CN101325169A - Carrying bench and plasma treatment apparatus using the same - Google Patents
Carrying bench and plasma treatment apparatus using the same Download PDFInfo
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- CN101325169A CN101325169A CNA2008101256363A CN200810125636A CN101325169A CN 101325169 A CN101325169 A CN 101325169A CN A2008101256363 A CNA2008101256363 A CN A2008101256363A CN 200810125636 A CN200810125636 A CN 200810125636A CN 101325169 A CN101325169 A CN 101325169A
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- cutting plate
- base material
- mounting table
- force application
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
Abstract
The invention provides a table which can not cause the damage of the shielding part similar to that of shielding ring and can decrease the clearance between the shielding part and the base caused by thermal expansion difference. The table (3) for supporting the base panel, in the treating chamber for applying plasma treatment to the base panel (G), comprises a base (5) made of metal; a carrying section (6) for carrying the base panel, arranged on the base; a shielding part (7) made of insulated ceramics, winding around the periphery of the upper part of the carrying section (6) and the base (5), wherein the shielding part (7) is divided into a plurality of division pieces (7a); and a force-applying mechanism (50), which can apply force in such a manner that makes the plurality of division pieces close to each other.
Description
Technical field
The present invention relates in the substrates such as glass substrate that the flat-panel monitor (FPD) such to liquid crystal indicator (LCD) made usefulness are implemented the treatment chamber of plasma treatment of dry ecthing etc. the mounting table of mounting substrate and use the plasma processing apparatus of this mounting table.
Background technology
For example in FPD or semi-conductive manufacturing process, the glass substrate as processed substrate is carried out the plasma treatment of dry ecthing etc.In the plasma processing apparatus that carries out such plasma treatment, upload under the state that is equipped with substrate in the mounting table that is arranged at treatment chamber and to generate plasma, the plasma treatment of utilizing this plasma that substrate is stipulated.
In such plasma processing apparatus, mounting have the mounting table of processed substrate to possess the base material that works as the lower electrode that applies the High frequency power that is used to generate plasma and be arranged at base material around shading ring.This shading ring is formed by insulating ceramicses such as aluminium oxide for the insulation that improves focusing and High frequency power is provided with, and screw is on base material.
But FPD maximizes all the more with glass substrate in recent years, is difficult to form shading ring, as record in the patent documentation 1, uses the shading ring of Splittable.
Shown in Figure 10 a, the shading ring 107 of the Splittable that patent documentation 1 is put down in writing, for example under combination is the state of 4 cutting plate 107a of crank shape, be disposed at base material 105 around.And each cutting plate 107a of shading ring 107 is fixed in base material 105 by hold-down screw 109.In this case, the heat that produces owing to the Continuous irradiation of the adjustment of base material 105 and plasma, make base material 105 and shading ring 107 thermal expansions, but base material 105 is metallic articles such as aluminium, to compare thermal coefficient of expansion big with the shading ring 107 that is made of insulating ceramicses such as aluminium oxide, therefore because hot, bigger displacement takes place in base material 105.At this, if hold-down screw 109 does not have play ground to fix, then the thermal expansion difference owing to both causes shading ring 107 to break, therefore take place for anti-kind situation here, as as shown in the Figure 10 (b) in the AA cross section of Figure 10 (a), between screwed hole 109a and hold-down screw 109, be provided with the gap.Thereby, when temperature rises, each cutting plate 107a of shading ring 107 follows base material 105 displacements owing to the existence in the gap of screwed hole 109a in the mode that is pushed by the bigger base material 105 of thermal expansion, but when temperature is got back to normal temperature, shown in Figure 11 (a), between base material 105 and shading ring 107, produce gap 108.Promptly, but when temperature is got back to normal temperature, contraction along with base material 105, screw 109 turns back to original position, but owing to hold-down screw 109 in order not damage not tight that shading ring 107 twists, so only hold-down screw 109 moves at gap 109a as Figure 11 (b) of the BB sectional view of Figure 11 (a), the cutting plate 107a of shading ring 107 can't turn back to original position, consequently produces gap 108 between base material 105 and shading ring 107.
