CN105206497A - Ring-shaped shield member, components thereof and substrate mounting table comprising ring-shaped shield member - Google Patents
Ring-shaped shield member, components thereof and substrate mounting table comprising ring-shaped shield member Download PDFInfo
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- CN105206497A CN105206497A CN201510523186.3A CN201510523186A CN105206497A CN 105206497 A CN105206497 A CN 105206497A CN 201510523186 A CN201510523186 A CN 201510523186A CN 105206497 A CN105206497 A CN 105206497A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
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- Chemical Vapour Deposition (AREA)
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Abstract
To provide a ring-shaped shield member capable of preventing occurrence of a gap between a component of the ring-shaped shield member and a substrate placement stage, and also preventing breakage of the component. A shield ring 15 comprises four ring components 41-44. An omnidirectional movement regulating part 45 is provided to a fixed end in a length direction of the ring components 41-44. A unidirectional movement tolerable part 46 is provided away from the omnidirectional movement regulating part 45. For example, the ring components 41-44 are combined such that an end surface of a fixed end 41a of one ring component 41 abuts with a side surface of a free end 43b of an adjoining other ring component 43, and one side surface of a free end 41b of one ring component 41 abuts with an end surface of a fixed end 44a of an adjoining other ring component 44.
Description
The application is the application number proposed on August 24th, 2012 is the divisional application of the application of the same name of 201210306041.4.
Technical field
The present invention relates to ring shielding parts, its constituent part of being applicable to the substrate-placing platform loading substrate in process chamber and there is the substrate-placing platform of ring shielding parts.
Background technology
In FPD (FlatPanelDisplay: the flat-panel monitor) manufacturing process headed by liquid crystal indicator (LCD), there will be a known the substrate board treatment various substrates of glass substrate etc. being implemented to plasma treatment.
This substrate board treatment has: the substrate-placing platform loading substrate in process chamber (hereinafter referred to as ' chamber '); With the upper electrode be oppositely disposed across process space and this substrate-placing platform, substrate-placing platform is supplied to the High frequency power (RF) that plasma generates, this substrate-placing platform plays function as lower electrode, utilize the process gas in the process space be fed in chamber to generate plasma, utilize the plasma generated the substrate being placed in substrate-placing platform to be implemented to the plasma treatment of regulation.
Usually, the substrate-placing face of substrate-placing platform is rectangular, is configured with the shading ring as ring shielding parts at its peripheral part, to improve the focusing of plasma and to guarantee electrical insulating property.Shading ring is by aluminium oxide (Al
2o
3) etc. insulating properties pottery form, be fixed on the base material of substrate-placing platform by bolt (bolt).Due to the ring bodies that shading ring is the rectangle surrounding in the substrate-placing face of rectangle surrounded, the requirement of adjoint industrial circle in recent years in addition, treatment substrate maximizes, therefore integrally formed comparatively difficulty, so shading ring is combined to form by multiple constituent part (parts) usually.
Figure 13 is the plane graph representing existing shading ring structure.
In fig. 13, shading ring 105 is configured with in the mode of the surrounding surrounding the substrate-placing face 106 of the rectangle of lower electrode (substrate-placing platform) 100.Shading ring 105 is the assembly of four ring constituent parts 101 ~ 104 roughly in L-shaped on plane graph.Two positions near the vicinity in the bight of each comfortable L-shaped of each ring constituent part 101 ~ 104 and the top ends in long size portion that is connected with this bight have bolt hole 107, each ring constituent part 101 ~ 104, by being installed on the set bolt of bolt hole 107, is fixed in the flange part of the surrounding in the substrate-placing face 106 forming lower electrode 100.
But shading ring 105, according to different processing intents, by being heated from by the heat transfer of lower electrode 100 of heating and the Continuous irradiation etc. of plasma, produces thermal expansion.Now, in the bearing surface that adjacent ring constituent part is mutual, ring constituent part side's upwardly another ring constituent part represented by hollow arrow.Now, another ring constituent part only displacement bolt hole 107 and gap value of set bolt (not shown) on the direction represented by hollow arrow, therefore, can produce gap between shading ring 105 and processing substrate face 106.
When producing gap between shading ring 105 and lower electrode 100, plasma enters this gap, the ceramic spraying plating of such as lower electrode 100 is exposed base material by cutting down, and becomes the reason producing paradoxical discharge (arc discharge) or corrosion (erosion) at lower electrode 100.
In order to prevent the gap between shading ring 105 and lower electrode 100, motion is provided with the shading ring (such as: with reference to patent documentation 1) of the afterburning parts attracting the ring constituent part of the afterburning parts of the mode reinforcing of adjacent ring constituent part or be provided with the central part reinforcing making each ring constituent part towards lower electrode.
Patent documentation 1: Japanese Unexamined Patent Publication 2008-311298 publication
Summary of the invention
Invention issue to be resolved
But, each ring constituent part 101 ~ 104 combination forming shading ring 105 is applied to the afterburning parts of the active force worked in specific direction, may not be easy.The opposing party, in order to prevent distortion because thermal expansion causes, movement, and when each ring constituent part 101 ~ 104 being fixed on the binding strength increasing of the set bolt of the base material 100 of lower electrode, when there is link to the base material of lower electrode 100 or thermal expansion time, the problem that ring constituent part 101 ~ 104 is easily damaged.
The object of the invention is to: provide and prevent from producing gap between the constituent part and substrate-placing platform of ring shielding parts and the ring shielding parts of the breakage of constituent part, its constituent part can be prevented and possess the substrate-placing platform of ring shielding parts.
For the method for dealing with problems
In order to achieve the above object, at the constituent part of the ring shielding parts that technical scheme 1 is recorded, it is arranged in the mode around the mounting surface of surrounding the rectangle of the substrate-placing platform loading aforesaid substrate in the process chamber of the substrate board treatment substrate of rectangle being implemented to plasma treatment, the feature of the constituent part of above-mentioned ring shielding parts is, comprise along above-mentioned rectangle mounting surface while the long size shape object (long shaped member) of insulating properties of configuration, have: the first movement limiting portion, it is arranged at the one end on the length direction of this long size shape object, limit the movement in the omnirange (comprehensive) of above-mentioned constituent part, second movement limiting portion, above-mentioned length direction is arranged with above-mentioned first movement limiting portion with leaving, limit above-mentioned constituent part () movement beyond above-mentioned length direction, with at least one linking part above-mentioned constituent part being attached to aforesaid substrate mounting table.
