KR20120123931A - Electonic parts inspecting apparatus and method - Google Patents

Abstract

PURPOSE: An electronic component inspecting apparatus and method are provided to improve productivity of an LED package. CONSTITUTION: An LED package inspecting apparatus comprises an outer tube inspection part(200), a classification part, and a taping part. The outer tube inspection part inspects an outer tube of LED packages. The classification part inspects electric and optical characteristics of the LED packages in which inspection is completed and determines quality of the LED packages. The taping part wraps the LED package which is determined as good quality. The outer tube inspection part comprises an inspection camera, an inspection controller, and a bad quality displayer. The inspection camera takes a photograph of the LED packages and creates an inspection camera. The inspection controller analyzes the inspection image and determines an LED package in which an outer tube is faulty. The bad quality displayer disconnects a circuit of the LED package in which the outer tube is faulty by radiating laser rays.

Description

ELECTRONIC PARTS INSPECTING APPARATUS AND METHOD

The present invention relates to an apparatus and method for inspecting an electronic component, and more particularly, to an apparatus and method for inspecting an LED package.

Recently, LED packages have been widely used as display devices or backlights for indoor and outdoor lighting and display devices.

In general, LED packages are commercialized through visual inspection, electrical and optical characterization, and taping processes. Appearance inspection examines the appearance of the LED package to determine the presence or absence of foreign matter, and electrical and optical property inspection applies the current to the LED package to check the connection status of chip circuits and wires, and the brightness and color of light emitted from the chip. do. The LED package determined as good after the inspection is commercialized in the taping process.

1 is a view showing a conventional method for displaying a bad mark on the LED package having a foreign object in the appearance inspection. Referring to FIG. 1, the light irradiation part 231 irradiates a laser light L to the resin layer 31 of the LED package 10, which is determined to have a foreign material, and burns the surface of the resin layer 31 to form a small round point. The defective mark R of the form is formed. After the operator inspects the electrical and optical characteristics, the operator classifies the defect as the LED package 10 in which the defect mark R is displayed.

However, the defective mark is not easy to identify because of its small size. Therefore, in the case of the LED package in which the defective mark is displayed but the electrical characteristics are good, it is determined that the good quality in the electrical and optical characteristics inspection. Due to the above causes, there is a problem that the LED package to be classified as defective is determined to be good and provided to the taping process. Of course, it is possible to classify the defective LED package by performing the external inspection again in the taping process, but this inspection process extends the inspection time and reduces the product production efficiency. In addition, the resin burnt in the laser light in the process of forming the defect mark may be a foreign material may act as a pollution source of the surrounding LED package.

The present invention provides an apparatus and method that can improve the yield of the LED package.

The present invention also provides an apparatus and method for improving the inspection accuracy of the LED package.

In addition, the present invention provides an apparatus and method capable of preventing contamination of LED packages.

The present invention provides an LED package inspection method. The LED package inspection method is to inspect the LED packages, the chip is coated with a resin layer, by inspecting the appearance of the LED packages to inspect the appearance; And electrical and optical inspections for applying electrical current to the LED packages in which the appearance inspection is completed to inspect electrical and optical characteristics of the LED packages, wherein the appearance inspection generates an inspection image by photographing the LED packages. The inspection image is analyzed to determine an LED package having a poor appearance, and the laser light is irradiated to short circuit a circuit of the LED package having a poor appearance.

The laser light is placed on a chip of the LED package whose focus is poor in appearance and short circuits the chip.

The laser light is irradiated to the entire area of the chip.

The LED package with the short circuit is classified as defective in the electrical and optical inspection.

The present invention also provides an apparatus for inspecting LED packages in which a chip is coated with a resin layer. An inspection apparatus includes an appearance inspection unit which inspects the appearance of the LED packages; A classification unit which determines a good product by inspecting electrical and optical characteristics of the LED packages in which appearance inspection is completed; And a taping unit for wrapping the LED package determined as good quality, wherein the appearance inspection unit comprises: an inspection camera configured to photograph the LED packages to generate an inspection image; An inspection controller which analyzes the inspection image to determine an LED package having a poor appearance; And a defect display unit for irradiating laser light to short circuit a circuit of the LED package whose appearance is poor. The classification unit includes a classification controller for classifying the LED package in which the circuit is shorted as defective.

The defect display unit includes a light irradiation unit for irradiating the laser light; And a vertical moving part that adjusts the height of the light irradiation part so that the focus of the laser light is located on the chip positioned lower than the surface of the resin layer, wherein the laser light shorts the circuit of the chip.

