KR20130014256A - 발광 소자 패키지 및 이를 이용한 조명 시스템 - Google Patents

발광 소자 패키지 및 이를 이용한 조명 시스템 Download PDF

Info

Publication number
KR20130014256A
KR20130014256A KR1020110076252A KR20110076252A KR20130014256A KR 20130014256 A KR20130014256 A KR 20130014256A KR 1020110076252 A KR1020110076252 A KR 1020110076252A KR 20110076252 A KR20110076252 A KR 20110076252A KR 20130014256 A KR20130014256 A KR 20130014256A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
light
phosphor
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020110076252A
Other languages
English (en)
Korean (ko)
Inventor
김태진
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110076252A priority Critical patent/KR20130014256A/ko
Priority to US13/368,660 priority patent/US8916887B2/en
Priority to TW101104489A priority patent/TWI550915B/zh
Priority to JP2012046391A priority patent/JP5999929B2/ja
Priority to CN201210058772.1A priority patent/CN102903706B/zh
Priority to EP12160057.1A priority patent/EP2551927B1/en
Publication of KR20130014256A publication Critical patent/KR20130014256A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C09K11/7738—Phosphates with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C09K11/7738—Phosphates with alkaline earth metals
    • C09K11/7739—Phosphates with alkaline earth metals with halogens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/07—Polyamine or polyimide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
KR1020110076252A 2011-07-29 2011-07-29 발광 소자 패키지 및 이를 이용한 조명 시스템 Ceased KR20130014256A (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020110076252A KR20130014256A (ko) 2011-07-29 2011-07-29 발광 소자 패키지 및 이를 이용한 조명 시스템
US13/368,660 US8916887B2 (en) 2011-07-29 2012-02-08 Light emitting device package and lighting system using the same
TW101104489A TWI550915B (zh) 2011-07-29 2012-02-13 發光裝置封裝件及使用其之發光系統
JP2012046391A JP5999929B2 (ja) 2011-07-29 2012-03-02 発光素子パッケージ及びこれを利用した照明システム
CN201210058772.1A CN102903706B (zh) 2011-07-29 2012-03-07 发光器件封装件及使用其的照明系统
EP12160057.1A EP2551927B1 (en) 2011-07-29 2012-03-19 Light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110076252A KR20130014256A (ko) 2011-07-29 2011-07-29 발광 소자 패키지 및 이를 이용한 조명 시스템

Publications (1)

Publication Number Publication Date
KR20130014256A true KR20130014256A (ko) 2013-02-07

Family

ID=45819126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110076252A Ceased KR20130014256A (ko) 2011-07-29 2011-07-29 발광 소자 패키지 및 이를 이용한 조명 시스템

Country Status (6)

Country Link
US (1) US8916887B2 (enExample)
EP (1) EP2551927B1 (enExample)
JP (1) JP5999929B2 (enExample)
KR (1) KR20130014256A (enExample)
CN (1) CN102903706B (enExample)
TW (1) TWI550915B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080769A1 (ko) * 2014-11-18 2016-05-26 서울반도체 주식회사 발광 장치
WO2016153212A1 (ko) * 2015-03-23 2016-09-29 엘지이노텍(주) 발광 소자 패키지 및 이를 포함하는 조명 장치
WO2018004018A1 (ko) * 2016-06-27 2018-01-04 (주)라이타이저코리아 발광 소자 패키지
US10211186B2 (en) 2015-08-21 2019-02-19 Lg Electronics Inc. Light emitting device package assembly and method of fabricating the same
US11906846B2 (en) 2020-09-16 2024-02-20 Samsung Electronics Co., Ltd. Display device and manufacturing method therefor

