KR101863868B1 - Light emitting device module and illumination system including the same - Google Patents

Light emitting device module and illumination system including the same Download PDF

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Publication number
KR101863868B1
KR101863868B1 KR1020110032849A KR20110032849A KR101863868B1 KR 101863868 B1 KR101863868 B1 KR 101863868B1 KR 1020110032849 A KR1020110032849 A KR 1020110032849A KR 20110032849 A KR20110032849 A KR 20110032849A KR 101863868 B1 KR101863868 B1 KR 101863868B1
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KR
South Korea
Prior art keywords
conductive layer
light emitting
heat transfer
transfer member
cavity
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KR1020110032849A
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Korean (ko)
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KR20120114977A (en
Inventor
이건교
오남석
유영헌
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엘지이노텍 주식회사
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Priority to KR1020110032849A priority Critical patent/KR101863868B1/en
Priority to US13/242,529 priority patent/US8829557B2/en
Publication of KR20120114977A publication Critical patent/KR20120114977A/en
Application granted granted Critical
Publication of KR101863868B1 publication Critical patent/KR101863868B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

An embodiment includes a heat transfer member forming a cavity; An insulating layer patterned to expose at least a part of the heat transfer member on a bottom surface of the cavity; A first conductive layer and a second conductive layer located on the heat transfer member with the insulating layer therebetween and electrically separated from each other; And a light emitting element located on the heat transfer member at a bottom surface of the cavity and electrically connected to the first conductive layer and the second conductive layer, Device module.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device module,

Embodiments relate to a light emitting device module and an illumination system including the same.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using semiconductor materials of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

BACKGROUND ART A light emitting device package in which a light emitting element is mounted on a package body and is electrically connected is widely used in a lighting device or a display device.

The embodiment intends to improve the heat dissipation characteristics of the light emitting element module and improve the element stability inside the cavity.

An embodiment includes a heat transfer member forming a cavity; An insulating layer patterned to expose at least a part of the heat transfer member on a bottom surface of the cavity; A first conductive layer and a second conductive layer located on the heat transfer member with the insulating layer therebetween and electrically separated from each other; And a light emitting element located on the heat transfer member at a bottom surface of the cavity and electrically connected to the first conductive layer and the second conductive layer, Device module.

Another embodiment includes a heat transfer member forming a cavity; An insulating layer patterned to expose at least a part of the heat transfer member on a bottom surface of the cavity; A first conductive layer and a second conductive layer located on the heat transfer member with the insulating layer therebetween and electrically separated from each other; And a light emitting element located on the heat transfer member at a bottom surface of the cavity and electrically connected to the first conductive layer and the second conductive layer, A light emitting device module having an open region is provided.

The insulating layer may include polyimide.

The insulating layer may have a thickness of at least 5 micrometers.

The light emitting element may be fixed on the heat transfer member with an adhesive.

The heat transfer member may comprise copper or aluminum.

And a reflective layer formed on the first conductive layer and the second conductive layer inside the cavity.

The exposed width of the insulating layer may be between 10 and 50 micrometers.

The light emitting device module further includes a circuit board electrically connected to the first conductive layer and the second conductive layer on the first conductive layer and the second conductive layer, respectively, and the insulating layer prevents the conductive adhesive from being drawn in .

The width of the open area may be 10 to 50 micrometers.

The open area may have a shape of at least one of a straight line and a curved line.

Wherein the open region has at least one shape of a straight line or a curved line on at least two different lines, and both side regions of the first conductive layer and the second conductive layer, which are divided around the open region, And may be electrically connected to each other through at least one connecting portion.

The connecting portions located on different lines may not overlap each other spatially.

Open lines on different lines may have the same pattern.

At least two light emitting elements are disposed in one cavity, and the light emitting elements are wire-bonded to each other, and the light emitting element at the edge is wire-bonded to the first conductive layer or the second conductive layer.

The heat transfer member can be exposed in the short axis direction in the cavity.

