KR20120081747A - Gas feeding assembly for substrate processing apparatus, and substrate processing apparatus having the same - Google Patents

Abstract

PURPOSE: Gas supply assembly and a substrate processing apparatus including the same are provided to prevent the substrate processing apparatus to be contaminated by preventing the leakage of gas in the gas supply line. CONSTITUTION: A gas supply unit is installed at the upper side of a processing space. A gas supply pipe(191) is connected with a gas supply device and supplies gas to the gas supply unit. A gas supply pipe unit(190) comprises an exhaust pipe exhausting the gas leaked from the gas supply pipe. The gas supply pipe unit is divided into a first gas supply pipe unit and a second gas supply pipe unit. The first gas supply pipe unit and the second gas supply pipe unit are detachably connected with each other through gas supply assembly.

Description

Gas feeding assembly for substrate processing apparatus and substrate processing apparatus having the same {Gas feeding assembly for substrate processing apparatus, and substrate processing apparatus having the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a gas supply assembly installed to supply a gas used for substrate processing to a processing space, and a substrate processing apparatus having the same.

The substrate processing apparatus is a device for performing a predetermined process such as etching and deposition on a substrate, and includes a chamber main body and an upper lead detachably coupled to each other to form a closed processing space, and a substrate support installed in the chamber main body to support the substrate. It is configured to include.

At this time, the substrate processing apparatus is supplied through the gas supply unit installed in the upper portion of the processing space and the processing gas for substrate processing is injected into the processing space.

On the other hand, the substrate treating apparatus separates the upper lead from the chamber body for the maintenance of the apparatus, and at this time, the gas supply line for supplying the gas to the gas supply unit also needs to be separated.

That is, in the conventional substrate processing apparatus, the gas supply line is divided into a first gas supply line and a second gas supply line.

The first gas supply line is connected to the gas supply device at one end and is connected to the lower block installed at the other end of the chamber body, and the second gas supply line is connected to the gas supply at one end and the other end is installed on the upper lead. Is connected to. Here, the upper block and the lower block connecting the first gas supply line and the second gas supply line are sealed by an O-ring at the contact surface.

However, in the conventional substrate processing apparatus, the O-ring for sealing the surface in which the upper block and the lower block contact with each other may be broken or worn by the continuous use of the device, and the upper block and the lower block may be connected by the breaking and wear of the O-ring. There is a problem that the sealing is not smooth at the site to be leaked to pollute the gas.

An object of the present invention, in order to solve the above problems, when the chamber body and the upper lead constituting the process chamber is coupled to each other, the separated gas supply line gas of the substrate processing apparatus can be connected stably without fear of gas leakage A supply assembly and a substrate processing apparatus having the same are provided.

The present invention was created in order to achieve the object of the present invention as described above, the present invention is a chamber body and the upper lead which is detachably coupled to each other to form a processing space for substrate processing, and installed on the upper side of the processing space A substrate processing apparatus comprising a gas supply unit, wherein the substrate processing apparatus is connected to a gas supply unit installed outside and supplies a gas supply pipe to the gas supply unit installed above the processing space, and is connected to an exhaust device. A gas supply pipe part including an exhaust pipe for exhausting gas leaking from the gas supply pipe; The gas supply pipe part may be divided into a first gas supply pipe part and a second gas supply pipe part, and the first gas supply pipe part and the second gas supply pipe part may be detachably connected to each other by a gas supply assembly. It starts.

The gas supply assembly may include a first block connected to the first gas supply pipe part and coupled to the upper lead, and a second block connected to the second gas supply pipe part and coupled to the chamber body.

The first block is formed with a first gas supply passage communicating with the gas supply pipe of the first gas supply pipe part and a first exhaust passage communicating with the exhaust pipe of the first gas supply pipe part, and the second block is the second block. A second gas supply passage communicating with the gas supply pipe of the gas supply pipe part and a second exhaust passage communicating with the exhaust pipe of the second gas supply pipe part are formed, and when the first block and the second block are coupled to each other, The first gas supply passage and the first exhaust passage may communicate with the second gas supply passage and the second exhaust passage, respectively.

The first block is coupled to the upper lead and coupled to the first gas supply pipe portion and the first body formed with a first contact member receiving portion; A first adhesion member accommodated in the first adhesion member accommodation portion to form the first gas supply passage and the first exhaust passage together with the first body, and the second block is coupled to the chamber body; A second main body coupled to the second gas supply pipe part and in contact with the first main body, and having a second contact member receiving part; It may include a second contact member which is accommodated in the second contact member accommodating portion to form the second gas supply passage and the second exhaust passage with the second body.

