DISSIPATION CHARACTERISTICS AND METHOD THEREOF}

The present invention relates to an LED lighting and a method for improving heat dissipation, and more particularly, when the LED and the PCB board are bonded, a soldered part where heat is generated most intensively is irradiated with light from the LED. It is formed on the back side of the PCB substrate in the opposite direction to the part, so that the heat generated by the irradiation of light is easily transferred to the heat sink coupled to the rear side, the heat dissipation characteristics improved LED lighting and method for effective heat dissipation It is about.

LED lighting consists of a combination of PCB and LED, in particular the heat generated in the soldered part for bonding the PCB and LED.

Conventional LED lighting is generally formed on the front surface where the soldered part is irradiated with light when the LED and the PCB board are combined, at this time, the light is installed in the state that the heat generated while the light is irradiated enough heat is not achieved As it is delivered to the space there is a problem that can make people who are active in the space feel uncomfortable, and there is a problem that the lighting device itself can also cause disturbances due to heat.

With respect to the above-described conventional problem, with reference to Figures 1 and 2 are shown an exploded perspective view and a cross-sectional view of a conventional LED lighting in more detail.

As shown in FIG. 1 and FIG. 2, the LED lighting includes a heat sink 10, a thermal conductive tape 20 mounted on the heat sink 10, a PCB substrate 30 mounted on the thermal conductive tape 20, and It is composed of an LED (40) mounted on the PCB board (30).

LED lighting, the above-described components are implemented by the Surface Mount Technology (SMT) method is applied to the power to generate light, the heat generated at this time is the PCB substrate 30 and the thermal conductive tape 20 The heat transfer plate 10 is configured to transmit heat to the heat sink 10.

However, as the soldered portion formed for coupling the LED 40 and the PCB substrate 30 is formed on the front surface to which light is irradiated, the PCB substrate 30 made of a material having no thermal conductivity is removed from the soldered portion. The heat generated intensively acts as an obstacle in the process of transferring to the heat sink 10, there is a problem that can not expect sufficient heat dissipation effect from the LED light.

In order to solve the above problems, other conventional LED lighting is used a metal PCB, a ceramic PCB, etc. excellent in heat transfer, but there is a problem that the price of the metal PCB and the ceramic PCB is not difficult to generate a significant manufacturing cost.

An object of the present invention is to solve the above-mentioned problems, the soldered part of the heat is most concentrated when the LED and the PCB board is combined, the direction of the PCB substrate in the opposite direction to the light irradiation portion of the LED It is to be provided on the back, and the heat generated by the irradiation of light is easily transmitted to the heat sink coupled to the rear surface to provide a heat dissipation is improved LED lighting and its method for effective heat dissipation.

LED lighting having improved heat dissipation characteristics according to the present invention for achieving the above object is mounted on a heat sink, a heat conductive tape mounted on the heat sink, a heat conductive tape, a PCB substrate having a plurality of perforated holes, and inserted into the hole It characterized in that it comprises an LED that is soldered on the back of the PCB substrate and coupled to the PCB substrate,

LED lighting method improved heat dissipation characteristics according to the present invention comprises the steps of forming a pattern on the outer peripheral surface of the heat sink, mounting a thermal conductive tape on the heat sink; Forming perforated holes in the PCB substrate, and forming electrodes on the back side of the PCB substrate; And inserting the LED into the hole and soldering the terminal of the LED to the electrode of the PCB substrate to mount the PCB substrate 300 to which the LED is coupled onto a thermally conductive tape.

LED lighting and improved method of the heat dissipation characteristics according to the present invention, when the combination of the LED and the PCB substrate, forming a hole in the PCB substrate, by inserting the LED into the formed hole, the most concentrated heat is soldered (soldering) By forming the portion on the back of the PCB substrate, the heat generated while the light is easily transmitted to the heat sink has an effect that can significantly improve the heat dissipation effect.

1 is an exploded perspective view of a conventional LED light,
2 is a cross-sectional view and a plan view of a conventional LED light,
3 is an exploded perspective view of an LED light having improved heat radiation characteristics according to the present invention;
Figure 4 is a view showing the back of the PCB substrate of the LED light improved heat radiation characteristics according to the present invention,
5 is a cross-sectional view and a plan view of the LED light improved heat radiation characteristics according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately The present invention should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

3 is an exploded perspective view of an LED light having improved heat dissipation according to the present invention.

As shown in FIG. 3, the LED lighting having improved heat dissipation characteristics according to the present invention includes a heat sink 100, a thermal conductive tape 200, a PCB substrate 300, and an LED 400.

