KR20130130567A - Apparatus for inspecting of led and led inspection method using the same - Google Patents

Apparatus for inspecting of led and led inspection method using the same Download PDF

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Publication number
KR20130130567A
KR20130130567A KR1020120054480A KR20120054480A KR20130130567A KR 20130130567 A KR20130130567 A KR 20130130567A KR 1020120054480 A KR1020120054480 A KR 1020120054480A KR 20120054480 A KR20120054480 A KR 20120054480A KR 20130130567 A KR20130130567 A KR 20130130567A
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KR
South Korea
Prior art keywords
inspection object
white led
inspection
stage
led
Prior art date
Application number
KR1020120054480A
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Korean (ko)
Inventor
정중기
Original Assignee
주식회사 고영테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR1020120054480A priority Critical patent/KR20130130567A/en
Publication of KR20130130567A publication Critical patent/KR20130130567A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Abstract

Disclosed are an LED inspection apparatus and an LED inspection method using the same, which can quickly and accurately identify whether a foreign substance is included in a white LED containing a fluorescent substance and a poor coating of the fluorescent substance. As described above, the present invention further enhances the fluorescence of the fluorescent material applied to the LED chip by using a black light emitting an ultraviolet wavelength as an illumination unit for irradiating an object to be inspected, and thus the boundary between the fluorescent material and the LED chip body. Can be clearly identified, and then by using the camera to acquire an image of the LED substrate, the automation of defect inspection of the substrate on which the white LED chip is mounted can be realized, as well as the drastically reduced defect inspection time. Defect inspection can be performed to further improve the reliability of the product.

Description

LED inspection apparatus and LED inspection method using the same {APPARATUS FOR INSPECTING OF LED AND LED INSPECTION METHOD USING THE SAME}

The present invention relates to an LED inspection apparatus and an LED inspection method using the same, and more particularly, to an LED inspection apparatus capable of inspecting whether or not a white LED having a fluorescent substance applied thereto is defective and an LED inspection method using the same.

In general, LED refers to a light emitting device using a semiconductor. The color of light generated here is determined by the semiconductor material, and the color of light in the image is a light source close to monochromatic light, but not as much as a laser.

Among the LEDs as described above, white LEDs are smaller than conventional light sources, and consume less power, have a semi-permanent lifespan, have no response time, have a fast response speed, and emit less harmful waves such as ultraviolet rays. As it is not used, it is expected to be an environmentally friendly lighting source.

As a method of implementing a white LED as a white light emitting diode (LED) as described above, in general, a multi-chip method of combining two LEDs having complementary colors or combining a plurality of LED chips to obtain a white color is used. Recently, a single chip method of obtaining white by applying a fluorescent material to a blue or ultraviolet LED chip has been used.

In the white LED coated with the fluorescent material, foreign matters are included in the fluorescent material during manufacturing, and the phenomenon in which the fluorescent material is applied to the outside of the body forming the sidewalls of the LED chip is generated. These defect inspections were generally dependent on the human eye.

However, the body forming the sidewall of the white LED chip is usually formed in white so that both the body and the fluorescent material have a bright color. Therefore, it is very difficult for the inspector to identify the state in which the fluorescent material is applied to the outside of the body with the naked eye, which causes a problem that the defect inspection time is very long.

Accordingly, an object of the present invention is to provide an LED inspection apparatus and an LED inspection method using the same, which can quickly and accurately identify whether a foreign substance is included in a white LED containing a fluorescent substance and a poor coating of the fluorescent substance.

An LED inspection apparatus according to the present invention includes a stage for supporting and transporting a test object mounted with a plurality of white LED chips coated with a fluorescent material; At least one lighting unit irradiating the inspection object with illumination so that a boundary between the fluorescent material applied to the white LED chips and the white LED chip body can be clearly identified; A camera installed at an upper portion of the stage to receive light reflected from the illumination unit and then reflected from the lighting unit to take an image of the inspection object; And a controller for controlling whether the white LED chip mounted on the inspection object is defective by mapping the image acquired by the camera and the previously input image while controlling the stage and the lighting unit.

