KR20130007823A - Manufacturing method for light emitting device - Google Patents

Abstract

PURPOSE: A method for manufacturing a light emitting device package is provided to prevent the penetration of oxygen and moisture by controlling a curing condition including the temperature of resin, a setting time, et cetera. CONSTITUTION: A light emitting device(130) is mounted on a package body(110). A cavity is formed in the package body. Resin(140) is filled in the cavity. The resin is cured in a first curing temperature and a second temperature which is higher than the first temperature.

Description

Manufacturing method for light emitting device package {Manufacturing method for light emitting device}

The embodiment relates to a method of manufacturing a light emitting device package.

Fluorescent lamps are increasingly being replaced by other light sources because they are against the trend of the future lighting market aiming to be environmentally friendly due to frequent replacement and the use of fluorescent materials.

The most popular light source is LED (Light Emitting Diode), which uses the characteristics of compound semiconductors to convert electrical signals into the form of light from the infrared to the ultraviolet region, including the visible region. In addition to its advantages such as processing speed and low power consumption, it is also considered as the next generation light source due to its environmentally friendly and high energy saving effect. Therefore, the use of LED to replace the existing fluorescent lamp is actively in progress.

Currently, semiconductor light emitting devices such as LEDs have been applied to various devices including televisions, monitors, notebooks, mobile phones, and other display devices. In particular, they are widely used as backlight units in place of conventional cold cathode fluorescent lamps, CCFLs. have.

In order to use the LED device in the lighting system, the light emitting device is encapsulated with resin. Degeneration of the resin is caused by heat emitted from the light emitting device or foreign matter, which affects the brightness and reliability of the light emitting device package. Korean Patent Laid-Open Publication No. 10-2007-0032320 provides a light emitting device having improved reliability by using a silicone resin composition, but does not mention a method for improving reliability in terms of a curing method using a conventional resin.

The embodiment provides a method of manufacturing a light emitting device package having improved reliability by controlling and curing a curing condition such as a curing temperature, a curing time, a gas atmosphere, and the like of a resin filled in the light emitting device package.

The method of manufacturing a light emitting device package according to an embodiment includes mounting a light emitting device on a package body in which a cavity is formed, filling a resin into the cavity, and curing the resin to a first curing temperature at a first curing step. And a second curing step of curing the resin material at a second curing temperature that is greater than the first curing temperature, wherein an increase in temperature per hour when the resin is increased to the first curing temperature is performed at the first curing temperature. It may be less than the temperature increase per hour when increasing to the second curing temperature, the duration of the first curing step may be longer than the duration of the second curing step.

The resin of the light emitting device package manufactured by the method of manufacturing the light emitting device package according to the embodiment may improve the degree of curing and hydrophobicity, thereby preventing the penetration of moisture and oxygen, thereby preventing discoloration and deterioration of the brightness of the light emitting device package.

1 is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment.
2 is a graph showing a curing temperature with time according to an embodiment.
3 is a view showing a contact angle test for the resin of the light emitting device package according to the embodiment.
4 is a view showing the water penetration degree after the water test of the light emitting device package according to the embodiment.
5 is a view showing a cross section after using the light emitting device package according to the embodiment for 1200 hours.
6A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view illustrating a DD ′ cross section of the lighting device of FIG. 6A.
7 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.
8 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

Advantages and features of the present invention, and methods of achieving the same will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment.

Referring to FIG. 1, the light emitting device package 100 includes a package body 110 in which a cavity C is formed, a lead frame 120, a light emitting device 130, a resin material 140, and a phosphor (not shown). can do.

The package body 110 serves as a housing, and a cavity C is formed at a central portion thereof so that the light emitting device 130 may be mounted inside the cavity.

In addition, the package body 110 wraps and supports the lead frame 120 and includes a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), and liquid crystal polymer. (PSG, photo sensitive glass), Polyamide 9T (PA9T), Syndiotactic Polystyrene (SPS), Metal, Sapphire (Al ₂ O ₃ ), Beryllium Oxide (BeO), Printed Circuit Board (PCB) It may be formed of at least one of.

The package body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The package body 110 may be formed with a cavity C having an upper side opened, and the cavity C may be formed by inclining the inside of the package body 110. The angle of reflection of the light emitted from the light emitting device 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 130 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light emitting device 130 to the outside.