Another embodiment provides an illumination system in which the above-described light emitting element module is disposed.

The light emitting device module according to the embodiment improves the heat dissipation property and improves the stability of the light emitting element in the cavity.

1A and 1B are views showing first and second embodiments of a light emitting device module,
2 to 5 are views showing patterns of an insulating layer exposed in the light emitting device module,
6 is an enlarged view of a portion 'A' in FIG. 1,
7 is a perspective view of a third embodiment of the light emitting device module,
8A to 8G are views showing an embodiment of a method of manufacturing the light emitting device module of FIG. 1A,
9 is a view showing a fourth embodiment of a light emitting device module,
10A to 10E and 11 are views showing a fifth embodiment of a light emitting device module and a manufacturing method thereof,
12 is a view showing a sixth embodiment of a light emitting device module,
13 is a view showing a seventh embodiment of the light emitting element module,
14 and 15 are views showing one embodiment of a light emitting device module array,
16 is an enlarged view of a part of the light emitting element module array of Fig. 14,
17 is a sectional view taken along the line A-A 'and the line B-B' of FIG. 16,
18A and 18B are a plan view and a sectional view of the eighth embodiment of the light emitting element module,
18C and 18D are a plan view and a sectional view of the ninth embodiment of the light emitting element module,
19 is a view showing a tenth embodiment of the light emitting element module,
20 is a view showing an eleventh embodiment of a light emitting element module,
21 is a view showing an embodiment of a lighting apparatus including a light emitting element module,
22 is a view showing an embodiment of a display device including a light emitting element module.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

1A and 1B are views showing first and second embodiments of a light emitting device module.

In the light emitting device module according to the embodiment, the light emitting device 240 is disposed in a cavity formed in the heat transfer member 210. The light emitting device 240 may include a vertical light emitting device, a horizontal light emitting device, and a flip chip type light emitting device. As the heat transfer member 210, a material having excellent thermal conductivity may be used. For example, copper (Cu) or aluminum may be used.

The light emitting device 240 may be disposed on the bottom surface of the cavity formed in the heat transfer member 210, and the side walls of the cavity may be formed vertically. In the present embodiment, the width of the side wall of the cavity becomes wider toward the upper side with reference to the drawing, and the width of the cavity gradually increases.

Although the heat transfer member 210 forming the cavity is bent at a sharp angle, it may be bent in a streamlined manner as shown in FIG. 9 and the like.

An insulating layer 220 is formed on the heat transfer member 210. The insulating layer 220 may be formed of polyimide, for example. The insulating layer 220 may be patterned to expose at least a portion of the heat transfer member 210 on the bottom surface of the cavity. That is, the material forming the insulating layer 220 may not be formed on at least a part of the bottom surface of the cavity.

The first conductive layer 230 and the second conductive layer 230 are formed with the insulating layer 220 interposed therebetween. As described later, the first and second conductive layers 230 form a current through the light emitting device 240 So that it can be electrically isolated from the heat transfer member 210 by the insulating layer 220.

That is, the first and second conductive layers 230 may be formed in the same shape as the insulation layer 220, but the first and second conductive layers 230 and 230 may be formed in a region adjacent to the circuit board 270, A part of the insulating layer 220 may be exposed. The first and second conductive layers 230 may include a copper foil or the like.

The light emitting device 240 is electrically connected to the first and second conductive layers 230. For example, a wire 250 is bonded. The resin layer 260 is filled in the cavity to protect the light emitting device 240 and the wire 250. At this time, the resin layer 260 includes a phosphor to change the wavelength of light emitted from the light emitting device 240.

The heat transfer member 210 is horizontally disposed at an upper portion of the outer periphery of the cavity. The heat transfer member 210 is disposed horizontally on the heat transfer member 210, between the insulating layer 220 and the first and second conductive layers 230 And the circuit board 270 is connected.