The defective display unit may further include a horizontal moving unit configured to scan move the light irradiation unit in a direction parallel to the upper surface of the chip.

The present invention also provides a method for inspecting the quality of electronic components. An inspection method includes inspecting the appearance of the electronic components, forcibly and electrically making the electronic component determined as defective in the appearance inspection; And inspecting the electrical properties of the electronic products to classify good and defective products.

The electronic product is an LED package.

The step of making the electronic component determined to be defective is to short-circuit the circuit of the electronic component by irradiating laser light to the electronic component.

According to the present invention, since the inspection time is shortened, the yield of the LED package can be improved.

In addition, the present invention can improve the inspection accuracy because good or bad of the LED package is distinguished in the electrical and optical characteristic inspection.

In addition, according to the present invention, since no foreign matter is generated in the inspection process, contamination of the LED packages can be prevented.

1 is a view showing a conventional method for displaying a bad mark on the LED package having a foreign object in the appearance inspection.
Figure 2a is a perspective view of the LED package provided for the LED package inspection of the present invention.
FIG. 2B is a plan view of FIG. 2A and FIG. 2C is a cross-sectional view taken along the line AA ′ of 2A.
3 is a view briefly showing an LED package inspection apparatus according to an embodiment of the present invention.
FIG. 4 is a diagram schematically illustrating an appearance inspection unit of FIG. 3.
5 is a diagram illustrating a process of displaying a defect mark on an LED package having a defect display unit having foreign matter.
6 is a plan view of the LED package in which the defect mark is displayed.
7 is a flowchart illustrating an LED package inspection process according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

Figure 2a is a perspective view of the LED package provided for the LED package inspection of the present invention, Figure 2b is a plan view of Figure 2a, Figure 2c is a cross-sectional view taken along the line AA 'of 2a.

2A-2C, the LED package 10 has a body 11 that is provided in a generally rectangular block. The receiving groove 12 is formed on the upper surface of the body (11). The receiving groove 12 is formed in a generally rectangular shape and has an inner side surface 12a inclined so that the size of the groove gradually increases from the lower end to the upper end. The inner surface 12a is provided plated with a reflector. The chip 21 is provided on the bottom surface of the receiving groove 12. According to the embodiment, two chips 21 are provided. The chip 21 is mounted on a metal pad 23 located at the bottom of the receiving groove 12. Each chip 21 is connected to the lead plate 26 via a wire 25. The resin layer 31 is coated on the chip 21. The resin layer 31 is provided by dispensing and curing the liquid resin in the accommodation groove 12. The resin layer 31 may be formed to be concave so that its upper surface is positioned higher than the upper surface of the chip 21, and the center region of the upper surface is lower than the edge region. The resin layer 31 may be provided of an epoxy or silicon material. Four terminals 41 to 44 are connected to the outer surface of the body 11. The two terminals 41 and 42 are spaced apart from each other at one side of the body 11, and the remaining two terminals 43 and 44 are spaced apart from each other at the other side of the body 11. The terminals 41 to 44 are bent to the bottom side of the body 11 to firmly support the body 11. The edge of the body 11 adjacent to the ground terminal 44 is stepped to form the mark portion 13. The marking portion 13 indicates the position of the ground terminal 44. The connection terminals 41 to 43 are connected to an external power supply to supply current to each chip 21. Light is emitted to the chip 21 by the supplied current. Each chip 21 emits light of a complementary color relationship with each other. White light may be expressed by controlling the amount of light emitted from the chip 21.

3 is a view schematically showing an LED package inspection apparatus according to an embodiment of the present invention, Figure 4 is a view showing a simplified appearance inspection unit of FIG.

3 and 4, the LED package inspection apparatus 1000 includes a supply unit 100, an appearance inspection unit 200, a classification unit 300, and a taping unit 400. The supply unit 100, the appearance inspection unit 200, the classification unit 300, and the taping unit 400 are sequentially arranged in the order described. The supply unit 100 supplies the LED package 10 to the appearance inspection unit 200. The appearance inspection unit 200 photographs the LED package 10 to generate an inspection image and inspects whether the appearance is defective. The classification unit 300 performs an electrical and optical inspection on the LED package 10 to classify good or bad. The taping unit 400 wraps the LED package 10 determined as good quality. Hereinafter, each configuration will be described in detail.