The heat sink 100 has a maximum that can be brought into contact with the outer peripheral surface are per unit area of the air of the heat sink 300 sikineunde radiating the heat generated with the light from the LED (400) In this case, to be able to rapidly dissipate the heat In order to have a surface area, it is preferable that various patterns 110 in the form of valleys or grids are formed.

Meanwhile, the thermally conductive tape 200 has a soldering part 500 formed by coupling one side of the thermal conductive tape 200 to the heat sink 100 and the other side of the thermally conductive tape 200 to which the electrode of the rear surface of the PCB substrate 300 and the LED terminal 410 are coupled. The heat sink 300 is interposed between the heat sink 300 and the PCB substrate 300 to transfer heat generated by the soldering part 500 to the heat sink 100.

That is, the thermally conductive tape 200 is mounted between the heat generating element and the heat sink, and corresponds to an interface material in a mechanism for conducting heat from the heat generating element to the heat sink and dissipating heat through the heat sink.

The thickness of the thermally conductive tape 200 as described above is 0.5T, the withstand voltage characteristic is not more than 500V as well as 3KV, and when the thickness is increased to 0.75T can be guaranteed up to 3.2KV.

As shown in FIG. 3 or 4, the PCB substrate 300 is formed with holes 310 drilled at regular intervals, and as shown in FIG. 4, electrodes 320 are disposed at both sides of the hole 310. ) Is formed.

The electrode 320 is wired with a negative electrode and a positive electrode formed at one end of the PCB substrate 300 to receive power.

The LED 400 including a pair of terminals 410 is formed on the rear surface of the PCB substrate 300 while being inserted into the hole 310 formed in the PCB substrate 300 as shown in FIG. 5. The electrode 320 and the terminal 410 are soldered to combine with the PCB substrate 300.

As the electrode 320 and the terminal 410 are soldered, a soldering part 500 is formed on the rear surface of the PCB substrate 300, so that the LED 400 is illustrated in a cross-sectional view and a plan view of FIG. 5. The terminal 410 formed at the upper surface of the terminal 410 is not directly exposed to the surface and is in direct contact with the thermally conductive tape 200.

Meanwhile, the PCB substrate 300 coupled with the LED 400 is mounted on the thermally conductive tape 200, in which the LED 400 is inserted into the hole 310 about halfway. As the electrode 320 formed on the rear surface of the PCB substrate 300 and the terminal 410 are soldered, the thermally conductive tape 200 and the PCB substrate 300 are spaced apart by a predetermined distance D. The thermal conductive tape 200 and the LED 400 and the soldering part 500 are in direct contact.

In this case, the thermally conductive tape 200 and the PCB substrate 300 may be spaced apart by a predetermined distance D, and the air may be spaced apart from the thermally conductive tape 200 and the PCB substrate 300. Since the flow is smooth, heat dissipation of the soldering part 500 in which heat generation is concentrated may be more efficiently performed.

In addition, as the soldering part 500 is in direct contact with the thermally conductive tape 200, the heat generated from the LED 400 does not pass through the PCB substrate 300, which is an obstacle, and the thermally conductive tape 200. Since it is directly transmitted to the heat sink 100, the heating effect of the LED lighting according to the present invention is further improved.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following by those of ordinary skill in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

100: heat sink 110: pattern
200: thermally conductive tape 300: PCB substrate
310: hole 320: electrode
400: LED 410: Terminal
500: soldering part

Claims

Heat sink 100;
A thermally conductive tape 200 mounted on the heat sink 100;
A PCB substrate 300 mounted on the thermally conductive tape 200 and having a plurality of perforated holes 310 formed therein; And
LED 400 is inserted into the hole 310 is soldered (soldering) on the rear surface of the PCB substrate 300 and coupled to the PCB substrate 300; LED lighting improved heat resistance characterized in that it comprises a.

The method of claim 1,
LED lighting having improved heat dissipation characteristics, characterized in that the terminal 410 provided on the LED 400 and the electrode 320 formed on the back of the PCB substrate 300 is soldered.

The method of claim 1,
LED lighting, characterized in that the pattern 110 is formed on the outer peripheral surface of the heat sink (300).

(a) forming a pattern 110 on an outer circumferential surface of the heat sink 300;
(b) mounting a thermally conductive tape 200 on the heat sink 300; And
(c) mounting a PCB substrate 300 to which the LED 400 is coupled on the thermally conductive tape 200;

5. The method of claim 4,
The step (c)
(c-1) forming a hole 310 in the PCB substrate;
(c-2) forming an electrode 320 on the rear surface of the PCB substrate;
(c-3) inserting the LED 400 into the hole 310 to solder the terminal 410 provided in the LED 400 to the electrode 320; LED lighting method with improved heat dissipation.