For example, the illumination unit emits ultraviolet wavelengths to further enhance the fluorescence of the fluorescent material applied to the white LED chips so that the boundary between the fluorescent material and the white LED chip body formed of the white series is clearly identified. Black light can be used.

The test object may be, for example, an LED substrate mounted on a bar-shaped substrate in which the white LED chips extend in one direction.

Alternatively, the inspection object may be an LED substrate in which the white LED chips are mounted at regular intervals on a substrate having a square flat plate shape.

On the other hand, the LED inspection apparatus according to the present invention may further include a defect discharge unit installed to be located on one side of the stage to be electrically connected to the control unit for discharging the inspection object determined to be defective to the outside of the stage.

LED inspection method according to the invention, the step of loading a test object mounted with a white LED chip on the stage; Illuminating the inspection object with an illumination unit so that the boundary between the fluorescent material applied to the white LED chips and the white LED chip body can be clearly identified; Receiving an image reflected by the inspection object by using a camera to obtain an image of the inspection object; And determining whether the inspected object is defective by mapping an image of the inspected object obtained by using the camera with an image of the inspected object previously input through a control unit.

For example, the illumination unit emits ultraviolet wavelengths to further enhance the fluorescence of the fluorescent material applied to the white LED chips, so that the boundary between the fluorescent material and the white LED chip body formed of the white series is clearly identified. You can use lights.

On the other hand, the LED inspection method according to the invention, may further comprise the step of discharging the inspection object determined to be defective through the failure discharge unit to the outside of the stage.

As described above, an LED substrate inspection apparatus and an LED substrate inspection method using the same according to an embodiment of the present invention are applied to an LED chip using black light emitting ultraviolet wavelengths as an illumination unit for irradiating illumination to an inspection object. By further enhancing the fluorescence of the fluorescent material so that the boundary between the fluorescent material and the LED chip body can be clearly identified, an image of the LED substrate is obtained by using a camera to inspect defects of the substrate on which the white LED chip is mounted. In addition to realizing automation, it is possible to drastically reduce defect inspection time, and to perform accurate defect inspection, thereby improving the reliability of the product.

1 is a schematic view for explaining the LED inspection apparatus according to an embodiment of the present invention
2 is a flow chart showing an LED inspection method using the LED inspection apparatus according to an embodiment of the present invention.
3 is a diagram showing an example of a substrate image mounted with a white LED chip taken by the camera;
4 is a view showing another example of a substrate image mounted with a white LED chip taken by the camera;
5 is a diagram illustrating another example of a substrate image on which a white LED chip photographed by a camera is mounted.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

For convenience of description, the same reference numerals are given to the same or similar parts as those of the conventional non-metal substrate cutting apparatus.

Hereinafter, an LED inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.

1 is a schematic view for explaining an LED inspection apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the LED inspection apparatus 100 according to an embodiment of the present invention includes a stage 110, at least one lighting unit 120, a camera 130, and a controller 140.

The stage 100 of the LED inspection apparatus 100 according to the embodiment of the present invention configured as described above supports the inspection object 150, that is, the substrate 152 on which the plurality of white LED chips 151 are mounted. Transfer.

The at least one lighting unit 120 is installed to be positioned above the stage 100 to irradiate the inspection object 150, which is the substrate 152 on which the white LED chips 151 are mounted. Although not shown in the drawing, the at least one lighting unit 120 is installed to be positioned above the stage 100 by, for example, a moving unit that can move up, down, left, and right, and the LED chips 151 from the lighting unit 120. The angle of illumination irradiated to the mounted substrate 152 may be adjusted. Here, black light is used as the lighting unit 120 that irradiates the inspection object 150, which is the substrate 152 on which the white LED chips 151 are mounted. The black light employed as the illumination unit 120 emits not only a photochemical action but also an ultraviolet wavelength which makes the fluorescence effect stronger, so that the inspection object 150 is a substrate 152 on which the white LED chips 151 are mounted. When irradiated onto the white LED chips 151, the fluorescent material applied to the white LED chips 151 (153: see FIG. 3) is further enhanced, so that the boundary between the fluorescent material 153 and the LED chip body 151a formed in a white series is clear. To be identified.

