KR101762322B1 - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR101762322B1
KR101762322B1 KR1020100129865A KR20100129865A KR101762322B1 KR 101762322 B1 KR101762322 B1 KR 101762322B1 KR 1020100129865 A KR1020100129865 A KR 1020100129865A KR 20100129865 A KR20100129865 A KR 20100129865A KR 101762322 B1 KR101762322 B1 KR 101762322B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
light
phosphor layer
electrode layer
Prior art date
Application number
KR1020100129865A
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Korean (ko)
Other versions
KR20120068297A (en
Inventor
윤형선
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100129865A priority Critical patent/KR101762322B1/en
Publication of KR20120068297A publication Critical patent/KR20120068297A/en
Application granted granted Critical
Publication of KR101762322B1 publication Critical patent/KR101762322B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

An embodiment includes a package body including a cavity; A first electrode layer and a second electrode layer formed on a bottom surface of the cavity; A light emitting element mounted on a bottom surface of the cavity and electrically connected to the first electrode layer and the second electrode layer; A molding part surrounding the light emitting device; And a phosphor layer patterned on the surface of the molding part.

Description

[0001] LIGHT EMITTING DEVICE PACKAGE [0002]

Embodiments relate to a light emitting device package and a manufacturing method thereof.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using semiconductor materials of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

In the light emitting device module, the light emitting device such as the above-described light emitting diode is fixed on a circuit board and supplied with current, and the light emitting device module is used for an illumination device, a display device, etc., Contact properties are particularly important.

The embodiment intends to improve the light efficiency of the light emitting device package.

An embodiment includes a package body including a cavity; A first electrode layer and a second electrode layer formed on a bottom surface of the cavity; A light emitting element mounted on a bottom surface of the cavity and electrically connected to the first electrode layer and the second electrode layer; A molding part surrounding the light emitting device; And a phosphor layer patterned on the surface of the molding part.

Here, the phosphor layer may be formed at 10% to 80% of the surface of the molding portion.

The phosphor layer may be patterned in a stripe shape.

The phosphor layer may be patterned into a plurality of polygonal shapes.

The area of the phosphor layer formed on the light emitting device may be larger than the area of the light emitting device.

The area of the phosphor layer formed on the light emitting element may be larger than the area of the other phosphor layers.

The phosphor layer may be patterned into at least two arcs having different diameters and a predetermined width.

The at least two arcs may have the same center.

The phosphor layer may be patterned in a polygonal or circular shape in a region corresponding to the light emitting device.

Further, the width of the polygonal or circular shape may be wider than the width of the light emitting device.

Another embodiment includes filling a molding material on a package body on which a light emitting device is mounted; And patterning the phosphor layer on a part of the emission area of the light emitted from the light emitting device on the molding material.

Here, the phosphor layer may be patterned at 10% to 80% of the light emitting area.

In the step of patterning the phosphor layer, a phosphor layer material may be applied to the entire surface of the molding part, and a part of the phosphor layer material may be removed using a mask.

Further, in the step of patterning the phosphor, a mask may be placed on the molding part, and the phosphor layer material may be selectively coated.

The light emitting device package according to the embodiment has improved light efficiency.

1 is a sectional view of an embodiment of a light emitting device package,
2 is a schematic view of a conventional light emitting device package,
3 to 7 are plan views of the light emitting device package of FIG. 1,
8A to 8D are views showing an embodiment of a manufacturing process of the light emitting device package of FIG. 1,
9A and 9B are views showing another embodiment of the manufacturing process of the light emitting device package of FIG. 1,
9C and 9D are views showing other embodiments of the light emitting device package,
10 is an exploded perspective view of an embodiment of a lighting apparatus in which a light emitting device package is disposed,
11 is an exploded perspective view of a display device in which a light emitting device package is disposed.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

In describing the above embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and " under" include both being formed "directly" or "indirectly" In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

1 is a cross-sectional view of an embodiment of a light emitting device package.

The light emitting device package 100 according to the embodiment includes a package body 10, a first electrode layer 21 and a second electrode layer 22 on the package body 10, A light emitting element 30 mounted on the first electrode layer 21 and the second electrode layer 22 and electrically connected to the molding portion 50 surrounding the light emitting element 30, And a phosphor layer 60 formed on a part of the emission area of the light emitted from the light emitting element 30. [

The package body 10 may be formed of a silicon material, a synthetic resin material, or a metal material. A cavity including the inclined surface 10a may be formed around the light emitting device 10, .

The first electrode layer 21 and the second electrode layer 22 are electrically isolated from each other and provide power to the light emitting device 30. The first electrode layer 21 and the second electrode layer 22 may increase the light efficiency by reflecting the light generated from the light emitting device 30, As shown in FIG.

