KR20120124186A - Ligth emitting device package and illuminating system including the same - Google Patents

Abstract

PURPOSE: A light emitting device package and a lighting system including the same are provided to improve entire brightness and light efficiency by minimizing that light progresses in the inner side. CONSTITUTION: A light emitting device(130) is formed on a package body(110). The light emitting device is electrically connected to a first electrode layer(121) and a second electrode layer(122). Wires(141,142) are electrically connected to a first electrode(131) and a second electrode(132) of the light emitting device. A film(160) is placed on the light emitting device. The film comprises three fluorescent material layers which emit light of different wavelength. A resin layer(150) is formed between the light emitting device and the film.

Description

Light emitting device package and lighting system including the same {LIGTH EMITTING DEVICE PACKAGE AND ILLUMINATING SYSTEM INCLUDING THE SAME}

Embodiments relate to a light emitting device package and a lighting system including the same.

Light emitting devices such as light emitting diodes (LEDs) and laser diodes (LDs) using semiconductors of Group 3-5 or 2-6 compound semiconductor materials of semiconductors have been developed using thin film growth technology and device materials. Various colors such as green, blue, and ultraviolet light can be realized, and efficient white light can be realized by using fluorescent materials or combining colors, and low power consumption, semi-permanent life, and quicker than conventional light sources such as fluorescent and incandescent lamps can be realized. It has the advantages of response speed, safety and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

BACKGROUND In the lighting device and the display device, a light emitting device package is mounted on a package body and electrically connected thereto.

The embodiment aims to improve the light efficiency of the light emitting device package.

Embodiments include a package body in which a cavity is formed; A light emitting element disposed in the cavity; A film disposed on the light emitting device and including at least three phosphor layers emitting light of different wavelengths, at least a part of which is disposed in the cavity; And a resin layer disposed between the light emitting device and the film.

The distance between the phosphor layer disposed adjacent to the light emitting device and the side surface of the cavity may be equal to or smaller than the distance between the phosphor layer disposed close to the upper surface of the cavity and the side surface of the cavity.

The film may include a red phosphor layer, a yellow phosphor layer, and a green phosphor layer.

The peak wavelength of the light emitted from the phosphor layer disposed far from the light emitting device may be a shorter wavelength region than the peak wavelength of the light emitted from the phosphor layer disposed close to the light emitting device.

At least three phosphor layers may be integrally disposed.

The film may include a red phosphor layer on the light emitting device, a yellow phosphor layer on the red phosphor layer, and a green phosphor layer on the yellow phosphor layer.

The resin layer may be disposed between the film and the side surface of the cavity.

The film may have a hexahedron shape.

The cavity may have a cross-sectional area of a region farther from the light emitting device than a cross-sectional area of a region close to the light emitting device.

The film may have a cross-sectional area of a region far from the light emitting device than a cross-sectional area of a region close to the light emitting device.

The cross-sectional area of the cavity farther from the light emitting device is larger than the cross-sectional area of the area closer to the light emitting device, and the film has a larger cross-sectional area of the area farther from the light emitting device than that of the light emitting device. This may be greater than the rate of increase in cross-sectional area of the film.

Each phosphor layer may have a thickness of 20-100 micrometers.

The film may have a thickness of 300 micrometers or less.

The cavity may be disposed with a step, a resin layer may be disposed at the first end of the cavity, and a film may be disposed at the second end of the cavity.

It may further include a resin layer on the film.

Another embodiment provides an illumination system including the light emitting device package described above.

The light emitting device according to the embodiment improves the light efficiency.

1A to 1C are cross-sectional views of a first embodiment of a light emitting device package,
2 and 3a to 3c are cross-sectional views and perspective views of one embodiment of the phosphor film of the light emitting device package of FIG.
4 and 5a and 5b is a sectional view and a perspective view of another embodiment of the phosphor film of the light emitting device package of FIG.
6A and 6B are views illustrating a package body in which the phosphor film of FIG. 4 is disposed;
7 is a cross-sectional view of a second embodiment of a light emitting device package,
8 is a view showing a package body of the light emitting device package of FIG.
9 to 10 are views illustrating a manufacturing process of the phosphor film of FIGS. 2 and 3,
11 to 12 are views illustrating a manufacturing process of the phosphor film of FIGS. 4 and 5,
13 to 17a and 17b are views illustrating a manufacturing process of a light emitting device package,
18 is an exploded perspective view of an embodiment of a lighting apparatus including a light emitting device package according to the embodiments;
19 is a diagram illustrating an example of a display device including a light emitting device package according to embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, when described as being formed on the "on or under" of each element, the (up) or down (on) or under) includes both two elements being directly contacted with each other or one or more other elements are formed indirectly between the two elements. In addition, when expressed as "on" or "under", it may include the meaning of the downward direction as well as the upward direction based on one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

1A to 1C are cross-sectional views of a first embodiment of a light emitting device package.