At the constituent part of the ring shielding parts that technical scheme 2 is recorded, it is characterized in that, in the constituent part of the ring shielding parts of technical scheme 1 record, above-mentioned first movement limiting portion has: the first cylindric packing ring; First gasket hole, it coordinates with this first packing ring is dynamic, and the face of the central axis with dynamic this first packing ring coordinated has circular cross section; With the first bolt, dynamic above-mentioned first packing ring be coupled in this first gasket hole presses to above-mentioned substrate-placing platform by it, the gap of the side of above-mentioned first packing ring and the side of above-mentioned first gasket hole is set to little, to limit the movement in the omnirange of above-mentioned constituent part, above-mentioned second movement limiting portion has: the second cylindric packing ring; Second gasket hole, it coordinates with this second packing ring is dynamic, and the face of the central axis with dynamic this second packing ring coordinated has oval cross section; With the second bolt, dynamic above-mentioned second packing ring be coupled in this second gasket hole presses to above-mentioned substrate-placing platform by it, and the major diameter in the cross section of the above-mentioned ellipse of above-mentioned second gasket hole is along above-mentioned length direction.
At the constituent part of the ring shielding parts that technical scheme 3 is recorded, it is characterized in that, in the constituent part of the ring shielding parts of technical scheme 1 record, above-mentioned first movement limiting portion has: the first rectangular-shaped guide, and it is set to can not move relative to aforesaid substrate mounting table; With the first guiding piece bores, it is for move with this first guide the rectangular-shaped recess coordinated, the gap of each side of above-mentioned first guide and each side of above-mentioned first guiding piece bores sets little, to limit the movement in the omnirange of above-mentioned constituent part, above-mentioned second movement limiting portion has: the second rectangular-shaped guide, and it is set to can not move relative to aforesaid substrate mounting table; With the second guiding piece bores, it is move with this second guide the rectangular-shaped recess coordinated, and the length setting on the above-mentioned length direction of above-mentioned second guiding piece bores is larger than the length on the above-mentioned length direction of above-mentioned second guide.
At the constituent part of the ring shielding parts that technical scheme 4 is recorded, it is characterized in that, in the constituent part of the ring shielding parts recorded any one of technical scheme 1 to 3, above-mentioned long size shape object is split into the first long size portion and the second long size portion along above-mentioned length direction, above-mentioned first movement limiting portion is arranged on the one end on the above-mentioned length direction in above-mentioned first long size portion, above-mentioned second movement limiting portion is arranged on above-mentioned second long size portion, the other end on the above-mentioned length direction in above-mentioned first long size portion abuts with the one end on the above-mentioned length direction in above-mentioned second long size portion, above-mentioned first long size portion and above-mentioned second long size portion have above-mentioned linking part separately.
At the ring shielding parts that technical scheme 5 is recorded, it is characterized in that, in the constituent part of the ring shielding parts of claim 4 record, above-mentioned first long size portion and above-mentioned second long size portion are bonded with each other, have the anti-locking mechanism of position deviation in the attachment in above-mentioned first long size portion and above-mentioned second long size portion, the anti-locking mechanism of this position deviation prevents the relative position in above-mentioned first long size portion and above-mentioned second long size portion from departing from.
In order to achieve the above object, at the ring shielding parts that technical scheme 6 is recorded, it configures in the mode around the mounting surface of surrounding the rectangle of the substrate-placing platform loading aforesaid substrate in the process chamber of the substrate board treatment substrate of rectangle being implemented to plasma treatment, the feature of above-mentioned ring shielding parts is, comprise the assembly of the constituent part of ring shielding parts above-mentioned any one of claim 1 to 5, each above-mentioned constituent part abuts with the side of the end face of the one end on the above-mentioned length direction of an above-mentioned constituent part with the other end on the above-mentioned length direction of another adjacent above-mentioned constituent part, and the side of the other end on the above-mentioned length direction of an above-mentioned above-mentioned constituent part, different from being different from adjacent another above-mentioned constituent part above-mentioned, the mode that the end face of the one end on the above-mentioned length direction of adjacent another above-mentioned constituent part abuts combines.
At the ring shielding parts that technical scheme 7 is recorded, it is characterized in that, in the ring shielding parts recorded in claim 6, each bight of above-mentioned rectangle mounting surface is implemented the chamfered of plane respectively, except above-mentioned constituent part, also possess the movable fit parts of triangle column, landfill is carried out in the gap of the triangle column that the junction surface of above-mentioned movable fit parts to the end face by the end face of the fillet surface in each above-mentioned bight and one end of an above-mentioned constituent part and the other end of adjacent other above-mentioned constituent part is formed.
In order to achieve the above object, at the substrate-placing platform that technical scheme 8 is recorded, it is characterized in that, possess the ring shielding parts recorded in technical scheme 6 or 7.
Invention effect
According to the present invention, the long size shape object forming the constituent part of ring shielding parts is attached to substrate-placing platform by least one linking part, on the other hand, by the movement in the omnirange of the first movement limiting portion restriction constituent part, and by the movement beyond the second movement limiting portion restriction constituent part length direction, so the binding strength of linking part need not be increased in order to prevent the distortion of constituent part and movement.In addition, because constituent part can with the first movement limiting portion for starting point be out of shape and movement, so the problem not having internal stress to increase because of thermal expansion on the length direction of long size shape object.Thereby, it is possible to prevent the breakage of constituent part.
In addition, abut with the side of the end face of the one end on the length direction of a constituent part with the other end on the length direction of another adjacent constituent part, and the side of other one end of a constituent part, with be different from adjacent another constituent part, the mode of the end face abutting of the one end on adjacent another constituent part length direction, combination constituent part, so, the end face of the other end of a constituent part does not abut with adjacent another constituent part, constituent part due to thermal expansion with the first movement limiting portion being arranged at one end for starting point be out of shape on the length direction of long body and mobile time, the end face of the other end of neither one constituent part extrudes the problem of adjacent another constituent part.
In addition, the problem that neither one constituent part abuts with adjacent another constituent part, even if the position relationship of another constituent part adjacent with constituent part is also identical, the problem that the end face of one end of neither one constituent part is extruded by another adjacent constituent part.
Thus, adjacent other constituent part can not move to the length direction of a constituent part, and constituent part can not to the length direction of another constituent part move.Its result, can prevent from producing gap between the constituent part and substrate-placing platform of ring shielding parts.
Accompanying drawing explanation
Fig. 1 is the sectional view with the structure of the substrate board treatment of the substrate-placing platform that ring shielding parts are suitable for schematically representing embodiments of the present invention.
Fig. 2 is the figure of the structure of the shading ring schematically representing present embodiment, Fig. 2 (A) is plane graph, and Fig. 2 (B) is the sectional view along II-II line in Fig. 2 (A).