When like this between base material 105 and shading ring 107 in case when producing the gap, even might work as the temperature rising of the plasma of next time mounting table when applying, this gap is kept, and is caused the generation of paradoxical discharge by this gap.In addition, in order to prevent the generation in such gap,, then might cause shading ring breakage of ceramic owing to thermal stress if strengthen the connection power of the screw 109 of fixed mask ring 107.
Summary of the invention
The present invention proposes in view of such situation, and its purpose is to provide a kind of danger of the breakage that can not cause the shield member that shading ring is such and reduces by the mounting table in the gap between caused shield member of thermal expansion difference and the base material and use the plasma processing apparatus of such mounting table.
In order to solve above-mentioned problem, in first viewpoint of the present invention, provide a kind of mounting table, it is the mounting substrate in the treatment chamber of substrate being implemented plasma treatment, it is characterized in that, comprising: metal base material; The mounting portion of mounting substrate thereon is set; With the shield member that constitutes by insulating ceramics that is provided with in the mode around the top of above-mentioned mounting portion and above-mentioned base material, above-mentioned shield member is divided into a plurality of cutting plates, and has so that the force application mechanism of the mutually approaching mode application of force of above-mentioned cutting plate.
In above-mentioned first viewpoint, above-mentioned force application mechanism also can constitute has the cutting plate that connects adjacency, along the force application part that draws their the direction application of force mutually.In addition, also can constitute aforesaid substrate is rectangular substrate, and above-mentioned shield member is frame-like, and above-mentioned each cutting plate comprises that each bight forms 4 crank-like.And, also can constitute above-mentioned base material and have the protuberance that above-mentioned mounting portion is set, above-mentioned shading ring is provided with in the mode around raised part and above-mentioned mounting portion.In addition, can constitute above-mentioned force application mechanism and have the cover that covers above-mentioned force application part.
Also can constitute, above-mentioned base material has the protuberance that above-mentioned mounting portion is set, above-mentioned shading ring is provided with in the mode around above-mentioned mounting portion and raised part, above-mentioned force application mechanism has the recess that is arranged at above-mentioned cutting plate, with the above-mentioned recess of insertion, connect the screw component of above-mentioned cutting plate and above-mentioned base material, and be arranged between the wall portion in the above-mentioned recess of above-mentioned screw component and above-mentioned cutting plate, to the projection of above-mentioned base material force application part the above-mentioned cutting plate application of force.In addition, also can constitute, above-mentioned base material has the protuberance that above-mentioned mounting portion is set, above-mentioned shading ring is provided with in the mode around raised part, above-mentioned force application mechanism has the recess of the mortar shape that is arranged at above-mentioned cutting plate, with the taper washer that inserts above-mentioned recess, thereby the screw component that is connected above-mentioned cutting plate and above-mentioned base material with the above-mentioned taper washer of insertion, and the force application part between above-mentioned screw component and above-mentioned taper washer, when producing thermal expansion difference between above-mentioned base material in cooling procedure and the above-mentioned cutting plate, above-mentioned force application part by above-mentioned taper washer to the projection of above-mentioned base material to the above-mentioned cutting plate application of force.In this case, has between the head and above-mentioned base material of above-mentioned screw component the fixed part of fixing above-mentioned screw component.And, can also constitute, in these structure, aforesaid substrate is a rectangular substrate, and above-mentioned shield member is frame-like, and above-mentioned each cutting plate comprises that each bight forms 4 crank-like, above-mentioned force application mechanism is arranged at the bight of each cutting plate, in the adjacency section of each cutting plate, when making above-mentioned cutting plate displacement along with elastic force, form the such step of cutting plate displacement to the inside that makes adjacency by above-mentioned force application mechanism.In addition, above-mentioned force application mechanism has the cover that covers above-mentioned recess.
And even in above-mentioned any, also preferred above-mentioned force application part is a spring members.