The first contact member may be installed to be movable in a direction in which the first block and the second block are coupled in the first contact member accommodation portion of the first body.

In this case, the first contact member may be constrained to the first body by a restraining member and may be pressed outwardly by the elastic member so as to be linearly movable in the first contact member receiving portion of the first body.

The second contact member may be installed to be movable in the coupling direction of the first block and the second block in the second contact member receiving portion of the second body.

At this time, the second contact member may be constrained to the second body by a restraining member and may be pressed outwardly by the elastic member so as to be linearly movable in the second contact member receiving portion of the second body.

The first contact member is installed to be movable in the direction in which the first block and the second block is coupled in the first contact member receiving portion of the first body, the second contact member is a second of the second body The contact member accommodating part may be installed to be movable in the coupling direction of the first block and the second block.

In this case, the first contact member and the second contact member is the first contact member receiving portion of the first body and the second contact member receiving portion of the second body by the restraining member so as to be linearly movable in each of the second contact member receiving portion of the second body. In addition to being constrained to each of the main body and the second body, it is possible to maintain a state pressed outward by the elastic member.

On the other hand, at least one of the first contact member and the second contact member may be installed to be movable in the direction of the mating block facing the contact member in each contact member receiving portion in which the contact member is accommodated.

At this time, the close contact member may be constrained to the main body by the restraining member so as to be linearly movable in the close contact member accommodating part of the main body, and may be kept pressed outward by the elastic member.

The exhaust pipe may be installed to surround the outer peripheral surface of the gas supply pipe at intervals.

The present invention discloses the gas supply assembly for use in a substrate processing apparatus having the above configuration.

A gas supply assembly of a substrate processing apparatus and a substrate processing apparatus having the same according to the present invention are coupled to a first gas supply line and an upper lead coupled to a chamber main body by a gas supply line connected to a gas supply unit for injecting gas into a processing space. By splitting into a second gas supply line and connecting the divided first gas supply line and the second gas supply line by the gas supply assembly, there is an advantage that the upper lead coupled with the gas supply line can be freely separated from the chamber body. .

In particular, when the gas supply assembly is composed of a first block coupled to the upper lead and the second block coupled to the chamber body, the gas leaks in the vicinity of the gas supply passage connected to the gas supply pipe for supplying gas to the gas supply unit By forming an exhaust passage connected to the exhaust pipe for exhausting the leaked gas to the exhaust device, it is possible to prevent the leakage of gas in the gas supply line to prevent contamination of the surroundings of the substrate processing apparatus.

1 is a cross-sectional view showing a substrate processing apparatus according to the present invention.
2A is a cross-sectional view illustrating a gas supply assembly installed in the substrate processing apparatus of FIG. 1.
FIG. 2B is a cross-sectional view of the gas supply assembly of FIG. 2A seen in the direction of coupling to the substrate processing apparatus of FIG. 1.
2C is a cross-sectional view illustrating a state in which the first block and the second block are separated from each other by separation of the upper lead and the chamber body in the gas supply assembly of FIG. 2A.
FIG. 3 is a bottom view illustrating the adhesion member of the first block of the gas assembly of FIG. 2A.
FIG. 4 is a top view illustrating the adhesion member of the first block of the gas assembly of FIG. 2A.

Hereinafter, a gas supply assembly of a substrate processing apparatus and a substrate processing apparatus having the same according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing a substrate processing apparatus according to the present invention.

As shown in FIG. 1, the substrate processing apparatus 100 according to the present invention includes a chamber main body 120 and an upper lead 110 which are detachably coupled to each other to form a processing space S for substrate processing; A gas supply unit 140 installed at an upper side of the processing space S and connected to the gas supply apparatus and the gas supply pipe part 190 to supply gas to the processing space S; It is installed on the chamber body 120 includes a substrate support 130 for supporting the substrate 10.

The chamber body 120 and the upper lead 110 may be any configuration as long as it can form a processing space (S) for substrate processing and is detachably coupled to each other by a detachment mechanism such as a crane.

Here, the substrate treating apparatus according to the present invention is a device for performing a substrate treatment, such as etching or depositing the surface of the substrate 10, the glass for the LCD panel is formed in a rectangle, such as a wafer, a rectangular shape for manufacturing a semiconductor device The surface of the substrate, the solar cell substrate and the like may be configured to perform a substrate treatment by forming a plasma in a vacuum state.

In this case, as shown in FIG. 1, the chamber body 120 may correspond to the shape of the substrate 10 and have a substantially circular or substantially rectangular shape.

The chamber body 120 may be formed with one or more gates 121 for entering and exiting the substrate 10 and connected to an exhaust device (not shown) for pressure control and exhaust in the processing space S. An exhaust port 180 may be installed.