Fig. 3 is the stereogram being configured in the movable fit parts in the substrate-placing face of pedestal in Fig. 1.
Fig. 4 is the figure of the structure of the omnirange movement limiting portion of the ring constituent part schematically represented in Fig. 2, Fig. 4 (A) is the sectional view on the direction vertical with the length direction of ring constituent part, sectional view on the length direction that Fig. 4 (B) is ring constituent part, Fig. 4 (C) is the sectional view of IV-IV along the line in Fig. 4 (A).
Fig. 5 is the figure that the one direction of the ring constituent part schematically represented in Fig. 2 moves the structure of allowing portion, Fig. 5 (A) is the sectional view on the direction vertical with the length direction of ring constituent part, sectional view on the length direction that Fig. 5 (B) is ring constituent part, Fig. 5 (C) is the sectional view of V-V along the line in Fig. 5 (A).
Fig. 6 is the figure of the structure of the linking part of the ring constituent part schematically represented in Fig. 2, Fig. 6 (A) is the sectional view on the direction vertical with the length direction of ring constituent part, sectional view on the length direction that Fig. 6 (B) is ring constituent part, Fig. 6 (C) is the sectional view of VI-VI along the line in Fig. 6 (A).
Fig. 7 is the plane graph that each ring constituent part of the shading ring represented in Fig. 2 there occurs the state of thermal expansion.
Fig. 8 is the plane graph that the pedestal represented in Fig. 1 there occurs the state of thermal expansion.
Fig. 9 is the plane graph that the pedestal representing in FIG is placed with the state of substrate.
Figure 10 is the figure of the structure of the first variation of the shading ring of the present embodiment schematically representing Fig. 2, Figure 10 (A) is the plane graph of the first variation, Figure 10 (B) is the sectional view on the direction vertical with the length direction of the ring constituent part of omnirange movement limiting portion in the first variation, Figure 10 (C) is the sectional view on the ring constituent part length direction of omnirange movement limiting portion in the first variation, Figure 10 (D) is the sectional view moved with one direction on the vertical direction of the length direction of the ring constituent part of allowing portion in the first variation, Figure 10 (E) is the sectional view that the one direction in the first variation moves on the length direction of the ring constituent part of allowing portion.
Figure 11 is the plane graph of the structure of the second variation of the shading ring of the present embodiment schematically representing Fig. 2.
Figure 12 is the figure of the attachment representing first of Figure 11 the long size component and the second long size component, the amplification view that Figure 12 (A) is connecting portion, the amplification longitdinal cross-section diagram that Figure 12 (B) is attachment, Figure 12 (C) is the sectional view of XII-XII along the line in Figure 12 (A).
Figure 13 is the plane graph representing existing shading ring structure.
Description of reference numerals
G substrate
10 substrate board treatments
11 chambers
12 pedestals
13a substrate-placing face
13b flange part
15 shading rings
41 ~ 44,51 ~ 54,58 ~ 61 ring constituent parts
41a ~ 44a, 51a ~ 54a, 58aa ~ 61aa stiff end
41b ~ 44b, 51b ~ 54b, 58bb ~ 61bb free end
45,55 omnirange movement limiting portions
45b, 46b gasket hole
45c, 46c packing ring
45d, 46d bolt
46,56 one directions move and allow portion
47 linking parts
48 movable fit parts
55a, 56a guide
55b, 56b lead piece bores
The long size component of 58a ~ 61a first
The long size component of 58b ~ 61b second
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.
Fig. 1 is the sectional view with the schematic configuration of the substrate board treatment of the substrate-placing platform that shield member is suitable for schematically representing embodiments of the present invention.The plasma treatment that the glass substrate that this substrate board treatment such as manufactures liquid crystal indicator (LCD) specifies.
In FIG, substrate board treatment 10 has storage such as while be the process chamber (chamber) 11 of the glass substrate G (being called ' substrate ' to place an order) of the rectangle of several meters, is configured with the mounting table (pedestal) 12 of mounting substrate G in the Figure below of this chamber 11 inside.Pedestal 12 is such as made up of by the base material 13 that the aluminium of alumite or stainless steel etc. are formed surface, and base material 13 is supported in the bottom of chamber 11 across insulating element 14.The cross section of base material 13 is convex, and its upper plane is the substrate-placing portion 13a of mounting substrate G.Substrate-placing portion 13a is capped by ceramic spraying plating, prevents base material 13 from exposing.
At base material 13, the mode of surrounding around the 13a of substrate-placing face is provided with the shading ring 15 as shield member, shading ring 15 is formed by the assembly of the long size shape object be such as made up of the pottery of the insulating properties of aluminium oxide etc. and ring constituent part 41 ~ 44 (describing below).
The built-in electrostatic attraction electrode plate 16 in top of base material 13, plays function as electrostatic chuck.Electrostatic attraction electrode plate 16 is connected with DC power supply 17, when applying positive direct voltage to electrostatic attraction electrode plate 16, be placed in substrate-placing face 13a substrate G electrostatic attraction electrode plate 16 side surface (hereinafter referred to as ' the inside ') produce negative potential, between electrostatic attraction electrode plate 16 and substrate G, produce potential difference thus, substrate G is adsorbed by the Coulomb force that caused by this potential difference or Johnson-La Bieke (Johnson-Rahbek) power and is held in substrate-placing face 13a.
The thermoregulation mechanism (omitting diagram) be made up of refrigerant flow path for regulating base material 13 and the temperature of the substrate G being placed in substrate-placing face 13a is provided with in the inside of base material 13.The supply that such as circulates of this thermoregulation mechanism has the cold-producing medium of cooling water or galden (ガ Le デ Application: registered trade mark) etc., is cooled by the base material of this refrigerant cools 13 couples of substrate G.
Around base material 13, be configured with the dead ring 18 as side annular seal member, it covers the side of this base material 13.Dead ring 18 is made up of the pottery such as aluminium oxide of insulating properties.
At the through hole of the diapire of through chamber 11, insulating element 14 and base material 13, liftably insert lifter pin 21.Lifter pin 21 action when being placed in the moving into and take out of of substrate G of substrate-placing face 13a, when substrate G is moved in chamber 11 or when taking out of from chamber 11, rise to the conveyance position of the top of pedestal 12, outside this, be accommodated in the 13a of substrate-placing face to bury state underground.
At substrate-placing face 13a, opening has not shown multiple heat-conducting gas supply holes.Multiple heat-conducting gas supply hole is to gap supply heat-conducting gas such as helium (He) gas of the inside of substrate-placing face 13a and substrate G.Be supplied to the helium atmosphere in the gap of the inside of substrate-placing face 13a and substrate G, the heat of substrate G is conducted effectively to pedestal 12.
