KR20130013508A

KR20130013508A - Light emitting device module and lighting system including the same

Info

Publication number: KR20130013508A
Application number: KR1020110075206A
Authority: KR
Inventors: 고장근
Original assignee: 엘지이노텍 주식회사
Priority date: 2011-07-28
Filing date: 2011-07-28
Publication date: 2013-02-06

Abstract

An embodiment includes a substrate: a plurality of light emitting device package groups arranged in parallel on the substrate; And first wirings and second wirings electrically connected to the respective light emitting device package groups, wherein each of the light emitting device package groups includes at least two light emitting device packages, and each of the light emitting device package groups adjacent to each other. On the opposite edge, a light emitting device module in which the same second wire is electrically connected is provided.

Description

Light emitting device module and lighting system including the same

Embodiments relate to a light emitting device module and an illumination system including the same.

Light emitting devices such as light emitting diodes (LEDs) and laser diodes (LDs) using semiconductors of Group 3-5 or 2-6 compound semiconductor materials of semiconductors have been developed using thin film growth technology and device materials. Various colors such as green, blue, and ultraviolet light can be realized, and efficient white light can be realized by using fluorescent materials or combining colors, and low power consumption, semi-permanent life, and quicker than conventional light sources such as fluorescent and incandescent lamps can be realized. It has the advantages of response speed, safety and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

When a light emitting device is used in a lighting device or a backlight unit, a light emitting device module in which a plurality of light emitting device packages on which a light emitting device is disposed is fixed to a circuit board is used.

1 is a view showing the wiring of a conventional light emitting device module.

The string 1, the string X, and the like each include a plurality of light emitting device packages, and the entire light emitting device package is grouped into a plurality of strings. Since two wirings (+,-) are connected to each string, if X strings are arranged, 2X total wirings are arranged on the circuit board.

The embodiment is to efficiently arrange the cathode and the anode in the circuit board in the light emitting device module.

The light emitting device packages in one light emitting device package group may be connected in series with each other.

The plurality of light emitting device package groups may be arranged in a line.

The light emitting device package located at the end of the first light emitting device package group and the light emitting device package located at the first of the second light emitting device package group adjacent to the first light emitting device package group may have the same polarity.

The second wiring can be an anode wiring.

In respective light emitting device packages in one light emitting device package group, lead frames having the same polarity may be disposed in the same direction.

The number of second wires may be equal to the number of light emitting device package groups.

The number of second wirings may be 1/2 of the number of light emitting device package groups, and an even number of light emitting device package groups may be disposed.

The first wiring may supply driving signals of the light emitting device packages.

Another embodiment provides a lighting system in which the above-described light emitting device module is disposed.

In the light emitting device module according to the embodiment, the width of the substrate can be reduced by reducing the number of anode electrodes on the circuit board, and the risk of short circuit between each wiring can be reduced.

1 is a view showing the wiring of a conventional light emitting device module,
2 is a perspective view of one embodiment of a light emitting device module;
3 is a view showing a first embodiment of wiring of the circuit board of FIG.
4 is a diagram illustrating an electrode distribution of a light emitting device array in one string of FIG. 3;
5 is a cross-sectional view of the light emitting device package of FIG.
FIG. 6 is a view showing a second embodiment of wiring of the circuit board of FIG. 2;
7 is an exploded perspective view of an embodiment of a display device in which a light emitting device module is disposed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, when described as being formed on the "on or under" of each element, the (up) or down (on) or under) includes both two elements being directly contacted with each other or one or more other elements are formed indirectly between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

2 is a perspective view of an embodiment of a light emitting device module.

In the light emitting device module 200 according to the embodiment, a plurality of light emitting device package 100 arrays are disposed on a substrate such as a circuit board 210.

As the circuit board, a metal PCB, FR4, FPCB, or the like may be used, and each light emitting device package array is described later with reference to FIG. 5. When power is supplied from the outside, a driving signal is supplied from the circuit board 210 to the light emitting device package 100. Cathode wiring and anode wiring are provided on the circuit board 210, respectively. It is connected to the lead frame of (100).

FIG. 3 is a diagram illustrating a first embodiment of wiring of the circuit board of FIG. 2, and FIG. 4 is a diagram illustrating an electrode distribution of a light emitting device array in one string in FIG. 3.

In FIG. 3, a plurality of light emitting device package arrays on the circuit board 210 are grouped and arranged in the string 1 231 to the string 4 234. A plurality of light emitting device packages are arranged in each string. Each string 231 to 234 may be a light emitting device package group having a plurality of light emitting device packages, and the strings 231 to 234 may be connected to each other in parallel. The strings 231 to 234 may be arranged in a line.

The connector 220 may be disposed at one edge of the circuit board 210 to supply power to the light emitting device module from the outside. In FIG. 4, four light emitting device packages 100 are included in one string 231, and each light emitting device package 100 is connected in series. That is, in one light emitting device package group, that is, the first lead frame and the second lead frame of each light emitting device package are arranged in the same direction.