On the other hand, the shape viewed from above the cavity (C) formed in the package body 110 may be a shape of a circle, a square, a polygon, an oval, and the like, in particular, a corner may be a curved shape, but is not limited thereto.

In this case, a reflective coating film (not shown) may be formed on side and bottom surfaces of the cavity C forming the inner wall of the cavity C. Here, the surface of the package body 110 in which the reflective coating film (not shown) is formed may be formed to have a smooth or predetermined roughness, and may be made of silver (Ag), aluminum (Al), or the like. .

Lead frame 120 is a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. In addition, the lead frame 120 may be formed to have a single layer or a multilayer structure, but is not limited thereto.

In addition, the lead frame 120 may be configured of the first lead frame 121 and the second lead frame 122 to apply different power. Here, the first lead frame 121 and the second lead frame 122 may be formed spaced apart from each other at a predetermined interval.

The light emitting device 130 is mounted in the cavity C and is positioned on the upper surface of any one of the first lead frame 121 and the second lead frame 122 to emit light having a predetermined wavelength by a power applied from the outside. It is a kind of semiconductor device that exits. GaN (gallium nitride), AlN (aluminum nitride), InN (indium nitride), AlAs (aluminum arsenide), GaAs (gallium arsenide), InP (indium phosphide), GaP (gallium phosphide), AlP (aluminum phosphide) It may be implemented based on Group 3 and 5 compounds, such as, for example, the light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In the exemplary embodiment, a single light emitting diode is illustrated as being provided at the center portion, but the present invention is not limited thereto, and a plurality of light emitting diodes may be provided.

In addition, the light emitting device 130 may be applied to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type formed on the upper and lower surfaces.

The resin material 140 may be filled in the cavity C to seal the light emitting device 130 and the wire. At this time, the resin material 140 may be formed of a light-transmissive resin material such as silicone or epoxy, and may be formed by filling the material in the cavity C and then UV or heat curing the material.

The hardening method of the resin material 140 is mentioned later with reference to the graph of FIG.

The surface of the resin material 140 may be formed in a concave lens shape, a convex lens shape, a flat shape, or the like, and the orientation angle of the light emitted from the light emitting device 130 may be changed according to the shape of the resin material 140 have.

Further, other resin-shaped resin materials may be formed or adhered on the resin material 140, but the present invention is not limited thereto.

The resin 140 may include a phosphor (not shown). Here, the phosphor may be selected according to the wavelength of the light emitted from the light emitting device 130 to allow the light emitting device package 100 to realize white light.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, the light emitting device 130 is a blue light emitting diode and the phosphor is a yellow phosphor. In this case, the yellow phosphor may be excited by blue light to emit yellow light. As the yellow light generated by blue light and blue light generated by the blue light emitting diode is mixed, the light emitting device package 100 may be white light. Can be provided.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light emitting device 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is mixed. For example,

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

2 is a graph showing a curing temperature with time when curing the resin material filled in the light emitting device package according to the embodiment.

In the graph of FIG. 2, the horizontal axis represents time and the vertical axis represents temperature. Referring to the graph of FIG. 2, the light emitting device package filled with the resin is gradually heated to increase the temperature (section A), and the initial temperature may be about 25 ° C. at room temperature.

The temperature of the resin may be increased until the first curing temperature T1 of the first curing step is reached, the temperature may be gradually increased at one time, or the temperature may be increased over several steps.

At this time, by increasing the temperature to the first curing temperature (T1) in several steps, it is possible to minimize the internal stress generation of the resin material. When the internal stress of the resin is minimized, the reliability of the wire bonding encapsulated with the resin may be increased, thereby improving the reliability of the light emitting device package.

When the temperature is increased and the first curing temperature T1 is reached, the resin is primarily cured while maintaining the temperature without increasing the temperature (Section B). At this time, when the curing at a temperature lower than 100 ℃ does not cause sufficient curing and even when curing at temperatures higher than 190 ℃ the degree of reliability improvement is not large, the first curing temperature (T1) may be 100 ℃ to 190 ℃.

In addition, if the first curing time is less than 30 minutes, sufficient curing does not occur, and if the workability is lowered beyond 300 minutes, the duration of the first curing step may be 30 minutes to 300 minutes.

After completion of the first curing step, the temperature of the resin is increased again to the second curing temperature T2 of the second curing step (section C).