The base material 13 of pedestal 12 is connected with the high frequency electric source 23 for supply high frequency electric power via adaptation 24.Be applied with the High frequency power of such as 13.56MHz from high frequency electric source 23, pedestal 12 plays function as lower electrode.Adaptation 24 reduces the reflection from the High frequency power of pedestal 12 and makes the efficiency of supply of High frequency power to pedestal 12 maximum.
In substrate board treatment 10, be formed with side-exhaustion road 26 by the madial wall of chamber 11 and the side of pedestal 12.This side-exhaustion road 26 is connected with exhaust apparatus 28 via blast pipe 27.Reduce pressure to vacuumizing in chamber as the TMP (TurboMolecularPump: turbomolecular pump) of exhaust apparatus 28 and DP (DryPump: dry pump) and MBP (MechanicalBoosterPump: straight empty pump) (all not shown).Specifically, DP or MBP is decompressed to middle vacuum state (such as 1.3 × 10Pa (0.1Torr) below) by chamber 11 from atmospheric pressure, and TMP and DP or MBP collaborates and will be decompressed to the high vacuum state (such as 1.3 × 10 of the pressure lower than middle vacuum state in chamber 11
-3pa (1.0 × 10
-5torr) below).Further, the pressure in chamber 11 is controlled by APC valve (omitting diagram).
At the top section of chamber 11, be configured with spray head 30 in the mode relative with pedestal 12.Spray head 30 has inner space 31, and has multiple gas orifices 32 of discharging process gas to the process space S between this spray head 30 and pedestal 12.Spray head 30 ground connection, forms pair of parallel plate electrode together with play the pedestal 12 of function as lower electrode.
In addition, spray head 30 is connected with process supplies for gas 39 via gas supply pipe 36.Gas supply pipe 36 is provided with switch valve 37 and mass flow controller 38.In addition, the sidewall for the treatment of chamber 11 is provided with substrate carrying-in/carrying-out mouth 34, this substrate carrying-in/carrying-out mouth 34 can be opened and closed by the family of power and influence 35.And, as the substrate G of handling object, be moved to via this family of power and influence 35 and take out of.
In substrate board treatment 10, supply process gas from process supplies for gas 39 via process gas introduction tube 36.The process gas be supplied to is imported into the process space S of chamber 11 via the inner space 31 of spray head 30 and gas orifice 32, the process gas that this is imported into, is become plasma by exciting to the High frequency power that the plasma that process space S applies generates from high frequency electric source 23 via pedestal 12.Ion in plasma is drawn towards substrate G, substrate G is implemented to the plasma treatment of regulation.
The action of each constituent part of substrate board treatment 10, the CPU of the control part (not shown) that substrate board treatment 10 possesses controls according to the program of corresponding plasma etch process.
Fig. 2 is the figure of the structure of the shading ring schematically representing the first execution mode of the present invention, Fig. 2 (A) is vertical view, and Fig. 2 (B) is the sectional view of II-II line along Fig. 2 (A).
In Fig. 2 (A), shading ring 15 configures in the mode of the surrounding surrounding the substrate-placing face 13a of the rectangle of the pedestal 12 (hereinafter referred to as ' lower electrode ') as lower electrode performance function, comprises the ring constituent part 41,42 be made up of rectangular-shaped long size shape object configured respectively by two relative minor faces of the substrate-placing face 13a along rectangle and forms with the assembly of the ring constituent part 43,44 be made up of rectangular-shaped long size shape object configured respectively by two relative long limits of the substrate-placing face 13a along rectangle.
Each ring constituent part 41 ~ 44 has: the omnirange movement limiting portion 45 (the 1st movement limiting portion) being arranged on one end (hereinafter referred to as ' stiff end ') 41a ~ 45a of the length direction (being called ' length direction ' to place an order) of long size shape object; At the one direction movement limiting portion 46 (the 2nd movement limiting portion) that length direction and this omnirange movement limiting portion 45 are arranged with leaving; Two linking parts 47 arranged along its length.When one direction movement limiting portion 46 and linking part 47 are all arranged with omnirange movement limiting portion 45 with leaving, be not particularly limited about setting position, but from the view point of making each ring constituent part 41 ~ 44 reliably mobile in the longitudinal direction, preferred one direction movement limiting portion 46 is arranged with omnirange movement limiting portion 45 as far as possible with leaving, such as, also can be arranged on the other end (hereinafter referred to as ' free end ') on the length direction of long size shape object
In shading ring 15, abut with the side of the end face of the stiff end 41a of ring constituent part 41 with the free end 43b of another adjacent ring constituent part 43, the mode that the side of free end 41b abuts with the end face of the stiff end 44a of adjacent another ring constituent part 44 is configured with ring constituent part 41.On the other hand, the end face of free end 41b does not abut with the stiff end 44a of ring constituent part 44.In the present embodiment, each ring constituent part 42 ~ 44 with the position relationship of another adjacent separately ring constituent part 44,42,41 in, also equally with ring constituent part 41 to configure, and ring constituent part 42 and 44 is configured to: be point symmetry about the central point of substrate-placing face 13a with ring constituent part 41 and 43 separately.
In Fig. 2 (B), convexly, the upper plane of this cross section convex body becomes substrate-placing face 13a, and stage portion surface becomes flange part 13b in the cross section of the base material 13 of lower electrode 12.
Each bight of substrate-placing face 13a is implemented the chamfered of plane respectively, thus, such as, be formed with the gap of triangle column between the junction surface of the side of the end face of the stiff end 41a of the fillet surface in a bight of substrate-placing face 13a and substrate ring constituent part 41 and the free end 43b of adjacent ring constituent part 43, this gap coordinates with the movable fit parts 48 of the rectangular leg-of-mutton triangle column in cross section are as shown in Figure 3 dynamic.Also be formed with the gap of same triangle column in remaining each bight of substrate-placing face 13a, each gap also coordinates with movable fit parts 48 are dynamic.
Fig. 4 is the figure of the structure of the omnirange movement limiting portion of the ring constituent part schematically representing Fig. 2, Fig. 4 (A) is the sectional view on the direction vertical with length direction, Fig. 4 (B) is the sectional view on length direction, and Fig. 4 (C) is the sectional view of the IV-IV along the line in Fig. 4 (A).
In Fig. 4 (A) ~ Fig. 4 (C), omnirange movement limiting portion 45 has: circular spot-facing face 45a, and it such as cuts ring constituent part 41 from the top Fig. 4 (A), Fig. 4 (B) and is formed; Packing ring (collar: lasso) hole 45b (the first gasket hole), it is through ring constituent part 41 in a thickness direction at 45a center, spot-facing face, is formed by cylindrical space; Cylindric packing ring 45c (the first packing ring), it coordinates with gasket hole 45b is dynamic; With bolt 45d (the first bolt), it is inserted by packing ring 45c inside, and presses packing ring 45c to flange part 13b.The omnirange movement limiting portion 45 of ring constituent part 42 ~ 44 also has identical structure.