The circuit board 270 may be coupled to the first and second conductive layers 230 through the conductive adhesive 280. The circuit board 270 may be a printed circuit board, or may be a metal PCB such as MPCB or MCPCB.

A part of the insulating layer 220 is exposed in a region between the cavity and the circuit board 270 as shown in part A of FIG. 1A. That is, as described above, a portion of the first and second conductive layers 230 is not formed in the region and is opened so that the insulating layer 220 is exposed. At this time, the conductive adhesive 280 may not be formed on the exposed insulating layer 220.

In the embodiment shown in FIG. 1B, a reflective layer 235 is formed on the first and second conductive layers 230 in the cavity. The reflective layer 235 is a material for reflecting light emitted from the light emitting device 240 and transmitting the light to the outside of the cavity, and may be coated with silver (Ag) or the like.

The heat transfer member 210 may be superimposed on the substrate 100 through the adhesive layer 110. The substrate 100 may serve as a body of the light emitting device module, and may function as a bracket for supporting the light source module in the backlight unit if made of metal.

The adhesive layer 110 is excellent in thermal conductivity and can bond the substrate 100 and the heat transfer member 210. The heat emitted from the light emitting device 240 is directly transferred to the substrate 100 such as a bracket through the heat transfer member 210 so that the heat dissipation efficiency is improved by not using the PPA resin in the backlight unit, .

FIGS. 2 to 5 are views showing patterns of an insulating layer exposed in the light emitting device module, and FIG. 6 is an enlarged view of a portion 'A' in FIG.

As shown, the insulating layer 220 is partially exposed in the area between the circuit board 270 and the cavity. In order to electrically connect the light emitting device 240 and the circuit board 270, the first conductive layer 230 or the second conductive layer 230 on both sides of the exposed insulating layer 220 may be electrically .

The insulating layer 220 may be disposed on at least one line adjacent to the circuit board 270. At least one of the first conductive layer and the second conductive layer may be disposed on a portion of the line, Emitting device 240 and the circuit board 270 are electrically connected to each other.

That is, in the embodiment shown in FIGS. 2 to 5, the first conductive layer or the second conductive layer 230 is formed on a part of the shape of the insulating layer 220 exposed.

In FIG. 2, the insulating layer 220 is exposed in one line type. In FIG. 3, the insulating layer 220 is exposed in two line types. In FIG. 4, the insulating layer 220 In FIG. 5, the insulating layer 220 is exposed in three line types.

A part of the conductive adhesive 280 overflows in the process of bonding the first and second conductive layers 230 and the circuit board 270 to the insulating layer 220, Can be prevented.

At this time, the width of the exposed portion (d in FIG. 2) of the insulating layer 220 may be 10 to 50 micrometers. If the width is too narrow, it is not enough to cut the conductive adhesive 280, It may be inefficient in designing the light emitting device package or module.

That is, a part of the conductive adhesive 280 flows from above the first and second conductive layers 230 to flow into the cavity, and the discoloration of the resin layer 260 and the like, and the decrease in luminance of light emitted from the light emitting element 240 Or may cause color change. Therefore, in this embodiment, a part of the insulating layer 220 may be exposed to block the conductive adhesive 280, and the conductive adhesive 280 may not be transmitted to the surface of the insulating layer 220. A portion of the first conductive layer 230 or the second conductive layer 230 is formed in the exposed region of the insulating layer 220 for electrical connection between the light emitting device 240 and the circuit board 270 as described above .

2, the insulating layer 220 is exposed in a straight line, and the first conductive layer or the second conductive layer 230 in both side regions (first and second regions) of the exposed insulating layer 220 are exposed to each other And is electrically connected. For this electrical connection, a first conductive layer or a second conductive layer is formed on a part of the linear shape of the exposed insulating layer 220 as 230a and 230b.

