KR20120037907A - Light irradiation device for exposure device, exposure device, exposure method, production method for substrate, mask and exposed substrate - Google Patents

Abstract

Provided are a light irradiation apparatus for exposure apparatus, a proximity exposure apparatus, a proximity exposure method, and a method for manufacturing a substrate that can improve the resolution without using an expensive mask. Also provided are a mask, a substrate to be exposed, an exposure apparatus, and an exposure method capable of efficiently producing a color filter or a liquid crystal panel.
In the proximity exposure apparatus, the main optical axis L of the light emitted from the plurality of light source portions 73 is dispersed and incident on the peripheral portion of the integrator 74. The mask may include an exposure pattern having a pattern exposed on the substrate to be exposed, a first alignment mark formed at a position adjacent to the first side of the exposure pattern outer edge, and a second side opposite to the first side of the exposure pattern outer edge. It has a 2nd alignment mark formed in the adjacent position, and the 1st alignment mark is arrange | positioned in the position which does not overlap with the position in which the 2nd alignment mark is formed, when it sees from a step direction.

Description

LIGHT IRRADIATION DEVICE FOR EXPOSURE DEVICE, EXPOSURE DEVICE, EXPOSURE METHOD, PRODUCTION METHOD FOR SUBSTRATE, MASK AND EXPOSED SUBSTRATE}

TECHNICAL FIELD The present invention relates to a light irradiation apparatus for an exposure apparatus, an exposure apparatus, an exposure method, a method for manufacturing a substrate, a mask, and an exposed substrate, and more particularly, a substrate for a large flat panel display such as a liquid crystal display or a plasma display. The present invention relates to a light irradiation apparatus for an exposure apparatus, an exposure apparatus, an exposure method, a method for manufacturing a substrate, a mask, and an exposed substrate, which can be applied to an exposure apparatus for exposure-transferring a mask pattern of a mask onto it.

BACKGROUND ART Conventionally, as an apparatus for manufacturing a panel such as a color filter of a flat panel display device, a proximity exposure apparatus is known which irradiates light for exposure to a substrate through a mask while a predetermined gap is formed between the substrate and the mask. Among the proximity exposure apparatuses, in the split-sequential proximity exposure apparatus, a mask smaller than the substrate is held at the mask stage, the substrate is held at the work stage, and the two are closely disposed to face each other, and then the work stage is moved stepwise with respect to the mask. Each time, the pattern exposure light is irradiated to the board | substrate from the mask side, the some pattern drawn on the mask is exposed-transferred on a board | substrate, and a some panel is manufactured on one board | substrate. Moreover, in a scanning exposure apparatus, exposure light is irradiated to the board | substrate conveyed at a fixed speed | rate through the mask in the state in which the predetermined | prescribed clearance gap was formed, and the pattern of a mask is exposed and transferred on a board | substrate.

Moreover, in the projection exposure apparatus which is another exposure method, what provided the aperture to the output side of an optical integrator and determined the shape of a secondary light source (for example, a patent document) 1).

In addition, in Patent Literature 2, an exposure target substrate larger than a pattern forming mask held in a mask holder is loaded and held on an exposure chuck, and the exposure chuck is moved in a direction along a step movement axis with respect to the mask. The exposure apparatus which divides the said exposure target board | substrate with respect to the mask in multiple circuits, positions them sequentially in different exposure positions, and performs exposure processing in each of the positioned exposure positions, respectively.

In addition, Patent Document 3, as an exposure apparatus for a color filter substrate that exposes a plurality of colored patterns on a substrate using one mask, the mask and the substrate are provided with a plurality of alignment marks at different intervals for each colored pattern. And a plurality of image acquiring means for acquiring an image of alignment marks of the mask and alignment marks of the substrate, and outputting an image signal by the alignment means for aligning the mask and the substrate. Image signal processing means for processing the output image signal to detect the amount of misalignment between the position of the alignment mark of the mask and the position of the alignment mark of the substrate, and a plurality of formed on the mask based on the detection result of the image signal processing means. The alignment marks of the alignment mark and the alignment marks formed on the substrate An exposure apparatus of a color filter substrate is described, comprising control means for controlling the tooth alignment means.

Japanese Patent No. 3212197 Japanese Patent No. 3936546 Japanese Unexamined Patent Publication No. 2007-256581

By the way, in the proximity exposure apparatus, since there exists a clearance of about 100 micrometers between a mask and a board | substrate, and exposure light cannot be imaged, there exists a limit in resolution and a resolution lower than a projection optical system. That is, in the case of an incoherent optical system such as close exposure, it is impossible to form a high resolution by forming an image with a lens.

In addition, by using a so-called gray tone or halftone mask and actively studying the phase and transmittance of light, by improving the optical image on the exposure surface, a high resolution can be obtained, but there is a problem that the cost of the mask becomes high.

In the exposure apparatus described in Patent Literature 1, the aperture was changed in accordance with the mask pattern and changed to an optimal NA. However, the concept of NA does not exist in the proximity exposure apparatus.

In addition, as described in Patent Literature 2 and Patent Literature 3, the exposure apparatus shifts the position where the color filter is formed by performing exposure while aligning the substrate and the mask using an alignment mark or the like. Suppress it.

Here, in order to align a board | substrate and a mask with high precision, it is necessary to form an alignment mark in a board | substrate, The area | region in which the alignment mark was formed cannot be used as a color filter. Therefore, if an alignment mark is formed, a wasteful area is generated in the substrate.

This invention is made | formed in view of the subject mentioned above, The 1st objective is the light irradiation apparatus for exposure apparatuses, the proximity exposure apparatus, and the proximity exposure method which can improve the resolution, without using an expensive mask, And it is providing the manufacturing method of a board | substrate. Moreover, a 2nd object is to provide the mask, the to-be-exposed board | substrate, the exposure apparatus, and the exposure method which can manufacture a color filter or a liquid crystal panel efficiently.

The said objective of this invention is achieved by the following structures.

(1) a substrate holding portion for holding a substrate as an exposed material;

A mask holding part for holding a mask so as to face the substrate;

A plurality of light source portions each including a light emitting portion and a reflection optical system that emits light emitted from the light emitting portion by directivity, an integrator into which light from the plurality of light source portions is incident, and light emitted from the integrator is substantially parallel An illumination optical system having a collimation mirror for converting to light and a shutter for controlling opening and closing to transmit or block light from the light source unit,

A proximity exposure apparatus for irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask,

The light emitted from at least one of the plurality of light source units is incident on the integrator through a position where the main optical axis is shifted from the center of the integrator.

(2) The illumination optical system includes a plurality of cassettes each capable of mounting a predetermined number of the light source units, and a support on which the plurality of cassettes can be mounted.

Each said cassette is equipped with said predetermined number of light source parts so that the intersection of each main optical axis of the light radiate | emitted from the said predetermined number of light source parts may substantially correspond,

The close-up exposure apparatus according to (1), wherein the plurality of cassettes are attached to the support so that the intersections of the respective main optical axes of the light emitted from the predetermined number of light source units of the cassettes are at different positions.

(3) a substrate holding portion for holding a substrate as an exposed material;

A mask holding part for holding a mask so as to face the substrate;

A light source unit including a light emitting unit and a reflection optical system that emits light emitted from the light emitting unit by directivity, an integrator in which light from the light source unit is incident, and a collie for converting light emitted from the integrator into approximately parallel light. An illumination optical system having a simulation mirror and a shutter for controlling opening and closing to transmit or block light from the light source unit,

A proximity exposure apparatus for irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask,

And a light intensity adjusting unit for adjusting the intensity of light emitted from the emitting surface, in the vicinity of the emitting surface of the light source unit.

(4) The proximity exposure apparatus according to (3), wherein the light intensity adjusting unit is an aperture partially shielding including a central portion of the emission surface.

(5) The light source portion includes a plurality of light source portions each including the light emitting portion and the reflective optical system,

The said light intensity adjustment part is each provided in the said some light source part, The proximity exposure apparatus as described in (3) or (4) characterized by the above-mentioned.

(6) The illumination optical system includes a plurality of cassettes each capable of mounting a predetermined number of the light source units, and a support on which the plurality of cassettes can be mounted.

The close-up exposure apparatus according to (5), wherein the light intensity adjusting unit is an aperture that partially shields each exit surface, including a central portion of each exit surface of the entire predetermined number of light source units mounted in the cassette.

(7) a substrate holding portion for holding a substrate as an exposed material;

A mask holding part for holding a mask so as to face the substrate;

A light source unit including a light emitting unit and a reflection optical system that emits light emitted from the light emitting unit by directivity, an integrator in which light from the light source unit is incident, and a collie for converting light emitted from the integrator into approximately parallel light. An illumination optical system having a simulation mirror and a shutter for controlling opening and closing to transmit or block light from the light source unit,

A proximity exposure apparatus for irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask,

And a light intensity adjuster for adjusting the intensity of light incident on the incident surface of the incidence surface of the integrator.

(8) The integrator is a fly eye integrator or a rod integrator, in which a plurality of lens elements are arranged in a vertical and horizontal direction,

The close-up exposure apparatus according to (7), wherein the light intensity adjusting unit is a plurality of apertures partially shielding including a central portion of the incident surface of each lens element.

(9) The proximity exposure apparatus according to any one of (1) to (8), wherein a diffusion lens for diffusing light from the light source unit is formed between the light source unit and the integrator.

(10) a plurality of light source portions each including a light emitting portion and a reflection optical system which emits light by directing the light generated from the light emitting portion;

A plurality of cassettes each capable of mounting a predetermined number of the light source units;

A support body to which the plurality of cassettes can be mounted;

Each said cassette is equipped with said predetermined number of light source parts so that the intersection of each main optical axis of the light radiate | emitted from the said predetermined number of light source parts may substantially correspond,

And the plurality of cassettes are mounted on the support such that the intersections of the respective main optical axes of the light emitted from the predetermined number of light source units of the respective cassettes are at different positions.