In the light emitting device package 100 according to the present exemplary embodiment, a lead frame may be disposed on the package body 110, and the lead frame may include a first electrode layer 121 and a second electrode layer 122 electrically separated from each other. have.

The light emitting device 130 is disposed on the package body 110 and electrically connected to the first electrode layer 121 and the second electrode layer 122. The light emitting device 130 may be bonded to the first electrode layer 121 and the second electrode layer 122 by wires 141 and 142. The wires 141 and 142 may be electrically connected to the first and second electrodes 131 and 132 of the light emitting device 130.

A cavity is formed in the package body 110, and the light emitting device 130 is disposed on the bottom surface of the cavity. The package body 110 may be formed of at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, and photo sensitive glass (PSG), and the body 110 may be extrusion molded. , But may be formed by an etching process, but is not limited thereto. In addition, an inclined surface is formed around the light emitting device 130 to increase light extraction efficiency.

The inclined surface forms a sidewall of the cavity, and the film 160 is spaced apart from the light emitting device 130 by a predetermined distance in the cavity.

In the cavity, resin layers 150 and 151 are filled between the light emitting device 130 and the film 160 and on the film 160, respectively. Although the surface of the resin layer 151 is shown flat, the center may be convex or concave.

The first electrode layer 121 and the second electrode layer 122 are electrically separated from each other, and provide power to the light emitting device 130. In addition, the first electrode layer 121 and the second electrode layer 122 may generate light from the light emitting device 130, and may also serve to discharge heat generated from the light emitting device 130 to the outside. have.

The light emitting device 130 may be energized with the electrode layers 121 and 122 by a flip chip method or a die bonding method in addition to the wire bonding method shown in the drawings.

In addition, the resin layer 150 may cover and protect the top and side surfaces of the light emitting device 130. In addition, the resin layer 151 may be formed on the film 151 to fix or protect the film 151.

In addition, the light diffusion unit 170 may be disposed on the resin layer 151. A lens or the like may be used for the light diffusion unit 170. Light of the first wavelength region emitted from the light emitting element 130 may be excited by a phosphor in the film 160, thereby forming a second wavelength region. The optical path may be converted into light and the light path of the second wavelength region may be changed while passing through the lens.

In FIG. 1A, the resin layer 151 may be flat, but the resin layer 151 may be concave, as shown in FIG. 1B, or the resin layer 151 may be convex, as shown in FIG. 1C.

In FIG. 1, the phosphor is disposed in the shape of a film 160. 2 and 3A to 3C are cross-sectional views and perspective views of one embodiment of the phosphor film of the light emitting device package of FIG. 1, and FIGS. 4 and 5 are cross-sectional views and perspective views of another embodiment of the phosphor film of the light emitting device package of FIG. 1. . Hereinafter, the phosphor in the shape of the film 160 will be described in detail with reference to FIGS. 2 to 4.

The film 160 includes a red phosphor layer 162, a yellow phosphor layer 164, and a green phosphor layer 166. In this embodiment, the red phosphor layer 162, the yellow phosphor layer 164, and the green phosphor layer 166 are arranged in the order adjacent to the light emitting element, so that the peak wavelength of the light emitted from the phosphor layer disposed close to the light emitting element is The long wavelength range may be reversed.

In FIG. 3A, three phosphor layers 162, 164, and 166 are disposed in the film 160, but in FIG. 3B, two phosphor layers 162 and 164 are disposed in the film 160. Four phosphor layers 162, 164, 166, and 168 may be disposed in the 160.

In addition, a phosphor layer having two colors or a phosphor layer emitting four or more colors may be disposed in the film 160. In addition, the phosphor layer emitting each color may be integrally formed by forming one film.