In omnirange movement limiting portion 45, as shown in Fig. 4 (C), gasket hole 45b with the face of packing ring 45c central axis on there is circular cross section, and the gap of the side of the side of packing ring 45c and gasket hole 45b is set as the value of fixing in all directions substantially.In the present embodiment, the gap of the side of packing ring 45c and the side of gasket hole 45b sets little, with the movement in the omnirange of limit collar constituent part 41.Specifically, because this gap is such as set as 0.01 ~ 0.2mm (the adding up to 0.02 ~ 0.4mm of the both sides in diametric(al)), so ring constituent part 41 almost can not move near omnirange movement limiting portion 45.
Fig. 5 is the figure that the one direction of the ring constituent part schematically represented in Fig. 2 moves the structure of allowing portion, Fig. 5 (A) is the sectional view on the direction vertical with length direction, Fig. 5 (B) is the sectional view on length direction, and Fig. 5 (C) is the sectional view of V-V along the line in Fig. 5 (A).
In Fig. 5 (A) ~ Fig. 5 (C), one direction moves allows that portion 46 has: such as, circular spot-facing face 46a, and it is from Fig. 5 (A), and the top in Fig. 5 (B) is cut ring constituent part 41 and formed; Gasket hole 46b (the second gasket hole), it is through ring constituent part 41 in a thickness direction at 46a center, spot-facing face; Cylindric packing ring 46c (the second packing ring), it coordinates with gasket hole 46b is dynamic; With bolt 46d (the second bolt), it is inserted by packing ring 46c inside, and presses packing ring 46c to flange part 13b.The one direction of ring constituent part 42 ~ 44 moves allows that portion 46 also has identical structure.
Moving in one direction allows in portion 46, as shown in Fig. 5 (C), gasket hole 46b has oblong cross section on the face of the central axis with packing ring 46c, due to this long round section major axis along its length, so produce larger gap between the side of packing ring 46c in the longitudinal direction and the side of gasket hole 46b, such as when making the gap equalization of both sides of grip bolt 46d, in the gap of one-sided generation such as 1.5 ~ 2.5mm, thus, the ring constituent part 41 being provided with gasket hole 46b can relative movement along its length relative to packing ring 46c.On the other hand, on the direction (to place an order be called ' vertical direction ') vertical with length direction, the gap of the side of packing ring 46c and the side of gasket hole 46b sets little, with the movement in the vertical direction of limit collar constituent part 41.Specifically, identical with the gap in omnirange movement limiting portion 45, this gap is such as set as 0.01 ~ 0.2mm one-sided, and therefore ring constituent part 41 moves in one direction and allows that portion 46 almost can not move in vertical direction.That is, ring constituent part 41 moves in one direction and allows and only can move along its length near portion 46.At this, " Long Circle " refers to, two ends are the rectangle of semicircle or ellipse and the similar figure with major axis and minor axis.Below also identical.
As mentioned above, in the present embodiment, when thermal expansion occurs ring constituent part 41, ring constituent part 41 moves for starting point in the longitudinal direction with omnirange movement limiting portion 45.Ring constituent part 42 ~ 44 moves for starting point in the longitudinal direction with omnirange movement limiting portion 45 too.
In addition, moving at omnirange movement limiting portion 45 and one direction allows in portion 46, even if as shown in Fig. 4 (A), Fig. 4 (B), Fig. 5 (A) and Fig. 5 (B), each bolt 45d, 46d abut with packing ring 45c, 46c, also can not abut to spot-facing face 45a, 46a.So the binding strength of bolt 45d, 46d can not be applied to ring constituent part 41 ~ 44.
Fig. 6 is the figure of the structure of the linking part of the ring constituent part schematically represented in Fig. 2, Fig. 6 (A) is the sectional view on the direction vertical with length direction, Fig. 6 (B) is the sectional view on length direction, and Fig. 6 (C) is the sectional view of VI-VI along the line in Fig. 6 (A).
In Fig. 6 (A) ~ Fig. 6 (C), linking part 47 has: circular spot-facing face 47a, and it such as cuts ring constituent part 41 from the top Fig. 6 (A), Fig. 6 (B) and is formed; Screw 47b, it is through ring constituent part 41 in a thickness direction at 47a center, spot-facing face, is formed by oval column or cylindrical space; With bolt 47c, it is inserted to screw 47b inside and is pressed spot-facing face 47a to flange part 13b.In linking part 47, because bolt 47c presses spot-facing face 47a, so ring constituent part 41 is linked to the base material 13 of pedestal 12 to flange part 13b.In addition, the linking part 47 of ring constituent part 42 ~ 44 also has identical structure.
In linking part 47, as shown in Fig. 6 (C), screw 47b has oblong cross section on the face of the central axis with bolt 47c, and has gap on the length direction of ring constituent part 41.In the present embodiment, the gap of the side of bolt 47c and the side of screw 47b sets greatly in the longitudinal direction, specifically, when making the gap equalization of both sides of grip bolt 47c, this gap is such as set as 3mm one-sided, so ring constituent part 41 can move freely near linking part 47.
Fig. 7 is the plane graph that each ring constituent part of the shading ring representing Fig. 2 there occurs the state of thermal expansion.
As mentioned above, although the ring constituent part 41 ~ 44 of shading ring 15 due to thermal expansion with omnirange movement limiting portion 45 for starting point is upper mobile at length direction (direction shown in figure hollow core arrow), but, in shading ring 15, the end face of the free end 41b of ring constituent part 41 is liberated, do not abut with the stiff end 44a of ring constituent part 44, equally, the end face of the free end 42b of ring constituent part 42 is liberated, do not abut with the stiff end 43a of ring constituent part 43, the end face of the free end 43b of ring constituent part 43 is liberated, do not abut with the stiff end 41a of ring constituent part 41, the end face of the free end 44b of ring constituent part 44 is liberated, do not abut with the stiff end 42a of ring constituent part 42, therefore, as shown in Figure 7, each ring constituent part 41 ~ 44 does not extrude another ring constituent part.
Fig. 8 is the plane graph that the pedestal represented in Fig. 1 there occurs the state of thermal expansion.