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI535070B (zh) * 2012-04-06 2016-05-21 晶元光電股份有限公司 發光元件
JPWO2013176195A1 (ja) * 2012-05-22 2016-01-14 宇部マテリアルズ株式会社 可視領域での発光光の発光強度と演色性とが最適化された蛍光体混合物
JP2013258209A (ja) * 2012-06-11 2013-12-26 Nitto Denko Corp 封止シート、発光ダイオード装置およびその製造方法
TWI525861B (zh) * 2012-11-28 2016-03-11 Ｌｇ化學股份有限公司 發光二極體
US20140209950A1 (en) * 2013-01-31 2014-07-31 Luxo-Led Co., Limited Light emitting diode package module
US9142732B2 (en) * 2013-03-04 2015-09-22 Osram Sylvania Inc. LED lamp with quantum dots layer
JP2014175354A (ja) * 2013-03-06 2014-09-22 Disco Abrasive Syst Ltd 発光ダイオード
DE102013102482A1 (de) * 2013-03-12 2014-10-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR20140124110A (ko) * 2013-04-16 2014-10-24 주식회사 포스코엘이디 광 반도체 조명장치
TWI596805B (zh) * 2013-07-24 2017-08-21 晶元光電股份有限公司 發光元件及其製作方法
WO2015036887A1 (en) * 2013-09-13 2015-03-19 Koninklijke Philips N.V. Frame based package for flip-chip led
KR102060195B1 (ko) * 2013-09-23 2020-02-11 엘지디스플레이 주식회사 발광소자 패키지 및 그 제조방법
JP6191453B2 (ja) * 2013-12-27 2017-09-06 日亜化学工業株式会社 発光装置
JP2015176960A (ja) * 2014-03-14 2015-10-05 株式会社東芝 発光装置
KR102224848B1 (ko) * 2014-10-06 2021-03-08 삼성전자주식회사 발광 소자 패키지 제조 방법
TWI635622B (zh) * 2015-06-10 2018-09-11 隆達電子股份有限公司 發光結構、燈具及背光模組
JP2017009725A (ja) * 2015-06-19 2017-01-12 ソニー株式会社 表示装置
US9735323B2 (en) * 2015-06-30 2017-08-15 Nichia Corporation Light emitting device having a triple phosphor fluorescent member
CN105529389A (zh) * 2015-08-25 2016-04-27 王子欣 一种全光谱的发光二极管及其应用
CN105762144A (zh) * 2016-05-24 2016-07-13 杜军 一种全光谱高显色性led发白光器件及其制作方法
JP6803539B2 (ja) * 2016-08-23 2020-12-23 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
CN107204394A (zh) * 2017-06-06 2017-09-26 江苏鸿利国泽光电科技有限公司 一种用于生鲜照明的led灯珠
TWI702362B (zh) * 2017-07-13 2020-08-21 東貝光電科技股份有限公司 Ｌｅｄ發光裝置
KR20190019539A (ko) * 2017-08-18 2019-02-27 삼성전자주식회사 발광 소자 및 발광소자 패키지
CN109804476A (zh) 2017-09-15 2019-05-24 厦门市三安光电科技有限公司 一种白光led封装结构以及白光源系统
US10957825B2 (en) * 2017-09-25 2021-03-23 Lg Innotek Co., Ltd. Lighting module and lighting apparatus having thereof
JP6940764B2 (ja) 2017-09-28 2021-09-29 日亜化学工業株式会社 発光装置
US11257990B2 (en) * 2017-09-29 2022-02-22 Nichia Corporation Light emitting device
JP7083255B2 (ja) * 2018-02-07 2022-06-10 シャープ株式会社 発光装置、表示装置及び基板
CN108467733B (zh) * 2018-04-08 2021-07-09 有研稀土新材料股份有限公司 一种近红外荧光粉、其制备方法及含该荧光粉的发光装置
CN108878621B (zh) * 2018-06-21 2020-03-17 深圳创维－Rgb电子有限公司 一种led封装结构、背光模组及显示设备
KR102785601B1 (ko) * 2018-12-26 2025-03-26 엘지이노텍 주식회사 조명 모듈, 조명 장치 및 그 제조방법
JP7443682B2 (ja) * 2019-07-01 2024-03-06 大日本印刷株式会社 バックライトモジュール、および表示装置
KR20230099023A (ko) * 2021-12-27 2023-07-04 엘지디스플레이 주식회사 표시 장치
US20240395987A1 (en) * 2023-05-25 2024-11-28 Seoul Viosys Co., Ltd. Light emitting device and apparatus using the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040012027A1 (en) 2002-06-13 2004-01-22 Cree Lighting Company Saturated phosphor solid state emitter
US7800121B2 (en) 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
ES2335878T3 (es) * 2002-08-30 2010-04-06 Lumination, Llc Led recubierto con eficacia mejorada.
JP2004352928A (ja) * 2003-05-30 2004-12-16 Mitsubishi Chemicals Corp 発光装置及び照明装置
TW200512949A (en) * 2003-09-17 2005-04-01 Nanya Plastics Corp A method to provide emission of white color light by the principle of secondary excitation and its product
EP2113549B1 (en) * 2004-04-27 2011-12-28 Panasonic Corporation Phosphor composition and light-emitting device using the same
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
JP5080723B2 (ja) * 2005-02-22 2012-11-21 シャープ株式会社 半導体発光装置
CN100508227C (zh) * 2005-03-18 2009-07-01 三菱化学株式会社 发光装置、白光发光装置、照明装置及图像显示装置
WO2006098450A1 (ja) * 2005-03-18 2006-09-21 Mitsubishi Chemical Corporation 発光装置、白色発光装置、照明装置及び画像表示装置
KR101055772B1 (ko) 2005-12-15 2011-08-11 서울반도체 주식회사 발광장치
JP4989936B2 (ja) * 2006-07-27 2012-08-01 株式会社朝日ラバー 照明装置
JP2008081631A (ja) * 2006-09-28 2008-04-10 Sharp Corp 発光装置
KR100862695B1 (ko) * 2006-10-17 2008-10-10 삼성전기주식회사 백색 발광 다이오드
WO2009028861A2 (en) * 2007-08-31 2009-03-05 Lg Innotek Co., Ltd Light emitting device package
JP5286585B2 (ja) * 2007-10-05 2013-09-11 シャープ株式会社 発光装置
JP5512515B2 (ja) 2008-05-30 2014-06-04 シャープ株式会社 発光装置、面光源および液晶表示装置
WO2010041195A1 (en) * 2008-10-09 2010-04-15 Philips Intellectual Property & Standards Gmbh Blue emitting sion phosphor
WO2011028033A2 (ko) 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
KR100999809B1 (ko) * 2010-03-26 2010-12-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080769A1 (ko) * 2014-11-18 2016-05-26 서울반도체 주식회사 발광 장치
WO2016153212A1 (ko) * 2015-03-23 2016-09-29 엘지이노텍(주) 발광 소자 패키지 및 이를 포함하는 조명 장치
US10211186B2 (en) 2015-08-21 2019-02-19 Lg Electronics Inc. Light emitting device package assembly and method of fabricating the same
WO2018004018A1 (ko) * 2016-06-27 2018-01-04 (주)라이타이저코리아 발광 소자 패키지
US11906846B2 (en) 2020-09-16 2024-02-20 Samsung Electronics Co., Ltd. Display device and manufacturing method therefor