(11) a plurality of light source portions each including a light emitting portion and a reflection optical system which emits light by directing the light generated from the light emitting portion;

A plurality of cassettes each capable of mounting a predetermined number of the light source units;

A support body to which the plurality of cassettes can be mounted;

And a plurality of apertures respectively formed in each of the cassettes, and including a plurality of apertures partially shielding each exit surface, including a central portion of each exit surface of the entire predetermined number of light source units mounted in the cassette. Light irradiation device.

(12) The light irradiation apparatus for exposure apparatus according to (11), wherein the aperture is attached to the cassette so as to be freely attached to and detached from the cassette.

(13) A substrate holding portion for holding a substrate as an object to be exposed, a mask holding portion for holding a mask so as to face the substrate, a light emitting portion and a reflecting optical system which emits light by directing the light generated from the light emitting portion, respectively. A plurality of light source units included, an integrator into which light from the plurality of light source units is incident, a collimation mirror for converting light emitted from the integrator into substantially parallel light, and opening / closing control so as to transmit or block light from the light source unit As a proximity exposure method using the proximity exposure apparatus provided with the illumination optical system which has a shutter to make,

Arranging the plurality of light source parts such that the light emitted from at least one of the plurality of light source parts is incident on the integrator through a position where the main optical axis is shifted from the center of the integrator;

And a step of irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask.

(14) a substrate holding portion for holding a substrate as a to-be-exposed material, a mask holding portion for holding a mask so as to face the substrate, and a light emitting portion and a reflecting optical system that emits light by directing the light generated from the light emitting portion. An illumination having a light source unit, an integrator into which light from the light source unit is incident, a collimation mirror for converting light emitted from the integrator into substantially parallel light, and a shutter for opening and closing control to transmit or block light from the light source unit As a proximity exposure method using the proximity exposure apparatus provided with an optical system,

A step of forming a light intensity adjusting unit for adjusting the intensity of light emitted from the exit surface near the exit surface of the light source unit;

And a step of irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask.

(15) The light intensity adjusting unit includes a plurality of apertures, each of which has a shielding area that partially shields, including a central portion of the emission surface, in accordance with the exposed substrate,

The desired exposure method according to (14), wherein the desired aperture is formed near the exit surface of the light source unit in accordance with the exposed substrate.

(16) a substrate holding portion for holding a substrate as an exposed material, a mask holding portion for holding a mask so as to face the substrate, a light emitting portion and a reflecting optical system that emits light by directing the light generated from the light emitting portion An illumination having a light source unit, an integrator into which light from the light source unit is incident, a collimation mirror for converting light emitted from the integrator into substantially parallel light, and a shutter for opening and closing control to transmit or block light from the light source unit As a proximity exposure method using the proximity exposure apparatus provided with an optical system,

Forming a light intensity adjusting unit for adjusting the intensity of light incident on the incident surface of the integrator;

And a step of irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask.

(17) The proximity exposure method according to any one of (13) to (16), wherein a diffusion lens is formed between the light source unit and the integrator to diffuse the light from the light source unit.

(18) It manufactures using the proximity exposure method in any one of (13)-(17), The manufacturing method of the board | substrate characterized by the above-mentioned.

(19) A mask for exposing a pattern to the exposed substrate by moving relative to the exposed substrate in the step direction,

An exposure pattern having a pattern exposed on the exposed substrate,

A first alignment mark formed at a position adjacent to a first side of the exposure pattern outer edge;

Has a second alignment mark formed at a position adjacent to a second side opposite the first side of the exposure pattern outer edge,

The said 1st alignment mark is arrange | positioned in the position which does not overlap with the position in which the said 2nd alignment mark is formed, when seen from the said step direction.

(20) a first measurement window formed at a position adjacent to the first side;

The mask according to (19), further comprising a second measurement window formed at a position adjacent to the second side.

(21) The mask according to (20), wherein the mask is formed at a position where the first measurement window and the second measurement window do not overlap with each other when viewed from the step direction.

(22) In the mask which exposes a pattern to a to-be-exposed board | substrate,

An exposure pattern having a pattern exposed on the exposed substrate,

A first alignment mark formed at a position adjacent to a first side of the exposure pattern outer edge;

And a second alignment mark formed at a position adjacent to a second side extended in a direction different from said first side of said exposure pattern outer periphery.

(23) An exposed substrate on which a pattern is formed by moving relative to a mask and a step direction,

With a transparent plate member,

A pattern portion having a pattern formed on a surface of the plate member, a first alignment mark formed at a position adjacent to a first side of the pattern portion outer circumference of the plate member surface, and the first portion of the pattern region outer circumference of the plate member surface It has a short unit comprised of the 2nd alignment mark formed in the position adjacent to the 2nd side opposite to 1 side,

The said 1st alignment mark is formed in the position which does not overlap with the position in which the said 2nd alignment mark is formed, when seen from the said step direction. The to-be-exposed board | substrate characterized by the above-mentioned.

(24) The short unit includes: a first measurement area formed at a position adjacent to the first side;

The to-be-exposed board | substrate as described in (23) characterized by further having the 2nd measurement area | region formed in the position adjacent to the said 2nd edge | side.

(25) The to-be-exposed substrate according to (24), wherein the first measurement region is formed at a position not overlapping with the position where the second measurement window is formed when viewed from the step direction. .

(26) a transparent plate-like member,

A pattern portion having a pattern formed on a surface of the plate member, a first alignment mark formed at a position adjacent to a first side of the pattern portion outer circumference of the plate member surface, and the first portion of the pattern region outer circumference of the plate member surface A to-be-exposed board | substrate which has a short unit comprised from the 2nd alignment mark formed in the position adjacent to the 2nd side extended in a direction different from a 1 side.

(27) having a plurality of the short units,

The interval between the pattern portion and the pattern portion disposed adjacent to the first side or the second side is L ₁ ,

When the distance from the end of the said pattern part to the end of the side of the said alignment mark separated from the end of the said pattern part is set to L <_2> ,

An exposed substrate as set forth in any one of _{0 <L 1 <2L 2 (} 23) , characterized in that to (26).

(28) The to-be-exposed substrate according to any one of (23) to (27), wherein the alignment mark is closer to an adjacent pattern than the corresponding pattern portion.

(29) the mask according to any one of (19) to (22),

A mask support mechanism for supporting the mask,

A substrate holding mechanism supporting the substrate to be exposed,

A moving mechanism for relatively moving said mask and said exposed substrate,

An irradiation optical system for irradiating the light passed through the mask to the exposed substrate;

It has a control apparatus which controls the movement of the said moving mechanism, and irradiation of the light by the said irradiation optical system,

The control device is adjacent to a side corresponding to the second side of the pattern portion exposed on the exposed substrate, the first side of the exposure pattern of the mask, and the exposure position of the exposure pattern and the exposed side. When the distance between the pattern portion is L ₁ and the distance from the end of the pattern portion to the end away from the end of the pattern portion of the alignment mark is L ₂ , the mask and the position are placed at a position where 0 <L ₁ <2L _2. An exposure apparatus which moves a to-be-exposed board | substrate relatively and exposes the said exposure pattern to the to-be-exposed board | substrate.

(30) further including an alignment mark formed on the exposed substrate, an alignment camera for acquiring an image of the alignment mark formed on the mask, and a camera moving mechanism for moving the alignment camera,

The said control apparatus moves the said mask and the to-be-exposed board | substrate relatively with the said moving mechanism based on the position of the alignment mark of the image acquired with the said alignment camera, The exposure apparatus of (29) characterized by the above-mentioned.

(31) The exposure apparatus according to (29) or (30), further comprising a gap sensor for measuring the distance between the mask and the substrate to be exposed.

(32) The exposure apparatus according to any one of (29) to (31), wherein the mask support mechanism holds the mask at a position proximate to the exposed substrate.

(33) An exposure method in which the mask and the to-be-exposed substrate are moved relative to the step direction to expose the exposure pattern formed on the mask to a plurality of positions of one to-be-exposed substrate,

A first alignment mark formed at a position adjacent to a first side of the exposure pattern outer edge, a second alignment mark formed at a position adjacent to a second side opposite to the first side of the exposure pattern outer periphery, and the first alignment mark In the case where the mark is viewed from the step direction, using a mask disposed at a position not overlapping with the position at which the second alignment mark is formed,

The first side of the exposure pattern of the mask is adjacent to the side corresponding to the second side of the pattern portion exposed on the exposed substrate, and the exposure position of the exposure pattern and the interval between the exposed pattern portions are L; ₁ and the distance from the end of the pattern portion to the end of the alignment mark separated from the end of the pattern portion is L ₂ , the mask and the substrate to be exposed at a position where 0 <L ₁ <2L _2. Relatively to the step direction and exposing the exposure pattern to the exposed substrate.

(34) The exposure method according to (33), wherein the exposure pattern is exposed closer to the alignment mark adjacent to the pattern portion exposed to the exposed substrate than to the alignment mark of the mask on the exposed substrate. .

According to the proximity exposure apparatus and the proximity exposure method of the present invention, the light emitted from at least one of the plurality of light source portions is caused to enter the integrator through the position where the main optical axis is shifted from the center of the integrator. When a predetermined gap is formed between the mask and the mask, when irradiating light from the illumination optical system to the substrate via a mask, the illuminance distribution within the collimation angle of the light on the exposure surface is changed, so that the width of the exposure light is changed. You can taper it. This makes it possible to improve the resolution without using an expensive mask.