The entire film 160 and each of the phosphor layers 162, 164, and 166 may have a hexahedral shape. In this case, the thickness t _R , t _Y , t _G of the phosphor layers 162, 164, and 166 may be 20 micrometers to 100 micrometers, and the thickness of the entire film 300 may be 300 micrometers or less. have. In addition, the thicknesses t _R , t _Y , and t _G of the phosphor layers 162, 164, and 166 may not be the same.

If the thickness (t _R , t _Y , t _G ) of each phosphor layer 162, 164, 166 is too thin, it may not be sufficient for the wavelength change or durability of light, too thick may cause a decrease in luminance, Given the limited space of the cavity, the thickness of the film 160 may be 300 micrometers or less.

In addition, although the thickness of each phosphor layer 162, 164, and 166 is constant in consideration of the wavelength change of light, it may not be a hexahedral shape. That is, in consideration of the shape of the cavity in which the film 160 is to be disposed, the shape of the film 160 or the phosphor layers 162, 164, and 166 may be changed, and in particular, the film 160 or the phosphor layer 162 may be formed. The edges of 164 and 166 may be rounded as shown in FIG. 5B.

In the embodiment shown in FIGS. 4 and 5A and 5B, the cross-sectional areas of the phosphor layers 162, 164, and 166 in the film 160 are not constant. That is, the cross-sectional area of the phosphor layer 162 to be disposed nearest to the light emitting element 130 is the smallest, and the cross-sectional area of the phosphor layer 166 to be disposed farthest from the light emitting element 130 is widest.

Here, the cross-sectional area means a cross-sectional area of each phosphor layer 162, 164, 166 in a direction parallel to the bottom surface of the cavity in which the film 160 is to be disposed.

The size of the phosphor layers 162, 164, and 166 in the above-described film 160 is because the above-mentioned cavity becomes wider toward the light emitting device package 100.

6A is a view illustrating a package body in which the phosphor film of FIG. 4 is disposed. In FIG. 6A, the size relationship of the cavity of the package body 110 and the phosphor layers 162, 164, 166 in the film 160 is shown. In FIG. 6A the widths D _R , D _G , D _Y of the cavities corresponding to each phosphor layer 162, 164, 166 are shown in FIG. 6B.

Although not shown, a light emitting device may be disposed on the bottom surface of the cavity, and the cavity has a larger cross-sectional area of an area farther from the light emitting device than that of the area closer to the light emitting device.

The film 160 is composed of three phosphor layers 162, 164, and 166 in this embodiment, wherein the cross-sectional area of the phosphor layer 166 in a region far from the light emitting element is closer to the light emitting element. Larger than the cross-sectional area of layer 162.

The cross-sectional area increase rate of the cavity may be greater than the cross-sectional area increase rate of the film. That is, the width W _R of the red phosphor layer 162 is the same as the width d _R of the cavity in contact with the red phosphor layer 162 so that the red phosphor layer 162 may be fixed to the cavity. have.

However, the width W _Y of the yellow phosphor layer 164 is the same as the width d _Y of the cavity in contact with the red phosphor layer 162, so that the yellow phosphor layer 164 is predetermined with the sidewall of the cavity. Intervals can be spaced.

In addition, the width W _G of the green phosphor layer 166 is equal to the width d _G of the cavity in contact with the green phosphor layer 166, such that the yellow phosphor layer 164 may be formed at a sidewall of the cavity. Intervals can be spaced.

If the cross-sectional area increase rate of the film is greater than the cross-sectional area increase rate of the cavity, the uppermost phosphor layer in the film 160 is fixed to the cavity and the lower phosphor layer is spaced apart from the cavity by a predetermined distance, The layout may not be stable.

In this case, the rate of increase of the cross-sectional area of the phosphor layer constituting each phosphor layer 162, 164, 166 may not be constant. For example, in the present embodiment, the width W _Y / red phosphor layer ( The value of the width W _R of 162 may be different from the value of the width W _Y of the width W _G / yellow phosphor layer 164 of the green phosphor layer 166.

That is, the distance between the phosphor layer disposed adjacent to the light emitting element and the side surface of the cavity may be equal to or smaller than the distance between the phosphor layer disposed close to the upper surface of the cavity and the side surface of the cavity. Layer 162 may be in contact with the side of the cavity and the phosphor layers 164 and 166 of the upper layer may not be in contact with the side of the cavity.

