KR101606674B1 - Etching system and method of molding compound of led package - Google Patents

Etching system and method of molding compound of led package

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Publication number
KR101606674B1
KR101606674B1 KR1020150115061A KR20150115061A KR101606674B1 KR 101606674 B1 KR101606674 B1 KR 101606674B1 KR 1020150115061 A KR1020150115061 A KR 1020150115061A KR 20150115061 A KR20150115061 A KR 20150115061A KR 101606674 B1 KR101606674 B1 KR 101606674B1
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South Korea
Prior art keywords
unit
laser
led
etching
scanning
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KR1020150115061A
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Korean (ko)
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이종명
최한섭
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주식회사 아이엠티
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Publication of KR101606674B1 publication Critical patent/KR101606674B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed is a laser etching system for etching encapsulation materials of LED packages by using a laser while conveying LED materials in which the LED packages including the encapsulation materials are disposed in a matrix array with rows and columns. The system comprises: a conveyor unit which conveys the LED materials to pass a laser etching position; a loading unit which loads the LED materials to an inlet side of the conveyor unit; an unloading unit which unloads the LED materials at an outlet side of the conveyor unit; a position/alignment checking unit which checks a position or an alignment of the LED materials placed on the conveyor unit; a laser etching unit which etches the encapsulation materials of the LED packages included in the LED materials, the position or the alignment of which is checked by the position/alignment checking unit, at the laser etching position by using the laser; and an integrated control unit which controls the position/alignment checking unit and the laser etching unit in an integrated manner. The laser etching unit comprises a laser generating unit for generating a laser beam, a laser beam scanning unit for x-y scanning the laser beam, a focus lens unit for making the laser beam as a laser beam spot, and an X-Y-Z moving unit for moving a body including the laser generating unit, the laser scanning unit, and the focus lens unit in three axes, i.e., an X axis, a Y axis, and a Z axis.

Description

[0001] ETCHING SYSTEM AND METHOD OF MOLDING COMPOUND OF LED PACKAGE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a sealing material etching technique for an LED (Light Emitting Diode) package, and more particularly, to a system for surface etching a molding compound used for manufacturing an LED package using a laser .

Among various light emitting devices, an LED has a PN junction structure using a semiconductor, and when a forward voltage is applied to the PN junction, the energy of electrons is converted into light energy to emit light. LED was first developed by Nick Hororniak of the University of Illinois in 1962 and has been used today as a light source for lighting, a backlight unit of a liquid crystal display (LCD) And has been attracting attention as a light source to replace a fluorescent lamp or a bulb in the future.

BACKGROUND ART In general, an LED package includes an LED chip mounted on a lead frame or a printed circuit board (PCB), electrically connected to an electrode for applying an external voltage through a bonding wire, And then the entire structure is molded into a translucent encapsulant. Epoxy resin or silicone resin is mainly used as an encapsulating material.

1 is a cross-sectional view of a typical LED package. 1, an LED package 1 is mounted on a submount 2a provided on or in addition to the package body 2, and the LED chip 4 is attached to the + Electrode terminals and external terminals 3a and 3b provided on the package body 2 are electrically connected by a wire W such as a gold wire and the LED chip 18 and the wire W are electrically connected. Is encapsulated and completed by the translucent encapsulant 5 molded on the package body 2 by an epoxy resin or a silicone resin. Recently, an encapsulant containing a phosphorous has been used to produce a white LED or a UV LED.

At this time, it is difficult to make the amount of the light-transmitting resin included in the encapsulating material 5 or the amount or distribution of the fluorescent material uniform, and this makes it possible to change the characteristics of the light that is wavelength-converted by the fluorescent material, The color coordinates (CIE XYZ) of the losing light are also changed. That is, in the packaging process of the LED package, the color coordinate of the final LED package deviates from the reference value due to the change in discharge amount of the resin including the fluorescent material and / or the blending of the non-uniform fluorescent material. There is also a need to change the light properties of LED packages manufactured for other reasons, such as, for example, the needs of the customer or consumer. Almost the only way to change the light properties of an LED package that has been completed by encapsulation molding is to form a pattern on the light-transmitting encapsulant.