 3 to 5, when the insulating layer 220 is exposed in two or more lines and the exposure pattern of the insulating layer 220 in each line is changed, the conductive adhesive ( The first conductive layer 230 or the second conductive layer 230 may be formed on the insulation layer 220 exposed in two lines in FIG. The first conductive layer or the second conductive layer 230 does not correspond to each other. The first conductive layer 230 or the second conductive layer 230 is formed on the other end of the line-shaped insulating layer 220 on each line.

That is, the open region on the first and second conductive layers 230 has at least one of a straight line and a curved line on at least two different lines, and the open region in each of the first and second conductive layers 230 The two side regions (the region 1 and the region 2 in FIG. 2) divided into the center can be electrically connected to each other through at least one connecting portion located on the different line.

Therefore, since the connection portions on the different lines do not overlap each other or correspond to each other, it is difficult for the conductive adhesive 280 to pass through another line even if the conductive adhesive 280 penetrates through the insulation layer 220 in one line.

The line shape formed by exposing the insulating layer 220 may be curved as shown in FIG. 4B in addition to a straight line. In this case, the open regions on different lines may have the same pattern.

7 is a perspective view of a third embodiment of the light emitting element module.

In this embodiment, two light emitting devices 240 are disposed in a cavity. Further, wires are connected to the two electrode pads 242 and 244 on the light emitting element 240, respectively. The two light emitting devices 240 are connected to the first and second conductive layers 230 through wires and each of the light emitting devices 240 is electrically connected to each other through the third conductive layer 258 of the island- .

The electrode pads 255 are formed on the first and second conductive layers connected to the light emitting devices 240 by wires. Inside the cavity, the resin layer 260 is filled to protect the light emitting device 240 and the wires.

Also in this embodiment, a part of the first and second conductive layers 230 is patterned between an external circuit board (not shown) and the cavity, and a part of the insulating layer 220 is exposed.

8A to 8G are views showing an embodiment of a method of manufacturing the light emitting device module of FIG. 1A.

First, an insulating layer 220 and a conductive layer 230 are formed on a base substrate 290 as shown in FIG. 8A. At this time, the insulating layer 220 may be fixed to the base substrate 290 using an adhesive 295.

Here, as the conductive layer 230 to which the insulating layer 220 is adhered, a copper foil having a polyimide film bonded thereto can be used. The polyimide has a thickness of only 5 micrometers (탆) and is very advantageous in heat resistance .

A mask 300 is formed on the conductive layer 230 and the conductive layer 230 is patterned using the mask 300 as shown in FIG.

First, three open regions are shown in FIG. 8C by patterning the conductive layer 230. The open region in the middle corresponds to the bottom surface of the cavity in FIG. 1A, and the left and right conductive layers 230 become the first and second conductive layers, respectively. The conductive layer 230 has an open area narrower than that of the conductive layer 230. Each open area of the conductive layer 230 becomes an exposed area of the insulating layer 220 in FIG. 1A.

Then, as shown in FIG. 8D, the insulating layer in the area corresponding to the bottom surface of the cavity is also removed. At this time, since the base substrate 290 is to be removed in a process to be described later, the base substrate 290 may be patterned together or not.

8E, the base substrate 290 is removed, and the heat transfer member 210 is bonded to the insulating layer 210. Then, as shown in FIG. At this time, the conventional adhesive 295 may be used, or an adhesive 295 may be further used. The base substrate 290 acts as a stiffener in the manufacturing process and is then removed.

At this time, the insulating layer 220 and the adhesive 295 are provided in two layers between the heat transfer member 210 and the conductive layer 230, and the polyimide or the like is responsible for electrical insulation and the adhesive 295 is bonded So that optimization can be made and consequently the thermal conductivity characteristics are improved.

In addition, the light emitting element 240 is supported by a heat transfer member 210 such as a metal, which is thicker than the copper foil, so that the reliability is remarkably improved and there is no need to reinforce the rigidity with the transparent resin, thereby widening the selection range of the resin layer material, .