At this time, the temperature increase per hour when increasing from the first curing temperature (T1) to the second curing temperature (T2) may be greater than the hourly temperature increase when increasing to the first curing temperature (T1).

 When the temperature of the resin reaches the second curing temperature T2, the resin is cured secondly while maintaining the temperature without increasing the temperature (Section D). At this time, curing at a temperature lower than 200 ° C. does not sufficiently cure the uncured portion of the resin material, and curing at a temperature higher than 300 ° C. may cause the package body to melt. Can be.

In addition, when the secondary curing is less than 1 second, sufficient curing does not occur. If the curing is continued for more than 30 minutes for a long time, the degree of curing of the resin may be increased, but the resin may be denatured. Therefore, the duration of the second curing step may be 1 second to 30 minutes.

After the second curing step is finished, the temperature of the resin is reduced to room temperature of about 25 ℃ (section E).

The gaseous atmosphere of the first curing step and the gaseous atmosphere of the second curing step may be different, the gaseous atmosphere of the first curing step or the gaseous atmosphere of the second curing step may be an inert gas atmosphere, The gas atmospheres of the A, C, and E sections other than the secondary curing step (Section B) and the second secondary curing step (Section D) may also be inert gas atmospheres. When the gas atmosphere is made to be an inert gas atmosphere during curing of the resin, it is possible to prevent the surface of the lead frame or the like from reacting with an active gas such as air to oxidize during the curing process.

Table 1 is a table showing the degree of curing of the resin according to the duration of the second curing step.

time Reference 1 minute 5 minutes 10 minutes 30 minutes Curing degree 33 36.47 36.53 36.53 36.6

Referring to Table 1, it can be seen that the degree of curing increases when the secondary curing is added as well as the primary curing. The degree of cure of the resin (Reference) that is only the first cure but not the second cure is 33, the degree of cure of the resin that undergoes the second cure is greater than 33, and even if the duration of the second cure step is longer, The degree of curing remains constant without significant change. In the second curing step, since the uncured hardening material of the resin reacts in the first curing step, the degree of curing may increase and the reliability of the resin may be improved.

3 is a view showing a contact angle test for the resin of the light emitting device package according to the embodiment. The contact angle test is to determine the degree of hydrophilicity of the resin, which can be determined using the contact angle.

Referring to FIG. 3, when a liquid such as water is placed on a solid, the liquid becomes a droplet maintaining a constant lens shape. At this time, the surface of the liquid becomes curved, and the surface of the solid and the surface of the liquid form a constant angle. The measurement of this angle inside the liquid is called a contact angle (d).

When the contact angle d is 0 °, the hydrophilicity of the liquid on the solid surface is maximum and the liquid can completely wet the solid surface. On the other hand, when the contact angle d is 90 ° or more, there is no hydrophilicity to the liquid on the solid surface. Therefore, in the range where the contact angle d is in the range of 0 ° to 90 °, the value may be an index for evaluating the hydrophilicity of the liquid on the solid surface.

When the solid is made of a resin, the hydrophilicity of the resin can be determined by using a contact angle. The contact angles according to the curing time of the resin material cured secondly at a second curing temperature of 256 ° C. are shown in Table 2 below.

Time (minutes) Reference One 5 10 Contact angle (°) 79.4 82.5 83.1 87.9

Referring to Table 2, the contact angle (d) of the resin (Reference) which is only the first curing but not the second curing is 79.4 °, and the contact angle increases as the duration of the second curing step is longer. Able to know. When the duration of the second curing step is 10 minutes, the contact angle of the resin is 87.9 degrees, showing a value similar to 90 degrees.

As the secondary curing is performed, the contact angle increases, and the degree of hydrophilicity of the resin is decreased. By secondary curing, surface modification of the surface of the resin may occur from hydrophilicity to hydrophilicity. As described above, when the surface of the resin is hydrophilic, moisture does not penetrate into the resin, and thus, the light emitting device may be protected from external moisture, thereby increasing reliability of the package.

Table 3 shows the thermal shock test results of the light emitting device package according to the embodiment.

Secondary curing temperature (℃) Reference 180 197 256 Number of test samples Cycle 10 10 10 10 Cycle
Breakdown 200 0 0 0 0 300 0 0 0 0 400 3 2 0 0 500 6 6 One 0 600 6 6 3 0 700 8 8 6 One 800 8 8 6 3

Referring to Table 3, it can be seen that the number of failures of the light emitting device package subjected to the second curing is reduced compared to the light emitting device package (Reference) that only hardens the resin but not the second curing. As the second curing temperature, which is the secondary curing temperature, increases, the number of failures decreases, and when the second curing temperature is 256 ° C, the number of failures is minimal.

