KR20120096792A - Apparatus for sticking force measuring instrument of substrate bonding and method for thereof - Google Patents

Abstract

PURPOSE: A device and a method for measuring the adhesive power of a substrate laminating device are provided to accurately recognize a replacing period by measuring the adhesive power of an adhesive member, thereby preventing damage to a substrate. CONSTITUTION: A device for measuring the adhesive power of a substrate laminating device comprises a chamber, an upper table(110), a lower table(210), and a regulator, a vision, and a determining unit. The upper table is installed in the inside of the chamber and adhere an upper substrate with an adhesive chuck and comprises a diaphragm to separate the upper substrate from the adhesive chuck. The lower table is installed in the inside of the chamber and faces to the upper table and maintains a lower substrate being laminated with the upper table and comprises lift pins for seating/separating the lower substrate. The regulator supplies and controls air for expanding the diaphragm. The vision is arranged in an upper chamber, thereby confirming the upper plate is separated from the adhesive chuck by the diaphragm. The determining unit determining the adhesive power of the adhesive chuck by confirming the pressure being supplied to the diaphragm from the regulator when photographing that the upper substrate is separated from the vision.

Description

Apparatus for sticking force measuring instrument of Substrate bonding and method for

The present invention relates to an adhesive force measuring device and an adhesive force measuring method of the substrate bonding apparatus, and more particularly, to an adhesive force measuring apparatus and adhesive force measuring method of the substrate bonding apparatus that can measure the replacement cycle of the adhesive chuck.

The substrate bonding apparatus is a device for bonding two substrates for the manufacture of a flat panel display panel and is used for manufacturing various flat panel display panels such as LCD, PDP, OLED, and the like.

The substrate bonding apparatus includes a substrate chuck supporting the substrate in order to bond the substrate using the substrate bonding apparatus. There are several types of substrate chucks, the most commonly used being electrostatic chucks. The electrostatic chuck chucks the substrate using electrostatic power. Thus, the electrostatic chuck consumes power to generate constant power. Electrostatic chucks require power and are very difficult to manufacture and control. And the manufacturing cost of the electrostatic chuck is very expensive. In order to solve various problems of the electrostatic chuck, an adhesive chuck has been developed as a chuck device that can replace the electrostatic chuck.

The adhesive chuck adheres a substrate using an adhesive member, and uses a diaphragm made of a resin material to separate the substrate. The diaphragm is expanded by air supplied from the outside to separate the substrate adhered to the adhesive member. This expansion force separates the substrate attached to the adhesive member.

However, the sticking chuck used in the related art incorrectly recognizes the replacement cycle of the sticking member, which causes a problem that the substrate is broken.

The present invention is to provide an adhesive force measuring device and adhesive force measuring method of the substrate bonding apparatus that can measure and recognize the replacement cycle of the adhesive member.

Adhesive force measuring apparatus of the substrate bonding apparatus according to the present invention comprises a chamber; An upper surface plate installed inside the chamber and having an diaphragm that expands the upper substrate to adhere to the adhesive chuck and separates the upper substrate from the adhesive chuck; A lower surface plate installed inside the chamber to face the upper surface plate, maintain the lower substrate to be bonded to the upper substrate, and have a lift pin for seating and separating the lower substrate; A regulator for supplying and regulating air for inflating the diaphragm; A vision provided in the upper chamber to confirm that the upper substrate is peeled off the adhesive chuck by the diaphragm; And a determination unit that determines the adhesive force of the adhesive chuck by checking the pressure applied to the diaphragm by the regulator when photographing that the upper substrate is peeled off in the vision.

In the regulator, air may be supplied to the diaphragm at a pressure rising in stages.

The regulator may include a pressure gauge for checking the pressure provided to the diaphragm.

The determination unit may receive the pressure measurement value provided by the pressure gauge to determine the pressure measurement value at the time when the alignment mark of the upper substrate is not photographed in the vision as the magnitude of the adhesive force of the adhesive chuck.