The supply unit 100 supplies the LED package 10 to the appearance inspection unit 200. The plurality of LED packages 10 may be provided to be aligned on the strip (S). The strips S are stacked and provided in the supply unit 100, and the strips S are sequentially supplied to the appearance inspecting unit 200.

The appearance inspection unit 200 inspects the appearance of the LED packages 10. The appearance inspection unit includes a first inspection unit 210, a second inspection unit 220, a defective display unit 230, and an inspection control unit 240. The first inspection unit 210 primarily inspects the external appearance of the LED package 10, and the second inspection unit 220 secondaryly inspects the external appearance of the LED package 10 that is primarily inspected. The failure display unit 230 displays a failure mark on the LED package 10 determined to have a poor appearance. Hereinafter, a direction in which the first inspecting unit 210, the second inspecting unit 220, and the defective display unit 230 are sequentially disposed is referred to as a first direction X, and when viewed from above, The vertical direction is referred to as the second direction (Y), and the direction perpendicular to the first and second directions (X and Y) is referred to as the third direction (Z).

The first inspection unit 210 is positioned at the tip of the appearance inspection unit 200 adjacent to the supply unit 100. The first inspection unit 210 includes a first inspection camera 211, a first camera driver 212, and a first strip transfer unit 215.

The first inspection camera 211 is positioned above the first strip transfer part 215 and photographs the appearance of the LED packages 10 positioned on the strip S. The first inspection camera 211 photographs the LED package 10 with high accuracy to generate a high resolution inspection image. The first inspection camera 211 may be provided as a 2D camera to planally photograph the LED package 10, and in some cases, may be provided as a 3D camera so as to photograph the LED package 10 in three dimensions. The first inspection camera 211 is provided in a size that can simultaneously photograph the width of the strip S in the second direction (Y). According to an embodiment, the first inspection camera 211 photographs the LED packages 10 by focusing on the upper surface of the body (11 of FIG. 2A) of the LED package 10. The first inspection image photographed by the first inspection camera 211 is provided to the inspection controller 240.

The first camera driver 212 moves the first inspection camera 211. According to an embodiment, the first camera driver 212 scan-moves the first inspection camera 211 in the first direction X. FIG. Since the first inspection camera 211 scans and moves in the first direction X, the entire region of the strip S may be photographed.

The first strip transfer part 215 transfers the strip S in the first direction X. The first strip transfer part 215 includes a plurality of shafts 216 and a shaft driver 217. The shafts 216 are arranged side by side spaced apart from each other in the first direction. Each shaft 216 is connected and interlocked with each other by a belt or gear. The shaft drive 217 rotates the shafts 216. The first strip transfer unit 215 having the above-described structure transfers the strip S supplied from the supply unit 100 in the first direction X to be positioned below the first inspection camera 211. Then, the first inspection camera 211 supports the strip S in a fixed position while photographing the LED packages 10 provided in the strip S. When the photographing of the first inspection camera 211 is completed, the first strip transfer unit 215 transfers the strip S to the second inspection unit 220.

The second inspection unit 220 is located at the rear end of the first inspection unit 210 along the first direction X. FIG. The second inspection unit 220 includes a second inspection camera 221, a second camera driver 221, and a second strip transfer unit 225. The second inspection camera 221 is located on the upper portion of the second strip transfer part 225, and photographs the appearance of the LED packages 10 positioned on the strip S. The second inspection camera 221 may be provided in the same structure as the first inspection camera 211. The second inspection camera 221 photographs the LED packages 10 by focusing on the resin layer formed in the receiving groove of the LED package 10. The second inspection image photographed by the second inspection camera 221 is provided to the inspection controller 240.

The second camera driver 222 moves the second inspection camera 221. According to the embodiment, the second camera driver 222 scan-moves the second inspection camera 221 in the first direction X. Since the second inspection camera 221 scans and moves in the first direction X, the entire region of the strip S may be photographed.

The second strip transfer part 225 transfers the strip S in the first direction X. The second strip transfer unit 225 may be provided in the same structure as the first strip transfer unit 215. The second strip transfer unit 225 transfers the strip S supplied from the first strip transfer unit 215 in the first direction X to be positioned below the second inspection camera 221. Then, the second inspection camera 221 supports the strip S in a fixed position while photographing the LED packages 10 provided in the strip S. When the photographing of the second inspection camera 221 is completed, the second strip transfer unit 225 transfers the strip S to the failure display unit 230.