Korean Patent Registration No. 10-1051140

Accordingly, the inventor of the present invention has proposed a technique of etching a sealing material of an LED package with a laser, forming a specific pattern on the sealing material, and changing the color coordinate through the pattern. However, there are a number of barriers in implementing such techniques, including the problems of efficiency and yield, the problem of precision in accurately scanning the laser beam with a specific pattern on the encapsulant of the LED package, , The problem of secondary contamination caused by laser etching, and the like.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method and an apparatus for improving efficiency by supplying a tray type or lead frame type LED material having a plurality of LED packages arranged in a mattress arrangement to a laser beam scanning region of a laser etching unit, An encapsulant etching system of an LED package is provided which enables more precise laser etching by allowing position / alignment confirmation and height measurement to occur before or after the LED material enters the laser beam scan area of the laser etch unit will be.

Another object of the present invention is to improve efficiency by supplying a tray type or lead frame type LED material having a plurality of LED packages arranged in a mattress arrangement to a laser beam scanning region of a laser etching unit, Alignment / confirmation and height measurement are performed before or after entering the laser beam scan region of the etching unit so that more precise laser etching can be performed. Immediately after laser etching, And it is an object of the present invention to provide an encapsulant etching system of an LED package which can prevent contamination of an LED package which can be caused by laser etching.

According to one aspect of the present invention, there is provided a laser etching system for laser etching the encapsulants of LED packages, wherein the LED packages comprising the encapsulant carry LED material disposed in a mattress arrangement comprising rows and columns The etching system comprising: a conveyor unit for transferring the LED material past the laser etch location; A loading unit for loading the LED material onto the entrance side of the conveyor unit; An unloading unit for unloading the LED material at an exit side of the conveyor unit; A position / alignment confirmation unit for confirming the position or alignment of the LED material placed on the conveyor unit; A laser etching unit for laser-etching the encapsulants of the LED packages contained in the LED material with respect to the LED material whose position or alignment is confirmed by the position / alignment confirmation unit; And an integrated control unit for integrally controlling the position / alignment confirmation unit and the laser etching unit. The laser etching unit includes a laser generator for generating a laser beam, a laser beam scanning unit for xy scanning the laser beam, A focus lens unit for making the laser beam into a laser beam spot, and a main body made up of the laser generator, the laser beam scanning unit, and the focus lens unit are moved in three directions along the X axis, the Y axis, and the Z axis Gt; XYZ < / RTI >

According to one embodiment, the sealing material etching system further comprises a height measuring unit controlled by the integrated control unit, the height measuring unit measuring the height of the LED material that has reached the height measuring position on the conveyor unit, The control unit controls the Z-axis movement of the XYZ movement unit according to the height information measured by the height measurement unit, and the height measurement position is located between the entrance side of the conveyor unit and the laser etching position.

According to one embodiment, the sealing material etching system is controlled by the integrated control unit, and when the LED material reaches the optical characteristic measuring position on the conveyor unit after laser etching by the laser etching unit is completed, Further comprising an optical characteristic measurement unit for measuring the optical characteristics of the LED packages, wherein the optical characteristic measurement position is located between the laser etch position and the exit side of the conveyor unit.

According to one embodiment, the encapsulation material etch system is controlled by the integrated control unit, and when the LED material has reached the pattern inspection position on the conveyor unit after laser etching by the laser etching unit has been completed, And a pattern inspection unit for inspecting the laser etching pattern formed on the ashes with a vision camera, wherein the pattern inspection position is located between the laser etching position and the exit side of the conveyor unit.

According to one embodiment, the encapsulant etch system is controlled by the integrated control unit, wherein when the LED material has reached the clean position on the conveyor unit after laser etching by the laser etch unit has been completed, the CDA And a dry cleaning unit for cleaning the LED material by spraying clean dry air.

According to one embodiment, the dry scrubbing unit cleans the LED material by spraying CO 2 dry ice with the CDA.

According to one embodiment, the encapsulant etch system, when the LED material has finished laser etching by the laser etch unit and then reaches the inspection position on the conveyor unit, the pattern of the optical properties or encapsulants of the LED packages And a sorting unit for sorting the unloaded product by the unloading unit into a good product and a defective product according to the inspection result by the inspection means.

According to one embodiment, the focus lens section comprises a confocal f-& theta lens, the laser beam scanning section comprises a Galvano scanner, the position / alignment confirmation unit comprises machine vision, The measuring unit includes a laser distance sensor.

According to one embodiment, the laser beam scanning unit performs a laser scanning operation for a specific laser scanning area including a plurality of sealing materials.

According to one embodiment, the laser beam scanning unit divides the entire area of the LED material into a plurality of laser scanning areas having the same size with respect to the LED material, laser-scans each laser scanning area, and includes the laser scanning area The encapsulated encapsulants are collectively laser-etched, and when the laser scanning for one laser scanning area is completed, the laser scanning is performed to the next laser scanning area to perform laser scanning for the corresponding laser scanning area.