On the other hand, the adhesive force measuring method of the substrate bonding apparatus according to the present invention is an adhesive step of adhering the lower substrate to be bonded to the upper substrate with an adhesive chuck; An identification step of photographing and identifying an alignment mark of the upper substrate by a camera; An air supply step of supplying air of a predetermined pressure for expanding the diaphragm provided in the adhesive chuck to peel the upper substrate adhered to the adhesive chuck; Confirming, by the camera, a time point at which the alignment mark of the upper substrate disappears; And determining the pressure as the size of the adhesive force of the adhesive chuck by measuring the pressure at the time when the alignment mark disappears.

The pressure providing step may supply a pressure rising stepwise to the diaphragm by a regulator.

The checking step may measure the pressure supplied to the diaphragm by the regulator by a pressure gauge.

Adhesive force measuring device and adhesive force measuring method of the substrate bonding apparatus according to the present invention can accurately recognize the replacement cycle by measuring the adhesive force of the adhesive member has the effect of preventing the breakage of the substrate.

1 and 2 is a view showing the configuration of the adhesion chuck measuring apparatus of the substrate bonding apparatus according to an embodiment of the present invention.
Figure 3 is an enlarged view of the main part of the adhesion chuck measurement apparatus of the substrate bonding apparatus according to an embodiment of the present invention.
4 and 5 are flowcharts for explaining a method of measuring the adhesive force of the substrate bonding apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the embodiment disclosed below, the substrate bonding apparatus will be described as an example. However, embodiments of the present invention can be used in not only substrate bonding apparatuses, but also etching apparatuses, vapor deposition apparatuses, and various other apparatuses in which a substrate is held by an adhesive chuck.

1 to 3, the adhesive force measuring apparatus of the substrate bonding apparatus according to the present embodiment includes a chamber. The chamber includes an upper chamber 100 on which the upper substrate S1 and the lower substrate S2 are seated, and a lower chamber 200 facing the upper chamber 100. The lower chamber 200 is fixed to the base 400, and the upper chamber 100 is lifted up and down by the chamber lifting unit 300 formed of a universal joint or a jack screw.

An upper surface plate 110 is installed in the upper chamber 100, and an upper adhesion chuck 120 is attached to the upper surface plate 110 to adhere the upper substrate S1. A plurality of upper adhesion chuck 120 is installed distributed in the upper surface plate (110). The upper adhesive chuck 120 includes a housing 121, and when the upper substrate S1 and the lower substrate S2 are bonded to a central portion of the housing 121, the upper substrate S1 is directed to the lower substrate S2. The diaphragm 112 expands by air to be removed, and an outer circumference of the diaphragm 112 is provided with an adhesive member 116 for adhering the upper substrate S1.

A regulator 800 that supplies and regulates air is connected to the housing 121 in which the diaphragm 112 expanding by air is installed. The regulator 800 supplies air to the diaphragm 112 at a pressure rising in stages so that the expansion of the diaphragm 112 proceeds sequentially.

The pressure measuring device 850 for checking the pressure provided from the regulator 800 is connected to the space S in which air is supplied to the diaphragm 112 of the housing 121. The pressure gauge 850 may use a gauge or display device that allows a user to recognize the pressure at which the diaphragm 112 expands.

The adhesive member 116 is commonly used for the upper adhesive chuck 120 and the lower adhesive chuck 212 to be described later. The adhesive member 116 includes an organopolysiloxane (10 to 75 parts by weight), an organohydrogenpolysiloxane (5 to 30 parts by weight), an addition reaction catalyst, and the like containing an alkenyl group bonded to a small amount of silicon atoms. It is manufactured by hardening addition reaction hardening type silicone rubber composition which has a main component. In addition, the adhesive member may be directly formed by compression molding, injection molding, injection molding, punching, or the like.

In addition, a sealing film (not shown) may be coated on another surface of the adhesive member 116 other than the surface adhered to the upper substrate S1. This sealing film is composed of Liquid Silicone Rubber (LSR), Room-Temperature-Vulcanizing (RTV) Elastomers (HCR), High Consistency Silicone Rubber (HCR), Silicone Modified Organic Compound (SMO) ) Elastomeric Emulsion (SMO) Elastomeric Emulsion and other components that can perform a sealing function can be formed.