With the secondary curing, the reliability of the resin increases, which leads to a reduction in wire deformation and thus a failure rate of the light emitting device package in the thermal shock test.

4 is a view showing the water penetration degree after the water test of the light emitting device package according to the embodiment.

Figure 4 (a) is a view showing a light emitting device package only the first curing without the secondary curing, Figure 4 (b) is a light emitting device package of the first curing and the second curing The figure shown.

Figure 4 (a) can be confirmed that there is a lot of moisture on the surface of the lead frame due to the water penetrating the resin material, and Figure 4 (b) can be confirmed that there is no change even after the water test because it does not penetrate the moisture.

When the second curing step is additionally performed after the first curing step as described above, curing of the resin is additionally performed, and external moisture or gas is prevented from penetrating or diffusing the resin, thereby improving reliability of the light emitting device package. do.

5 is a view showing a cross section after driving the light emitting device package according to the embodiment for 1200 hours.

Referring to FIG. 5, (a) of FIG. 5 illustrates a light emitting device package that is not first cured but only cured. The metal or phosphor such as a lead frame inside the package reacts with external moisture or oxygen. It can be confirmed that the discoloration. As described above, when the metal or the phosphor inside the light emitting device package reacts with external moisture or oxygen, foreign matter may be generated, thereby reducing the brightness of the light emitting device package.

On the other hand, Figure 5 (b) can prevent the penetration of moisture or oxygen by adding a secondary curing in addition to the primary curing, it can be confirmed that almost no discoloration occurs.

Therefore, by additionally performing the second curing step, it is possible to prevent the color change and the brightness of the light emitting device package.

6A is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view illustrating a cross-sectional view taken along line D-D 'of the lighting apparatus of FIG. 6A.

Hereinafter, in order to describe the shape of the lighting apparatus 200 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 200, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 6B is a cross-sectional view of the lighting apparatus 200 of FIG. 6A cut in the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

6A and 6B, the lighting device 200 may include a body 210, a cover 230 coupled to the body 210, and a closing cap 250 positioned at both ends of the body 210. have.

The lower surface of the body 210 is fastened to the light emitting device module 240, the body 210 is conductive so that the heat generated in the light emitting device package 244 can be discharged to the outside through the upper surface of the body 210 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 244 may be mounted on the PCB 242 in a multi-colored, multi-row array to form an array. The light emitting device package 244 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. . As the PCB 242, a MCPCB (Metal Core PCB) or a PCB made of FR4 may be used.

Meanwhile, the light emitting device package 244 may include a plurality of holes and a film made of a conductive material.

Since a film formed of a conductive material such as a metal causes a lot of interference of light, the intensity of the light wave may be strengthened by the interaction of the light wave, thereby effectively extracting and diffusing the light. The interference and diffraction of the light can effectively extract the light. Therefore, the efficiency of the lighting device 200 can be improved. At this time, the size of the plurality of holes formed in the film is preferably smaller than the wavelength of the light generated from the light source.

The cover 230 may be formed in a circular shape to surround the lower surface of the body 210, but is not limited thereto.

The cover 230 protects the light emitting device module 240 from the outside and the like. In addition, the cover 230 may include diffusing particles to prevent the glare of the light generated from the light emitting device package 244, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 230 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 230.

On the other hand, since the light generated from the light emitting device package 244 is emitted to the outside through the cover 230, the cover 230 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 244. It should be, the cover 230 is preferably formed of a material containing polyethylene terephthalate (PET), polycarbonate (PC) or polymethyl methacrylate (PMMA), etc. .

Closing cap 250 is located at both ends of the body 210 may be used for sealing the power supply (not shown). In addition, the closing cap 250 has a power pin 252 is formed, the lighting device 200 according to the embodiment can be used immediately without a separate device in the terminal from which the existing fluorescent light is removed.

7 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

7 is an edge-light method, the liquid crystal display device 300 may include a liquid crystal display panel 310 and a backlight unit 370 for providing light to the liquid crystal display panel 310.