The light emitting device 30 may be a light emitting diode and may be mounted on the package body 10 through a conductive adhesive layer 35 or may be formed on the first electrode layer 21 or the second electrode layer 22 As shown in FIG. . In this embodiment, the first electrode layer 21 and the second electrode layer 22 are formed on the bottom surface of the cavity in the package body 10, and the light emitting device 30 is mounted on the bottom surface of the cavity.

The light emitting device 30 may be electrically connected to the first electrode layer 21 and the second electrode layer 22 by a wire bonding method as shown in FIG. As shown in FIG.

The molding part 50 may be made of silicon or epoxy resin, and may protect the light emitting device 30 and the wire 40.

The phosphor layer 60 on the molding part 50 can change the wavelength of light emitted from the light emitting device 30 to a longer wavelength. For example, in the light emitting device 30, And the phosphor layer 60 is excited by light in the blue wavelength range to emit light in the yellow wavelength range, and light in the blue wavelength range and light in the yellow wavelength range are mixed, The light of the white wavelength region can be realized.

At this time, when light of a blue wavelength region having a high energy is absorbed into the phosphor layer 60, some light may be reflected by the phosphor layer 60 and proceed inside the light emitting device package 100. In addition, the light emitting device 30 has a relatively high light absorbance, and light efficiency may be degraded if light reflected from the phosphor layer 60 is absorbed by the light emitting device 30. FIG.

That is, the light emitting device package shown in FIG. 2 includes the phosphor layer 60 in the molding part 50, so that the light reflected by the phosphor layer 60 is absorbed by the light emitting element 30, have.

The phosphor layer 60 is not disposed on the entire surface of the molding part 50 but is disposed on a part of the surface area of the molding part 50. Accordingly, a part of the emission area of the light emitted from the light emitting device 30 60 are formed.

The phosphor layer 60 is formed at 10% to 80% of the emission area of the light projected from the light emitting device 30, and the phosphor layer 60 is locally formed, The amount of reflection of light into the light emitting device package 100 can be reduced.

If the arrangement area of the phosphor layer 60 is too narrow, it is not enough to change the wavelength of the light emitted from the light emitting device 30. If the arrangement area of the phosphor layer 60 is too wide, The reflectance of the light emitted from the light source 30 is excessively increased.

3 to 7 are plan views of the light emitting device package of Fig.

In FIG. 3, the phosphor layer 60 is patterned into a plurality of rectangular shapes on the molding part 50. In this case, the light emitting device 30 may not be hidden from the molding part 50, but the molding part 50 is omitted to illustrate the structure of the cavity of the light emitting device package 100 . The inclined surface 10a of the package body 10 is shown differently from the package body 10a for convenience of description.

Here, the phosphor layer 60 does not necessarily have a rectangular shape, but may be triangular or other polygonal or circular. However, considering the patterning process of the phosphor layer 60 as described later, a quadrangle is the easiest.

In this figure, the inclined surface 10a and the inclined surface 10a are the emission areas of the light projected from the light emitting device 30, and the area of the phosphor layer 60 is 10 to 100 times the emission area of the light. 80%. At this time, some light emitted from the light emitting device 30 may be directly emitted to the outside without passing through the phosphor layer 60. However, in the light emitting device package as a whole, the light projected to the outside is mainly white .

The embodiment shown in FIG. 4 is the same as the embodiment shown in FIG. 3 except that the area of the phosphor layer 60a formed on the upper portion of the light emitting element 30 corresponds to the light emitting element 30, 30). That is, since the amount of light directly projected onto the upper portion of the light emitted from the light emitting device 30 is large, the light is arranged to pass through the phosphor layer 60a.

3 and 4, the phosphor layers 60a and 60b have the same area but may be arranged differently from each other, and the area of the phosphor layer 60a corresponding to the light emitting element 30 is arranged larger .

In the embodiment shown in Fig. 5, the phosphor layers 60a, 60b and 60c are patterned in a stripe shape. Here, the phosphor layers 60a, 60b, and 60c have the same width but may be arranged with different widths, and the area of the phosphor layer 60a corresponding to the light emitting element 30 may be larger have.

In the embodiment shown in Fig. 6, the phosphor layer is composed of the phosphor layer 60a corresponding to the light emitting element 30 and the phosphor layers 60b and 60c having a predetermined width in the peripheral portion. The at least two phosphor layers 60b and 60c have the same center.