In addition, the upper chamber 100 photographs an alignment mark displayed on the upper substrate S1 and the lower substrate S2 to check whether the substrates S1 and S2 are positioned at the correct bonding point. 181) can be installed. The vision 181 photographs alignment marks formed on the upper substrate S1 and the lower substrate S2 through the imaging hole 181a penetrating the upper chamber 100. In this case, the illumination device 199 may be installed under the lower chamber 200 to provide illumination to the vision 181 so that the vision 181 may photograph the alignment mark.

By measuring the adhesive force of the adhesive chuck 120 through the regulator 800, the pressure measuring instrument 850 and the vision 181 and the determination unit 900 connected thereto, the adhesive force is lost when the adhesive force is supplied below the set pressure. Replace the adhesive chuck 120 by judging.

When the upper substrate S1 is loaded into the upper chamber 100, the upper chamber 100 is provided with a vacuum suction pin 139 for lowering and vacuum absorbing the upper substrate S1. The vacuum suction pin 139 which vacuum-adsorbs the imported upper substrate S1 is moved up to the upper surface 110, and the upper substrate S1 is attached to the upper adhesive chuck 120 provided in the upper surface 110. This keeps sticking. The vacuum suction pin 139 is lifted by the suction pin lift unit 141.

Support bars 111 are provided at both sides of the upper surface plate 110. The support bar 111 is supported by the surface lifting unit 244, which will be described later, and supports the upper surface plate 110 that is lifted by the surface lifting unit 244.

And when the upper surface 110 is lifted by the surface lifting unit 244 between the upper chamber 100 and the upper surface 110, the anti-rotation unit 410 to prevent the upper surface 110 is rotated Is provided.

The anti-rotation part 410 includes a support shaft 412 having a polygonal cross section provided on the upper surface plate 110 and an insertion groove 101 formed in the upper chamber 100 to insert the support shaft 412. do. The support shaft 412 has a polygonal shape, for supporting the polygonal shape so that the upper surface 110 does not rotate when the upper surface 110 is elevated. Accordingly, the upper surface plate 110 is prevented from rotating when lowered, so that the upper substrate S1 can be accurately positioned and bonded to the lower substrate S2, thereby improving the bonding accuracy.

In addition, between the upper chamber 100 and the upper plate 110, the leaf spring 522 to prevent the upper plate 110 is rotated when the upper plate 110 is elevated by the plate lifting portion 244 Is provided. The leaf spring 522 is formed in an approximately '-' shape so that both ends are fixed to the upper chamber 100 and the upper surface plate 110, respectively.

Leaf spring 522 is provided with a plurality, the upper plate 110 is lowered when the gap is opened, if raised, it is restored to the original state.

A lower surface plate 210 is installed in the lower chamber 200, and a lower adhesion chuck 212 for chucking the lower substrate S2 is installed in the lower surface plate 210. The lower adhesion chuck 212 installed on the lower surface plate 210 is for seating and holding the lower substrate S2, which is described as an adhesive chuck in this embodiment, but an electrostatic chuck that chucks the substrate with electrostatic force is applied. , ESC). Since the lower adhesion chuck 212 is the same shape as the upper adhesion chuck 120 of the above-described form, description thereof will be omitted.