Even in above-mentioned arbitrary structure, above-mentioned mounting portion can have the electrostatic chuck of Electrostatic Absorption substrate.In addition, can also have High frequency power supply power from the High frequency power of plasma generation usefulness to above-mentioned base material that supply with.
In second viewpoint of the present invention, a kind of plasma processing apparatus is provided, it is characterized in that, comprising: the treatment chamber of accommodating substrate; Mounting substrate in above-mentioned treatment chamber has the mounting table of the structure of above-mentioned first viewpoint; In above-mentioned container handling, supply with the processing gas supply mechanism of handling gas; The plasma that generates the plasma of handling gas in above-mentioned treatment chamber generates mechanism; With to carrying out the exhaust gear of exhaust in the above-mentioned treatment chamber.
In above-mentioned second viewpoint, generate mechanism as above-mentioned plasma, can use to have and supply with the mechanism of High frequency power supply power that plasma generates the High frequency power of usefulness to above-mentioned base material.
According to the present invention, because shield member is divided into a plurality of cutting plates, and have with the force application mechanism of approaching mutually mode to the above-mentioned cutting plate application of force, so in the cooling procedure after mounting table temporarily is heated, can be difficult to thermal expansion difference owing to the cutting plate of shield member and base material and cause and between them, form the gap.
Description of drawings
Fig. 1 is the sectional view that expression is provided with the plasma processing apparatus of the mounting table that an embodiment of the present invention relates to.
Fig. 2 is the vertical view of the mounting table that relates to of the employed an embodiment of the present invention of the plasma processing apparatus of presentation graphs 1.
Fig. 3 is the vertical view and the sectional view of the employed force application mechanism of shading ring of the mounting table of presentation graphs 2.
Fig. 4 is illustrated in the existing mounting table, produces the figure of the state in gap in the cooling procedure after heating between base material and shading ring.
Fig. 5 is that expression utilizes the force application mechanism of Fig. 3 not produce the figure of the state in gap between base material and shading ring.
Fig. 6 is the vertical view of the mounting table that relates to of expression other execution mode of the present invention.
Fig. 7 is the sectional view and the vertical view of the employed force application mechanism of shading ring of the mounting table of presentation graphs 6.
Fig. 8 is the vertical view of the mounting table that relates to of expression another other execution mode of the present invention.
Fig. 9 is the sectional view of the employed force application mechanism of shading ring of the mounting table of presentation graphs 8.
Figure 10 is vertical view and its AA sectional view of the existing mounting table of expression.
Figure 11 is vertical view and its BB sectional view that produces the state in gap in the process that is illustrated in after the heating between base material and shading ring.
Symbol description
1 plasma processing apparatus
2 treatment chamber
3 mounting tables
5 base materials
6 mounting portions (electrostatic chuck)
7,7 ' shading ring
7a, 7b cutting plate
14 high frequency electric sources
20 spray heads
28 handle the gas supply source
34 DC power supply
50,60,70 force application mechanisms
51,64,77 spring members
53,65,78 covers
61,62 recesses
63 screw components
71,72 recesses
72a wall portion
73 taper washers
74 screw components
75 collars
The G glass substrate
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.Fig. 1 is the sectional view that expression is provided with the plasma processing apparatus of the mounting table that an embodiment of the present invention relates to.This plasma processing unit 1 for carrying out the sectional view of FPD with the device of the predetermined processing of glass substrate G etc., constitutes as capacity mating type parallel flat plasma-etching apparatus.At this, LCD (LCD), electroluminescent (Electro LuminescenceEL) display, plasma display (PDP) etc. are arranged as the FPD illustration.
This plasma processing unit 1 has the chamber that is configured as the angle barrel shape 2 of for example being handled the aluminium formation of (anodized) by the surface through pellumina.Bottom in this treatment chamber 2 is provided with and is used for the mounting table 3 of mounting as the glass substrate G of processed substrate.