In fig. 8, because each ring constituent part 41 ~ 44 of shading ring 15 is to configure with the mode that each limit of substrate-placing face 13a abuts one to one, so when pedestal 12 there occurs thermal expansion along the figure hollow core direction of arrow, each ring constituent part 41 ~ 44 is subject to pressing force only from the substrate-placing face 13a of correspondence.So each ring constituent part 41 ~ 44 can move up in the side identical with the moving direction of corresponding substrate-placing face 13a, and do not produce gap between one side of the substrate-placing face 13a of each ring constituent part 41 ~ 44 and correspondence.
In addition, along with the thermal expansion of pedestal 12, between each ring constituent part, such as between the end face and the side of free end 43b of the stiff end 41a abutted, produce gap (not shown), but by adopting labyrinth (labyrinth) structure at this abutting part, base material 13 can be made not expose.Labyrinth structure such as, can by arranging difference of height (step difference) separately and the mode combining this difference of height is formed at stiff end 41a and free end 43b in abutting part.
Fig. 9 is the plane graph that the pedestal representing in FIG is placed with the state of substrate.
In pedestal 12, when being placed with substrate G at substrate-placing face 13a, as shown in Figure 9, substrate G opposing substrate mounting surface 13a departs from, the bight of the directional plane 49 (orientationflat) as otch in the bight of this substrate G not covered substrate mounting surface 13a, but be configured with movable fit parts 48 in each bight of the substrate-placing face 13a of pedestal 12, therefore, substrate-placing face 13a does not expose, and only movable fit parts 48 expose.Thus, the ceramic spraying plating of the substrate-placing face 13a not having plasma to cause, by the problem of cutting down, thus can prevent from producing paradoxical discharge or corrosion at pedestal 12.
In addition, at pedestal 12, owing to being configured with movable fit parts 48 in whole bight of substrate-placing face 13a, even if so at the content changing corresponding to plasma treatment substrate G towards, also there are arbitrary movable fit parts 48 accordingly with the position of directional plane 49.Thereby, it is possible to reliably prevent the ceramic spraying plating of substrate-placing face 13a from being cut down.Even if movable fit parts 48 consume due to plasma, but, because movable fit parts 48 can easily exchange, so the plasma resistance of pedestal 12 easily can be maintained.
According to the shading ring 15 as ring shielding parts of embodiment of the present invention, the long size shape object of formation each ring constituent part 41 ~ 44 of shading ring 15 is attached to pedestal 12 by linking part 47, but the movement limited by omnirange movement limiting portion 45 in the omnirange of each ring constituent part 41 ~ 44, moved by one direction and allow that portion 46 limits the movement beyond the length direction of each ring constituent part 41 ~ 44, so in order to prevent distortion and the movement of each ring constituent part 41 ~ 44, without the need to increasing the binding strength of connecting member 47.In addition, because each ring constituent part 41 ~ 44 can be out of shape in the longitudinal direction for starting point and move with omnirange movement limiting portion 45, so the internal stress do not caused because of thermal expansion becomes large problem.Thereby, it is possible to prevent the breakage of each ring constituent part 41 ~ 44.
In addition, each ring constituent part 41 ~ 44 is combined as: a ring constituent part 41 (42, 43 or 44) stiff end 41a (42a, 43a or 44a) end face and another adjacent ring constituent part 43 (44, 42 or 41) free end 43b (44b, 42b or 41b) side abut, and ring structure parts 41 (42, 43 or 44) free end 41b (42b, 43b or 44b) side and adjacent another ring constituent part 44 (43, 41 or 42) stiff end 44a (43a, 41a or 42a) end face abut, so, a ring constituent part 41 (42, 43 or 44) free end 41b (42b, 43b or 44b) end face not with adjacent another ring constituent part 44 (43, 41 or 42 abut, when a ring constituent part 41 (42, 43 or 44) because of thermal expansion with the omnirange movement limiting portion 45 being arranged at stiff end for starting point be out of shape in the longitudinal direction and move time, a ring constituent part 41 (42, 43 or 44) free end 41b can not extrude another ring constituent part 44 (43, 41 or 42).Thus, another ring constituent part 44 (43,41 or 42) is not moved on the length direction of first ring constituent part 41 (42,43 or 44), its result, can prevent from producing gap between each ring constituent part 41 ~ 44 and pedestal 12 of shading ring 15.
Above, use above-mentioned execution mode to describe the present invention, but the present invention is not limited to above-mentioned execution mode.
Such as, in above-mentioned shading ring 15, use packing ring 45c, 46c to limit the movement of each ring constituent part 41 ~ 44, but the parts of moving-limiting can not be only limited to packing ring.
Figure 10 is the figure of the structure of the first variation of the shading ring of the present embodiment schematically representing Fig. 2, Figure 10 (A) is the plane graph of the first variation, Figure 10 (B) is the sectional view on the direction vertical with the length direction of the ring constituent part of the omnirange movement limiting portion in the first variation, Figure 10 (C) is the sectional view on the length direction of the ring constituent part of omnirange movement limiting portion in the first variation, Figure 10 (D) is the sectional view moved with one direction on the vertical direction of the length direction of the ring constituent part of allowing portion in the first variation, Figure 10 (E) is the sectional view that the one direction in the first variation moves on the length direction of the ring constituent part of allowing portion.
In Figure 10 (A), shading ring 50 is made up of the assembly of each ring constituent part 51 ~ 54, and wherein, the rectangular-shaped long size shape object that above-mentioned each ring constituent part 51 ~ 54 is configured by each limit of the substrate-placing face 13a along rectangle is formed.
Each ring constituent part 51 ~ 54 has: the omnirange movement limiting portion 55 (the first movement limiting portion) being arranged at stiff end 51a ~ 54a; One direction moves allows portion 56 (the second movement limiting portion), arranges with leaving in the longitudinal direction from this omnirange movement limiting portion 55; Two linking parts 47 arranged along its length.
In Figure 10 (B) and Figure 10 (C), omnirange movement limiting portion 55 has: rectangular-shaped guide 55a (the first guide), and it is set to a part and is embedded in flange part 13b and can not be moved relative to pedestal 12; Guiding piece bores 55b (first guiding piece bores), its be such as arranged at ring constituent part 51 with the contact-making surface of flange part 13b, and for move with guide 55a the rectangular-shaped recess coordinated.The omnirange movement limiting portion 55 of ring constituent part 52 ~ 54 also has identical structure.
In omnirange movement limiting portion 55, the gap of the side of guide 55a and the side of guiding piece bores 55b is set to fixed value substantially in all directions.In the present embodiment, the gap of the side of guide 55a and the side of guiding piece bores 55b sets little, with the movement in the omnirange of limit collar constituent part 51.Specifically, identical with the omnirange movement limiting portion 45 in the first execution mode, this gap length is such as set as 0.01 ~ 0.2mm (such as, the both sides of the guide 55a on the length direction of ring constituent part add up to 0.02 ~ 0.4mm), therefore ring constituent part 51 almost can not move near omnirange movement limiting portion 55.