The insulating layer 220 and the adhesive 295 may be formed together to greatly improve the heat dissipation characteristics. For example, the conductive layer 230 made of a copper foil having a thickness of 18 micrometers and the copper foil having a thickness of 125 micrometers When only the polyimide insulating layer 220 is used between the heat transfer members 210, the thickness of the insulating layer 220 is required to be about 20 to 30 micrometers, for example, in view of tolerance and adhesion.

However, in the present embodiment, the insulating layer 220 and the adhesive 295 are provided together to reduce the thickness of the polyimide. The polyimide is thinly coated on the conductive layer 230 made of the copper foil to form the insulating layer 220 ). As a result, the thickness of the insulating layer 220 of polyimide can be realized to be 5 micrometers. At this time, since the polyimide insulating layer 220 having a thickness of 5 micrometers is responsible for the insulation resistance, the adhesive 295 can increase the thermal conductivity.

Then, as shown in FIG. 8F, pressure is applied to the heat transfer member 210 so as to form a cavity, thereby bending the heat transfer member. At this time, the insulating layer 220 and the first and second conductive layers 230 are also bent. The cavity may have a curve shape as shown in FIG. 8F, or may be formed with an inflection point as shown in FIG. 1A or the like.

8G, the light emitting device 240 is mounted on the bottom surface of the cavity. The light emitting device 240 is bonded to the first and second conductive layers 230 and the wires 250. At this time, the electrode pad 255 may be formed on the first and second conductive layers 230 to which the wire 250 is bonded.

9 is a view showing a fourth embodiment of the light emitting device module.

8G. However, the light emitting device 240 is adhered to the heat transfer member 210 with an adhesive 295. In this embodiment, The adhesive 295 may use, for example, a thermal pad.

10A to 10E and 11 are views showing a fifth embodiment of a light emitting device module and a manufacturing method thereof.

The present embodiment does not use the base substrate 290 unlike the embodiment shown in FIG. 8A and the like. First, as shown in FIG. 10A, a heat transfer member 210 is prepared. As the heat transfer member 210, a material having excellent thermal conductivity may be used. For example, copper (Cu) or aluminum may be used.

Then, as shown in FIG. 10B, the insulating layer 220 and the conductive layer 230 are fixed using the adhesive 295 on the heat transfer member 210.

Then, as shown in Fig. 10C, the conductive layer 230 is patterned. At this time, a part of the conductive layer 230 is removed to expose the insulating layer 220. The exposed region S is formed by the conductive layer 230 as a first conductive layer and a second conductive layer .

The removal process of a part of the conductive layer 230 may cover the mask and selectively remove the conductive layer 230 as shown in FIG. 8B and the like. In this embodiment, both ends of the conductive layer 230 are not removed, and a part of the insulating layer 220 is not exposed. However, as shown in FIG. 8C and the like, the insulating layer 220 is exposed at the periphery of the cavity An open region can be formed, and the same is true in the following embodiments.

Then, as shown in FIG. 10D, pressure is applied to the heat transfer member 210 so as to form a cavity, thereby bending the heat transfer member. At this time, the insulating layer 220 and the first and second conductive layers 230 are also bent. In addition, the cavity may have a curved shape at the edges as shown in FIG. 10D, or may have an edge at an inflection point.

As shown in FIG. 10E, a reflective layer 235 is formed on the first and second conductive layers 230 and 230. The reflective layer 235 is a material for reflecting light emitted from the light emitting device 240 and transmitting the light to the outside of the cavity, and may be coated with silver (Ag) or the like.

When the light emitting device 240 is disposed in the cavity of the heat transfer member 210, the light emitting device package shown in FIG. 11 is completed. In the light emitting device package, when the heat transfer member 210 is overlapped with the substrate 100 through the adhesive layer 110, the light emitting device module is completed.