Mounting table 3 is supported on the bottom of treatment chamber 2 by insulating element 4, base material 5 with metal convexs such as aluminium, be arranged on the mounting portion 6 of the mounting glass substrate G on the protuberance 5a of base material 5 and be arranged on mounting portion 6 and the protuberance 5a of base material 5 around by the insulating ceramics shading ring 7 of the frame-like that constitutes of aluminium oxide for example.Mounting portion 6 is configured for the electrostatic chuck of Electrostatic Absorption glass substrate G.In addition, be provided with in the inside of base material 5 and be used for the thermoregulator thermoregulation mechanism of glass substrate G (not shown).And the dead ring 8 that is provided with the ring-type that is made of insulating ceramics, for example aluminium oxide on every side at base material 5 is used to support shading ring 7.The mounting portion 6 that constitutes electrostatic chuck has with the ceramic molten of insulating ceramicses such as aluminium oxide formation penetrates film 41 and is embedded in its inner electrode 42.DC power supply 34 is connected with electrode 42 by supply lines 33, is used to the direct voltage Electrostatic Absorption glass substrate G from this DC power supply 34.
In the mode of the diapire, insulating element 4 and the mounting table 3 that connect chamber 2, can insert up and down and be common to the lifter pin 10 that the glass substrate G on it is carried out loading and unloading.When this lifter pin 10 conveyance glass substrate G, rise to the conveyance position of the top of mounting table 3, in addition, be in the state in the mounting table 3 of submerging.
On the base material 5 of mounting table 3, be connected with the supply lines 12 that is used for supply high frequency electric power, on this supply lines 12, be connected with adaptation 13 and high frequency electric source 14.Supply with for example High frequency power of 13.56MHz from high frequency electric source 14 to the base material 5 of mounting table 3.Thereby mounting table 3 plays a role as lower electrode.
Above mounting table 3, be provided with and the parallel relative and spray head 20 that work as upper electrode of this mounting table 3.Spray head 20 is supported on the top of treatment chamber 2, has inner space 21 in inside, and is formed with a plurality of squit holes 22 that gas is handled in ejection at the opposite face with mounting table 3.These spray head 20 ground connection constitute the pair of parallel plate electrode with the mounting table 3 that works as lower electrode.
Be provided with gas introduction port 24 on spray head 20, be connected with on this gas introduction port 24 and handle gas supply pipe 25, this is handled gas supply pipe 25 and is connected with gas supply source 28.In addition, on processing gas supply pipe 25, be inserted with open and close valve 26 and mass flow controller 27.Supply with the processing gas that is used for plasma treatment, for example plasma etching from handling gas supply source 28.As handling gas, can use halogen class gas, O
2Gas, Ar gas etc. is the employed gas in this field usually.
Be formed with blast pipe 29 in the bottom of treatment chamber 2, this blast pipe 29 is connected with exhaust apparatus 30.Exhaust apparatus 30 possesses turbomolecular pump equal vacuum pump, can will be evacuated to the reduced pressure atmosphere of regulation in the treatment chamber 2 thus.In addition, be provided with substrate at the sidewall of treatment chamber 2 and move into and take out of mouthfuls 31, this is moved into and takes out of mouthfuls 31 and can open and close by gate valve 32.And, under the state of opening this gate valve 32, move into and take out of glass substrate G by carrying device (not shown).
Then, mounting table 3 is elaborated.
Fig. 2 is the vertical view of expression mounting table 3.As shown in the drawing, be Splittable as the shading ring 7 of the inscape of mounting table 3, in this example, be divided into 4 cutting plate 7a that are crank shape.And, between the cutting plate 7a of adjacency, be provided with force application mechanism 50 in the mutual approaching direction cutting plate 7a application of force of cutting plate 7a.
Shown in the vertical view of Fig. 3 (a) and sectional view (b), force application mechanism 50 has spring members 51, the cutting plate 7a of the adjacency of these spring members 51 connection shading rings 7 each other, so that the cutting plate of these adjacency mutual each other approaching mode, the particularly application of force on their direction that furthers.In these cutting plates 7a, be embedded with the fixed part 52 of the end of fixing spring parts 51.In addition, the part corresponding with force application mechanism 50 of cutting plate 7a above by otch, is provided with in this notch portion and is used for the cover 53 that stops spring members 51 to fly out upward in plasma protection spring members 51.This cover 53 is made of the ceramic component identical with shading ring 7, is formed with the screwed hole 54a of slotted hole shape at four positions in bight, and 54a is fixed on the cutting plate 7a by screw 54 by this screwed hole.