The gas supply unit 140 may be configured in various ways according to the substrate processing required, and may be installed in combination with at least one of the upper lead 110 and the chamber body 120.

On the other hand, the substrate processing apparatus 100 may be applied with power to form a plasma in the processing space (S), various configurations are possible according to the power application method.

For example, the gas supply unit 140 may receive RF power, install an electrode member (not shown) in the substrate support 130, and ground the electrode member. On the contrary, the gas supply unit 140 may be grounded, and the electrode member may be applied with RF power.

In addition, an RF power source having a different frequency may be applied to each of the electrode members as well as the gas supply unit 140.

Meanwhile, the substrate processing apparatus 100 needs to separate the upper lead 110 from the chamber body 120 in order to maintain the apparatus.

However, a part of the gas supply pipe part 190 connected to the gas supply part 140 installed below the upper lead 110, that is, the first gas supply pipe part 190a is installed at the upper lead 110, and thus, the chamber body. When the upper lead 110 is separated from the 120, the first gas supply pipe part 190a installed in the upper lead 110 and the rest of the gas supply pipe part 190, that is, the second gas supply pipe part 190b may be separated. There is a need.

Therefore, the gas supply pipe part 190 is divided into a first gas supply pipe part 190a and a second gas supply pipe part 190b, and the first gas supply pipe part 190a and the second gas supply pipe part 190b are Removably connected to each other by the gas supply assembly 200 so that the gas can be delivered without leakage at the time of coupling.

2A is a cross-sectional view illustrating a gas supply assembly installed in the substrate processing apparatus of FIG. 1, and FIG. 2B is a cross-sectional view of the gas supply assembly of FIG. 2A viewed in a direction coupled to the substrate processing apparatus of FIG. 1, and FIG. 3 is a cross-sectional view illustrating a state in which a first block and a second block are separated from each other by separation of an upper lead and a chamber main body from a gas supply assembly, and FIG. 3 is a bottom view showing an adhesion member of a first block of the gas assembly of FIG. 2A. 4 is a top view illustrating an adhesive member of the first block of the gas assembly of FIG. 2A.

The gas supply pipe part 190 divided into the first gas supply pipe part 190a and the second gas supply pipe part 190b is connected to the gas supply device 170 installed outside as illustrated in FIGS. 2A to 2C. And a gas supply pipe 191 for supplying gas to the gas supply unit 140 installed above the processing space S, and an exhaust pipe 192 connected to the exhaust device 160 to exhaust the gas leaked from the gas supply pipe 191. It may include a gas supply pipe section 190 including a).

The gas supply pipe 191 is connected to the gas supply unit 140 and any configuration may be used as long as it is a configuration for supplying gas to the processing space S.

The exhaust pipe 192 is configured to prevent leakage of the gas leaking from the gas supply pipe 191 to the outside, and various configurations are possible.

In particular, the exhaust pipe 192 is a point where the gas can leak in order to prevent the leakage of the gas leaking from the gas supply pipe 191, that is, the point or chamber body connected in the divided state of the gas supply pipe 191 120, the upper lead 110 and the like is preferably connected to the connection.

In particular, the exhaust pipe 192 is installed so as to surround the outer peripheral surface of the gas supply pipe 191 and may be configured in the form of a double pipe gas supply pipe 190.

Of course, the exhaust pipe 192 may be installed so as to communicate only at the point where the gas supply pipe 191 is connected in a divided state, and may be installed separately from the exhaust pipe 192.

Here, the gas supply pipe 191 and the exhaust pipe 192, in particular the exhaust pipe 192 is the elastic material or corrugated pipe and its deformation is required in the longitudinal direction according to the detachment of the upper lead 110 and the chamber body 120 It is desirable to have a flexible structure as well.

The gas supply assembly 200 supplies the first gas supply pipe part 190a and the second gas so that the gas can be delivered without leakage when the first gas supply pipe part 190a and the second gas supply pipe part 190b are combined. As a configuration for coupling the tube 190b, various configurations are possible.

For example, the gas supply assembly 200 may be connected to the first gas supply pipe 190a and coupled to the upper lead 110, as shown in FIGS. 2A to 2C. It may include a second block 220 connected to the second gas supply pipe part 190b and coupled to the chamber body 120.

The first block 210 is fixedly coupled to the side wall of the upper lead 110, and the first gas supply passage 214a and the first gas supply communicated with the gas supply pipe 191 of the first gas supply pipe 190a. The first exhaust passage 215a is formed in communication with the exhaust pipe 192 of the pipe section 190a.