The camera 130 is installed so as to be positioned above the stage 110, and as the black light is illuminated, the boundary between the fluorescent material 153 and the LED chip body 151a formed of a white series is clearly identified. An image of the inspection object 150 configured as 152 is obtained. For example, the camera 130 may be installed at an upper portion perpendicular to the stage 110. The camera 130 may be a rolling shutter type camera using a CMOS sensor. A rolling shutter type camera scans two-dimensionally arranged pixels in line units to obtain image data. Alternatively, a global shutter type camera using a CCD sensor may be used as the camera 130. The global shutter type camera acquires image data at a time by taking a snapshot of an image within a field of view. Like the illumination unit 120, the camera 130 may be installed to be positioned above the stage 110 by a moving unit (not shown) capable of moving up, down, left, and right, and may adjust up and down height and left and right positions.

The controller 140 is electrically connected to the stage 110, the lighting unit 120, and the camera 130 to control the stage 110, the lighting unit 120, and the camera 130. In addition, the control unit 140 maps an image of the inspection object 150 acquired by the camera 130 and an image of the inspection object 150 previously input to the control unit 140 to inspect the inspection object 150, That is, it is determined whether the substrate 150 on which the white LED chips 151 are mounted is defective.

On the other hand, the LED substrate inspection apparatus 100 according to an embodiment of the present invention is the inspection object 150 that is determined to be defective, that is, the substrate 152 on which the LED chips 151 are mounted outside the stage 110. It may further include a bad discharge unit 160 for discharging to. For example, the defective discharge unit 160 may be a pneumatic cylinder that is electrically connected to the control unit 140 to discharge the test object 150 to the outside of the stage 110.

The LED inspection apparatus 100 having the above-described configuration has an ultraviolet wavelength that further enhances fluorescence on the substrate 152 on which the white LED chips 151 are mounted using the lighting unit 120 using the black light. Irradiate light, take an image of the substrate 152 mounted with the white LED chips 151 through the camera 130, and then obtain an image obtained through the camera 130 by the controller 140 and the controller The image inputted to the 140 is mapped to determine whether the substrate 152 on which the white LED chips 151 are mounted is defective.

Hereinafter, a process of inspecting whether a substrate on which white LED chips are mounted is defective by using the LED inspection device having the above configuration will be described in detail.

2 is a flowchart illustrating an LED inspection method using the LED inspection apparatus according to an embodiment of the present invention, Figure 3 is a view showing an example of a substrate image mounted with a white LED chip taken by the camera, Figure 4 FIG. 5 is a diagram illustrating another example of a substrate image mounted with a white LED chip photographed by a camera, and FIG. 5 is a diagram illustrating another example of a substrate image mounted with a white LED chip photographed by a camera.

1 to 5, a defect inspection of the substrate 152 on which the inspection object 150, that is, the white LED chip 151 is mounted, is performed using the LED inspection apparatus 100 according to an embodiment of the present invention. In order to do so, first, at least one inspection object 150 is loaded on the stage 110 of the LED inspection apparatus 100 (S110). Here, the inspection object 150 is on the LED bar or the square plate-shaped substrate 152 in which the white LED chips 151 are mounted at a predetermined interval on the bar-shaped substrate 152 extending in one direction. The white LED chips 152 may include an LED substrate mounted at regular intervals. The test object 150 may be loaded by a test board (not shown) on the stage 100 of the LED test apparatus 100. The inspection board may be, for example, a fixed support for fixing the inspection objects 150. The fixing support includes the inspection objects 150, that is, an LED substrate 152 having a bar or a square flat plate shape. At least one groove that can be accommodated may be formed. For example, when performing a defect inspection of the bar-shaped LED substrate 152, the plurality of LED substrates 152 may be arranged on the inspection board to be arranged in a plurality of rows in a predetermined direction. On the other hand, in the case of the LED substrate 152 in the form of a rectangular flat plate may be directly loaded on the stage 110 without using the test board.

When the inspection object is loaded on the stage 110 of the LED inspection apparatus 100 as described above, the inspection object 150 is transferred to the inspection position through the transfer of the stage 110 (S120). For example, the inspection object 150 is moved to a position perpendicular to the camera 130 through the transfer of the stage 110 so that the inspection object 150 is detected by a position sensor (not shown). When the transfer of the stage 110 is stopped by the controller 140, the inspection object 150 is set at the inspection position.