Further, according to the light irradiation apparatus for the proximity exposure apparatus of the present invention, each cassette is equipped with a predetermined number of light source parts such that the intersections of the respective main optical axes of the light emitted from the predetermined number of light source parts are almost identical, and the support is provided with Since a plurality of cassettes are mounted so that the intersections of the respective main optical axes of the light emitted from the predetermined number of light sources are at different positions, the mask from the illumination optical system is applied to the substrate while the predetermined gap is formed between the substrate and the mask. When irradiating through it, the illuminance distribution in the collimation angle of the light in an exposure surface changes, and it can thin the width of exposure light. Thereby, while it is possible to improve the resolution without using an expensive mask, the said effect can be easily achieved even if the light source part is changed for every cassette.

Moreover, according to the proximity exposure apparatus and the proximity exposure method of this invention, since the light intensity adjustment part which adjusts the intensity of the light radiate | emitted from an emission surface is formed in the vicinity of the emission surface of the light source part, a predetermined clearance gap was formed between a board | substrate and a mask. In the state, when irradiating light from the illumination optical system to the substrate via a mask, the illuminance distribution within the collimation angle of the light on the exposure surface is changed to narrow the width of the exposure light. This makes it possible to improve the resolution without using an expensive mask.

In addition, according to the proximity exposure apparatus and the proximity exposure method of the present invention, since the light intensity adjusting portion for adjusting the intensity of light incident on the incident surface of the integrator lens is formed, a predetermined gap is formed between the substrate and the mask. In this formed state, when irradiating light from the illumination optical system to the substrate via a mask, the illuminance distribution within the collimation angle of the light on the exposure surface is changed to narrow the width of the exposure light. This makes it possible to improve the resolution without using an expensive mask.

Furthermore, according to the light irradiation apparatus for exposure apparatus of this invention, it is provided in each cassette and is provided with the aperture which partially shields each exit surface including the center part of each exit surface of the whole predetermined number of light source parts mounted in the cassette. Therefore, when a predetermined gap is formed between the substrate and the mask, the illuminance distribution within the collimation angle of the light on the exposure surface is changed when irradiating light from the illumination optical system to the substrate via the mask. The width of the exposure light can be made thin. As a result, the resolution can be improved without using an expensive mask, and the aperture can be easily replaced.

Moreover, according to the mask, the to-be-exposed board | substrate, the exposure apparatus, and the exposure method which concern on this invention, a color filter can be formed in a board | substrate with little useless space, and a color filter or a liquid crystal panel can be manufactured efficiently.

BRIEF DESCRIPTION OF THE DRAWINGS It is a partially exploded perspective view for demonstrating the split sequential proximity exposure apparatus which concerns on 1st Embodiment of this invention.
FIG. 2 is a front view of the divided sequential proximity exposure apparatus shown in FIG. 1. FIG.
3 is a cross-sectional view of the mask stage.
4: A is a front view which shows an illumination optical system, FIG. 4B is sectional drawing along the IV-IV line of FIG. 4A, FIG. 4C is sectional drawing along the IV'-IV 'line of FIG. 4A.
5 is a diagram illustrating a state in which each main optical axis from the plurality of light source units is incident on the integrator.
FIG. 6: is a figure which shows the light which injects into the integrator in the case of using the illumination optical system of this embodiment in diagonal lines.
7 is a graph showing illuminance in the integrator when the illumination optical system of the present embodiment is used.
FIG. 8A is a front view showing a light irradiation apparatus of an illumination optical system of a proximity exposure apparatus according to a second embodiment of the present invention, FIG. 8B is a sectional view taken along the line VIII-VIII of FIG. 8A, and FIG. 8C is a view of FIG. 8A It is sectional drawing along the VIII'-VIII 'line | wire.
Fig. 9A is a front view showing the cassette, Fig. 9B is a sectional view seen from the IX direction of Fig. 9A, and Fig. 9C is a sectional view of the cassette seen from the IX 'direction of Fig. 9A together with the integrator lens.
10 is an enlarged sectional view of the vicinity of the light source unit mounted in the cassette.
11 is a sectional view of a cassette showing a modification of the lamp pressing mechanism.
12 is an enlarged view of an essential part showing a state in which a cassette is mounted on a support;
Fig. 13 is a schematic diagram showing the main optical axis from the exit surface of each light source unit to the entrance surface of the integrator lens.
14 is a diagram for illustrating a control configuration of each light source unit.
15 is a diagram for explaining a life time detection means.
It is a figure which shows an example of the structure which cools each light source part with air.
17A to 17C are diagrams showing examples of exhaust holes formed in the cassette pressurization cover.
18A and 18B are diagrams showing design examples of cooling paths in which each light source unit is cooled by a refrigerant.
19 is a diagram illustrating an example in which a cassette and a lid member are disposed in a cassette mounting portion.
20A and 20B are diagrams showing an arrangement of a light source unit attached to a cassette.
21 is a view showing a support on which the cassette of FIG. 20A is mounted.
22A to 22D are diagrams showing the lighting control method of the light irradiation apparatus.
23A to 23C are diagrams showing the lighting patterns of the respective light source units in the cassette.
24A is a front view showing a light irradiation apparatus of the illumination optical system according to the third embodiment, FIG. 24B is a sectional view taken along the line XXIV-XXIV in FIG. 24A, and FIG. 24C is taken along the line XXIV'-XXIV 'in FIG. 24A. According to the cross-sectional view.
FIG. 25A is a front view showing a cassette, FIG. 25B is a sectional view seen from the XXV direction of FIG. 25A, and FIG. 25C is a view showing a sectional view of the cassette as seen from the XXV 'direction of FIG. 25A together with the integrator lens.
Fig. 26 is an enlarged cross sectional view of the vicinity of the light source unit attached to the cassette.
27 is an enlarged view of an essential part showing a state in which a cassette is mounted on a frame.
Fig. 28 is a schematic diagram showing the distance from the exit surface of each light source unit to the entrance surface of the integrator lens.
It is a figure which shows the modification of an aperture.
30A and 30B are diagrams showing apertures mounted in a cassette.
FIG. 31 is a diagram showing an aperture mounted to a cassette, which is constituted by a Ronky grating. FIG.
32 is a diagram for illustrating a control configuration of each light source unit.
33 is a diagram for explaining a life time detection means.
34A is a front view of the integrator for explaining the aperture according to the modification of the third embodiment, and FIG. 34B is a side view thereof.
35 is an overall perspective view of a proximity scan exposure apparatus according to a fourth embodiment of the present invention.
It is an upper side figure which shows the proximity scan exposure apparatus in the state which removed upper structures, such as an irradiation part.
It is a side view which shows the exposure state in the mask arrangement | positioning area of a proximity scan exposure apparatus.
38A is a top view of an essential part for explaining the positional relationship between the mask and the air pad, and FIG. 38B is a cross-sectional view thereof.
It is a figure for demonstrating the irradiation part of a proximity scan exposure apparatus.
FIG. 40A is a front view illustrating the light irradiation apparatus of FIG. 35, and FIG. 40B is a cross-sectional view along the XL-XL line of FIG. 40A.
FIG. 41: A is a front view which shows the light irradiation apparatus of the proximity scan exposure apparatus which concerns on 5th Embodiment, and FIG. 41B is sectional drawing along the XLI-XLI line of FIG. 41A.
FIG. 42A is a front view showing the illumination optical system to which the aperture is applied according to a modification of the present invention, FIG. 42B is a top view of FIG. 42A, and FIG. 42C is a side view of FIG. 42A.
43 is a front view of a part of the illumination optical system to which the diffusion lens is applied, according to a modification of the present invention.
FIG. 44 is a diagram illustrating light incident on an integrator when the illumination optical system of FIG. 43 is used by oblique lines.
FIG. 45 is a graph showing illuminance in the integrator when the illumination optical system of FIG. 43 is used.
It is a schematic diagram which shows the illumination optical system of a comparative example.
It is a figure which shows the light which injects into the integrator at the time of using the illumination optical system of a comparative example in diagonal lines.
It is a graph which shows the illuminance in the integrator at the time of using the illumination optical system of the comparative example.
Fig. 49 is a graph showing the difference between the relative light intensities of the illumination optical system of the present invention and the comparative example.
50A is a schematic diagram of an exposure apparatus for confirming the effect of the aperture of the present invention, and FIG. 50B is a diagram illustrating a state in which the aperture shields the light source unit.
FIG. 51 is a graph showing the difference in relative light intensity with and without aperture; FIG.
FIG. 52A shows the relationship between light passing through the opening when no light shielding plate or filter is used and light intensity distribution on the exposure surface, and FIG. 52B shows light and exposure passing through the opening when light shielding plate or filter is used. It is a figure which shows the relationship of the light intensity distribution in a plane.
53 is a perspective view partially disassembled showing an exposure apparatus according to a sixth embodiment of the present invention.
FIG. 54 is an enlarged perspective view of the mask stage shown in FIG. 53.
FIG. 55 is a cross-sectional view taken along the line LV-LV of FIG. 54.
56 is a top view illustrating the mask position adjusting means of FIG. 55.
57 is a side view illustrating a schematic configuration of a gap sensor and an alignment camera.
FIG. 58 is a front view of the exposure apparatus shown in FIG. 53.
FIG. 59 is a block diagram showing a configuration of the exposure apparatus shown in FIG. 53.
60 is a front view illustrating an example of a mask.
61 is a front view illustrating an example of a substrate.
FIG. 62 is an enlarged view of the vicinity of the alignment mark shown in FIG. 61.
63 is a front view illustrating another example of the substrate.
64 is an explanatory diagram for explaining the operation of the exposure apparatus.
It is explanatory drawing for demonstrating the operation | movement of an exposure apparatus.
66 is an explanatory diagram for explaining the operation of the exposure apparatus.
67 is an explanatory diagram for explaining an example of the relationship between the alignment mark and the pattern.
68 is an explanatory diagram for illustrating another example of the relationship between the alignment mark and the pattern.
It is explanatory drawing for demonstrating the exposure operation of the exposure apparatus.
70 is a front view illustrating another example of the mask.
71 is a front view illustrating another example of the substrate.
It is a schematic diagram which shows an example of the pattern formed in a board | substrate.
FIG. 73 is an enlarged schematic view showing a part of the pattern shown in FIG. 72 in an enlarged manner.
74 is a schematic diagram illustrating an example of an exposure pattern.
75 is a front view illustrating another example of the mask.
76 is a front view illustrating another example of the substrate.
It is an enlarged front view which expands and shows the vicinity of the alignment mark of a board | substrate.
78 is a front view illustrating another example of the mask.
79 is a front view illustrating another example of the substrate.
80 is a front view illustrating a relationship between a mask and an aperture during exposure.
81 is a front view illustrating another example of the mask.
82 is a front view illustrating another example of the substrate.
It is a top view which shows the exposure apparatus which concerns on 7th Embodiment of this invention in the state which removed the irradiation part.
84 is a front view of the exposure apparatus in FIG. 83.
85 is a plan view illustrating an example of a mask.
It is a top view which shows an example of schematic structure of a board | substrate.
87 is a flowchart illustrating the operation of the exposure apparatus shown in FIG. 83.
FIG. 88 is an explanatory diagram for explaining the operation of the exposure apparatus shown in FIG. 83.
FIG. 89 is an explanatory diagram for explaining the operation of the exposure apparatus shown in FIG. 83. FIG.
FIG. 90 is an explanatory diagram for explaining the operation of the exposure apparatus shown in FIG. 83.
FIG. 91 is an explanatory diagram for explaining the operation of the exposure apparatus shown in FIG. 83.
It is a top view which shows the other example of the arrangement position of a mask.
93 is a front view illustrating another example of the mask.
94 is a front view illustrating another example of the substrate.