The lower surface plate 210 is provided with a plurality of lift pins 162 to penetrate through the lower surface plate 210 and the lower adhesion chuck 212. The lift pin 162 rises to the bottom surface of the lower substrate S2 to support the lower substrate S2 when the lower substrate S2 mounted on the lower adhesion chuck 212 is carried in, and then descends to lower the lower adhesion. The lower substrate S2 is seated on the chuck 212. And after the upper substrate (S1) and the lower substrate (S2) is bonded to serve to raise the panel to take out the bonded panel to the outside. The plurality of lift pins 162 are disposed to support the lower substrate S2, and are lifted by the lift pin driver 290 by grouping the pins 172. The pin plate 172 and the pin driver 290 may be provided in plurality. In this case, if necessary, a lift pin 162 supporting the outer portion and the central portion of the substrate S2 and a pin plate 172 for grouping them are separately provided, and a separate lift pin driver 290 is also provided to operate. do. At the lower end of the lift pin 162 is installed, a bellows (not shown) for guiding the lifting of the lift pin 162 and maintaining the vacuum inside the chambers 100 and 200 is installed. As described above, the lift pin 162 may be lifted and lifted by the pin driver 290, and the lift pin 162 is relatively lifted by lifting the lower surface plate 210 while the lift pin 162 is fixed. It can also be produced in the form of lifting and receiving the lower substrate (S2).

And the side surface of the lower surface plate 210 is provided with a surface lifting portion 244 of the same type as a linear actuator (Linear actuator) for elevating the upper surface 110.

The surface lifting unit 244 is positioned in a state where the support bar 111 of the upper surface plate 110 described above is placed to stably support the lifting of the upper surface plate 110 by the operation of the surface lifting unit 244.

The end of the surface lifting unit 244 is formed with a V-shaped notch so that the support bar 111 is stably placed.

The upper chamber 100 and the lower chamber 200 are in close contact with each other to form a process space. And a high vacuum molecular pump (Turbo Molecular Pump, TMP) and a dry pump (Dry pump) is connected to the chamber 100, 200 to implement the interior of the process space in a vacuum atmosphere.

In addition, a lower surface alignment device (not shown) connected to the lower surface 210 may be installed at an outer lower portion of the lower chamber 200. The lower surface alignment device may be a UVW stage. Reference numeral 622 is an O-ring for hermetic formation.

Hereinafter, a method of measuring adhesive force of a substrate bonding apparatus according to an embodiment of the present invention having the above-described configuration will be described with reference to FIGS. 4 and 5. 4 shows the flow of setting the adhesive force of the adhesive member 116 in the state where the adhesive chucks 120 and 212 are initially installed, and the predetermined pressure lower than the peeling pressure at which the upper substrate S1 is peeled off. Set to. In this state of setting pressure, the state in which the supply pressure of air is gradually increased is determined to determine the pressure at which the upper substrate S1 is peeled off from the adhesive member 116. That is, by recognizing the state that the alignment mark of the upper substrate (S1) is determined by the gradual rise of the pressure at the set pressure, and through the average peel pressure that the substrate (S1) is peeled off in the general adhesive chuck (120, 212) It is determined by the adhesive force of the adhesive chuck (120, 212).

5 illustrates a flow of a process of peeling the substrate S1 after the peeling pressure of the adhesive chucks 120 and 212 is set as shown in FIG. 4, in which case the pressure corresponding to the peeling pressure is diaphragm 116. ) To determine whether the substrate (S1) is peeled off from the adhesive chuck (120, 212). When the peeling pressure is reached in a general state, the substrate S1 is separated from the adhesive chucks 120 and 212. However, when a leak occurs in the diaphragm 112 and the adhesive member 116, the substrate S1 is peeled only when a pressure higher than the peeling pressure is supplied. Therefore, the substrate S1 is recognized before the peeling pressure is detected. As it is not recognized, the adhesive chuck 120, 212 is replaced by recognizing a state where the adhesive force is lost.

As shown in FIG. 4, the adhesive step S100 of adhering the lower substrate S2 to be bonded to the upper substrate S1 with an adhesive chuck, photographing alignment marks of the upper substrate S1 by the camera 181. Identification step 200 for identifying, a predetermined pressure for inflating the diaphragm 112 provided in the adhesive chuck 120, 212 to peel the upper substrate (S1) adhered to the adhesive chuck 120, 212 Air supply step (S300) for supplying the air, the confirmation step (S400) to confirm the point of disappearance of the alignment mark of the upper substrate (S1) by the camera 181, by measuring the pressure at the time when the alignment mark disappears The determination step (S400) to determine the size of the adhesive force of the adhesive chuck (120, 212).