The substrate 100 may serve as a body of the light emitting device module, and may function as a bracket for supporting the light source module in the backlight unit if made of metal. In FIG. 11, the light emitting device 240 is bonded to the first conductive layer 230 and the wires 250. When the light emitting device 240 is bonded to the second conductive layer 230 with a conductive material, bonding of one wire 250 is sufficient. Although the light emitting device 240 is electrically connected to the reflective layer 235 in the drawing, the first and second conductive layers 230 may be electrically connected to each other.

At this time, the electrode pad 255 may be formed on the first conductive layer 230 to which the wire 250 is bonded. In Fig. 11, a resin layer (not shown) is filled in the cavity to protect the light emitting element 240 and the wire 250, and the same is true in the following embodiments.

11, since the light emitting device 240 is in contact with the heat transfer member 210 through the conductive layer 230 and the insulating layer 220, the light emitting device 240 is more resistant to heat radiation than the embodiment shown in FIGS. 1A and 1B. The effect can be reduced. However, in the same manner as in the embodiment shown in FIGS. 1A and 1B, the circuit board can be disposed in the edge region of the conductive layer 230 above the cavity. In this case, since the package body is not formed using PPA resin, 240 are transmitted to the heat transfer member 210 is large.

12 is a view showing a sixth embodiment of a light emitting device module. 11, the light emitting device 240 is wire-bonded to the first and second conductive layers 230 by two wires 250, respectively.

13 is a view showing a seventh embodiment of the light emitting element module. In this embodiment, the light emitting device 240 is not electrically connected to the conductive layer 230 by wires. The light emitting device 240 may be directly bonded to the conductive layer 230 using the flip chip type light emitting device 240.

14 and 15 are views showing one embodiment of a light emitting device module array.

In manufacturing the above-described light emitting device module, it is possible to perform a process of laminating the insulating layer, the conductive layer, and the like on the heat transfer member, and then separate into the respective light emitting device package units. FIG. 14 is a view showing a state before separation in each light emitting device package unit, FIG. 15 is a view illustrating a structure in which a plurality of light emitting devices are arranged in one cavity, .

FIG. 16 is an enlarged view of a part of the light emitting element module array of FIG. 14, and FIG. 17 is a sectional view taken along the 'A' direction and the 'B' direction of FIG.

16 shows a conductive layer 230 constituting a cavity, and a part of the insulating layer 220 is exposed at the periphery of the cavity, and in the region C of the bottom surface of the cavity, a heat transfer member Hour) can be directly exposed.

16, the heat transfer member 210 is exposed at the center of the cavity in the cross-sectional view of line AA 'in FIG. 16, but in the cross-sectional view of line BB' . That is, the heat transfer member 210 is exposed in the short axis direction in the cavity.

18A and 18B are a plan view and a sectional view of an eighth embodiment of the light emitting device module.

In the present embodiment, a plurality of light emitting devices 240 are disposed in the cavity, and the light emitting devices 240 are bonded to the conductive layers 230 and 250, .

It is to be noted that the heat transfer member can be exposed in the central region C of the cavity. 18B, the light emitting device 240 directly contacts the heat transfer member 210 exposed at the bottom surface of the cavity.

18C and 18D are a plan view and a sectional view of the ninth embodiment of the light emitting element module.

This embodiment is similar to the embodiment shown in Figs. 18A and 18B, but differs in that the heat transfer member 210 is not exposed at the bottom surface of the cavity. That is, the insulating layer 220 and the conductive layer 230 are all disposed on the heat transfer member 210 on the bottom surface of the cavity in which the light emitting device 240 is disposed.

In order to prevent short-circuiting of the current supplied to the light emitting element, the conductive layer 230 is removed in a partial region C of the bottom surface of the cavity. 18D, the insulating layer 220 is left in the region (C), but the insulating layer 220 is also removed, so that the heat transfer member 210 can be exposed.

18A to 18D, each light emitting element 240 in the cavity is electrically connected by wire bonding or the like, and the light emitting element at the edge is electrically connected to one of the first and second conductive layers 230, Bonding or the like.