The inspection controller 240 analyzes the first inspection image provided by the first inspection unit 210 and the second inspection image provided by the second inspection unit 220 to determine the defective LED package 10. First, the inspection controller 240 analyzes the first inspection image and detects a defect generated on the upper end of the body 11 of the LED package 10. For example, the inspection controller 240 determines that the LED package 10 provided with resin up to the upper end of the body 11 as resin is excessively supplied to the receiving groove 12 is defective. In addition, the inspection controller 240 analyzes the second inspection image and detects a defect generated in the resin layer 31. For example, the inspection control unit 240 detects the LED package in which the foreign material is introduced into the resin layer 31 as defective. The foreign material prevents the light emitted from the chip from being evenly emitted. Foreign bodies include conductive and nonconductive materials. In addition, the inspection control unit 240 includes an LED package in which bubbles or pores are formed in the resin layer 31, an LED package in which a surface of the resin layer 31 is convex, or a crack is generated on the surface of the resin layer 31, and a receiving groove 12. ), The LED package in which the chip 21 or the wire 25 is exposed due to insufficient resin supply, and the LED package in which the resin does not fill the bottom of the receiving groove 12 are determined as defective. The inspection controller 240 generates position data of the LED packages 10 determined as defective and transmits the position data to the defective display unit 230.

The failure display unit 230 is positioned at the rear end of the second inspection unit 220 along the first direction X, and displays a failure mark on the failure LED package 10. According to an embodiment, the failure display unit 230 includes a light irradiation unit 231, a vertical moving unit 233, a strip moving unit 235, and a driving control unit 238.

The light irradiator 231 irradiates laser light to the LED package 10 determined as defective. The vertical moving unit 233 raises and lowers the light irradiation unit 231 so that the focal point of the laser light irradiated from the light irradiation unit 231 moves in the vertical direction. The strip moving part 235 moves the strip S in the first direction X and the second direction W. FIG. The strip moving part 235 includes a plurality of shafts 236 and a shaft driver 237. The shafts 236 are arranged side by side spaced apart from each other in the first direction (X). Each shaft 236 is connected to and interlocked with each other by a belt or gear. The shaft driver 237 rotates the shafts 236 to move the strip S in the first direction X and the shafts 236 to the second direction Y.

The driving controller 238 receives the position data of the defective LED package 10 and controls the driving of the vertical moving unit 233 and the shaft driving unit 235. The driving controller 238 places the defective LED package 10 under the light irradiation unit 231 so that the laser light is irradiated onto the defective LED package 10 indicated in the position data. Under the control of the drive controller 238, the shaft drive unit 235 rotates the shaft 236 to move the strip S in the first direction X or the shaft 236 in the second direction Y. The defective LED package 10 is positioned below the light irradiation part 231. In addition, the vertical moving unit 233 moves the light irradiation unit 231 in the vertical direction so that the focus of the laser light emitted from the light irradiation unit 231 is located on the chip of the defective LED package 10.

5 is a diagram illustrating a process of displaying a defective mark on a defective LED package by a defective display unit, and FIG. 6 is a plan view illustrating an LED package on which a defective mark is displayed.

4 to 6, the vertical moving part 233 has the height of the light irradiation part 231 so that the focus of the laser light L irradiated from the light irradiation part 231 is located lower than the surface of the resin layer 31. Adjust According to the embodiment, the vertical moving part 233 adjusts the height of the light irradiation part 231 so that the focus of the laser light L is located on the upper surface of the chip 21. The laser light L irradiated from the light irradiation part 231 passes through the resin layer and converges on the upper surface of the chip 21. The converged laser light L forms high energy to short circuit the circuit formed on the chip 21. The laser light L may be irradiated to the entire area of the upper surface of the chip 21. The laser light L may be irradiated to each of the chips 21 provided in the defective LED package 10.

When the bad mark display process is completed, the strip moving unit 235 transfers the strip S to the classification unit 400.

Referring again to FIGS. 2A to 3, the classification unit 300 inspects electrical and optical characteristics of the LED packages 10 in which appearance inspection is completed. In the electrical property test, a current is applied to the connection terminals 41 to 43 of the LED package 10 to check whether there is a circuit abnormality in the chip 21 and whether the wire 25 is poor. In addition, the optical property test determines whether brightness of light emitted from the chip 21 and white light of high luminance are generated without shading in overlapping lights. The classification unit 300 has a classification controller. The classification controller classifies the good LED package 10 and the bad LED package 10 in the electrical and optical characteristics test. The LED packages 10 provided for the inspection are large, poor appearance and poor electrical and optical characteristics of the first type LED package, poor appearance but good electrical and optical characteristics of the second type LED package, the appearance is good The LED package may be classified into a third type LED package having poor electrical and optical characteristics, and a fourth type LED package having good appearance and good electrical and optical characteristics. Of the LED packages, only the fourth type LED package may be recognized as a good product and provided by a taping process. All of the first to third type LED packages should be classified as defective.