Then, the processing action to the plasma-etching apparatus 1 of such formation describes.
At first, open gate valve 32, utilize carrying arm (not shown) that glass substrate G is moved into by substrate and take out of mouthfuls 31 and move in the chamber 2, and mounting is to the electrostatic chuck 6 of mounting table 3.In this case, make lifter pin 10 outstanding upward and be positioned at the Support Position, the glass substrate G on the carrying arm is transferred on the lifter pin 10.Thereafter, thus lifter pin 10 is descended glass substrate G mounting to the mounting portion 6 of the electrostatic chuck that constitutes mounting table 3.
Thereafter, closing gate valve 32 utilizes exhaust apparatus 30 to be evacuated to the specified vacuum degree in the chamber 2.Then, by applying voltage from DC power supply 34 to the electrode 42 of mounting portion 6, Electrostatic Absorption glass substrate G.Then, open valve 26, utilize mass flow controller 27 to adjust the flow of handling gas from handling gas supply source 28, and import to the inner space 21 of spray head 20 by handling gas supply pipe 25, gas introduction port 24, and 22 relative substrate G spray equably by squit hole, regulate air displacement and with chamber 2 inner control at authorized pressure.
Under this state, supply with the High frequency power that plasma generates usefulness by adaptation 13 to the base material 5 of mounting table 3 from high frequency electric source 14, between as the mounting table 3 of lower electrode and spray head 20, produce high-frequency electric field as upper electrode, thereby generate the plasma of handling gas, utilize this plasma that glass substrate G is implemented plasma treatment.
When carrying out this plasma processing, carry out adjustment to the situation of high temperature at the thermoregulation mechanism that utilizes base material 5 than room temperature, thereby or applying continuously from high frequency electric source 14 under the situation of High frequency power Continuous irradiation plasma, thus mounting table 3 is heated, make base material 5 and shading ring 7 thermal expansion together.
In this case, if it is fixing simply the cutting plate 7a of shading ring 7 to be carried out the network top as existing, then as shown in Figure 4, shading ring 7 is followed base material 5 and is carried out after the thermal expansion, in the process of cool to room temperature, because the shading ring 7 of ceramic is in the coefficient of thermal expansion differences of metal base material 5, and between base material 5 and shading ring 7 generation gap s.
But, in the present embodiment, as shown in Figure 5, utilize force application mechanism 50, each other in they approaching modes mutually, particularly provide elastic force A to the cutting plate of adjacency, therefore in case in the cooling procedure after the heating along the direction that furthers mutually, can with toward the cutting plate 7a that can't turn back to original position to original position drawing, thereby can between base material 5 and shading ring 7, not produce the gap.
Moreover force application mechanism 50 uses spring members 51 as the unit that elastic force is provided, but so long as can provide elastic force just not limit therewith in the approaching direction of cutting plate 7a that makes adjacency.
Then, other the execution mode to mounting table describes.
Fig. 6 is for representing the vertical view of the mounting table that other execution mode relates to.As shown in the drawing, in this embodiment, have be divided into 4 shading rings 7 that are the cutting plate 7b of crank shape ', be provided with the force application mechanism 60 of 1 place double as screw portion in the bight of each cutting plate 7b.In the present embodiment, as shown in Figure 6, be formed with stage portion 7c in the adjacency section of cutting plate 7b.And, force application mechanism 60 along the interior side direction (center position) shown in the arrow B of Fig. 6 to the cutting plate 7b application of force.That is, force application mechanism 60 so that cutting plate 7b towards the mutual approaching mode application of force of the protuberance 5a of base material 5 (with reference to Fig. 1).And, when stage portion 7c makes the cutting plate displacement at the elastic force owing to force application mechanism 60, thereby form to the mode of the interior side direction displacement shown in the arrow C with the cutting plate 7b that pushes adjacency.