Here, the respective phosphor layers 60b and 60c have the same width, but they can be arranged with different widths. The phosphor layer 60a corresponding to the light emitting element 30 may be arranged in a polygonal shape or a circular shape. In this case, the width of the phosphor layer 60a corresponding to the light emitting element 30 may be different from that of the phosphor layers 60b, 60c. ≪ / RTI > The width of the phosphor layer 60a corresponding to the light emitting element 30 means the length of one side and the diameter when the phosphor layer 60a is circular.

In the light emitting device package according to the above-described embodiments, the amount of light reflected from the phosphor layer to the inside is reduced, so that the light efficiency of the entire package can be improved.

8A to 8D are views showing an embodiment of a manufacturing process of the light emitting device package of FIG.

First, the molding material 50 is filled on the package body 10 on which the light emitting device 30 is mounted. The first electrode layer 21 and the second electrode layer 22 are formed on the package body 10 and the light emitting element 30 is electrically connected to the first electrode layer 21 and the second electrode layer 22, (Not shown). The molding material 50 is filled with the cavity shown in the housing part 50a and then cured to protect the light emitting device 30 and the wires 40 as shown in FIG. 8B.

8C, a material of the phosphor layer 60 is coated on the molding part 50, and a part of the material of the phosphor layer 60 is removed by using the mask 200 and patterned. At this time, the phosphor layer 60 may be patterned to remain only a part of the emission area of the light projected from the light emitting device 30. As described above, the phosphor layer 60 may be formed only in an area of 10 to 80% 60 may remain. The mask 200 having various shapes may be used depending on the arrangement shape of the phosphor layer 60 described above.

9A and 9B are views showing another embodiment of the manufacturing process of the light emitting device package of FIG.

The process of filling the molding material 50 on the package body 10 on which the light emitting element 30 is mounted in Fig. 9A is the same as in Fig. 8A. Then, as shown in FIG. 9B, the mask 200 may be placed on the molding part 50 to selectively apply the material of the phosphor layer 60.

9C and 9D are views showing another embodiment of the light emitting device package. Although the light emitting device package in which the horizontal light emitting device is mounted is shown in the above embodiment, the package in which the vertical light emitting device is mounted is shown in Fig. 9C, and the package in which the flip chip emitting device is mounted in Fig. 9D . In FIG. 9C, the vertical light emitting device 30 is mounted in the cavity, a wire 40 is bonded to one electrode layer 22, and a conductive adhesive 35 is connected to the other electrode layer 21.

9D, the flip-chip type light emitting device 30 is connected to the electrode layers 21 and 22 through a conductive adhesive 35 such as solder, and the light emitting device 30 ) May be mounted.

The above-described light emitting device package can be mounted on a printed circuit board in a plurality, but the invention is not limited thereto.

Other embodiments may be implemented with an indicator device, an illumination system, including the light emitting device package described in the above embodiments, for example, the illumination system may include a lighting device such as a lamp, a streetlight, Or the like. Here, the light guide plate, the prism sheet, the diffusion sheet, and the like, which are optical members, may be disposed on the light path of the light emitting device package according to the above-described embodiment.

10 is an exploded perspective view of an embodiment of a lighting apparatus in which a light emitting device package is disposed.

The illumination device according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation unit 500 for emitting heat of the light source 600, And a holder 700 for coupling the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. The body 420 may have one air flow hole 430 formed therethrough.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The light source 600 includes a plurality of light emitting device packages 650 on a substrate 610. Here, the substrate 610 may be inserted into the opening of the housing 400, and may be formed of a material having a high thermal conductivity to transmit heat to the heat dissipating unit 500 as described later.

In addition, a holder 700 is provided under the light source, and the holder 700 may include a frame and another air flow hole. Although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

11 is an exploded perspective view of an embodiment of a display device including a backlight in which a light emitting device package is disposed.

The display device 800 according to the present embodiment includes the light emitting device modules 830 and 835, the reflection plate 820 on the bottom cover 820, and the reflection plate 820 disposed in front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840, a second prism sheet 860 disposed on the front side of the light guide plate 840, A panel 870 disposed in front of the panel 860 and a color filter 880 disposed in the front of the panel 870.

The light emitting device module includes the light emitting device package 835 on the substrate 830. [ Here, a PCB or the like may be used for the substrate 830, and the light emitting device package 835 is as described with reference to FIG.

The bottom cover 810 may house the components in the display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing or may be formed on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 in a state of being coated with a highly reflective material It is also possible.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters the light emitted from the light emitting device package so that the light is uniformly distributed over the whole area of the screen of the liquid crystal display device. Accordingly, the light guide plate 840 is made of a material having a good refractive index and transmittance. The light guide plate 840 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE).