19 is a view showing a tenth embodiment of a light emitting device module. In this embodiment, not only the first and second conductive layers 230 but also the insulating layer 220 are formed with an open region, and the heat transfer member 210 is exposed at the bottom of the open region. The shape and the like of the open region are the same as those of the other embodiments described above.

20 is a view showing an eleventh embodiment of the light emitting element module. In this embodiment, not only the first and second conductive layers 230 and the insulating layer 220 but also the heat transfer member 210 are formed with an open region. Although the first and second conductive layers 230, the insulating layer 220, and the heat transfer member 210 are illustrated as being separated from each other in FIG. 20, The open region is formed in a line shape and the first and second conductive layers 230, the insulating layer 220, and the heat transfer member 210 are connected to each other in a part of the open region.

FIG. 21 is an exploded perspective view of a lighting device including a light emitting device module according to embodiments of the present invention. FIG. 21 is an exploded perspective view of a lighting device according to an embodiment of the present invention .

The illumination device according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation unit 500 for emitting heat of the light source 600, And a holder 700 for coupling the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. The body 420 may have one air flow hole 430 formed therethrough.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The light source 600 includes a plurality of light emitting device packages 650 on a circuit board 610. Here, the circuit board 610 may be inserted into the opening of the housing 400, and may be made of a material having a high thermal conductivity to transmit heat to the heat dissipating unit 500, as described later.

A holder 700 is provided under the light source. The holder 700 may include a frame and another air flow hole. Although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

The above-described illumination device includes the above-described light emitting device module or light emitting device package, and the heat emitted from the light emitting device can be directly emitted through the heat transfer member.

22 is a view illustrating a backlight including the light emitting device module according to the embodiments.

The display device 800 according to the present embodiment includes the light source modules 830 and 835, the reflection plate 820 on the bottom cover 810, the light source module 830 disposed on the front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840 and a second prism sheet 860 disposed in front of the light guide plate 840, A panel 870 disposed in front of the panel 870 and a color filter 880 disposed in the front of the panel 870.

The light source module comprises a light emitting device package 835 on a circuit board 830. Here, the circuit board 830 may be a PCB or the like, and the light emitting device package 835 is as described above.

The bottom cover 810 may house the components in the display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing or may be formed on the rear surface of the light guide plate 840, It is also possible that the bottom cover 810 is coated with a material having a high reflectivity.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 830 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance, and may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE).

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to disperse the light transmitted from the light source module and the reflection sheet evenly in all directions of the panel 870.

Although not shown, a protective sheet may be provided on each of the prism sheets. A protective layer including light diffusing particles and a binder may be provided on both sides of the support film.

The prism layer may be made of a polymer material selected from the group consisting of polyurethane, styrene butadiene copolymer, polyacrylate, polymethacrylate, polymethyl methacrylate, polyethylene terephthalate elastomer, polyisoprene, polysilicon .

Although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and the light incidence angle may be maximized by refracting and scattering light incident from the backlight unit.

The diffusion sheet includes a support layer including a light diffusing agent and a first layer and a second layer which are formed on a light exit surface (first prism sheet direction) and a light incident surface (a direction of a reflection sheet) .

Wherein the support layer comprises 0.1 to 10 parts by weight of a siloxane-based light-diffusing agent having an average particle diameter of 1 to 10 micrometers based on 100 parts by weight of a resin in which a methacrylic acid-styrene copolymer and a methyl methacrylate-styrene copolymer are mixed, And 0.1 to 10 parts by weight of an acrylic light-diffusing agent having an average particle diameter of 1 to 10 micrometers.

The first layer and the second layer may contain 0.01 to 1 part by weight of an ultraviolet absorber and 0.001 to 10 parts by weight of an antistatic agent per 100 parts by weight of the methyl methacrylate-styrene copolymer resin.