Shown in the sectional view of Fig. 7 (a) and (b) vertical view, force application mechanism 60 has: be arranged at shading ring 7 ' cutting plate 7b on rounded recess 61 and be arranged at recess 61 under ratio recess 61 little be fusiform recess 62; Thereby be inserted into recess 61 is connected cutting plate 7b and base material 5 with 62 screw 63; Spring members 64 between the wall portion that is arranged at screw 63 and cutting plate 7b in the recess 62.In addition,, for for from plasma protection spring members 64, and stop spring members 64 to fly out, screw togather by the cover 65 that constitutes with the ceramic component of shading ring 7 ' identical on the top of recess 61.The head of screw 63 is positioned at recess 61 and makes the bottom surface of recess 61 become joint face, and this screw division connects recess 62 and screws togather with base material 5.Under this state, screw 63 is for being fixed in the state of base material 5, so spring members 64 is a benchmark to the direction of arrow B to the cutting plate 7b application of force with base material 5.That is, with the mutual mode application of force near cutting plate 7b.
Thereby, identical with former execution mode, in the cooling procedure after mounting table 3 temporarily is heated, can be with cutting plate 7b towards original position drawing, can make base material 5 and shading ring 7 ' between do not produce the gap.In this case, if the force application mechanism 60 with double as screw portion on each cutting plate 7b is provided with one in the bight, then also can utilize stage portion 7c to make the cutting plate 7b of adjacency to desirable direction pushing displacement, therefore needn't be as existing two screws of needs, the number that can subdue screw.But, the screw portion (force application mechanism) at 2 places also can same as the prior artly be set.
Moreover, even, also be not limited to spring members 64, as long as the parts of elastic force can be provided in the approaching direction of cutting plate 7b that makes adjacency in this embodiment as the unit that elastic force is provided of force application mechanism 60.
Then, another other execution mode to mounting table describes.
Fig. 8 is the vertical view of the mounting table that relates to of another other execution mode of expression.The mounting table of present embodiment has except the structure of force application mechanism and identical construction shown in Figure 6.That is, replace force application mechanism 60 and use and the different force application mechanism 70 of force application mechanism 60 structures.
Shown in the sectional view of Fig. 9, force application mechanism 70 have be arranged at shading ring 7 ' cutting plate 7b rounded recess 71 and with one heart shape be arranged at continuously recess 71 under the recess 72 of mortar shape, embedding in recess 72 has taper washer 73.Center at taper washer 73 is formed with through hole, and the collar 75 is inserted into this through hole.The collar 75 is formed centrally the hole of inserting screw component 74 therein, and screw component 74 is inserted into this hole.At this moment, this collar 75 is inserted between the lower surface and base material 5 of head of screw component 74, has the function of hold-down screw parts 74.And the screw component 74 and the collar around it 75 insert the through hole of taper washer 73, and the bottom of screw component 74 is screwed on the base material 5.The upper end of the collar 75 becomes flange part 75a, is formed with recess 76 around the through hole on the top of taper washer 73, is provided with the spring members 77 of coiled type between the bottom surface of the lower surface of flange part 75a and recess 76.Moreover, between the upper surface of the lower surface of taper washer 73 and base material 5, be formed with the gap.In addition,, for from plasma protection spring members 77 and screw component 74, and stop spring members 77 and screw component 74 to fly out, screw togather by the cover 78 that constitutes with the pottery of shading ring 7 ' identical on the top of recess 71.
At this, the power of shading ring 7 ' be fixed on base material 5 only is the bounce of spring members 77.Under this state, when making mounting table when heated condition turns back to normal temperature, because taper washer 75 has been positioned, so thereby the contraction of traction base material 5 is in the state with the 72a of the wall portion butt of the inboard of recess 72.And, 77 pairs of taper washer 73 application of forces of spring members (compression) since this elastic force and the arrow B direction vertical with the direction of principal axis of screw component 74 produce pushing shading ring 7 ' power.