Pressure providing step (S300) may supply a pressure rising stepwise to the diaphragm 112 by the regulator 800, the check step (S400) is a pressure supplied to the diaphragm 112 by the regulator 800 Can be measured by the pressure gauge 850.

When the upper substrate S1 enters the chambers 100 and 200, the vacuum suction pin 141 descends to absorb the upper substrate S1 and then rises to raise the upper adhesive chuck provided in the upper surface plate 110. A pressure-sensitive adhesive step (S100) for sticking the upper substrate (S1) on 120 is performed.

Thereafter, the upper substrate S1 is aligned (S110), and it is determined whether the alignment mark is identified by the vision 181. (S200) If the alignment mark is not identified, the upper substrate S1 is not adhered normally. The state does not progress the process (S370), and performs work to compensate for this.

The pressure of air described below is set arbitrarily, and it demonstrates on the assumption that an initial pressure is 1 Pa, a set pressure is 3 Pa, and a peeling pressure is 4 Pa. The set pressure is any pressure at which the substrate S1 obtained by measurement or the like through manual labor or the like does not peel off. In other words, after setting a certain set pressure, the pressure is increased to be the same as the set pressure, and then supplying a pressure higher than the set pressure to determine the alignment mark to determine the pressure at the time when the substrate (S1) is peeled off To save it.

When the alignment mark is identified, the air is supplied to the diaphragm 116 through the regulator 850 at an initial pressure having a predetermined pressure (S300), and then the diaphragm (850) is connected to the diaphragm 116. 116) The internal pressure is sensed. (S310)

When the pressure inside the diaphragm 116 is less than the set pressure, the regulator 800 is operated again to supply air at a pressure higher than the initial pressure. Thereafter, the pressure gauge 850 connected to the diaphragm 116 senses the pressure inside the diaphragm 116 to determine an alignment mark when the set pressure is reached.

 If the upper substrate S1 is determined by measuring the pressure inside the diaphragm 116, the set pressure is increased so that the upper substrate S1 is not peeled, that is, the peeling pressure is not reached. The air is supplied at a higher pressure through the regulator 800 again to be adjusted (S350). (S300) The peeling pressure is determined by increasing the pressure step by step by repeating the process (S300) to (S350).

If the alignment mark is not determined in the process of determining the alignment mark after supplying the pressure by increasing the pressure, that is, when the upper substrate S1 is peeled off, it becomes a peeling pressure and stores it in the DB (S400). Peeling of S1) is carried out. (S410)

When the peeling pressure is set as described above, the peeling and adhesion chuck 120, 212 of the upper substrate (S1) through the flow as shown in Figure 5 to replace.

After performing the adhesive step (S100) to hold the upper substrate (S1) adhesively, the upper substrate (S1) is aligned (S110), and it is determined whether the alignment mark is identified by the vision (181). (S200)

When the alignment mark is identified, the air is supplied to the diaphragm 116 through the regulator 850 at a predetermined pressure (S300), and then inside the diaphragm 116 through the pressure gauge 850 connected to the diaphragm 116. Sensing the pressure. (S310)

At this time, when the peeling pressure or more, the substrate S1 is peeled off.

However, when the pressure is not detected when the pressure is not the peeling chuck 120, 212 is an abnormal state occurs (S390), replace the sticky chuck (120) (212). (S500)

Hereinafter will be described the operating state of the adhesive force measuring device and the adhesive force measuring method of the substrate bonding apparatus according to the embodiment of the present invention as described above.

In the state where the upper chamber 100 and the lower chamber 200 are spaced apart or the gate valve (not shown) is opened, the robot (not shown) moves the upper substrate into the space between the upper chamber 100 and the lower chamber 200. When the (S1) is brought in, the vacuum suction pin 139 installed on the upper surface plate 110 descends to raise and lower the upper substrate S1 after vacuum absorption, and the upper substrate to the upper adhesion chuck 120 installed on the upper surface plate 110. (S1) is adhered.