EMBODIMENT OF THE INVENTION Hereinafter, each embodiment which concerns on the light irradiation apparatus, exposure apparatus, and exposure method of this invention is described in detail based on drawing.

(1st embodiment)

As shown to FIG. 1 and FIG. 2, the divided sequential proximity exposure apparatus PE of 1st Embodiment hold | maintains the mask stage 10 which hold | maintains the mask M, and the glass substrate (exposed material) W. FIG. The substrate stage 20 and the illumination optical system 70 which irradiate the pattern exposure light are provided.

Moreover, the glass substrate W (henceforth simply called "substrate W") is arrange | positioned facing the mask M, and the surface (mask M for exposing and transferring the pattern drawn on this mask M). The photosensitive agent is apply | coated to the opposing surface side) of ().

The mask stage 10 can move to the mask stage base 11 in which the rectangular opening 11a is formed in the center part, and the opening 11a of the mask stage base 11 in X, Y, and θ directions. The mask holding frame 12, which is a mask holding part which is mounted securely, and the upper surface of the mask stage base 11 are formed, and the mask holding frame 12 is moved in the X-axis, Y-axis, and θ directions so that The mask drive mechanism 16 which adjusts a position is provided.

The mask stage base 11 is supported to be movable in the Z-axis direction by a support 51 formed on the device base 50 and a Z-axis moving device 52 formed at the upper end of the support 51. 2 (see FIG. 2), and is disposed above the substrate stage 20.

As shown in FIG. 3, the planar bearing 13 is arrange | positioned in multiple places in the upper surface of the periphery of the opening 11a of the mask stage base 11, and the mask holding frame 12 is formed in the outer periphery of the upper end. The flange 12a is mounted on the planar bearing 13. As a result, the mask holding frame 12 is inserted into the opening 11a of the mask stage base 11 via a predetermined gap so that the mask holding frame 12 can move in the X-axis, Y-axis, and θ directions by the gap. do.

Moreover, the chuck | zipper part 14 which hold | maintains the mask M is fixed to the lower surface of the mask holding frame 12 via the spacer 15. As shown in FIG. In this chuck | zipper part 14, the some suction nozzle 14a for adsorb | sucking the peripheral part which the mask pattern of the mask M is not drawn is opened, and the mask M has a suction nozzle 14a. It is held so that it can be attached or detached to the chuck | zipper part 14 freely by the vacuum adsorption apparatus which is not shown through it. In addition, the chuck | zipper part 14 is movable with respect to the mask stage base 11 with the mask holding frame 12 in the X-axis, Y-axis, and (theta) direction.

The mask drive mechanism 16 includes two Y-axis drive devices 16y attached to one side along the X-axis direction of the mask holding frame 12, and one along the Y-axis direction of the mask holding frame 12. One X-axis direction drive apparatus 16x attached to the side is provided.

The Y-axis direction drive device 16y is provided on the mask stage base 11 and has a drive actuator (for example, an electric actuator, etc.) 16a having a rod 16b stretched in the Y-axis direction, It is attached to the slider 16d connected to the front-end | tip of the rod 16b via the pin support mechanism 16c, and the edge part along the X-axis direction of the mask holding frame 12, and the slider 16d is mountably movable. A guide rail 16e is provided. Moreover, the X-axis direction drive apparatus 16x also has the same structure as the Y-axis direction drive apparatus 16y.

In the mask drive mechanism 16, the mask holding frame 12 is moved in the X-axis direction by driving one X-axis direction drive device 16x, so that the two Y-axis drive devices 16y are equal. By driving, the mask holding frame 12 is moved in the Y axis direction. Moreover, the mask holding frame 12 is moved (rotation around a Z axis) in the (theta) direction by driving any one of two Y-axis direction drive devices 16y.

Moreover, on the upper surface of the mask stage base 11, as shown in FIG. 1, it hold | maintains in the gap sensor 17 and the chuck | zipper part 14 which measure the gap between the opposing surface of the mask M and the board | substrate W. As shown in FIG. An alignment camera 18 for confirming the mounting position of the mask M to be used is formed. These gap sensors 17 and the alignment camera 18 are held so as to be movable in the X-axis and Y-axis directions via the moving mechanism 19, and are arranged in the mask holding frame 12.

Moreover, on the mask holding frame 12, the aperture which shields both ends of the mask M as needed to both ends of the opening 11a of the mask stage base 11 in the X-axis direction as shown in FIG. The blade 38 is formed. The aperture blade 38 is movable in the X axis direction by an aperture blade drive mechanism 39 made of a motor, a ball screw, a linear guide, and the like, and adjusts shielding areas at both ends of the mask M. FIG. do. Moreover, the aperture blade 38 is formed not only in the both ends of the X-axis direction of the opening 11a, but is formed similarly in the both ends of the Y-axis direction of the opening 11a.

As shown in FIG. 1 and FIG. 2, the substrate stage 20 includes a substrate holding part 21 holding the substrate W and a substrate holding part 21 with respect to the apparatus base 50. The board | substrate drive mechanism 22 which moves to an axis and a Z axis direction is provided. The board | substrate holding part 21 hold | maintains so that the board | substrate W can be detachably attached by the vacuum suction mechanism not shown. The board | substrate drive mechanism 22 is the Y-axis table 23, the Y-axis feed mechanism 24, the X-axis table 25, the X-axis feed mechanism 26, and Z under the board | substrate holding part 21. -Tilt adjustment mechanism 27 is provided.

As shown in FIG. 2, the Y-axis feed mechanism 24 includes a linear guide 28 and a feed drive mechanism 29, and the slider 30 mounted on the rear surface of the Y-axis table 23 is provided. In addition, it is hypothesized by the rolling element (not shown) to the two guide rails 31 extending on the device base 50, and by the motor 32 and the ball screw device 33, the Y-axis table 23 ) Along the guide rail 31.

Moreover, the X-axis feed mechanism 26 also has the same structure as the Y-axis feed mechanism 24, and drives the X-axis table 25 with respect to the Y-axis table 23 in the X direction. In addition, the Z-tilt adjustment mechanism 27 has one movable wedge mechanism formed by combining the wedge-shaped moving bodies 34 and 35 and the feed drive mechanism 36 on one end in the X direction and two on the other end. It is comprised by arrangement. Moreover, the structure which combined the motor and the ball screw apparatus may be sufficient as the feed drive mechanisms 29 and 36, and the linear motor which has a stator and a mover may be sufficient as it. In addition, the number of installation of the Z-tilt adjustment mechanism 27 is arbitrary.

Thereby, while the board | substrate drive mechanism 22 transfer-drives the board | substrate holding part 21 to an X direction and a Y direction, so that the gap between the mask M and the opposing surface of the board | substrate W may be finely adjusted. The substrate holding part 21 is fine-tuned and tilt-adjusted in the Z axis direction.

Bar mirrors 61 and 62 are attached to the X-direction side and the Y-direction side of the substrate holding part 21, respectively, and three laser interferometers (Y) at the Y-direction end and the X-direction end of the apparatus base 50, respectively. 63, 64, 65 are formed. Thereby, the laser beam is irradiated to the bar mirrors 61 and 62 from the laser interferometers 63, 64 and 65, and the laser beam reflected by the bar mirrors 61 and 62 is received, and the laser beam and the bar mirror are received. The position of the substrate stage 20 is detected by measuring the interference of the laser light reflected by the 61 and 62.