7 is a cross-sectional view of a second embodiment of a light emitting device package, and FIG. 8 is a view illustrating a package body of the light emitting device package of FIG. 7.

This embodiment is the same as the embodiment shown in FIG. 1, but the cavity in the package body 110 is formed with a step so that the first step above the first end 112 below the cavity as shown in FIG. 8. 114 has a larger cross-sectional area.

The sidewalls of the first end 112 and the second end 114 of the cavity are perpendicular to or close to each other, and the bottom surface of the second end 114 also has a flat portion, and the second end 114 of the second end 114 of the cavity is formed. The film 160 may be disposed in the flat section.

As shown in FIG. 7, the first end 112 of the cavity has a light emitting device 130 disposed therein, and the resin layer 150 surrounds and protects the light emitting device, and the second end 114 of the cavity has a film ( 160 is fixed and the resin layer 151 is filled on the film 160. In the present embodiment, unlike the first embodiment, a vertical light emitting device is disposed.

In the above-described embodiments, although the film 160 is disposed in the cavity, some of the film 160 may be disposed in the cavity and part of the film 160 may be exposed to the outside of the cavity. Here, the exposed film means that the film is placed higher than the highest portion of the cavity sidewall.

In the light emitting device package having the above-described structure, the phosphor layer is composed of a plurality of layers instead of one layer, and a phosphor layer emitting light of a long wavelength region is disposed at a position close to the light emitting element, and a short wavelength region is located at a position far from the light emitting element. A phosphor layer emitting light is arranged.

Here, since the light of the long wavelength has a smaller energy band gap than the light of the short wavelength, the light of the long wavelength may pass through the material of the short wavelength, but the light of the short wavelength may not pass through the material of the long wavelength.

Therefore, in the arrangement of the above-described phosphor layer in the film, light is converted into light of a long wavelength region in a region close to the light emitting device and proceeds to the outside.

Accordingly, light propagation into the light emitting device package may be minimized to improve overall brightness and light efficiency.

9 to 10 are views illustrating a manufacturing process of the phosphor film of FIGS. 2 and 3A.

First, as shown in FIG. 9, a red phosphor layer 166 is formed on the base sheet 200. The base sheet 200 serves to support the respective phosphor layers 162, 164, and 166, and the phosphor layers 162, 164, and 166 may be printed by a screen printing method or a conformal coating. Or lamination method.

As shown in FIG. 10, the yellow phosphor layer 164 and the red phosphor layer 162 are formed on the green phosphor layer 166 by printing. Then, the cutting process is performed according to the size of the cavity of the package body to be used.

At this time, several films can be manufactured by one process. After the cutting process is completed, a phosphor film including three phosphor layers emitting light of different wavelengths is completed.

11 and 12 are views illustrating a manufacturing process of the phosphor film of FIGS. 4 and 5.

This embodiment is similar to the embodiment shown in Figs. 9 and 10, but the areas of the respective phosphor layers 162, 164, and 166 in the film are different from each other. After printing the phosphor layers 162, 164, and 166, the phosphor layers may be pressed with a clean buffer or the like to be in close contact with each other.

13 to 17 are diagrams illustrating a manufacturing process of a light emitting device package. The present embodiment includes a horizontal light emitting device in an inclined cavity, but may be applied to a cavity having the above-described step, a vertical light emitting device, or a flip chip type light emitting device.

As shown in FIG. 13, the package body 110 is formed on the first and second electrode layers 121 and 122. The package body 110 fixes the first and second electrode layers 121 and 122 and forms a cavity therein.

As shown in FIG. 14, the light emitting device 130 is disposed in the cavity of the package body 110, and the first and second electrodes 131 and 132 and the first and second electrode layers of the light emitting device 130 ( 121 and 122 are electrically connected by bonding the wires 141 and 142.

As shown in FIG. 15, the resin layer 150 is applied by a method such as dispensing to a height that can cover the light emitting device 130 so that the light emitting device 130 does not come into contact with the film 160. do.

Then, as shown in FIG. 16, the film 160 is disposed on the resin layer 150. At this time, the base sheet 200 is positioned above the film 160 by changing up and down as shown in FIGS. 9 to 12.