According to the present invention, it is possible to regenerate defective products due to deviation of the color coordinates based on the discharge amount of the conventional fluorescent epoxy resin and the amount of uneven fluorescent material, etc., through good artifacts by moving artificial color coordinates, thereby improving the production yield. Further, the final brightness of the LED can be improved by etching the encapsulant of the LED, and the shape of the upper surface of the encapsulant of the LED is controlled through the pitch of the concentric circles of the ring pattern and the output of the laser, And can increase the efficiency and functionality of the LED.

According to the present invention, efficiency can be improved by feeding a tray type or a lead frame type LED material, in which the LED packages are arranged in a mattress arrangement, to the laser beam scanning region of the laser etching unit, and the LED material is irradiated onto the laser Alignment / confirmation and height measurement are performed before or after entering the beam scan region to enable more precise laser etching and to confirm that the optical characteristics of the LED packages meet the desired target value immediately after laser etching And can prevent contamination of the LED package, which can be caused by laser etching.

1 is a cross-sectional view of a typical LED package.
2 (A) and 2 (B) show two examples of LED materials that are supplied and processed in a sealing material etching system of an LED package according to the present invention.
3 is a block diagram illustrating an encapsulating material etching system of an LED package according to an embodiment of the present invention.
4 is a configuration diagram illustrating an encapsulating material etching system of an LED package according to another embodiment of the present invention.
5 is a configuration diagram illustrating an encapsulating material etching system of an LED package according to another embodiment of the present invention.
6 is a view for explaining an example in which the laser etching unit according to the present invention is applied to a large area LED material in a region division manner.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings and the description thereof are intended to aid those of ordinary skill in the art in understanding the present invention. Accordingly, the drawings and description are not to be construed as limiting the scope of the invention.

2 (A) and 2 (B) show two examples of LED materials that are supplied and processed in a sealing material etching system of an LED package according to the present invention.

The encapsulant etching system of the present invention, which will be described below, receives the LED material M1 or M2 (collectively M) transferred in the form of FIG. 2A or FIG. Laser processing is performed on the encapsulant 5 of the LED package 1 belonging to the above-mentioned group (M). The LED material M1 shown in FIG. 2A is arranged such that a plurality of LED packages 1 having a chip on board (COB) type are arranged in a tray T with a mattress arrangement including rows and columns . The LED material M2 shown in FIG. 2B is supported on the lead frame L with a plurality of LED packages 1 having a lead frame type arranged in a mattress arrangement including rows and columns . The lead frame L is cut to separate the LED packages 1 and a part of the lead frame L remaining in the LED package 1 after cutting becomes an external connection terminal, And serves to electrically connect the electrode terminals.

3 is a block diagram illustrating an encapsulating material etching system of an LED package according to an embodiment of the present invention.

Referring to FIG. 3, the sealing material etching system of the LED package according to the present embodiment includes the LED material M (see FIG. 3), which is sequentially passed through the position / alignment confirmation position, the height measurement position, the laser etching position, (Not shown). The conveyor unit 10 stops when the LED material M reaches the above-described positions, that is, the position / alignment confirmation position, the height measurement position, the laser etching position, the optical property measurement position, and the cleaning position It is good to be able to do that work. In this embodiment, although the position / alignment confirmation position and the laser etching position are different, the laser etching position and the position alignment confirmation position may be the same. In this case, the position alignment confirmation unit is in the same position as the laser etching unit.

The sealing material etching system of the LED package further comprises a position / alignment confirmation unit 20 for confirming the position and alignment of the LED material M placed on the conveyor unit 10 stopped at the position / alignment confirmation position, , A height measurement unit (22) for measuring the height of the LED material (M) which has reached the height measurement position after being confirmed by the position / alignment confirmation unit (20) A laser etching unit (10) for etching the encapsulants of the LED packages contained in the LED material (M) with a laser when the LED material (M) identified by the correcting unit (20) (30), and when the LED material (M) reaches the optical property measuring position after laser etching by the laser etching unit (30), the optical characteristics of the LED packages including the laser- , An optical characteristic measuring unit (40) And a dry cleaning unit 50 for dry cleaning the contaminants such as dust generated in the laser etching process when the material M reaches the cleaning position after the optical characteristic measurement unit 40 has measured the optical characteristics.