The liquid crystal display panel 310 may display an image by using light provided from the backlight unit 370. The liquid crystal display panel 310 may include a color filter substrate 312 and a thin film transistor substrate 314 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 312 may implement colors of the image displayed through the liquid crystal display panel 310.

The thin film transistor substrate 314 is electrically connected to the printed circuit board 318 on which a plurality of circuit components are mounted through the driving film 317. The thin film transistor substrate 314 may apply a driving voltage provided from the printed circuit board 318 to the liquid crystal in response to a driving signal provided from the printed circuit board 318.

The thin film transistor substrate 314 may include a thin film transistor and a pixel electrode formed of a thin film on another transparent substrate such as glass or plastic.

The backlight unit 370 may convert the light provided from the light emitting device module 320 and the light emitting device module 320 into a surface light source to provide the liquid crystal display panel 310 with the light guide plate 330 and the light guide plate ( Reflective sheet for reflecting the light emitted to the light guide plate 330 to the plurality of films 350, 360, 364 and the light guide plate 330 to uniform the luminance distribution of the light provided from the 330 and improve the vertical incidence ( 340.

The light emitting device module 320 may include a PCB substrate 322 such that a plurality of light emitting device packages 324 and a plurality of light emitting device packages 324 are mounted to form an array.

In particular, the light emitting device package 324 includes a film in which a plurality of holes are formed on the light emitting surface, so that the lens may be omitted, thereby implementing a slim light emitting device package and simultaneously improving light extraction efficiency. Therefore, the thinner backlight unit 370 can be implemented.

On the other hand, the backlight unit 370 is a diffusion film 360 for diffusing light incident from the light guide plate 330 toward the liquid crystal display panel 310, and a prism film 350 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 364 for protecting the prism film 350.

8 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

Since the liquid crystal display panel 410 is the same as that described with reference to FIG. 5, a detailed description thereof will be omitted.

The backlight unit 470 includes a plurality of light emitting device modules 423, a reflective sheet 424, a lower chassis 430 in which the light emitting device modules 423 and the reflective sheet 424 are accommodated, and an upper portion of the light emitting device modules 423. It may include a diffusion plate 440 and a plurality of optical film 460 disposed in the.

Light emitting device module 423 A plurality of light emitting device packages 422 may be mounted to include a PCB substrate 421 to form an array.

In particular, the light emitting device package 422 is formed of a conductive material, and by providing a film including a plurality of holes on the light emitting surface, it is possible to omit the lens to implement a slim light emitting device package, at the same time light extraction efficiency Can improve. Therefore, the thinner backlight unit 470 can be implemented.

The reflective sheet 424 reflects the light generated from the light emitting device package 422 in the direction in which the liquid crystal display panel 410 is located to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 423 is incident on the diffusion plate 440, the optical film 460 is disposed on the diffusion plate 440. The optical film 460 includes a diffusion film 466, a prism film 450, and a protective film 464.

Although the above has been illustrated and described with respect to the preferred embodiment of the present invention, the present invention is not limited to the above-described specific embodiment, but in the technical field to which the invention belongs without departing from the gist of the invention as claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

110: package body 120: lead frame
130: light emitting device 140: resin

Claims (7)

Mounting a light emitting device on the package body in which the cavity is formed;
Filling a resin into the cavity;
A first curing step of curing the resin at a first curing temperature; And
A second curing step of curing the resin material at a second curing temperature greater than the first curing temperature,
The temperature increase per hour when increasing to the first curing temperature is less than the temperature increase per hour when increasing from the first curing temperature to the second curing temperature, and the duration of the first curing step is the second difference. Method of manufacturing a light emitting device package longer than the duration of the curing step. The method of claim 1,
The gas atmosphere of the first curing step and the gas atmosphere of the second curing step is different manufacturing method of the light emitting device package. The method of claim 1,
The gas atmosphere of the second curing step is an inert gas manufacturing method of the light emitting device package. The method of claim 1,
The first curing temperature is 100 ℃ to 190 ℃ manufacturing method of the light emitting device package. The method of claim 1,
The second curing temperature is a manufacturing method of the light emitting device package 200 ℃ to 300 ℃. The method of claim 1,
The duration of the first curing step is 30 minutes to 300 minutes manufacturing method of the light emitting device package. The method of claim 1,
The duration of the second curing step is a method of manufacturing a light emitting device package 1 second to 30 minutes.

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