In Figure 10 (D) and Figure 10 (E), one direction moves allows that portion 56 has: rectangular-shaped guide 56a (the second guide), and its part is embedded in flange part 13b and is set to can not be moved relative to pedestal 12; With guiding piece bores 56b (second guiding piece bores), its be such as arranged at ring constituent part 51 with the contact-making surface of flange part 13b, and for move with guide 56a the rectangular-shaped recess coordinated.The one direction of ring constituent part 52 ~ 54 moves allows that portion 56 also has identical structure.
Moving in one direction allows in portion 56, as shown in Figure 10 (E), because the length setting on guiding piece bores 56b length direction must be larger than the length on the length direction of guide 56a, so produce larger gap between the side of the side of guide 56a in the longitudinal direction and guiding piece bores 56b, such as move with the one direction in the first execution mode and allow that portion 46 is identical, when being impartial when making the gap of the both sides be clamped with on the length direction of guide 55a, in the gap of one-sided generation 1.5 ~ 2.5mm, thus, the ring constituent part 51 being provided with guiding piece bores 56b can counter-guide 56a relative movement along its length.On the other hand, in vertical direction, the side of guide 56a and the gap of the side of guiding piece bores 56b are set little, with the movement in the vertical direction of limit collar constituent part 51.Specifically, such as identical with omnirange movement limiting portion 55, this gap is such as set as 0.01 ~ 0.2mm (such as, the both sides of guide 55a in vertical direction add up to 0.02 ~ 0.4mm), therefore, ring constituent part 51 moves in one direction and allows and almost can not move in vertical direction near portion 56.That is, ring constituent part 51 moves in one direction and allows near portion 56, only can move along its length.
As mentioned above, in the first variation, when thermal expansion occurs ring constituent part 51, ring constituent part 51 moves for starting point in the longitudinal direction with omnirange movement limiting portion 55.Ring constituent part 52 ~ 54 moves for starting point in the longitudinal direction with omnirange movement limiting portion 55 too.
In above-mentioned shading ring 15, although each ring constituent part 41 ~ 44 is made up of a long size shape object, each ring constituent part also can be made up of multiple long size shape object.
Figure 11 is the plane graph of the structure of the second variation of the shading ring of the present embodiment schematically represented in Fig. 2.
In fig. 11, shading ring 57 is made up of the assembly of each ring constituent part 58 ~ 61, and wherein, the rectangular-shaped long size shape object that each ring constituent part 58 ~ 61 is configured by each limit of the substrate-placing face 13a along rectangle is formed.
Each ring constituent part 58 ~ 61 is split into first long size component 58a ~ 61a (the first long size portion) and second long size component 58b ~ 61b (the second long size component) along its length, such as in ring constituent part 58, omnirange movement limiting portion 45 is arranged at one end (stiff end) 58aa on the length direction of the first long size component 58a, one direction moves allows that portion 46 is arranged at the second long size component 58b, the other end (abutment end) 58ab on the length direction of the first long size component 58a abuts with one end (abutment end) 58ba on the length direction of the second long size component 58b, first long size component 58a and the second long size component 58b has plural linking part 47 separately.In addition, as shown in Figure 12 (A) ~ Figure 12 (C), first long size component 58a and the second long size component 58b utilizes by the coupling members such as bolt 62 interconnected in connecting portion each other, in addition, be configured with the alignment pin 64 (deviation preventing mechanism) being fitted to pin-and-hole 63 at connecting portion, depart to prevent that relative position occurs each other.Wherein, coupling member 62 is not limited to bolt, it also can be the component can seizing connecting portion from upper surface and lower surface on both sides by the arms, in addition, when just realizing by means of only alignment pin 64 link of the first long size component 58a and the second long size component 58b and prevent relative position from departing from, also can not coupling member be set.Thus, even if form ring constituent part by the long size component split, the effect that the situation (the first execution mode) that forms ring constituent part with by integrated component is identical also can be obtained.Each ring constituent part 59 ~ 61 also has the structure identical with ring constituent part 58.
In ring constituent part 57, ring constituent part 58 is configured to, the end face of the stiff end 58aa of the first long size component 58a abuts with the side of the other end (free end) 60bb on the length direction of the adjacent second long size component 60b, and the side of the free end 58bb of the second long size component 58b abuts with the end face of the stiff end 61aa of the adjacent first long size component 61a.On the other hand, the stiff end 61aa of not long with the first size component 61a of the end face of the free end 58bb of the second long size component 58b abuts.In the present embodiment, each ring constituent part 59 ~ 61 is also same with ring constituent part 58 to be configured, and ring constituent part 59 and 61 is configured to, separately about the central point of substrate-placing face 13a and ring constituent part 58 and 60 in point symmetry.
In ring constituent part 57, such as when thermal expansion occurs ring constituent part 58, first long size component 58a is moved because of thermal expansion, second long size component 58b is moved because of thermal expansion and the first long moving of size component 58a, but the first long size component 58a moves for starting point in the longitudinal direction with omnirange movement limiting portion 45, the second long size component 58b, moved by one direction and allow moving-limiting direction, portion 46, move in the longitudinal direction.Ring constituent part 59 ~ 61 too, first long size component 59a ~ 61a moves for starting point in the longitudinal direction with omnirange movement limiting portion 45, second long size component 59b ~ 61b, is moved by one direction and allows moving-limiting direction, portion 46, move in the longitudinal direction.Thereby, it is possible to prevent the internal stress caused because of thermal expansion in first long size component 58a ~ 61a and first long size component 58b ~ 61b from becoming large.
In addition, in shading ring 57, the stiff end 61aa (60aa, 58aa or 59aa) of not long with the first size component 61a (60a, 58a or 59a) of end face of the free end 58bb (59bb, 60bb or 61bb) of the second long size component 58b (59b, 60b or 61b) abuts.Thus, another ring constituent part 61 (60,58 or 59) is not to a ring constituent part 58 (59,60 or 61) length direction moves, its result, can prevent from producing gap between each ring constituent part 58 ~ 61 and pedestal 12 of shading ring 57.
Also have, in shading ring 57, because each ring constituent part 58 ~ 61 is partitioned into first long size component 58a ~ 61a and second long size component 58b ~ 61b, therefore, operating personnel can prevent the size of functional unit from becoming excessive and can prevent the deterioration of operability, and, for the FPD manufacturing installation of a large-scale generation, such as use the device of the substrate larger than the 7th generation FPD substrate, be difficult to the shield member be shaped that is made into one, but by applying the present invention to shield member, the effect identical with the effect that the integrally formed shield member used of existing small-sized FPD manufacturing installation plays can be obtained.