The sealing material etching system of the LED package further comprises a loading unit 60 for loading the LED material M to the inlet side of the conveyor unit 10 and a charging unit 60 for charging the LED material M at the outlet side of the conveyor unit 10. [ (70) for unloading the object (M). In addition, the encapsulant etching system of the LED package may include the conveyor unit 10, the position / alignment confirmation unit 20, the height measurement unit 22, the laser etching unit 30, A characteristic measuring unit 40 and an integrated control unit 80 for controlling the dry cleaning unit 50 integrally.

The loading unit 60 can sequentially load the LED material M to the entrance side of the conveyor unit 10. In addition, the position / alignment confirmation unit 20 may consist of a vision device including a vision camera, more preferably a machine vision device . If the position / alignment confirmation unit 20 confirms that the position and alignment of the LED material M is correct at the position / alignment confirmation position or the laser etching position, The laser etching unit 30 is operated to perform laser etching on the encapsulants of the LED packages contained in the LED material M. [

If it is confirmed that the LED material M is misaligned, the integrated control unit 80 should inform the operator or correct the misalignment state by means provided in the system. The height measuring unit 22 measures the surface height of the encapsulant from which laser etching is performed by the laser distance sensor. The integrated control unit 80 performs control to adjust the distance between the surface of the encapsulant and the focus lens unit of the laser etching unit based on the measured height.

The laser etching unit 30 is a unit for etching the LED material M transferred on the conveyor unit 10 to reach the laser etching position and includes a laser generating unit 32 for generating a laser beam A laser beam scanning unit 34 for scanning the laser beam xy; a focus lens unit 36 for generating a laser beam with a very small laser spot; a laser generating unit 32; And an XYZ moving unit 38 for moving the main body of the laser etching unit 30 composed of the scanning unit 34 and the focus lens unit 36 in three directions along the X axis, the Y axis, and the Z axis.

The laser generating portion 32 may use a laser of various wavelengths as an energy source for etching the sealing material. For example, the laser may be a carbon dioxide (CO 2) laser, the wavelength may be 10.6um or 9.4um. The carbon dioxide laser has an advantage that the reaction with the epoxy resin or the fluorescent epoxy resin forming the encapsulating material is very efficient and the etching can be effectively performed even with a small energy.

The laser beam scanning unit 34 is used to scan a laser beam at high speed x-y, and is preferably implemented as a Galvano scanner using two mirrors used for high-speed laser marking. Also, the focus lens section 36 is used to make a very small laser spot on the encapsulation material. Preferably, the lens of the focus lens section 34 always has a constant focal length and / F &thetas; lens that maintains the focal size.

In this embodiment, one laser scanning area by the laser beam scanning unit 34 is defined as an area including all encapsulants included in the LED material M. The laser beam scanning unit 34 performs laser scanning across the entire area of the LED material M including the plurality of sealing materials while crossing the LED material M. [

The amount of etching that is performed in etching the encapsulation material can be finely controlled by adjusting the power and the scanning pitch of the laser beam. As the etching amount of the sealing material is finely controlled, the color coordinates (CIE-XYZ) of the light of the LED package which finally emits light changes finely. Accordingly, even if it is determined that the LED package provided in the LED material M is defective due to deviation of the reference value of the color coordinate, it is possible to reproduce the product by good products. The change in the color coordinates of the LED due to the laser beam etching largely depends on the etching amount of the sealing material and the etching pattern.

The integrated control unit 80 controls the laser generation unit 32 to generate a laser. In this case, the laser beam shape adjusting unit adjusts the beam shape of the laser generated in the laser generating unit 32 to adjust the shape of the laser beam, (34). The integrated control unit 80 controls the laser beam scanning unit 34 to scan the laser beam across the sealing material. The laser beam to be scanned is focused by the focus lens section 36 described above and focused on the surface of the encapsulant material before reaching the encapsulant surface. The laser beam spot size on the encapsulant surface is preferably about 1 to 100 micrometers in diameter.

On the other hand, the optical characteristic measuring unit 40 is a unit for measuring the optical characteristics of the LED packages of the LED material M, which has been transported on the conveyor unit 10 after the laser etching has been completed, A power applying means such as a probe for applying power to the LED packages, and a photodetector for detecting light emitted from the LED packages by power application. The measurement light characteristics may include color coordinates, luminance, light distribution, etc. At this time, it is preferable to use a spectrometer for accurate optical property measurement.