Thereby, identical with former execution mode, in the cooling procedure after mounting table 3 temporarily is heated, can be with cutting plate 7b towards original position drawing, can base material 5 and shading ring 7 ' between do not produce the gap.In this case, if the force application mechanism 70 of a double as screw portion is set on each cutting plate 7b, then also can utilize the cutting plate 7b of stage portion 7c to desirable direction pushing adjacency, therefore needn't be as existing two screws of needs, the number that can subdue screw.But, the screw portion (force application mechanism) at 2 places also can same as the prior artly be set.
Moreover, even, also be not limited to spring members 77, can use other spring members in this embodiment as the unit that elastic force is provided of force application mechanism 70.And, be not limited to spring members, so long as provide the parts of elastic force to get final product in the approaching direction of cutting plate 7b that makes adjacency.
More than, embodiments of the present invention are illustrated, but the present invention is not limited to above-mentioned execution mode, can carry out various deformation.For example, as force application mechanism, so long as when the contraction after the heating, can just be not limited to above-mentioned execution mode with the cutting plate application of force of approaching mutually mode to shading ring.In addition, in the above-described embodiment, represent shading ring is divided into 4 parts, but do not limit therewith.And, in the above-described embodiment, the situation of the plasma treatment that applies the present invention to the glass substrate that FPD uses is represented, but do not limited therewith, also can be applied to other various substrates.
Claims (15)
1. mounting table, it is the mounting substrate in the treatment chamber of substrate being implemented plasma treatment, it is characterized in that, comprising:
Metal base material;
Be arranged at the mounting portion of the mounting substrate on the base material; With
The shield member that constitutes by insulating ceramics that is provided with in the mode around the top of described mounting portion and described base material,
Described shield member is divided into a plurality of cutting plates, and has so that the force application mechanism of the mutually approaching mode application of force of described cutting plate.
2. mounting table as claimed in claim 2 is characterized in that:
Described force application mechanism has the cutting plate that connects adjacency, and along furthering their force application part of the direction application of force mutually.
3. as claim 2 or 3 described mounting tables, it is characterized in that:
Described substrate is a rectangular substrate, and described shield member is frame-like, and described each cutting plate comprises that each bight forms 4 crank-like.
4. mounting table as claimed in claim 1 is characterized in that:
Described base material has the protuberance that is provided with described mounting portion, and described shading ring is provided with in the mode around described protuberance and described mounting portion.
5. as each described mounting table of claim 2～4, it is characterized in that:
Described force application mechanism has the cover that covers described force application part.
6. mounting table as claimed in claim 1 is characterized in that:
Described base material has the protuberance that is provided with described mounting portion, and described shading ring is provided with in the mode around described mounting portion and described protuberance,
Described force application mechanism has the recess that is arranged at described cutting plate; Insert described recess, connect the screw component of described cutting plate and described base material; And be arranged between the wall portion in the described recess of described screw component and described cutting plate, to the projection of described base material force application part to the described cutting plate application of force.
7. mounting table as claimed in claim 1 is characterized in that:
Described base material has the protuberance that is provided with described mounting portion, and described shading ring is provided with in the mode around described protuberance,
Described force application mechanism has the recess of the mortar shape that is arranged at described cutting plate; Insert the taper washer of described recess; The screw component that connects described cutting plate and described base material across described taper washer; And the force application part between described screw component and described taper washer, when between base material described in the cooling procedure and described cutting plate, producing thermal expansion difference, described force application part by described taper washer to the projection of described base material to the described cutting plate application of force.
8. mounting table as claimed in claim 7 is characterized in that:
Has between the head and described base material of described screw component the fixed part of fixing described screw component.
9. as each described mounting table of claim 6～8, it is characterized in that:
Described substrate is a rectangular substrate, described shield member is frame-like, described each cutting plate comprises that each bight forms 4 crank-like, described force application mechanism is arranged at the bight of each cutting plate, adjacency section at each cutting plate, be formed with when the power that applies along with described force application mechanism makes described cutting plate displacement, make the such step of cutting plate displacement to the inside of adjacency.