The second block 220 is fixedly coupled to the side wall of the chamber body 120 and communicates with the gas supply pipe 191 of the second gas supply pipe part 190b and the second gas supply passage 214b and the second gas. A second exhaust passage 215b is formed in communication with the exhaust pipe 192 of the supply pipe 190b.

At this time, when the first block 210 and the second block 220 are coupled to each other, the first gas supply passage 214a and the first exhaust passage 215a are respectively the second gas supply passage 214b and the second gas passage 214b. The exhaust passage 215b communicates with each other.

On the other hand, the first block 210 is coupled to the upper lead 110 and coupled to the first gas supply pipe portion 190a and the first body 211 formed with a first contact member receiving portion 213; The first contact member 212 is accommodated in the first contact member accommodating part 213 to form a first gas supply passage 214a and a first exhaust passage 215a together with the first body 211. Can be.

The second block 220 is coupled to the chamber main body 120 and is coupled to the second gas supply pipe part 190b, interviews the first main body 210, and has a second contact member accommodating part 223. A main body 221; A contact member 222 may be included in the second contact member accommodating part 223 to form a second gas supply passage 214b and a first exhaust passage 215b together with the second body 221.

The first body 211 and the second body 221 constituting the first block 210 and the second block 220 are respectively coupled to the upper lead 110 or the chamber body 120 to supply a gas supply passage ( Any configuration can be used as long as it can form 214a, 214b and exhaust passages 215a, 215b, and the material can vary depending on the type of processing gas.

On the other hand, the first contact member 212 and the second contact member 222 together with the first body 211 and the second body 221, the gas supply passage (214a, 214b) and the exhaust passage (215a, 215b) Any configuration may be used as the configuration to be formed, and the material may vary depending on the type of processing gas.

Here, the gas supply passages 214a and 214b are positioned at the centers of the first block 210 and the second block 220, as shown in FIGS. 2A to 4, and the exhaust passages 215a and 215b are gasses. It communicates with each other at the periphery of the supply passages 214a and 214b.

The exhaust passages 215a and 215b may be communicated with each other by various structures at the periphery of the gas supply passages 214a and 214b, and as shown in FIGS. 2A to 4, outer surfaces of the contact members 212 and 222. It can be formed by forming the grooves (261, 262, 263, 264) connected to each other in the.

The grooves 261, 262, 263, and 264 may be formed inside the first block 210 and the second block 220 in addition to the contact members 212 and 222, in particular, the main bodies 211, 221 and the contact member 212. 222 can be formed between.

In addition, the exhaust passages 215a and 215b may be formed by forming through holes penetrating vertically through the centers of the main bodies 211 and 221.

On the other hand, the first contact member 212 in the first contact member receiving portion 213 of the first body 211 so that the first block 210 and the second block 220 are in close contact with each other, the first Preferably, the block 211 and the second block 221 are installed to be movable in the coupling direction.

For example, the first contact member 212 is constrained by the restraining member 216 to the first body 211 so as to be linearly movable in the first contact member accommodating portion 213 of the first body 211. In addition, it may be configured to maintain a state pressed outward by the elastic member 217.

The restraining member 216 is a structure for maintaining the state in which the first contact member 212 is coupled to the first body 211, and has a through hole 219 formed to penetrate the first contact member 212 up and down. It may be configured as a bolt that is movably inserted into and coupled to the first body 211.

The elastic member 217 is installed between the first body 221 and the first contact member 212 to apply an elastic force to the first contact member 212, a coil spring may be used.

Meanwhile, one or more O-rings 231, 232, and 233 may be installed on the surface where the first block 210 and the second block 220 contact each other to prevent leakage of gas.

That is, the O-ring may be installed between the first body 211 and the second body 221 and between the first contact member 212 and the second contact member 222.

On the other hand, the first contact member 212 is installed to be movable in the coupling direction of the first block 211 and the second block 221 in the first contact member receiving portion 213 of the first body 211 Such a configuration may be equally applied to the second contact member 222.

In this case, the contact members 212 and 222 are installed to be movable in the contact member accommodating parts 213 and 223 of the main body 211 and 221, that is, the first block 210 and the second block 220. ), Or both.

That is, at least one of the first contact member 212 and the second contact member 222 may be a corresponding contact member 212 at each contact member accommodating part 213, 223 in which the contact member 212, 222 is accommodated. , 222 may be installed to be movable in the direction of the counter blocks 210 and 220.

In addition, the contact members 212 and 222 are constrained to the main bodies 211 and 221 by the restraining member so as to be linearly movable in the contact member accommodating parts 213 and 223 of the main bodies 211 and 221 and the outer side by the elastic member. Pressurized state can be maintained.