When the stage 110 is moved and the inspection object 150 is set to the inspection position, at least one lighting unit 120 is operated by the controller 140 to illuminate the inspection object 150. (S130). For example, when the inspection object 150 is detected by the position detecting sensor, the controller 140 stops the transfer of the stage 110 to set the inspection object 150 at the inspection position, and at the same time, At least one lighting unit 120 is operated to illuminate the inspection object 150. Here, as the lighting unit 120, a black light emitting an ultraviolet wavelength is used, so that the fluorescent material 153 coated on the white LED chips 151 which are the inspection object 150 by the illumination irradiated by the lighting unit 120. By further enhancing the fluorescence of the fluorescence material and the boundary of the LED chip body 151a formed in a white series can be clearly identified.

When the illumination is irradiated to the inspection object 150 through the lighting unit 120, by using the camera 130 to take an image of the inspection object 150 to obtain an image (S140). That is, after the illumination of the black light is irradiated with light to the inspection object 150, the light reflected by the inspection object 150 is received by the camera 130 to take an image of the inspection object 150 to take an image Acquire. In this case, when the size of the inspection object 150 is large, the entire area of the inspection object 150 may not enter the field of view (FOV) of the camera 130. In this case, the inspection object 150 may be divided into a plurality of areas corresponding to the viewing range area of the camera 130 and photographed sequentially.

As described above, the image of the inspection object 150 obtained by using the camera 130 is mapped to the image of the inspection object 150 previously input by the controller 140 to mount the LED chips 151 on the substrate 152. In other words, it is determined whether the inspection object 150 is defective (S150). For example, when the image of the inspection object 150 is photographed using the camera 130 as described above, images as shown in FIGS. 3 to 5 may be obtained, and such an image may be obtained by the controller 140. The defect is determined by mapping with the image of the inspection object 150 previously input. In more detail, as shown in FIG. 3, when an image in which both the region to which the fluorescent material 153 is coated and the image of the LED chip body 151a are obtained by the camera 130 is obtained by the camera 130, the controller ( 140, the test object 150 is determined to pass, and as shown in FIGS. 4A and 4B, the fluorescent material 153 flows over the rectangular LED chip body 151a or the fluorescent material 153 is removed. When the area in which the fluorescent material 153 is applied is not properly coated and an image having a non-square shape is obtained, the inspection object 150 is determined to be defective by the controller 140. Meanwhile, even when an image in which the fluorescent material 153 is coated is obtained in a rectangular shape, as shown in FIG. 5, a region different from the fluorescent material 153 in contrast with the fluorescent material 153 is shown in FIG. 5. When it is detected, the inspection object 150 is determined to be defective by the controller 140.

As described above, the inspection object 150 that is determined to be passed by the controller 140 is moved to the acceptance product storage place through the transfer of the stage 110 to complete the inspection of the LED substrate (S160).

On the other hand, the inspection object 150 is determined that the defective discharge unit 160 is operated by the control unit 140 to discharge the inspection object 150 to the outside of the stage 110, that is, the defective product discharge place Inspection of the LED substrate is completed (S161).

As described above, the LED substrate inspection apparatus 100 according to the exemplary embodiment of the present invention uses the LED chip 151 using the black light emitting the ultraviolet wavelength as the illumination unit 120 that irradiates the inspection object 150 with illumination. By further strengthening the fluorescence of the fluorescent material 153 is applied to the) so that the boundary between the fluorescent material 153 and the LED chip body 151a can be clearly identified, the LED using the camera 130 By acquiring an image of the substrate 152, the automated inspection of the defect of the substrate 152 on which the white LED chip 151 is mounted can be realized, as well as the drastic inspection time can be greatly reduced, and accurate defect inspection can be performed. There is an advantage that can further improve the reliability of the product.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

110: stage 120: lighting unit
(130): camera 140: control unit
150: inspection object (160): defective discharge unit

Claims (8)