In addition, the first prism sheet 850 is formed of a light-transmitting and elastic polymeric material on one side of the support film, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys of one surface of the support film in the first prism sheet 850. This is to uniformly distribute the light transmitted from the light emitting device module and the reflective sheet in all directions of the panel 870.

Although not shown, a protective sheet may be provided on each of the prism sheets. A protective layer including light diffusing particles and a binder may be provided on both sides of the support film. The prism layer may be formed of a material selected from the group consisting of polyurethane, styrene-butadiene copolymer, polyacrylate, polymethacrylate, polymethylmethacrylate, polyethylene terephthalate elastomer A polymer material selected from the group consisting of polyethyleneterephthalate elastomer, polyisoprene, and poly silicon.

Although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and the light incidence angle may be maximized by refracting and scattering light incident from the backlight unit. The diffusion sheet includes a support layer including a light diffusing agent, a first layer formed on the light exit surface (first prism sheet direction) and a light incidence surface (reflection sheet direction) You can include layers.

The support layer is formed by mixing 100 parts by weight of a resin obtained by mixing a methacrylic acid-styrene copolymer and a methyl methacrylate-styrene copolymer with 0.1 to 10 parts by weight of a siloxane-based light diffusing agent having an average particle diameter of 1 to 10 micrometers And 0.1 to 10 parts by weight of an acrylic light-diffusing agent having an average particle diameter of 1 to 10 micrometers.

The first layer and the second layer may contain 0.01 to 1 part by weight of an ultraviolet absorber and 0.001 to 10 parts by weight of an antistatic agent per 100 parts by weight of the methyl methacrylate-styrene copolymer resin.

In the diffusion sheet, the thickness of the supporting layer may be 100 to 10000 micrometers, and the thickness of each layer may be 10 to 1000 micrometers.

In this embodiment, the diffusion sheet, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be made of other combinations, for example, a microlens array, A combination of a lens array or a combination of a prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 870. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that only the red, green, and blue light is transmitted for each pixel of the light projected from the panel 870.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: Package body 10a:
21, 22: first and second electrode layers 30:
35: conductive adhesive layer 40: wire
50: molding part 60, 60a, 60b, 60c: phosphor layer
100: light emitting device package 200: mask
400: housing 500:
600: light source 700: holder
800: Display device 810: Bottom cover
820: reflection plate 830: light emitting element module
840: light guide plate 850, 860: first and second prism sheets
870: Panel 880: Color filter

Claims (14)

A package body including a cavity;
A first electrode layer and a second electrode layer formed on a bottom surface of the cavity;
A light emitting element mounted on a bottom surface of the cavity and electrically connected to the first electrode layer and the second electrode layer;
A molding part surrounding the light emitting device; And
And a plurality of phosphor layers selectively disposed on the surface of the molding portion,
The area of the phosphor layer formed on the light emitting device is larger than the area of the light emitting device and is wider than the area of the other phosphor layer, the upper surface of the molding part is flat and the plurality of phosphor layers are formed on the upper part of the molding part Emitting element package. The method according to claim 1,
Wherein the plurality of phosphor layers are formed at 10% to 80% of the surface area of the molding portion. 3. The method according to claim 1 or 2,
And the plurality of phosphor layers are patterned in a stripe shape. 3. The method according to claim 1 or 2,
Wherein the plurality of phosphor layers are patterned in a polygonal shape. 3. The method according to claim 1 or 2,
And the height of the upper surface of the molding part is equal to the height of the upper surface of the package body. 3. The method according to claim 1 or 2,
The height of the upper surface of the plurality of phosphor layers is higher than the height of the upper surface of the package body. 3. The method according to claim 1 or 2,
Wherein the plurality of phosphor layers are patterned with at least two arcs having different diameters and a predetermined width. 8. The method of claim 7,
Wherein the at least two arcs have the same center. 8. The method of claim 7,
Wherein the plurality of phosphor layers are patterned in a polygonal or circular shape in a region corresponding to the light emitting element. 10. The method of claim 9,
And the width of the polygonal or circular shape is larger than the width of the light emitting element. delete delete delete delete
KR1020100129865A 2010-12-17 2010-12-17 Light emitting device package KR101762322B1 (en)

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Application Number Priority Date Filing Date Title
KR1020100129865A KR101762322B1 (en) 2010-12-17 2010-12-17 Light emitting device package

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KR20120068297A KR20120068297A (en) 2012-06-27
KR101762322B1 true KR101762322B1 (en) 2017-07-27

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198997A (en) 2007-01-15 2008-08-28 Sanyo Electric Co Ltd Semiconductor light-emitting apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198997A (en) 2007-01-15 2008-08-28 Sanyo Electric Co Ltd Semiconductor light-emitting apparatus

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