Claims (6)
1. the constituent part of ring shielding parts, it is arranged in the mode around the mounting surface of surrounding the rectangle of the substrate-placing platform loading described substrate in the process chamber of the substrate board treatment substrate of rectangle being implemented to plasma treatment, and the feature of the constituent part of described ring shielding parts is:
Comprise along described rectangle mounting surface while the long size shape object of insulating properties of configuration,
Have: the first movement limiting portion, it is arranged at the one end on the length direction of this long size shape object, limits the movement in the omnirange of described constituent part; With
Second movement limiting portion, it is arranged with described first movement limiting portion on described length direction with leaving, the movement beyond the described length direction limiting described constituent part,
Described first movement limiting portion has: the first guide, and it is set to can not move relative to described substrate-placing platform; With the first guiding piece bores, it is move with this first guide the recess coordinated, and the gap of each side of described first guide and each side of described first guiding piece bores sets little, to limit the movement in the omnirange of described constituent part,
Described second movement limiting portion has: the second guide, and it is set to can not move relative to described substrate-placing platform; With the second guiding piece bores, it is move with this second guide the recess coordinated, and the length setting on the described length direction of described second guiding piece bores is larger than the length on the described length direction of described second guide.
2. the constituent part of ring shielding parts as claimed in claim 1, is characterized in that:
Described long size shape object is split into the first long size portion and the second long size portion along described length direction, described first movement limiting portion is arranged on the one end on the described length direction in described first long size portion, described second movement limiting portion is arranged on described second long size portion, and the other end on the described length direction in described first long size portion abuts with the one end on the described length direction in described second long size portion.
3. the constituent part of ring shielding parts as claimed in claim 2, is characterized in that:
Described first long size portion and described second long size portion are bonded with each other, the abutting part abutted in described first long size portion and described second long size portion has the anti-locking mechanism of position deviation, and the anti-locking mechanism of this position deviation prevents the relative position in described first long size portion and described second long size portion from departing from.
4. ring shielding parts, it configures in the mode around the mounting surface of surrounding the rectangle of the substrate-placing platform loading described substrate in the process chamber of the substrate board treatment substrate of rectangle being implemented to plasma treatment, and the feature of described ring shielding parts is:
Comprise the assembly of the constituent part of ring shielding parts as claimed any one in claims 1 to 3,
Constituent part described in each abuts with the side of the end face of the one end on the described length direction of a described constituent part with the other end on the described length direction of constituent part described in adjacent another, and the side of the other end on the described length direction of a described described constituent part, be different from adjacent described in constituent part described in another, mode that the end face of one end on the described length direction of adjacent another described constituent part abuts combines.
5. ring shielding parts as claimed in claim 4, is characterized in that:
Each bight of described rectangle mounting surface is implemented the chamfered of plane respectively,
Except described constituent part, also possess the movable fit parts of triangle column, landfill is carried out in the gap of the triangle column that the junction surface of described movable fit parts to the end face by the end face of the fillet surface in bight described in each and one end of a described constituent part and the other end of adjacent other described constituent part is formed.
6. a substrate-placing platform, is characterized in that:
There are the ring shielding parts as described in claim 4 or 5.
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|---|---|---|---|
| JP2011-184510 | 2011-08-26 | ||
| JP2011184510A JP5667012B2 (en) | 2011-08-26 | 2011-08-26 | Ring-shaped shield member, component thereof, and substrate mounting table provided with ring-shaped shield member |
| CN201210306041.4A CN102956431B (en) | 2011-08-26 | 2012-08-24 | Ring shielding parts, its constituent part and substrate-placing platform |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210306041.4A Division CN102956431B (en) | 2011-08-26 | 2012-08-24 | Ring shielding parts, its constituent part and substrate-placing platform |
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| CN105206497A true CN105206497A (en) | 2015-12-30 |
| CN105206497B CN105206497B (en) | 2017-07-28 |
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| CN201510523186.3A Active CN105206497B (en) | 2011-08-26 | 2012-08-24 | Ring shielding part, its constituent part and substrate-placing platform |
| CN201210306041.4A Active CN102956431B (en) | 2011-08-26 | 2012-08-24 | Ring shielding parts, its constituent part and substrate-placing platform |
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| JP (1) | JP5667012B2 (en) |
| KR (2) | KR101414308B1 (en) |
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| US20160276142A1 (en) * | 2013-11-25 | 2016-09-22 | Applied Materials, Inc. | Substrate carrier for a reduced transmission of thermal energy |
| JP6380094B2 (en) | 2014-12-26 | 2018-08-29 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
| JP2016127185A (en) * | 2015-01-06 | 2016-07-11 | 東京エレクトロン株式会社 | Shield ring and substrate mounting table |
| KR101686564B1 (en) * | 2015-06-17 | 2016-12-15 | 세메스 주식회사 | Locking assembly and Apparatus for treating substrate with the assembly |
| JP6545613B2 (en) * | 2015-12-28 | 2019-07-17 | クアーズテック株式会社 | Focus ring |
| KR102604790B1 (en) * | 2021-05-03 | 2023-11-21 | 세메스 주식회사 | Apparatus for treating substrate |
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| JP2003115476A (en) * | 1999-12-22 | 2003-04-18 | Tokyo Electron Ltd | Division member of shield ring, shield ring, and plasma processor |
| CN1754978A (en) * | 2004-06-01 | 2006-04-05 | 应用材料股份有限公司 | Methods and apparatus for reducing arcing during plasma processing |
| CN101325169A (en) * | 2007-06-12 | 2008-12-17 | 东京毅力科创株式会社 | Carrying bench and plasma treatment apparatus using the same |
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- 2012-08-23 KR KR1020120092281A patent/KR101414308B1/en active IP Right Grant
- 2012-08-24 CN CN201510523186.3A patent/CN105206497B/en active Active
- 2012-08-24 CN CN201210306041.4A patent/CN102956431B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101414308B1 (en) | 2014-07-02 |
| CN102956431A (en) | 2013-03-06 |
| JP2013046002A (en) | 2013-03-04 |
| JP5667012B2 (en) | 2015-02-12 |
| KR20130023116A (en) | 2013-03-07 |
| TWI544544B (en) | 2016-08-01 |
| KR20130141418A (en) | 2013-12-26 |
| KR101563789B1 (en) | 2015-10-27 |
| CN105206497B (en) | 2017-07-28 |
| TW201327667A (en) | 2013-07-01 |
| CN102956431B (en) | 2015-09-30 |
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