A stage for supporting and transporting a test object mounted with a plurality of white LED chips coated with a fluorescent material;
At least one lighting unit irradiating the inspection object with illumination so that a boundary between the fluorescent material applied to the white LED chips and the white LED chip body can be clearly identified;
A camera installed at an upper portion of the stage to receive light reflected from the illumination unit and then reflected from the lighting unit to take an image of the inspection object; And
And a controller for controlling the stage and the lighting unit and determining whether the white LED chip mounted on the inspection object is defective by mapping an image obtained by the camera and an image previously input. The method of claim 1,
As the lighting unit,
It characterized by using a black light emitting the ultraviolet wavelength to further enhance the fluorescence of the fluorescent material applied to the white LED chips so that the boundary between the fluorescent material and the white LED chip body formed of a white series is clearly identified. LED board inspection device. The method of claim 1,
The inspection object,
LED substrate inspection device, characterized in that the white LED chips are mounted on the bar-shaped substrate extending in one direction at regular intervals. The method of claim 1,
The inspection object,
The LED substrate inspection device, characterized in that the white LED chips are mounted on the substrate of the square flat plate at a predetermined interval. The method of claim 1,
And a defective discharge unit installed at one side of the stage to be electrically connected to the control unit and discharging the inspection object determined to be defective to the outside of the stage. Loading a test object mounted with a white LED chip on a stage;
Transferring the inspection object loaded in the stage to an inspection position through the transfer of the stage;
Illuminating the inspection object with an illumination unit so that the boundary between the fluorescent material applied to the white LED chips and the white LED chip body can be clearly identified;
Receiving an image reflected by the inspection object by using a camera to obtain an image of the inspection object;
And determining whether the inspection object is defective by mapping an image of the inspection object obtained by using the camera to an image of the inspection object previously input through a control unit. The method according to claim 6,
As the lighting unit,
It is characterized by using a black light to make the boundary between the fluorescent material and the white LED chip body formed of a white series to be clearly identified by further enhancing the fluorescence of the fluorescent material applied to the white LED chips by emitting ultraviolet wavelengths LED board inspection method. The method according to claim 6,
And discharging the inspected object determined to be defective to the outside of the stage through the defective discharging unit.
KR1020120054480A 2012-05-22 2012-05-22 Apparatus for inspecting of led and led inspection method using the same KR20130130567A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9543221B2 (en) 2014-11-11 2017-01-10 Samsung Electronics Co., Ltd. Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement
KR20170106587A (en) * 2016-03-11 2017-09-21 삼성전자주식회사 Test apparatus and manufacturing apparatus of light emitting device package
US10217680B2 (en) 2016-08-03 2019-02-26 Samsung Electronics Co., Ltd. Test apparatus and manufacturing apparatus of light emitting device package
KR20190053360A (en) * 2017-11-10 2019-05-20 삼성전자주식회사 Led testing apparatus and method of testing led
US11710431B2 (en) 2019-10-15 2023-07-25 Samsung Electronics Co., Ltd. Manufacturing method of display apparatus, interposer substrate, and computer program stored in readable medium
KR102598469B1 (en) * 2022-10-14 2023-11-06 주식회사쎈비젼 Examining apparatus with multi-faceted lighting

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9543221B2 (en) 2014-11-11 2017-01-10 Samsung Electronics Co., Ltd. Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement
KR20170106587A (en) * 2016-03-11 2017-09-21 삼성전자주식회사 Test apparatus and manufacturing apparatus of light emitting device package
US10302412B2 (en) 2016-03-11 2019-05-28 Samsung Electronics Co., Ltd. Testing apparatus and manufacturing apparatus for testing light emitting device package
US10217680B2 (en) 2016-08-03 2019-02-26 Samsung Electronics Co., Ltd. Test apparatus and manufacturing apparatus of light emitting device package
KR20190053360A (en) * 2017-11-10 2019-05-20 삼성전자주식회사 Led testing apparatus and method of testing led
US11710431B2 (en) 2019-10-15 2023-07-25 Samsung Electronics Co., Ltd. Manufacturing method of display apparatus, interposer substrate, and computer program stored in readable medium
KR102598469B1 (en) * 2022-10-14 2023-11-06 주식회사쎈비젼 Examining apparatus with multi-faceted lighting

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