When the base sheet 200 is removed, the phosphor layer is disposed in the film 160 as described above.

As shown in FIG. 17A, a resin layer 151 is coated on the film 160. Although not shown, a light diffusing part such as a lens may be disposed on the resin layer 151.

In the embodiment shown in FIG. 17B, a portion of the film 160 is exposed to the outside of the cavity.

By the above-described process, a film composed of a plurality of phosphor layers instead of one conventional layer is disposed in a package. In the above-described phosphor layer, the phosphor layer emitting long wavelength light is disposed adjacent to the light emitting device as described above.

In addition, a resin layer may be disposed below / above the film to provide a stable arrangement of the film. In addition, the phosphor layer is contained in the resin layer in the cavity, and the film type phosphor layer is disposed without coating by dispensing or the like, so that stable and simple production is possible, and the thickness of each phosphor layer can be easily adjusted.

Hereinafter, an illumination device and a backlight unit will be described as an embodiment of a lighting system in which the above-described light emitting device package is disposed.

18 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to the embodiments.

The lighting apparatus according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation part 500 for dissipating heat from the light source 600, and the light source 600. And a holder 700 for coupling the heat dissipation part 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. One air flow port 430 may be formed in the body portion 420.

A plurality of air flow port 430 is provided on the body portion 420 of the housing 400, wherein the air flow port 430 is composed of one air flow port, or a plurality of flow ports as shown in the radial arrangement Various other arrangements are also possible.

The light source 600 includes a plurality of light emitting device packages 650 on the circuit board 610. Here, the circuit board 610 may be inserted into the opening of the housing 400, and may be made of a material having a high thermal conductivity to transmit heat to the heat dissipating unit 500, as described later.

A holder 700 is provided below the light source, and the holder 700 may include a frame and another air flow port. In addition, although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

19 illustrates a backlight including a light emitting device package according to embodiments.

As shown, the display device 800 according to the present exemplary embodiment includes a light source module, a reflector 820 on the bottom cover 810, and light emitted from the light source module in front of the reflector 820. The light guide plate 840 guiding in front of the display device, the first prism sheet 850 and the second prism sheet 860 disposed in front of the light guide plate 840, and in front of the second prism sheet 860. It comprises a panel 870 is disposed and the color filter 880 disposed in the first half of the panel 870.

The light source module includes a light emitting device package 835 on the circuit board 830. Here, the PCB 830 may be used as the circuit board 830, and the light emitting device package 835 is as described above.

The bottom cover 810 may accommodate components in the display device 800. The reflective plate 820 may be provided as a separate component as shown in the drawing, or may be disposed on the rear surface of the light guide plate 840, or The bottom cover 810 may be provided in the form of a coating with a highly reflective material.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 840 is made of a material having a good refractive index and transmittance. The light guide plate 840 may be formed of poly methylmethacrylate (PMMA), polycarbonate (PC), or polyethylene (PE).

In addition, the light guide plate 840 may be omitted, and may be an air guide method in which the light reflected from the reflector 820 proceeds straight to the panel direction.

The first prism sheet 850 is formed of a translucent and elastic polymer material on one surface of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, the plurality of patterns may be provided in the stripe type and the valley repeatedly as shown.

In the second prism sheet 860, the direction of the floor and the valley of one surface of the support film may be perpendicular to the direction of the floor and the valley of one surface of the support film in the first prism sheet 850. This is to evenly distribute the light transmitted from the light source module and the reflective sheet in all directions of the panel 870.

Although not shown, a protective sheet may be provided on each prism sheet, and a protective layer including light diffusing particles and a binder may be provided on both surfaces of the support film.

In addition, the prism layer is made of a polymer material selected from the group consisting of polyurethane, styrene butadiene copolymer, polyacrylate, polymethacrylate, polymethylmethacrylate, polyethylene terephthalate elastomer, polyisoprene, polysilicon Can be.

Although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and may maximize the light projection angle through refraction and scattering of light incident from the backlight unit.

The diffusion sheet includes a support layer including a light diffusing agent, a first layer and a second layer formed on a light exiting surface (first prism sheet direction) and a light incident surface (reflective sheet direction) and not including a light diffusing agent. It may include.