As shown in FIG.2 and FIG.4, the illumination optical system 70 is an ultrahigh pressure mercury lamp 71 as a light emitting part, and the reflector 72 as a reflecting optical system which gives directivity to the light emitted from this lamp 71, and emits it. Switching of lighting and extinction of the plurality of light source units 73 each including the light source unit 73, the integrator lens 74 to which the light beams emitted from the plurality of light source units 73 are incident, and the lamp 71 of each light source unit 73. A voltage controllable optical control unit 76 including light control and light emitted from the exit surface of the integrator lens 74 to reflect substantially parallel light (more specifically, a light having a collimation angle which is a predetermined irradiation angle). And a collimation mirror 77 to be converted into a), and an exposure control shutter 78 arranged between the plurality of light source units 73 and the integrator lens 74 to control the opening and closing of the irradiated light. In addition, a DUV cut filter, a polarization filter, and a band pass filter may be disposed between the integrator lens 74 and the exposure surface, and the collimation mirror 77 may further include a device capable of manually or automatically changing the curvature of the mirror. Claration angle correction means may be formed. As the light emitting portion, an LED may be applied instead of the ultra-high pressure mercury lamp 71. In addition, although the integrator lens 74 may be the fly-eye integrator 74 which comprises the some optical element 74A arranged vertically and horizontally with the same optical mechanism, a load integrator may be sufficient as it.

Moreover, in the illumination optical system 70, when the 160 W ultra-high pressure mercury lamp 71 is used, in the exposure apparatus which manufactures the 6th generation flat panel, the exposure apparatus which manufactures 374 light source parts and the 7th generation flat panel In the exposure apparatus for manufacturing 572 light source parts and the eighth generation flat panel, 774 light source parts are required. However, in this embodiment, in order to simplify description, as shown in FIG. 4, it demonstrates as the support body 82 equipped with 24 light source parts 73 of four columns in the (alpha) direction and 6 rows in the (beta) direction. Moreover, although the square shape which made the arrangement | positioning of the light source part 73 the same number in the (alpha), (beta) direction can also be considered, the support body 82 has the rectangular shape which made the number different in the (alpha), (beta) direction. In addition, in the light source part 73 of this embodiment, the opening part 72b of the reflecting mirror 72 is formed in substantially square shape, and it arrange | positions so that four sides may follow alpha and beta directions.

In addition, each light source unit 73 is individually connected to a lighting power supply and a control circuit for supplying electric power to the lamp 71 in the same manner as in the embodiment described later, and the optical control unit 76 includes each lamp 71. The control signal is transmitted to the control circuit of the control unit, and voltage control is performed to control the voltage or power supplied to the lamp 71 at the time of turning on or off the respective lamps 71.

In the exposure apparatus PE comprised in this way, when the exposure control shutter 78 is opened-controlled at the time of exposure by the illumination optical system 70, the light irradiated from the ultra-high pressure mercury lamp 71 will of the integrator lens 74. Incident on the incident surface. And the light generated from the exit surface of the integrator lens 74 is converted into parallel light with the advancing direction being changed by the collimation mirror 77. This parallel light is irradiated as light for pattern exposure substantially perpendicular to the surface of the mask M held by the mask stage 10 and further, the substrate W held by the substrate stage 20. The pattern P of M) is exposed-transferred on the board | substrate W. FIG.

Here, the surface on which the light source part 73 of the support body 82 is mounted is inclined, respectively, and as shown to FIG. 5 and FIG. 6, the main optical axis L of the light radiate | emitted from the some light source part 73 is interlaced. It is attached to the support body 82 so as to disperse | distribute to the position which shifted from the center of the greater 74, ie, the periphery of the integrator 74, about equally.

In this way, the light incident on the integrator 74 passes through the integrator 74 and becomes uniform, and the illuminance distribution in the collimation angle of the light on the exposure surface is as shown in FIG. 7. By setting it as such illuminance distribution, since the width | variety of exposure light becomes thin as described in the Example mentioned later, high resolution can be achieved.

As explained above, according to the proximity exposure apparatus of this embodiment, since the main optical axis L of the light radiate | emitted from the some light source part 73 was made to enter in the position shifted from the center of the integrator 74, the board | substrate W ) And the illuminance distribution within the collimation angle of the light on the exposure surface when irradiating light from the illumination optical system through the mask M to the substrate with a predetermined gap formed between the mask and the mask M It can change and narrow the width of exposure light. This makes it possible to improve the resolution without using an expensive mask.

(2nd embodiment)

Next, with reference to FIG. 8-FIG. 23, the division sequential proximity exposure apparatus PE which concerns on 2nd Embodiment of this invention is demonstrated. In addition, since this embodiment differs only from the thing of 1st Embodiment by the point in which the several light source part 73 of the illumination optical system 70 was unitized by the cassette 81, it is the same code | symbol about other structure. To omit or simplify the description.

As shown in FIG. 8, the illumination optical system 70 includes the light irradiation apparatus 80 provided with the some light source part 73, and the integrator lens 74 which the light beam radiate | emitted from the some light source part 73 injects. And an optical control unit 76 capable of voltage control including switching on and off of the lamp 71 of each light source unit 73, and light emitted from the exit surface of the integrator lens 74 to reflect the light. The collimation mirror 77 which converts into light (more specifically, the light which has a collimation angle which is a predetermined irradiation angle), and the light irradiated arrange | positioned between the some light source part 73 and the integrator lens 74, and irradiated. An exposure control shutter 78 for controlling the opening and closing so as to transmit and block the light is provided. In addition, as in the first embodiment, a DUV cut filter, a polarization filter, and a band pass filter may be disposed between the integrator lens 74 and the exposure surface, and the curvature of the mirror is arranged on the collimation mirror 77. May be provided with a declination angle correction means which can be changed manually or automatically.

8 to 10, the light irradiation apparatus 80 includes an ultra-high pressure mercury lamp 71 serving as a light emitting portion and a reflecting mirror serving as a reflecting optical system which emits light by directing the light generated from the lamp 71. A plurality of light source portions 73 each including 72, a plurality of cassettes 81 each capable of mounting a predetermined number of light source portions 73, and a plurality of cassettes 81 can be mounted among the plurality of light source portions 73. A support 82 is provided. As the light emitting portion, an LED may be applied instead of the ultra-high pressure mercury lamp 71.

In addition, in the illumination optical system 70, also in this embodiment, in order to simplify description, as shown in FIG. 8, three light source parts 73 of three columns in the α direction and two rows of the system in the β direction are provided. It demonstrates as having 72 light source parts 73 which arrange | positioned 12 cassettes of 4 steps x 3 rows. Moreover, although the square shape which made the arrangement | positioning of the light source part 73 the same number in the (alpha), (beta) direction can also be considered for the cassette 81 and the support body 82, the rectangular shape which made different numbers in the (alpha), (beta) direction is applied. In addition, in the light source part 73 of this embodiment, the opening part 72b of the reflecting mirror 72 is formed in substantially square shape, and it arrange | positions so that four sides may follow alpha and beta directions.

Each cassette 81 presses the light source support part 83 which supports the predetermined number of light source parts 73, and the light source part 73 supported by the light source support part 83, and is concave attached to the light source support part 83. It is formed in the substantially rectangular parallelepiped shape provided with the upper lamp pressing cover (cover member) 84, and each has the same structure.

The light source support part 83 is formed corresponding to the number of light source parts 73, is formed in the cover part of the window part 83a which emits the light from the light source part 73, and the window part 83a, and the reflecting mirror A lamp recess 83b is formed that surrounds the opening 72a of the 72 (or the opening of the reflector mounting portion on which the reflector 72 is mounted). Moreover, the some cover glass 85 is each attached to the half cover side of the window part 83a. Moreover, attachment of the cover glass 85 is arbitrary and does not need to be formed.

As shown in FIG. 9, the bottom face of each recessed part 83b for lamps has the intersection point p of each main optical axis L of the light radiate | emitted from the predetermined number of light source parts 73, and is single in each (alpha), (beta) direction. It is formed in a flat surface or curved surface (plane in this embodiment) so that it may be located on the curved surface, for example, spherical surface r.

The bottom face of the lamp press cover 84 is provided with the contact part 86 which abuts on the rear part of the light source part 73, and each contact part 86 has an actuator like a motor and a cylinder, a spring press part, a screw The lamp pressing mechanism 87 formed by the fixing or the like is formed. Thereby, each light source part 73 fits the opening part 72a of the reflecting mirror 72 to the recessed part 83b for lamps of the light source support part 83, and attaches the lamp press cover 84 to the light source support part 83. Is mounted to the cassette 81 by pressing the rear portion of the light source portion 73 by the lamp pressing mechanism 87. Therefore, as shown in FIG. 9C, approximately 80% to 100% of each irradiation surface irradiated by the light of the predetermined number of light source portions 73 positioned on the cassette 81 and the light irradiated from all the light source portions 73. The distance of each main optical axis L to the incidence surface of the integrator lens 74 to which light is incident becomes substantially constant. Moreover, in the storage space between the light source support part 83 and the lamp press cover 84, the back surface 72c of the reflecting mirror 72 of the adjacent light source part 73 opposes directly, and the light source part 73 and the lamp pressurization Except for the mechanism 87 and the like, there is no blocking of the flow of air in the storage space, so that good air flowability is provided.

Moreover, although the lamp press mechanism 87 may be formed for every contact part 86, as shown in FIG. 11, it may be formed in the side wall of the lamp press cover 84. As shown in FIG. Also in this case, although the contact part 86 may be individually formed in each light source part 73, you may make it contact a back part of two or more light source parts 73. As shown in FIG.

In addition, the support body 82 is attached to the support body 91 which has the some cassette mounting part 90 which mounts the some cassette 81, and the support body 91, The rear part of each cassette 81 is provided. It has a support cover 92 covering the.

As shown in FIG. 12, each cassette mounting portion 90 is provided with an opening 90a facing the light source supporting portion 83, and a rectangular plane around the light source supporting portion 83 is formed around the opening 90a. The cassette recessed part 90c which made the opposing plane 90b the bottom face is formed. Moreover, the cassette fixing means 93 for fixing the cassette 81 is formed in the circumference | surroundings of the cassette recessed part 90c of the support body 91, and in this embodiment, the recess formed in the cassette 81 is formed. The cassette 81 is fixed by engaging with the portion 81a.