In FIG. 3, a first wire (−) is connected to each of the strings 231, 232, 233, and 234. The first wire also transmits a driving signal of each light emitting device package, and thus may be used differently for each string. That is, the first-first wiring 244 is connected to the first string 231, the first-second wiring 243 is connected to the second string 232, and the first-first to the third string 233. The three wires 242 are connected, and the first to fourth wires 241 are connected to the fourth string 234.

In addition, since the second wire (+) may be used in common with two adjacent strings, one second-first wire 252 is connected to the first string 231 and the second string 232, and the third wire is connected to the third string. The second-second wiring 251 is connected to the string 232 and the fourth string 234.

That is, when the string closest to the connector 220 is called the first string 231 and the string farthest is the n-th string, the k-th string and the k + 1-th string may use the second wiring in common. Here, k is an odd number, and the second wiring is inserted in a direction in which the k th string and the k + 1 th string face each other, and are divided into the k th string and the k + 1 th string. For this wiring structure, the entire string may be made even.

Accordingly, the polarities of the light emitting device package located last in the first string 231 and the first light emitting device package located in the second string 232 are the same as (+).

When the LED package array is grouped into four strings, four first wires are required, but two second wires can be used, so that the width of the circuit board is not increased and many wires are patterned on a narrow circuit board. When the risk of short circuit can be reduced.

5 is a cross-sectional view of the light emitting device package of FIG. 2.

The light emitting device package 100 according to the embodiment includes a package body 110, a first lead frame 121 and a second lead frame 122 installed on the package body 110, and the package body 110. A light emitting device 140 according to an embodiment installed and electrically connected to the first lead frame 121 and the second lead frame 122, and a molding part 160 surrounding the light emitting device 140. do.

The package body 110 may be formed of any one of a resin material such as polyphthalamide (PPA), silicon (Si), metal, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and printed circuit board (PCB). It can be formed as one.

The top shape of the package body 110 may have various shapes such as triangle, rectangle, polygon, and circle according to the use and design of the light emitting device 140. For example, the light emitting device 140 may be formed in a rectangular shape and used for an edge type backlight unit (BLU), and when applied to a portable flashlight or home lighting, the package body 110 may be It can be changed to a size and shape that is easy to embed in a portable flashlight or home lighting.

In addition, the package body 110 is open at the top, the cavity (cavity) consisting of the side and the bottom is formed. The cavity may be formed in a cup shape, a concave container shape, or the like, and the inner surface of the cavity may be perpendicular to or inclined with respect to the floor. As shown, the light emitting device is positioned on the bottom surface of the cavity in the package body 110.

The first and second lead frames 121 and 122 may be made of a conductive material, for example, copper (Cu), and may have the same composition.

The light emitting device 140 may include a horizontal light emitting device in addition to the vertical light emitting device. The light emitting device 140 is fixed to the first lead frame 121 by the conductive adhesive layer 130, and the wire 150 is bonded to the second lead frame 122.

The resin layer 160 may be molded by protecting the light emitting device 140 and the wire 150 electrically connecting the light emitting device 140 to the first and second lead frames 121 and 122. .

The resin layer 160 may be made of a light-transmitting material such as silicon, and may convert light in the first wavelength region emitted from the light emitting device 140 including the phosphor into light in the second wavelength region. Although not shown, a filler may be included in the resin layer 160 to prevent the phosphor from being precipitated downward.

Although not shown, a lens is disposed on the resin layer 160 and the package body 110 to adjust the directing angle of the light emitted from the light emitting device.

FIG. 6 is a diagram illustrating a second embodiment of wiring of the circuit board of FIG. 2.

In FIG. 6, a plurality of light emitting device package arrays on the circuit board 210 are grouped and arranged in the string 1 231 to the string 4 234. A plurality of light emitting device packages are arranged in each string.

The connector 220 may be disposed at one edge of the circuit board 210 to supply power to the light emitting device module from the outside. Although not shown, a plurality of light emitting device packages are included in one string, and each light emitting device package is connected in series.

In FIG. 6, a first wire (−) is connected to each of the strings 231, 232, 233, and 234, and since the first wire also transmits a driving signal of each light emitting device package, it may be used differently for each string. That is, the first-first wiring 244 is connected to the first string 231, the first-second wiring 243 is connected to the second string 232, and the first-first to the third string 233. The three wires 242 are connected, and the first to fourth wires 241 are connected to the fourth string 234.

The four first wires 241 to 244 are disposed on the four strings 231 to 234 on the circuit board 210, and the second wire 251 is disposed below the four strings.

In the present embodiment, unlike the embodiment described above, one second wire 251 is connected to four strings. In order to effectively use the limited area of the circuit board 210, the second wiring 251 is divided and used between two adjacent strings.