The support layer is 0.1 to 10 parts by weight of a siloxane light diffusing agent having an average particle diameter of 1 to 10 micrometers with respect to 100 parts by weight of a resin in which a methacrylic acid-styrene copolymer and a methyl methacrylate methyl-styrene copolymer are mixed; 0.1 to 10 parts by weight of an acrylic light diffusing agent having an average particle diameter of 1 to 10 micrometers may be included.

The first layer and the second layer may be included as 0.01 to 1 part by weight of the ultraviolet absorber and 0.001 to 10 parts by weight of the antistatic agent based on 100 parts by weight of the methyl methacrylate-styrene copolymer resin.

The thickness of the support layer in the diffusion sheet is 100 ~ 10000 micrometers, the thickness of each layer may be 10 ~ 1000 micrometers.

In the present embodiment, the diffusion sheet, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, and the optical sheet is made of another combination, for example, a micro lens array or a diffusion sheet and a micro Combination of a lens array or a combination of one prism sheet and a micro lens array.

The liquid crystal display panel (Liquid Crystal Display) may be disposed on the panel 870, in addition to the liquid crystal display panel 860 may be provided with other types of display devices that require a light source.

The panel 870 is a state in which the liquid crystal is located between the glass body and the polarizing plate is placed on both glass bodies in order to use the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

The front surface of the panel 870 is provided with a color filter 880 to transmit the light projected from the panel 870, only the red, green and blue light for each pixel can represent an image.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100, 835: light emitting device package 110: package body
121 and 122: first and second electrode layers 130: light emitting device
131 and 132: first and second electrodes 141 and 142: wire
150, 151: resin layer 160: film
162: red phosphor layer 164: yellow phosphor layer
166: green phosphor layer 170: light diffuser
200: base sheet 400: housing
500: radiator 600: light source
700: holder 800: display device
810: bottom cover 820: reflector
830: circuit board module 840: light guide plate
850, 860: first and second prism sheet 870: panel
880 color filter

Claims (16)

A package body in which a cavity is formed;
A light emitting element disposed in the cavity;
A film disposed on the light emitting device and including at least three phosphor layers emitting light of different wavelengths, at least a part of which is disposed in the cavity; And
A light emitting device package comprising a resin layer disposed between the light emitting device and the film. The method of claim 1,
And a distance between the phosphor layer disposed adjacent to the light emitting element and the side surface of the cavity is equal to or smaller than a distance between the phosphor layer disposed close to the upper surface of the cavity and the side surface of the cavity. The method of claim 1, wherein the film,
A light emitting device package comprising a red phosphor layer, a yellow phosphor layer and a green phosphor layer. The method of claim 1,
The peak wavelength of light emitted from the phosphor layer disposed far from the light emitting device is a short wavelength region than the peak wavelength of light emitted from the phosphor layer disposed close to the light emitting device. The method of claim 1, wherein the at least three phosphor layers,
An integrated light emitting device package. The method of claim 1, wherein the film,
And a red phosphor layer on the light emitting device, a yellow phosphor layer on the red phosphor layer, and a green phosphor layer on the yellow phosphor layer. The method of claim 1, wherein the resin layer,
The light emitting device package disposed between the film and the side of the cavity. The method of claim 1, wherein the film,
Cube-shaped light emitting device package. The method of claim 1, wherein the cavity,
And a cross-sectional area of a region far from the light emitting element is larger than a cross-sectional area of a region close to the light emitting element. The method of claim 1, wherein the film,
And a cross-sectional area of a region far from the light emitting element is larger than a cross-sectional area of a region near the light emitting element. The method of claim 1,
The cavity has a cross-sectional area of an area farther from the light emitting device than a cross-sectional area of an area closer to the light emitting device, and the film has a cross-sectional area of an area farther from the light emitting device than a cross-sectional area of an area close to the light emitting device, and a cross-sectional area of the cavity. A light emitting device package, the increase rate is greater than the cross-sectional area increase rate of the film. The method of claim 1, wherein each phosphor layer,
Light emitting device package with a thickness of 20-100 micrometers. The method of claim 1, wherein the film,
Light emitting device package less than 300 micrometers thick. The method of claim 1,
The cavity is disposed having a step, the resin layer is disposed on the first end of the cavity, the film package is disposed on the second end of the cavity. 15. The method of claim 14,
Light emitting device package further comprising a resin layer on the film. 16. An illumination system comprising the light emitting device package of any one of claims 1-15.

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