As shown in FIG. 13, each plane 90b of the cassette recessed part 90c aligned in the (alpha) direction or the (beta) direction is the main optical axis of the light radiate | emitted from the predetermined number of light source parts 73 of each cassette 81 ( The intersection point p of L) is formed so that it may differ, ie, the periphery of the integrator 74. As shown in FIG.

Therefore, each cassette 81 has the cassette fixing means 93 of the cassette 81 in a state in which these light source support portions 83 are fitted in the cassette recessed portions 90c of the cassette mounting portions 90 and positioned. By engaging with the recessed part 81a, it is fixed to the support body 82, respectively. And in the state in which each of these cassettes 81 is attached to the support body 91, the support cover 92 is attached to the support body 91. As shown in FIG.

By arranging each light source unit 73 in the support body in this manner, the main optical axis L of the light emitted from the plurality of light source units 73 is shifted from the center of the integrator 74 as in the first embodiment. In other words, the light is incident evenly distributed around the integrator 74. The light incident on the integrator 74 passes through the integrator 74 and is uniformized to have the same illuminance distribution as shown in FIG. 7 of the first embodiment. Can be mad.

In addition, as shown in FIG. 14, the lighting source 95 and the control circuit 96 for supplying electric power to the lamp 71 are individually connected to the light source units 73 of the cassettes 81. Each wiring 97 extending rearward from the 73 is connected to at least one connector 98 formed in each cassette 81 and arranged. And the connector 98 of each cassette 81 and the optical control part 76 formed in the outer side of the support body 82 are connected by the other wiring 99, respectively. Thereby, the optical control part 76 transmits a control signal to the control circuit 96 of each lamp 71, and supplies it to the lamp 71 at the time of turning on or off of each lamp 71, and the lighting. Voltage control is performed to control the voltage.

In addition, the lighting power supply 95 and the control circuit 96 of each light source part 73 may be formed in the cassette 81, and may be formed in the exterior of a cassette. Moreover, the contact part 86 of the lamp press cover 84 is formed so that it may not interfere with each wiring 97 from each light source part 73.

As shown in FIG. 15, a life time detection means 94 including a fuse 94a is formed for each lamp 71, the lighting time is counted by the timer 96a, and the rated life time is turned on. A current flows through the fuse 94a to cut the fuse 94a. Therefore, by confirming the disconnection of the fuse 94a, it is possible to detect whether the lamp 71 is being used for its rated life time. Moreover, the life time detection means 94 is not limited to including the fuse 94a, What is necessary is just to know the rated life time of the lamp 71 at the time of maintenance of lamp replacement. For example, an IC tag may be provided for each lamp 71 so that the IC tag can confirm whether the lamp 71 has been used for its rated life time, or can confirm the usage time of the lamp 71.

Moreover, in each light source part 73, each cassette 81, and the support body 82 of the light irradiation apparatus 80, the cooling structure for cooling each lamp 71 is formed. Specifically, as shown in FIG. 10, a cooling path 75a is formed in the base portion 75 on which the lamp 71 and the reflecting mirror 72 of each light source portion 73 are mounted. Each cover glass 85 is provided with one or several through holes 85a. In addition, a plurality of exhaust holes (communication holes) 84a are formed in the bottom surface of the lamp pressing cover 84 of the cassette 81 (see FIG. 9C), and the plurality of the support covers 92 of the support 82 are also provided. An exhaust hole 92a is formed (see FIG. 8C). Moreover, the blower unit (forced exhaust means) 79 formed in the exterior of the support body 82 is connected to each exhaust hole 92a via the exhaust pipe 79a. Therefore, by squeezing and evacuating the air in the support body 82 by the blower unit 79, the outside air sucked from the through-hole 85a of the cover glass 85, the lamp 71 and the reflecting mirror in the direction shown by the arrow. It passes through the clearance gap s between 72, is guided to the cooling path 75a formed in the base part 75 of the light source part 73, and each light source part 73 is cooled by air.

In addition, the forced exhaust means is not limited to the blower unit 79, and may be any air that is drawn out of the support 82 such as a fan, an inverter, a vacuum pump, and the like. In addition, the exhaust of air by the blower unit 79 is not limited to the rear, but may be from any side of an upper side, a lower side, a left side, and a right side. For example, as shown in FIG. 16, you may make it connect the some exhaust pipe 79a connected to the side of a support body to the blower unit 79 via the damper 79b, respectively.

In addition, the exhaust hole 84a formed in the lamp press cover 84 may be formed in multiple numbers at the bottom face as shown in FIG. 9C, may be formed in the center of a bottom face, as shown in FIG. 17A, and FIG. 17B, FIG. 17C As shown to, it may be formed in the side surface of a longitudinal direction and the width direction. In addition to the exhaust hole 84a, by forming a communication groove notched from the opening edge of the lamp pressurizing cover 84, the storage space between the light source support portion 83 and the lamp presser cover 84 and the outside are formed. You may communicate. In addition, the lamp press cover 84 may have a frame structure composed of a plurality of supports, and may be configured to form a communication hole or a communication groove by separately attaching a cover plate on which a communication hole or a communication groove is formed.

In addition, a water cooling tube (cooling pipe) 91a is formed at the periphery of the support body 91, and each light source unit 73 is also circulated by circulating the cooling water in the water cooling tube 91a by the water pump 69. ) Is cooling. Moreover, as shown in FIG. 8, the water cooling tube 91a may be formed in the support body 91, and may be attached to the surface of the support body 91. As shown in FIG. In addition, only one of the exhaust type cooling structure and the water type cooling structure may be formed. In addition, the water cooling tube 91a is not limited to the arrangement | positioning shown in FIG. 4, As shown to FIG. 18A and FIG. 18B, arrangement | positioning so that the water cooling tube 91a may pass around all the cassettes 81, or all the cassettes ( 81) The cooling water may be circulated in a zigzag manner so as to pass a part of the surroundings.

In the exposure apparatus PE comprised in this way, in the illumination optical system 70, when the exposure control shutter 78 is opened-controlled at the time of exposure, the light irradiated from the ultra-high pressure mercury lamp 71 will be the integrator lens 74. Is incident on the incident surface of. And the light generated from the exit surface of the integrator lens 74 is converted into parallel light with the advancing direction being changed by the collimation mirror 77. This parallel light is irradiated as light for pattern exposure substantially perpendicular to the surface of the mask M held by the mask stage 10 and further, the substrate W held by the substrate stage 20. The pattern P of M) is exposed-transferred on the board | substrate W. FIG.

Here, when the light source unit 73 is replaced, it is exchanged for each cassette 81. In each cassette 81, a predetermined number of light source portions 73 are positioned in advance, and a wiring 97 from each light source portion 73 is connected to the connector 98. For this reason, the cassette 81 which needs to be replaced is separated from the opposite direction to the direction in which the light of the support 82 is emitted, and the new cassette 81 is fitted to the cassette recess 90c of the support 82 to fit the support. By attaching to 82, the alignment of the light source part 73 in the cassette 81 is completed. In addition, since the wiring work is completed by connecting the other wiring 99 to the connector 98, the replacement work of the light source unit 73 can be easily performed. In addition, it is necessary to stop the apparatus at the time of cassette replacement. This is because a plurality of lamps (9 or more) are disposed in the cassette 81, and each cassette contributes greatly to the illuminance distribution on the exposure surface. However, even when the plurality of cassettes 81 are replaced as described above, the operation is easy and the replacement time itself can be shortened, which is a useful method.

Moreover, the cassette mounting part 90 of the support body 82 is formed in the recessed part 90c which made the plane 90b the bottom face, and the cassette 81 is fitted in the recessed part 90c of the cassette mounting part 90. Since it is fitted, the cassette 81 can be fixed to the support 82 without rattling.

Moreover, the cassette 81 has the lamp press cover 84 attached to the light source support part 83 in the state surrounding the predetermined number of light source parts 73 supported by the light source support part 83, and the light source support part 83 In the storage space between the lamp press cover 84 and the back surface 72c of the reflecting mirror 72 of the adjacent light source unit 73 directly facing each other, good fluidity of air is provided in the storage space. When cooling the light source unit 73, the air in the storage space can be exhausted efficiently.

Moreover, since the communication hole 84a which communicates the storage space and the exterior of the lamp pressurization cover 84 is formed in the lamp pressurization cover 84, air can be exhausted to the exterior of the cassette 81 with a simple structure. have.

Moreover, since the water cooling tube 91a through which cooling water circulates is formed in the support body 82 to cool each light source part 73, each light source part 73 can be efficiently cooled by cooling water.

Moreover, since it has the blower unit 79 which forcibly evacuates the air in the support body 82 from at least one of the rear side and the side surface with respect to each irradiation surface which the light of each light source part 73 irradiates, It can circulate, and each light source part 73 can be cooled efficiently.

In addition, since the required exposure amount varies depending on the kind of exposure (coloring layer, BM, photospacer, photo-alignment film, TFT layer, etc.) or the type of resist in the same variety, as shown in FIG. There is a case where it is not necessary to mount all of the cassettes 81 in the plurality of cassette mounting portions 90 of the plurality of cassettes. In this case, the lid member 89 is attached to the cassette mounting portion 90 on which the cassette 81 is not arranged, and the lid member 89 has the same diameter as the through hole 85a of the cover glass 85. The same number of through holes 89a are formed. As a result, external air is also sucked from the through hole 89a of the lid member 89 in addition to the through hole 85a of the cover glass 85. Therefore, even when the cassette 81 is not attached to all the cassette mounting portions 90, by arranging the lid member 89, the fluidity of the same air as in the case where the cassette 81 is disposed on all the cassette mounting portions 90 is imparted. Thus, the light source unit 73 is cooled.