Referring to the operation process of the gas supply assembly in the substrate processing apparatus having the above configuration in detail as follows.

First, when the substrate processing apparatus 100 performs substrate processing, the upper lead 110 is maintained in the chamber body 120, and the first block 210 and the second block in the gas supply assembly 200. Block 220 remains in the state as shown in FIGS. 2A and 2B.

At this time, when the gas leaks from the contact surface of the first block 210 and the second block 220 due to the wear or breakage of the O-ring, the exhaust flow paths 215a and 215b disposed around are formed to exhaust the leaked gas. By being discharged to the exhaust device 160 along the flow paths 215a and 215b, leakage to the outside of the gas supply assembly 200 may be prevented.

On the other hand, when maintenance is required inside the substrate processing apparatus 100, that is, the inside of the substrate processing apparatus 100, such as electrostatic chuck and liner replacement, the upper lead 110 coupled to the chamber body 120 is separated.

In this case, as shown in FIG. 2C, the gas supply assembly 200 is separated from the first block 210 coupled to the upper lead 110 and the second block 220 coupled to the chamber body 120.

When the upper lead 110 is recombined with the chamber body 120, the first block 210 and the second block 220 are also closely coupled.

In more detail, when the upper lead 110 is lowered while being coupled to the chamber body 120, the first block 210 also approaches the second block 220 and is in close contact with each other.

Here, as shown in FIG. 2C, the first contact member 212 installed in the first block 210 is further protruded to the outside by the pressing of the elastic member 217, and the second contact member 220 is disposed on the first block 210. As shown in FIG. 2A, the first contact member 212 and the second contact member 222 are brought into close contact with each other as the first contact member 212 is pushed upward.

By the above configuration, when the upper lead 110 is separated from the chamber body 120, the gas supply pipe part 190 for gas supply to the gas supply part 140 also enables separation and coupling without fear of gas leakage. .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: substrate processing apparatus
200: gas supply assembly
210: first block 220: second block

Claims (8)

A substrate processing apparatus comprising a chamber main body and an upper lead detachably coupled to each other to form a processing space for processing a substrate, and a gas supply unit disposed above the processing space.
The substrate processing apparatus includes a gas supply pipe connected to an external gas supply device to supply gas to the gas supply unit installed above the processing space, and an exhaust pipe connected to an exhaust device to exhaust the gas leaked from the gas supply pipe. It includes a gas supply pipe portion comprising;
And the gas supply pipe part is divided into a first gas supply pipe part and a second gas supply pipe part, and the first gas supply pipe part and the second gas supply pipe part are detachably connected to each other by a gas supply assembly. The method according to claim 1,
The gas supply assembly includes a first block connected to the first gas supply pipe part and coupled to the upper lead, and a second block connected to the second gas supply pipe part and coupled to the chamber body. Substrate processing apparatus. The method according to claim 2,
The first block is formed with a first gas supply passage communicating with the gas supply pipe of the first gas supply pipe part and a first exhaust passage communicating with the exhaust pipe of the first gas supply pipe part, and the second block is the second block. A second gas supply passage communicating with the gas supply pipe of the gas supply pipe part and a second exhaust passage communicating with the exhaust pipe of the second gas supply pipe part are formed;
When the first block and the second block are combined with each other, the first gas supply passage and the first exhaust passage communicate with each other with the second gas supply passage and the second exhaust passage, respectively. Processing unit. The method according to claim 3,
The first block is coupled to the upper lead and coupled to the first gas supply pipe portion and the first body formed with a first contact member receiving portion; A first adhesion member accommodated in the first adhesion member accommodation portion to form the first gas supply passage and the first exhaust passage together with the first body;
The second block is coupled to the chamber body, the second body is coupled to the second gas supply pipe portion, the first body and the first body and the second contact member receiving portion is formed; And a second adhesive member accommodated in the second adhesive member accommodating part to form the second gas supply passage and the second exhaust passage together with the second body. The method of claim 4,
At least one of the first contact member and the second contact member is disposed so as to be movable in a direction of a counter block facing the contact member at each contact member accommodation portion in which the contact member is accommodated. Device. The method according to claim 5,
And the adhesion member is constrained to the main body by a restraining member so as to be linearly movable in the adhesion member receiving portion of the main body, and maintains a state in which the adhesion member is pressed outward by the elastic member. The method according to claim 1,
The exhaust pipe is a substrate processing apparatus, characterized in that it is installed so as to surround the outer peripheral surface of the gas supply pipe at intervals. The gas supply assembly for use in a substrate processing apparatus according to any one of claims 1 to 7.

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