That is, when the string closest to the connector 220 is referred to as the first string 231 and the furthest string is referred to as the n-th string, the second wiring 251 is formed by the k th string and the k + 1 th string. In the regions facing each other, they are concatenated into the k th string and the k + 1 th string, where k is odd.

Therefore, when the light emitting device package array is grouped into four strings, four first wires are required, but one second wire can be used, thereby preventing an increase in the width of the circuit board and a large number of wires in a narrow circuit board. When patterning, the risk of short circuits can be reduced. In addition, since the first wiring and the second wiring are patterned in different directions with respect to the string, the patterning process of the first wiring and the second wiring is also easy.

The light emitting device module according to the embodiment may be used in a lighting device or a backlight unit, and a light guide plate, a prism sheet, a diffusion sheet, or the like, which is an optical member, may be disposed on an optical path of the light emitting device module. The light emitting device module and the optical member may function as a light unit.

7 is an exploded perspective view of an embodiment of a display device in which a light emitting device module is disposed.

As shown, the image display apparatus 800 according to the present exemplary embodiment includes a light source module, a reflector 820 on the bottom cover 810, and light disposed in front of the reflector 820 and emitted from the light source module. The light guide plate 840 to guide the front of the image display device, the first prism sheet 850 and the second prism sheet 860 disposed in front of the light guide plate 840, and the second prism sheet 860. And a color filter 880 disposed in front of the panel 870 disposed in front of the panel 870.

The light source module includes the above-described light emitting device package 835 on the circuit board 830. The arrangement of the cathode wiring and the anode wiring in the circuit board 830 in the light source module is the same as described above.

The bottom cover 810 may accommodate components in the image display apparatus 800. The reflector 820 may be provided as a separate component as shown in the drawing, or a rear surface of the light guide plate 840, It is also possible to be provided in the form of a coating with a high reflectivity material on the front of the bottom cover 810.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 840 is made of a material having a good refractive index and transmittance. The light guide plate 840 may be formed of poly methylmethacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). In addition, the light guide plate may be omitted, and thus an air guide method in which light is transmitted in the space on the reflective sheet 820 may be possible.

The first prism sheet 850 is formed of a translucent and elastic polymer material on one surface of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, the plurality of patterns may be provided in the stripe type and the valley repeatedly as shown.

In the second prism sheet 860, the direction of the floor and the valley of one surface of the support film may be perpendicular to the direction of the floor and the valley of one surface of the support film in the first prism sheet 850. This is to evenly distribute the light transmitted from the light source module and the reflective sheet in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which is composed of another combination, for example, a micro lens array or a diffusion sheet and a micro lens array. Or a combination of one prism sheet and a micro lens array.

A liquid crystal display panel may be disposed on the panel 870, and other types of display apparatuses that require light sources may be provided.

The panel 870 is a state in which the liquid crystal is located between the glass body and the polarizing plate is placed on both glass bodies in order to use the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

The liquid crystal display panel used in the image display apparatus uses a transistor as an active matrix method as a switch for adjusting the voltage supplied to each pixel.

The front surface of the panel 870 is provided with a color filter 880 to transmit the light projected from the panel 870, only the red, green and blue light for each pixel can represent an image.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: light emitting device package 110: package body
121: first lead frame 122: second lead frame
130: conductive adhesive layer 140: light emitting element
150: wire 160: molding part
200: light emitting device module 210: circuit board
220: connector 231 to 234: string
241 to 244: first wiring 251 and 252: second wiring
300: display device 310: bottom cover
320: reflector 330: circuit board module
340: Light guide plate 350, 360: First and second prism sheet
370 panel 380 color filter

Claims

Board:
A plurality of light emitting device package groups arranged in parallel on the substrate; And
First and second wires electrically connected to the respective light emitting device package groups;
Each light emitting device package group includes at least two light emitting device packages, and the same second wire is electrically connected to edges facing each other of adjacent light emitting device package groups.

The method of claim 1,
Light emitting device modules in one light emitting device package group are connected in series with each other.

The method of claim 1,
The plurality of light emitting device package groups are arranged in a line.

The method of claim 1,
And a light emitting device package positioned at the end of the first light emitting device package group and a light emitting device package positioned at the first of the second light emitting device package group adjacent to the first light emitting device package group, having the same polarity.

The method of claim 1,
The second wiring is an anode wiring.

The method of claim 1,
In each light emitting device package in one light emitting device package group, the lead frames of the same polarity are arranged in the same direction.

The method of claim 1,
The number of the second wiring is the same as the number of the light emitting device package group.

The method of claim 1,
The number of the second wirings is 1/2 of the number of the light emitting device package group, and the light emitting device module is arranged even number of the light emitting device package group.

The method of claim 1,
The first wiring is a light emitting device module for supplying a drive signal of the light emitting device packages.

A lighting system in which the light emitting device module of any one of claims 1 to 9 is disposed.