The cleaning unit 50 is a unit for dryly cleaning the LED material M that has reached the position of the picking over the conveyor unit 10 so that an ionized CDA is applied to the surface of the LED material M Is preferred. In this case, when the foreign matter is sticky, it is preferable to use a dry ice spray cleaning method in which CO 2 dry ice is sprayed together with CDA.

The etch pattern for the encapsulant may be a dot pattern comprising a plurality of points or a lattice or screen pattern in which the lines cross each other in the lateral and longitudinal directions or the like, A circular, polygonal, or elliptical ring having a size can be formed to have the same center. When the ring pattern is etched by the laser, the pitch of the ring and the output of the laser can be adjusted to make the shape of the upper surface of the sealing material concave or convex.

For example, an etching pattern of an encapsulant is formed by etching a sealing material of an LED by a laser in a ring pattern patterned with a plurality of concentric circles, wherein the pitch of the concentric circles (meaning the width of each concentric circle) By controlling the output of the laser, the upper surface of the etching pattern of the sealing material may be patterned to have a concave shape according to the pitch or the output of the laser, patterned into a convex shape, or patterned into an aspherical shape.

Further, when the encapsulant of the LED package is laser-etched, the light emitted from the LED chip encapsulated in the encapsulant is very effectively emitted through the etched encapsulant surface. That is, the etching of the encapsulant increases the light extraction efficiency and improves the final brightness of the LED package by at least 10%.

4 is a configuration diagram illustrating an encapsulating material etching system of an LED package according to another embodiment of the present invention.

4, the encapsulant etching system of the LED package according to the present embodiment includes a conveyor unit 10 for conveying the LED material M, an LED (light emitting diode) 10 placed on the conveyor unit 10, A position / alignment confirmation unit (20) for confirming the position and alignment of the material (M), a height measurement unit (22) for measuring the height of the LED material (M) A laser etching unit 30 for laser-etching the encapsulants of the LED packages contained in the LED material M at the laser etch position with the LED material M identified by the unit 20 in correct position and alignment, And an optical characteristic for measuring the optical characteristics of the LED packages including the laser-etched encapsulant when the LED material (M) reaches the optical characteristic measurement position after laser etching by the laser etching unit (30) A measuring unit (40) for measuring the light intensity of the LED material (M) If after the optical characteristics measured by the unit 40 reaches the cleaning position comprises a dry cleaning unit 50 for the dry cleaning of contaminants such as dust generated in the laser etching process. The encapsulant etching system of the LED package also includes a loading unit 60 for loading the LED material M to the entrance side of the conveyor unit 10. In addition, the sealing material etching system according to the present embodiment receives the LED material M unloaded by the unloading unit 70 and the unloading unit 70 at the outlet side of the conveyor unit 10 And a sorting unit 90 for sorting the good product and the defective product according to the optical characteristic measurement result by the optical characteristic measurement unit 40.

5 is a schematic view illustrating a pattern inspection position of the LED material M in the conveying path of the conveyor unit 10 following the laser etching position according to another embodiment of the present invention. A pattern inspection unit 40 'for inspecting a laser etching pattern formed on the encapsulant with a vision camera is provided. In this embodiment, the pattern inspection unit 40 'and the optical characteristic measurement unit 40 are provided as a unit for inspecting the laser etching result by the laser etching unit 30, but it is also conceivable to use only one of them .

6 shows an example in which the entire area of the LED material M is divided into a plurality of laser scanning areas a1, a2, a3, a4, a5 a6, a7, and a8) to the laser beam scanning unit 34 of the laser etching unit 30 to scan the laser scanning areas a1, a2, a3, a4, a5, a6, The encapsulating materials 5 included in one laser scanning area are collectively laser-etched and when the laser scanning for one laser scanning area is completed, the laser beam scanning unit 34 is moved to the next laser scanning area, And the encapsulants contained in the laser scanning region are laser-etched in a batch by laser scanning on the region. The movement from one laser scanning area to the next laser scanning area can be performed, for example, by X-axis and / or Y-axis movement by the X-Y-Z moving part 38. This method can cover a large area at a low cost as compared with the case of using a large area laser beam scanning unit, and the focal point size of the laser beam can be made small by using the focus lens unit 36, thereby enabling more precise processing.