10. as each described mounting table of claim 6～9, it is characterized in that:
Described force application mechanism has the cover that covers described recess.
11. each the described mounting table as claim 2～10 is characterized in that:
Described force application part is a spring members.
12. each the described mounting table as claim 1～11 is characterized in that:
Described mounting portion has the electrostatic chuck of Electrostatic Absorption substrate.
13. each the described mounting table as claim 1～12 is characterized in that:
Also have to described base material and supply with the High frequency power supply power that plasma generates the High frequency power of usefulness.
14. a plasma processing apparatus is characterized in that, comprising:
Accommodate the treatment chamber of substrate;
Each the mounting table of the structure mounting substrate in described treatment chamber, that have described claim 1～13;
In described container handling, supply with the processing gas supply mechanism of handling gas;
The plasma that generates the plasma of handling gas in described treatment chamber generates mechanism; With
To carrying out the exhaust gear of exhaust in the described treatment chamber.
15. plasma processing apparatus as claimed in claim 14 is characterized in that:
Described plasma processor structure has to described base material supplies with the High frequency power supply power that plasma generates the High frequency power of usefulness.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007155444 | 2007-06-12 | ||
| JP2007155444A JP4782733B2 (en) | 2007-06-12 | 2007-06-12 | Mounting table and plasma processing apparatus using the same |
| JP2007-155444 | 2007-06-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101325169A true CN101325169A (en) | 2008-12-17 |
| CN101325169B CN101325169B (en) | 2010-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101256363A Expired - Fee Related CN101325169B (en) | 2007-06-12 | 2008-06-12 | Carrying bench and plasma treatment apparatus using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4782733B2 (en) |
| KR (1) | KR101019880B1 (en) |
| CN (1) | CN101325169B (en) |
| TW (1) | TW200919622A (en) |
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| CN102918180A (en) * | 2010-05-21 | 2013-02-06 | 应用材料公司 | Tightly fitted ceramic insulator on large area electrode |
| CN102956431A (en) * | 2011-08-26 | 2013-03-06 | 东京毅力科创株式会社 | Ring-shaped shield member, components thereof and substrate mounting table |
| CN103730317A (en) * | 2012-10-15 | 2014-04-16 | 东京毅力科创株式会社 | Gas introducing apparatus and inductively coupled plasma processing apparatus |
| CN103887136A (en) * | 2012-12-20 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | Etching cavity suitable for metal dry method etching semiconductor equipment |
| CN105789094A (en) * | 2016-03-30 | 2016-07-20 | 武汉华星光电技术有限公司 | Dry etching device and method for reducing gap between shielding ring and adsorption platform in dry etching device |
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2007
- 2007-06-12 JP JP2007155444A patent/JP4782733B2/en not_active Expired - Fee Related
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2008
- 2008-06-11 TW TW097121736A patent/TW200919622A/en unknown
- 2008-06-11 KR KR1020080054848A patent/KR101019880B1/en not_active IP Right Cessation
- 2008-06-12 CN CN2008101256363A patent/CN101325169B/en not_active Expired - Fee Related
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| CN103887136A (en) * | 2012-12-20 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | Etching cavity suitable for metal dry method etching semiconductor equipment |
| CN105789094A (en) * | 2016-03-30 | 2016-07-20 | 武汉华星光电技术有限公司 | Dry etching device and method for reducing gap between shielding ring and adsorption platform in dry etching device |
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| CN112117209A (en) * | 2019-06-21 | 2020-12-22 | 上海微电子装备（集团）股份有限公司 | Silicon wafer adsorption device and laser annealing equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101019880B1 (en) | 2011-03-04 |
| CN101325169B (en) | 2010-09-22 |
| JP4782733B2 (en) | 2011-09-28 |
| KR20080109646A (en) | 2008-12-17 |
| JP2008311298A (en) | 2008-12-25 |
| TW200919622A (en) | 2009-05-01 |
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