In the case of the LED package of the first type and the third type, since the current flow applied in the electrical and optical inspection is not desired and the light emitted from the chip is not uniform, it can be easily determined to be defective.

In the case of the LED package of the second type, according to the conventional inspection method, the defect mark is provided to the electrical and optical inspection in a state in which the defect mark is displayed on the resin layer in the appearance inspection, but the defect mark is not easily distinguished by the naked eye. In addition, since the electrical and optical characteristics are good, the second type of LED package has been identified as a good product in the electrical and optical characteristics inspection, thereby providing a problem in the taping process. However, in the present invention, since the circuit of the chip is shorted by directly irradiating laser light to the chip surface of the LED package having a poor appearance in appearance inspection, the LED package of the second type does not emit light in electrical and optical inspection. Accordingly, the worker can easily determine the failure of the LED package of the second type, it is possible to prevent the second type of LED package is supplied to the taping process.

By the above-described inspection process, the LED package of the first type to the third type is determined to be defective and excluded from the subsequent process, and only the fourth type LED package is supplied to the taper 400 and packaged. The taping unit 400 may be provided with an inspection camera (not shown). The inspection camera photographs the taped LED package to generate an inspection image. The generated inspection image is provided to inspect the presence or absence of a bad LED package among the finally taped LED packages.

Hereinafter, a process of inspecting an LED package using the above-described inspection apparatus will be described.

7 is a flowchart illustrating an LED package inspection process according to an embodiment of the present invention.

3 to 7, the LED packages 10 are supplied from the supply unit 100 to the appearance inspection unit 200. The appearance inspection unit 200 generates a first inspection image by photographing the LED packages 10 by focusing the first inspection camera 211 on the upper surfaces of the bodies 11 of the LED packages 10, and generating a first inspection image. 221 focuses on the resin layer 31 formed in the receiving groove 12 of the LED package 10 to photograph the LED packages 10 to generate a second inspection image. The photographing of the first inspection camera 211 and the photographing of the second inspection camera 221 are performed sequentially. The generated first and second inspection images are provided to the inspection controller 240. The inspection controller 240 analyzes the received inspection image to determine the presence or absence of the LED package 10 having a poor appearance. When the bad LED package 10 is detected, the inspection controller 240 generates position data of the bad LED package 10 and transmits the position data to the bad display unit 230.

The defect display unit 230 displays the defect mark R by irradiating the laser light L onto the LED package 10 having the appearance of a defect. After the vertical moving unit 233 adjusts the height of the light irradiation unit 231 so that the focal point of the laser light L irradiated from the light irradiation unit 231 is located on the upper surface of the chip 21, the light irradiation unit 231 The laser light L is irradiated to the upper surface of the chip 21. The irradiated light L shorts the circuit formed in the chip 21.

The LED packages 10 of which the visual inspection is completed are supplied to the sorting unit 300. In the classification unit 300, an inspection is performed on the electrical and optical characteristics of the LED packages 10 (S50). In the external inspection, a current is applied to each of the LED packages 10 to which the laser light L is irradiated and the LED packages 10 to which the light is not irradiated to determine whether the LED package is defective (S60).

The LED package 10 irradiated with the laser light L does not operate normally because the circuit of the chip 21 is shorted. As a result, since the LED package 10 does not emit light with the brightness and color of the light required for inspection, the operator can easily classify it as a defect (S70).

Among the LED packages 10 to which the laser light L is not irradiated, the LED package 10 in which the circuits of the chip 21 and the wires 25 are poorly connected may emit light with the brightness and color of the light required for inspection. Since it does not diverge it is classified as bad (S70).

Among the LED packages 10 to which the laser light L is not irradiated, the LED package 10 having a good circuit and wire 25 connection of the chip 21 is identified as good in electrical and optical inspection and is taped 400. It is provided to the processing (S80).

In the above embodiment, the light irradiation unit 231 positions the focus of the laser light L on the upper surface of the chip 21 to irradiate the laser light L. However, the focus of the laser light L is different from the chip. It may be located inside 21.