Next, when the lower substrate S2 is carried in by the robot, the lift pin 162 is raised to support the lower substrate S2, and the robot exits to the outside while supporting the lower substrate S2. Thereafter, the lift pin 162 descends to seat the lower substrate S2 on the lower adhesion chuck 212 of the lower surface plate 210. In the order of carrying in the upper substrate S1 and the lower substrate S2, the lower substrate S2 may be loaded first.

When the upper substrate (S1) and the lower substrate (S2) is located in the chamber 100, 200, the upper chamber 100 is lowered by the chamber lifting unit 300 is in close contact with the lower chamber 200 is in an airtight state. The inside of the chamber is converted to a vacuum state by the pump.

When the upper chamber 100 descends, the camera 181 photographs and identifies the alignment marks of the upper substrate S1 and the lower substrate S2. Alternatively, the upper chamber 100 may be lowered and then aligned.

While the vacuum is formed while the upper chamber 100 and the lower chamber 200 are in close contact with each other, the upper substrate S1 and the lower substrate S2 are continuously checked by the camera 181, and in this state, The upper surface plate 110 is lowered by the surface lifting unit 244 so that the upper substrate S1 is close to the lower substrate S2 within a few μm range.

Thereafter, the air of a predetermined pressure is supplied through the regulator 800 to expand the diaphragm 112 of the upper adhesive chuck 120, thereby peeling the upper substrate S1 toward the lower substrate S2, thereby lowering the upper substrate S1 and the lower substrate. The substrate S2 is bonded. At this time, the camera 181 confirms when the alignment mark of the upper substrate S1 disappears.

When the bonding is completed, the chambers 100 and 200 are switched from the vacuum state to the standby state, and after the chambers 100 and 200 are opened, the lift pins 162 are raised to bond the substrates S1 and S2. The robot enters from the outside in the state supported by the support and takes out the bonded panel to the outside.

The above embodiment of the present invention should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

100 ... upper chamber 200 ... lower chamber
110 ... top plate 210 ... bottom plate
120 ... top sticking

Claims (7)

chamber;
An upper surface plate installed inside the chamber and having an diaphragm that expands the upper substrate to adhere to the adhesive chuck and separates the upper substrate from the adhesive chuck;
A lower surface plate installed inside the chamber to face the upper surface plate, maintain the lower substrate to be bonded to the upper substrate, and have a lift pin for seating and separating the lower substrate;
A regulator for supplying and regulating air for inflating the diaphragm;
A vision provided in the upper chamber to confirm that the upper substrate is peeled off the adhesive chuck by the diaphragm;
And a determination unit which determines the adhesive force of the adhesive chuck by checking the pressure applied by the regulator to the diaphragm when photographing that the upper substrate is peeled off in the vision.
The apparatus of claim 1, wherein air is supplied from the regulator to the diaphragm at a stepwise rising pressure.
3. The apparatus of claim 2, further comprising a pressure gauge for checking the pressure provided by the regulator to the diaphragm.
According to claim 3, wherein the determination unit receives the pressure measurement value provided from the pressure gauge to determine the pressure measurement value at the time when the alignment mark of the upper substrate in the vision as the magnitude of the adhesive force of the adhesive chuck Adhesive force measuring device of the substrate bonding apparatus characterized in that.
An adhesive step of adhering the lower substrate to be bonded with the upper substrate with an adhesive chuck;
An identification step of photographing and identifying an alignment mark of the upper substrate by a camera;
An air supply step of supplying air of a predetermined pressure for expanding the diaphragm provided in the adhesive chuck to peel the upper substrate adhered to the adhesive chuck;
Confirming, by the camera, a time point at which the alignment mark of the upper substrate disappears;
And a determination step of measuring the pressure at the time when the alignment mark disappears and determining the pressure as the size of the adhesive force of the adhesive chuck.
6. The method of claim 5, wherein the pressure providing step supplies a pressure rising stepwise to the diaphragm by a regulator.
The method of claim 6, wherein the checking step measures the pressure supplied to the diaphragm by the regulator by a pressure gauge.

Images