10: Conveyor unit 20: Optical characteristic measuring unit
22: height measuring unit 30: laser etching unit
40: Optical characteristic measurement unit 50: Dry cleaning unit
60: loading unit 70: unloading unit
80: Integrated control unit

Claims (10)

CLAIMS 1. A laser etching system for laser etching encapsulants of LED packages, the LED packages comprising an encapsulant carrying an LED material arranged in a mattress arrangement comprising rows and columns,
A conveyor unit for conveying the LED material past a laser etch location;
A loading unit for loading the LED material onto the entrance side of the conveyor unit;
An unloading unit for unloading the LED material at an exit side of the conveyor unit;
A position / alignment confirmation unit for confirming the position or alignment of the LED material placed on the conveyor unit;
A laser etching unit for etching the encapsulants of the LED packages contained in the LED material with the laser at the laser etching position for the LED material whose position or alignment is confirmed by the position / alignment confirmation unit; And
And an integrated control unit for integrally controlling the position / alignment confirmation unit and the laser etching unit,
The laser etching unit includes a laser generating unit for generating a laser beam, a laser beam scanning unit for xy scanning the laser beam, a focus lens unit for forming a laser beam as a laser beam spot, And an XYZ moving unit for moving the main body made of the laser beam scanning unit and the focus lens unit in three axes in the X axis, the Y axis, and the Z axis. The apparatus according to claim 1, further comprising a height measurement unit controlled by the integrated control unit, the height measurement unit measuring the height of the LED material that has reached the height measurement position on the conveyor unit, Wherein the height measurement position is located between the laser etch position and the exit side of the conveyor unit, wherein the height measurement position is located between the laser etch position and the exit side of the conveyor unit. . 2. The method according to claim 1, further comprising the steps of: controlling, by the integrated control unit, the optical characteristics of the LED packages when the LED material has reached the optical property measurement position on the conveyor unit after laser etching by the laser etching unit Wherein the optical characteristic measurement position is located between the laser etch position and the exit side of the conveyor unit. The method according to claim 1, further comprising: controlling the integrated material to be inspected by the integrated control unit, wherein when the LED material reaches the pattern inspection position on the conveyor unit after laser etching by the laser etching unit, Wherein the pattern inspection position is located between the laser etch position and the exit side of the conveyor unit. ≪ Desc / Clms Page number 20 > The method according to any one of claims 1 to 4, wherein when the LED material is laser-etched by the laser etching unit and then reaches the cleaning position on the conveyor unit, the CDA Further comprising a dry cleaning unit for cleaning the LED material by spraying dry air on the LED material. 6. The encapsulant etching system of an LED package of claim 5, wherein the dry scrubbing unit cleans the LED material by spraying CO 2 dry ice with the CDA. An inspection apparatus according to claim 1, further comprising inspection means for inspecting a pattern of the optical characteristics or the sealing materials of the LED packages when the LED material reaches the inspection position on the conveyor unit after the laser etching by the laser etching unit is completed, Further comprising a sorting unit for sorting the unloaded product by the unloading unit into a good product and a defective product in accordance with the inspection result by the inspection means. The system of claim 2, wherein the focal lens section comprises a confocal f-theta lens, the laser beam scanning section comprises a Galvano scanner, the position / alignment confirmation unit comprises machine vision, RTI ID = 0.0 > 1, < / RTI > wherein the unit comprises a laser distance sensor. [2] The system according to claim 1, wherein the laser beam scanning unit performs a laser scanning operation for a specific laser scanning area including a plurality of sealing materials. [12] The method of claim 9, wherein the laser beam scanning unit divides an entire area of the LED material into a plurality of laser scanning areas having the same size with respect to the LED material, laser scans each laser scanning area, Wherein the encapsulating members are laser-etched in a batch, and when the laser scanning for one laser scanning area is completed, the laser scanning is performed to the next laser scanning area to perform laser scanning for the corresponding laser scanning area. .
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KR20190113231A (en) * 2018-03-28 2019-10-08 한미반도체 주식회사 Partial shield processing method for semiconductor member

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JP2004282026A (en) 2003-02-28 2004-10-07 Semiconductor Energy Lab Co Ltd Laser beam irradiation unit, laser beam irradiation method, and method of manufacturing laser beam irradiation system and semiconductor device

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JP2004282026A (en) 2003-02-28 2004-10-07 Semiconductor Energy Lab Co Ltd Laser beam irradiation unit, laser beam irradiation method, and method of manufacturing laser beam irradiation system and semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190113231A (en) * 2018-03-28 2019-10-08 한미반도체 주식회사 Partial shield processing method for semiconductor member
KR102531817B1 (en) 2018-03-28 2023-05-12 한미반도체 주식회사 Partial shield processing method for semiconductor member

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