In addition, in the above embodiment, the light irradiation unit 231 irradiates the laser light L to the chip 21 to short circuit the circuit of the chip 21. However, the light irradiation unit 231 is the chip 21. The wire 25 may be opened by irradiating the laser light L to the wire 25 connecting the lead plate 26 to the lead plate 26.

In addition, in the above embodiment, it has been described that the two packages 21 are provided in the LED package 10. Alternatively, the single package 21 is provided in the LED package 10, and the fluorescent layer 31 is fluorescent. Material may be provided. Light emitted from the chip 21 penetrates the fluorescent material and expresses white light. In addition, the LED package 10 may be provided with three chips 21 so that any one of red, green, and blue colors may emit light. The emitted light overlaps each other to produce white light.

In addition, in the above-described embodiment, the first and second inspection cameras 211 and 221 have been described as scanning and moving the LED packages 10. However, the first and second inspection cameras 211 and 221 have been described. Is fixed and the first and second inspection cameras 211 and 221 move the LED package 10 while the first and second strip moving parts 215 and 225 move the strip in the first direction X. You can shoot them.

In addition, in the above-described embodiment, the light moving part 231 is fixedly positioned, and the strip moving part 235 moves the strip S so that the defective LED package 10 is located under the light emitting part 231. However, unlike this, the strip S is fixed and the light irradiation unit 231 may move to the top of the defective LED package 10 to irradiate light.

In addition, in the above-described embodiment, the inspection apparatus and the method have been described as inspecting the LED package. However, a circuit such as a semiconductor chip, a printed circuit board, and a flexible printed circuit board is formed. It can be used to inspect various electronic components.

The foregoing detailed description is illustrative of the present invention. Furthermore, the foregoing is intended to illustrate and describe the preferred embodiments of the invention, and the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The described embodiments illustrate the best state for implementing the technical idea of the present invention, and various modifications required in the specific application field and use of the present invention are possible. Thus, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed as including other embodiments.

10: LED package 21: chip
31: resin layer 100: supply part
200: appearance inspection unit 210: first inspection unit
220: second inspection unit 230: defective display unit
231: light irradiation unit 300: classification unit
400: taping part

Claims (10)

In the method of inspecting the LED packages the chip is applied with a resin layer,
Inspecting the appearance of the LED packages by inspecting the appearance; And
Including electrical and optical inspection to examine the electrical and optical characteristics of the LED package by applying a current to the LED package is completed the appearance inspection,
The appearance inspection
Taking the LED package to generate a test image,
Analyzing the inspection image to determine the LED package having a poor appearance,
And irradiating a laser light to short circuit the circuit of the LED package whose appearance is poor. The method of claim 1,
And the laser light is located on a chip of an LED package whose focus is poor in appearance, and shorts a circuit of the chip. The method of claim 2,
And the laser light is irradiated to the entire area of the chip. 4. The method according to any one of claims 1 to 3,
And the LED package with the short circuit is classified as defective in the electrical and optical inspection. An apparatus for inspecting LED packages in which a chip is applied with a resin layer,
Appearance inspection unit for inspecting the appearance of the LED package;
A classification unit which determines a good product by inspecting electrical and optical characteristics of the LED packages in which appearance inspection is completed; And
Including a taping unit for packaging the LED package is determined as good,
The appearance inspection unit
An inspection camera photographing the LED packages to generate an inspection image;
An inspection controller which analyzes the inspection image to determine an LED package having a poor appearance; And
A defective display unit for irradiating laser light to short circuit a circuit of the LED package having a poor appearance;
And the classification unit includes a classification controller for classifying the LED package in which the circuit is short. The method of claim 5, wherein
The defective display unit,
A light irradiation unit for irradiating the laser light;
It includes a vertical moving portion for adjusting the height of the light irradiation portion so that the focus of the laser light is located on the chip which is located lower than the surface of the resin layer,
And said laser light shorts a circuit of said chip. The method according to claim 6,
The bad display unit
And a horizontal moving unit configured to scan move the light irradiation unit in a direction parallel to the upper surface of the chip. In the method of inspecting the quality of the electronic components,
Inspecting the appearance of the electronic components;
Forcibly and electrically making the electronic component determined to be defective in the visual inspection;
And inspecting the electrical properties of the electronic products to classify good and defective products. The method of claim 8,
And said electronic product is an LED package. 10. The method according to claim 8 or 9,
The step of making the electronic component determined to be defective is a failure, wherein the circuit of the electronic component is shorted by irradiating laser light to the electronic component.

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