Also Published As

Publication number Publication date
CN102903706B (zh) 2017-05-17
CN102903706A (zh) 2013-01-30
EP2551927B1 (en) 2018-09-12
JP2013033903A (ja) 2013-02-14
US20130026500A1 (en) 2013-01-31
EP2551927A1 (en) 2013-01-30
TWI550915B (zh) 2016-09-21
TW201306328A (zh) 2013-02-01
US8916887B2 (en) 2014-12-23
JP5999929B2 (ja) 2016-09-28

Similar Documents

Publication Publication Date Title
JP5999929B2 (ja) 発光素子パッケージ及びこれを利用した照明システム
US10559734B2 (en) Light emitting device package and light unit including the same
US8519426B2 (en) Light emitting device and lighting system having the same
US8519427B2 (en) Light emitting device and lighting system
CN103928596B (zh) 发光器件
US8680552B2 (en) Light emitting device package including light emitting diode, and lighting system having the same
US9249957B2 (en) Light emitting device and lighting system including the same
KR101873585B1 (ko) 발광 소자 패키지 및 이를 구비한 조명 시스템
KR20120030871A (ko) 발광 소자 패키지 및 이를 이용한 라이트 유닛
KR20120020601A (ko) 발광 소자 및 조명 시스템
KR20130074562A (ko) 발광 모듈
KR101896687B1 (ko) 발광 소자 패키지
KR20130014263A (ko) 발광 소자
KR101875435B1 (ko) 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR101886068B1 (ko) 발광 소자 패키지
KR101840031B1 (ko) 발광 장치
KR101905506B1 (ko) 발광 소자 패키지 및 이를 구비한 조명 시스템
KR101872521B1 (ko) 발광 소자 패키지 및 이를 구비한 조명 시스템
KR20130018071A (ko) 발광 소자 패키지 및 이를 구비한 발광 장치
KR20130037043A (ko) 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR20130118552A (ko) 발광 소자 패키지 및 이를 구비한 발광 장치

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20110729

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20160726

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20110729

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170717

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180102

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170717

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I