Moreover, in order to reliably cool each light source part 73, even if the cassette 81 or the cover member 89 is not attached to all the cassette mounting parts 90, even if it locks so that the light irradiation apparatus 80 cannot be operated. do.

Therefore, in the present embodiment, the main portion of the light emitted from the light source portion 73 of each cassette 81 disposed in the remaining cassette mounting portion 90 is studied by studying not to arrange the cassette 81 in some cassette mounting portions 90. The optical axis L may be incident at a position shifted from the center of the integrator 74.

In addition, in the said embodiment, in order to simplify description, the cassette 81 equipped with the light source part 73 of three columns of three steps in the (alpha) direction, and two rows in the (beta) direction was taken as an example, and it actually arrange | positions to the cassette 81 There are eight or more light source parts 73 to be used, and they are attached to the cassette 81 by point symmetry or line symmetry in the arrangement shown in Figs. 20A and 20B. That is, the light source portions 73 are arranged in different numbers in the α direction and the β direction, and the centers of the light source portions 73 located at the outermost circumferences mounted on the light source support portions 83 of the cassette 81 are connected by four sides. Lines form a rectangular shape. Moreover, as shown in FIG. 21, the cassette mounting part 90 of the support body 82 to which each cassette 81 is mounted is each number n (n: 2 or more positive) arrange | positioned in the (alpha), (beta) direction orthogonal to each other. Are formed in a rectangular shape. Here, the rectangular shape corresponds to the incident aperture angle ratio of each lens element of the integrator element, which will be described later, in the vertical and horizontal directions, and the case where the number of rows and columns of cassettes is the same is the most efficient, but may be different.

Here, the aspect ratio (aspect ratio) of each lens element of the integrator lens 74 is determined corresponding to the aspect ratio of the area of an exposure area. In addition, each lens element of the integrator lens has a structure in which light incident from an angle greater than the incident aperture angle cannot be introduced. In short, the lens element has a small incident aperture angle on the short side with respect to the long side. For this reason, the use efficiency of light is made by making the aspect ratio (aspect ratio / aspect ratio) of the whole light source part 73 arrange | positioned at the support body 82 into a rectangular shape corresponding to the aspect ratio of the incident surface of the integrator lens 74. This becomes good.

In the divided sequential proximity exposure apparatus PE configured as described above, the illuminance is controlled by turning on, off, or voltage-controlling the lamp 71 of each light source unit 73 for each cassette 81 by the optical control unit 76 according to the required illuminance. To change. That is, the optical control part 76 controls so that the lamp 71 of the predetermined number of light source parts 73 in each cassette 81 may light on point symmetry, and the predetermined number of light source parts of the some cassette 81 may be controlled. By controlling the lamps 71 of 73 to be point-symmetrically lit in the same lighting pattern, all the light source parts 73 in the support body 82 light up in point-symmetry. For example, FIG. 22A shows the case where 100% of lamps 71 (24 in this embodiment) of each cassette 81 are turned on, and FIG. 22B shows all the lamps of each cassette 81 ( FIG. 22C shows the case where 75% (71 in the present embodiment) is turned on, and FIG. 22C lights up 50% (12 in the present embodiment) of all the lamps 71 of each cassette 81. 22D shows the case where 25% (6 in this embodiment) of all the lamps 71 of each cassette 81 are turned on. Thereby, the illuminance can be changed without changing the illuminance distribution of the exposure surface, and for simultaneous control for each cassette, regardless of the change of the substrate size (generation) or the number of lamps, Lighting can be controlled easily.

In addition, "illuminance" means the energy [mW / cm <2>] which the area of 1 cm <2> receives for 1 second.

In addition, in the case of total lighting, the optical control part 76 turns on the lighting of the lamp 71 of each light source part 73 in the cassette 81 in which the number of the lamp 71 to light up according to desired illuminance differs, respectively. There are a plurality of lighting pattern groups (three in this embodiment) each having a plurality of lighting patterns (four in this embodiment) that control off the light by point symmetry. Specifically, as shown in FIG. 23A, the first pattern group that turns on the lamp 71 of 75% in the cassette 81 has four patterns A1 to D1. In addition, as shown in FIG. 23B, the second pattern group for lighting the 50% lamp 71 in the cassette 81 has four patterns A2 to D2. In addition, as shown in FIG. 23C, the third pattern group for lighting the 25% lamp 71 in the cassette 81 has four lighting patterns A3 to D3. Each of these lighting patterns A1 to D1, A2 to D2, and A3 to D3 is set so that the lamp 71 in the cassette 81 lights up in point symmetry. In addition, in FIG. 22 and FIG. 23, the diagonal line in the light source part 73 has shown the lamp 71 which turned off.

And the optical control part 76 selects which lighting pattern group of a 1st-3rd lighting pattern group according to desired illuminance, and selects any lighting pattern of the selected lighting pattern group. The selection of the lighting pattern may be such that the plurality of lighting patterns of the selected lighting pattern group are simultaneously switched in plural cassettes 81 at a predetermined timing. Alternatively, the selection may be based on the lighting time of the lamp 71 of each light source unit 73, specifically, the lighting pattern having the smallest lighting time may be selected. By switching or selecting such a lighting pattern, the lighting time of a lamp can be made uniform.

Moreover, the lighting pattern with the smallest lighting time may be a lighting pattern including the lamp 71 of the light source unit 73 having the smallest lighting time, and the lighting time of the lamp 71 of the light source unit 73 to be turned on. The lighting pattern with the smallest sum may be sufficient. In addition, the optical control part 76 calculates the remaining life of the lamp 71 of each light source part 73 based on the lighting time of the lamp 71 of each light source part 73, and the voltage supplied at the time of lighting, The lighting pattern may be selected based on the remaining life. The lighting pattern may be switched so as to avoid the lighting pattern including the lamp 71 having a short remaining life.

Moreover, when desired illuminance differs from the illuminance obtained by the 1st-3rd lighting pattern group, the lamp 71 of the light source part 73 to light also selects the lighting pattern group from which illuminance close to a desired illuminance is obtained. Adjust the voltage to be supplied above or below the rating. For example, when the desired illuminance is 60% illuminance at the time of 100% lighting, any lighting pattern is selected from the lighting pattern group of 50% lighting, and the voltage of the lamp 71 of the light source unit 73 to be lit is selected. Is given by raising.

Further, if the voltages of the lamps 71 to be lit of all the cassettes 81 are adjusted equally, if the deviation from the desired illuminance is obtained, the voltages of the lamps 71 of the cassettes 81 at the positions arranged in point symmetry become equal. While adjusting, you may apply different voltage according to the position of the cassette 81. FIG. Specifically, in Fig. 22, the voltages of the lamps 71 of the cassettes 81 located at the center are adjusted while the voltages of the lamps 71 of the cassettes 81 located at the periphery are equally adjusted. The adjustment is made so that it is different from the voltage of the lamp 71 of the cassette 81. Thereby, it is possible to make fine adjustment to desired illuminance, without changing the illuminance distribution of an exposure surface.

In addition, when only a part of the cassettes 81 is replaced with the cassette 81 provided with the new lamp 71, the lamp of the cassette 81 which is replaced by the lighting of the lamp 71 of the remaining cassette 81 is replaced. Light up (71) in point symmetry. At that time, the illuminance emitted from the lamp 71 of the new cassette 81 tends to be stronger than the illuminance emitted from the lamp 71 of the remaining cassette 81. For this reason, it adjusts so that the voltage of each lamp 71 of the new cassette 81 may be lowered so that the illumination intensity radiated | emitted from the lamp 71 of each cassette 81 of the position arrange | positioned by point symmetry may become uniform.

In addition, as a control for turning on or off the lamp 71, by comparing the illuminance measured with an illuminometer (not shown) and the appropriate appropriate illuminance in advance, it is possible to determine the excess or insufficient of the illuminance and to eliminate the excessive or insufficient illuminance. You may control the control circuit 96 or the optical control part 76 so that the voltage of 71 may be raised.

In addition, in this embodiment, although the optical control part 76 made it control the voltage supplied to the lamp 71, you may control electric power.

As explained above, according to the light exposure apparatus 80 for the proximity exposure apparatus and the proximity exposure apparatus of this embodiment, each main optical axis L of the light radiate | emitted from the predetermined number of light source parts 73 to each cassette 81 is made. A predetermined number of light source portions 73 are mounted so that the intersection points p of the plurality substantially coincide, and the support 82 is provided with each of the main light axes L of the light emitted from the predetermined number of light source portions 73 of each cassette 81. Since a plurality of cassettes 81 are mounted so that the intersection points p are different positions, the illumination optical system 70 with respect to the substrate W in a state where a predetermined gap is formed between the substrate W and the mask M. FIG. When irradiating light from the light source through the mask M, the illuminance distribution within the collimation angle of the light on the exposure surface is changed to narrow the width of the exposure light. Thereby, while it is possible to improve the resolution without using an expensive mask, even if the light source part 73 is replaced for every cassette 81, the said effect can be easily achieved.

(Third embodiment)

Next, the division sequential proximity exposure apparatus PE which concerns on 3rd Embodiment of this invention is demonstrated. In addition, since this embodiment differs only from the thing of 1st Embodiment in the structure of the light irradiation apparatus of the illumination optical system 70, the other code | symbol is attached | subjected about other structure, and description is abbreviate | omitted or simplified.