In the diffusion sheet, the thickness of the supporting layer may be 100 to 10000 micrometers, and the thickness of each layer may be 10 to 1000 micrometers.

In this embodiment, the diffusion sheet, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be made of other combinations, for example, a microlens array, A combination of a lens array or a combination of a prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 870. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

The backlight unit may include the light emitting device module or the light emitting device package, and the heat emitted from the light emitting device may be directly discharged through the heat transfer member.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: substrate 110: adhesive layer
200: light emitting device package 210: heat transfer member
220: insulating layer 230: (first and second) conductive layers
235: reflective layer 240: light emitting element
242, 244, 255: electrode pad 250: wire
270: Circuit board 280: Conductive adhesive
295: Adhesive material 290: Base substrate
300: mask 400: housing
500: heat dissipating unit 600: light source
700: Holder 800: Display device
810: bottom cover 820: reflector
830: circuit board module 840: light guide plate
850, 860: first and second prism sheets 870:
880: Color filter

Claims (18)

A heat transfer member forming a cavity;
An insulating layer patterned to expose at least a part of the heat transfer member on a bottom surface of the cavity;
A first conductive layer and a second conductive layer located on the heat transfer member with the insulating layer therebetween and electrically separated from each other;
A light emitting element located on the heat transfer member at a bottom surface of the cavity and electrically connected to the first conductive layer and the second conductive layer, respectively; And
And a circuit board disposed on the first conductive layer and the second conductive layer and electrically connected to the first conductive layer and the second conductive layer, respectively, with a conductive adhesive,
Wherein the insulating layer is partially exposed outside the cavity,
Wherein the first conductive layer includes a first region and a second region provided on both sides of a region where the insulating layer is partially exposed from the outside of the cavity and the first conductive layer is formed on the exposed region of the insulating layer, And connecting the first region and the first conductive layer in the second region,
Wherein the insulating layer comprises polyimide,
Wherein the light emitting element is fixed on the heat transfer member with an adhesive,
Wherein the heat transfer member comprises copper or aluminum. A heat transfer member forming a cavity;
An insulating layer patterned to expose at least a part of the heat transfer member on a bottom surface of the cavity;
A first conductive layer and a second conductive layer located on the heat transfer member with the insulating layer therebetween and electrically separated from each other; And
And a light emitting element located on the heat transfer member at a bottom surface of the cavity and electrically connected to the first conductive layer and the second conductive layer,
And an open region at both ends of the first conductive layer and the second conductive layer,
Wherein the first conductive layer and the second conductive layer include a first region and a second region provided on both sides of the open region and the first region and the second region are electrically connected through a connection portion,
Wherein the insulating layer comprises polyimide,
Wherein the light emitting element is fixed on the heat transfer member with an adhesive,
Wherein the heat transfer member comprises copper or aluminum. delete The method according to claim 1,
Wherein the insulating layer has a thickness of at least 5 micrometers,
Wherein an exposed width of the insulating layer is 10 to 50 micrometers. delete delete 3. The method according to claim 1 or 2,
And a reflective layer formed on the first conductive layer and the second conductive layer in the cavity. delete The method according to claim 1,
And the insulating layer blocks the drawing of the conductive adhesive agent. delete delete 3. The method of claim 2,
Wherein the open region has a shape of at least one of a straight line and a curved line. delete delete 3. The method of claim 2,
Wherein the different open line regions have the same pattern. 3. The method according to claim 1 or 2,
Wherein at least two light emitting elements are disposed in the one cavity, the light emitting elements are wire-bonded to each other, and the light emitting element at the edge is wire-bonded to the first conductive layer or the second conductive layer. The method according to claim 1,
And the heat transfer member is exposed in the minor axis direction in the cavity. delete
KR1020110032849A 2011-04-08 2011-04-08 Light emitting device module and illumination system including the same KR101863868B1 (en)

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KR100592508B1 (en) * 2005-07-15 2006-06-26 한국광기술원 High power led package with beacon type substrate

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