As shown in FIGS. 24 to 26, the light irradiation apparatus 80 includes an ultra-high pressure mercury lamp 71 as a light emitting portion and a reflecting mirror as a reflecting optical system that emits light by directing the light generated from the lamp 71 ( A plurality of light source portions 73 each including 72, a plurality of cassettes 81 each capable of mounting a predetermined number of light source portions 73, and a plurality of cassettes 81 can be mounted among the plurality of light source portions 73. A support 82 is provided. As the light emitting portion, an LED may be applied instead of the ultra-high pressure mercury lamp 71.

Moreover, also in this embodiment, the illumination optical system 70 is a cassette | seat provided with the six light source part 73 of three rows | stage in the (alpha) direction, and two columns of the system of two rows in the (beta) direction, as shown in FIG. It demonstrates as having 54 light source parts 73 which arrange | positioned 81 of three steps of 3 columns of 3 columns. Moreover, although the square shape which made the arrangement | positioning of the light source part 73 the same number in the (alpha), (beta) direction can also be considered for the cassette 81 and the support body 82, the rectangular shape which made the number different in the (alpha), (beta) direction is applied. In addition, in the light source part 73 of this embodiment, the opening part 72b of the reflecting mirror 72 is formed in substantially square shape, and it arrange | positions so that four sides may follow alpha and beta directions.

Each cassette 81 presses the light source support part 83 which supports the predetermined number of light source parts 73, and the light source part 73 supported by the light source support part 83, and is concave attached to the light source support part 83. It is formed in the substantially rectangular parallelepiped shape provided with the upper lamp pressing cover (cover member) 84, and each has the same structure.

The light source support part 83 is formed corresponding to the number of light source parts 73, is formed in the cover part of the window part 83a which emits the light from the light source part 73, and the window part 83a, and the reflecting mirror A lamp recess 83b is formed that surrounds the opening 72a of the 72 (or the opening of the reflector mounting portion on which the reflector 72 is mounted). Moreover, the some cover glass 85 is each attached to the half cover side of the window part 83a. Moreover, attachment of the cover glass 85 is arbitrary and does not need to be formed.

The bottom of each lamp recess 83b is an intersection of the irradiation surface (here, the opening 72b of the reflecting mirror 72) to irradiate the light from the light source unit 73 and the optical axis L of the light source unit 73 ( p) is formed in a plane or curved surface (in this embodiment, a plane) so that it may be located on a single curved surface, for example, spherical surface r, in each of the alpha and beta directions.

The bottom face of the lamp press cover 84 is provided with the contact part 86 which abuts on the rear part of the light source part 73, and each contact part 86 has an actuator like a motor and a cylinder, a spring press part, a screw The lamp pressing mechanism 87 formed by the fixing or the like is formed. Thereby, each light source part 73 fits the opening part 72a of the reflecting mirror 72 to the recessed part 83b for lamps of the light source support part 83, and attaches the lamp press cover 84 to the light source support part 83. Is mounted to the cassette 81 by pressing the rear portion of the light source portion 73 by the lamp pressing mechanism 87. Therefore, as shown in FIG. 25C, approximately 80% to 100% of each irradiation surface irradiated by the light of the predetermined number of light source units 73 positioned on the cassette 81 and the light irradiated from all the light source units 73. The distance of each optical axis L to the incidence surface of the integrator lens 74 to which light is incident becomes substantially constant. Moreover, in the storage space between the light source support part 83 and the lamp press cover 84, the back surface 72c of the reflecting mirror 72 of the adjacent light source part 73 opposes directly, and the light source part 73 and the lamp pressurization Except for the mechanism 87 and the like, there is no blocking of the flow of air in the storage space, so that good air flowability is provided.

In addition, the support body 82 is attached to the support body 91 which has the some cassette mounting part 90 which mounts the some cassette 81, and the support body 91, The rear part of each cassette 81 is provided. It has a support cover 92 covering the.

As shown in FIG. 27, each cassette mounting portion 90 is provided with an opening 90a facing the light source supporting portion 83, and a rectangular plane around the light source supporting portion 83 is formed around the opening 90a. The cassette recessed part 90c which made the opposing plane 90b the bottom face is formed. Moreover, the cassette fixing means 93 for fixing the cassette 81 is formed in the circumference | surroundings of the cassette recessed part 90c of the support body 91, and in this embodiment, the recess formed in the cassette 81 is formed. The cassette 81 is fixed in accordance with the portion 81a.

Each plane 90b of the cassette recessed portion 90c aligned in the α direction or the β direction has an irradiation surface for irradiating light from all the light source portions 73 of each cassette 81 and an optical axis of the light source portion 73. The intersection point p of L) is formed to intersect at a predetermined angle γ so as to be located on a single curved surface, for example, spherical surface r in each of the α and β directions (see FIG. 28).

Therefore, each cassette 81 has the cassette fixing means 93 of the cassette 81 in a state in which these light source support portions 83 are fitted in the cassette recessed portions 90c of the cassette mounting portions 90 and positioned. By engaging with the recessed part 81a, it is fixed to the support body 82, respectively. And in the state in which each of these cassettes 81 is attached to the support body 91, the support cover 92 is attached to the support body 91. As shown in FIG. Therefore, as shown in FIG. 28, about 80%-100% of each irradiation surface irradiated by the light of all the light source parts 73 positioned in each cassette 81, and the light irradiated from all the light source parts 73 is irradiated. The distance of each optical axis L to the incident surface of the integrator lens 74 to which light is incident also becomes substantially constant. For this reason, by using the cassette 81, the irradiation surface of all the light source parts 73 can be arrange | positioned on a single curved surface, without giving big curved surface processing to the support body 82. FIG.

Specifically, the plurality of cassette mounting portions 90 of the support body 82 are in contact with the opening portion 90a facing the light source support portion 83 of the cassette 81 and the flat portion formed around the light source support portion 83. Each plane 90b of the plurality of cassette mounting portions 90 each provided with 90b and aligned in a predetermined direction intersects at a predetermined angle, so that the cassette mounting portion 90 is a predetermined number by simple processing. Can be formed so that the distance between each irradiation surface to which the light from the light source unit 73 irradiates and each optical axis L to the incident surface of the integrator lens 74 becomes substantially constant.

In addition, as shown in FIG. 25, the opening part 72b of the reflecting mirror 72 which becomes the emission surface vicinity of each light source part 73 includes the center part of an emission surface (opening part 72b), and is partially shielded. The aperture 40 (light intensity adjustment part) of is attached, respectively. Each aperture 40 is provided with a plurality of arm portions 41 (four in the present embodiment) for fixing the aperture 40.

Each aperture 40 is directly mounted so that the plurality of arm portions 41 can be freely attached or detached from the reflecting mirror 72 so that the aperture 40 can be easily replaced according to the substrate to be exposed, or the opening of the reflecting mirror 72. By sandwiching between 72b and the contact surface of the light source support part 83, it is provided in the vicinity of the emission surface of each light source part 73. As shown in FIG. In addition, each aperture 40 is comprised by metals, such as aluminum, in order to prevent the deformation | transformation by the heat from each light source part 73. Moreover, when comprised with aluminum, black anodization may be given to the surface.

By forming such aperture 40 in the vicinity of the emission surface of each light source unit 73, the illuminance distribution within the collimation angle of the light on the exposure surface of the light uniformized through the integrator lens 74 changes. do. That is, since the center of light is shielded by the aperture 40, illuminance falls, but since the width | variety of exposure light becomes thin, high resolution can be achieved.

Moreover, the substantially center part of the aperture 40 can be formed in arbitrary shapes, such as an oval and a rectangle besides circular, and may change the shielding area of a substantially center part according to the board | substrate to expose. Moreover, the hole may be formed in the substantially center part of the aperture 40. FIG. In addition, the aperture 40 may be the structure which does not have the arm part 41, as shown in FIG. 29, and in that case, the aperture 40 may be attached to the cover glass 85, and the reflecting mirror ( When the light transmitting member is formed in the opening 72b of the 72, it may be attached to the light transmitting member.

30A and 30B, the aperture 40 partially shields each exit surface, including the central portion of each exit surface of all of the predetermined number of light source portions 73 mounted in the cassette 81. As shown in Figs. It may be configured so that the cassette 81 can be detachably attached to the cassette 81. In this case, the illuminance of the light emitted from all the light source parts 73 can be adjusted only by replacing one aperture 40 with respect to the cassette 81. In addition, the aperture 40 may connect the center part of each exit surface with the two arm part 41, respectively, and may connect with the four arm part 41, respectively. In addition, as shown in FIG. 31, the aperture 40 may be comprised by the Ronky grating.

In addition, the light intensity adjusting part which adjusts the intensity of the light radiate | emitted from an emitting surface may be formed in the vicinity of the emission surface vicinity of a light source part, and a variable density filter may be used instead of the aperture 40, and the wavelength which does not transmit a specific wavelength A cut filter may be used. In addition, these filters are applied to the part where the aperture 40 is shielding light.

Moreover, the control structure of each light source part 73, the life time detection means (refer FIG. 32, FIG. 33), and the cooling structure in a support body are comprised similarly to 2nd Embodiment, and the lamp 71 is turned on. The control method is also the same as in the second embodiment. Here, in the present embodiment using the light intensity adjusting unit such as the aperture 40 or the variable concentration filter, the control shown in the second embodiment is used in order to prevent the exposure time from lengthening due to the decrease in illuminance. What is necessary is just to increase the number of the lamp 71 to light more than usual, or to raise the voltage or electric power of the lamp 71. FIG.

As explained above, according to the proximity exposure apparatus of this embodiment, the aperture which adjusts the intensity of the light radiate | emitted from an emission surface by partially shielding in the vicinity of the emission surface of the light source part 73 including the center part of an emission surface ( Since 40) is formed, it becomes possible to improve the resolution without using an expensive mask.

In addition, since the plurality of apertures 40 are formed in the plurality of light source units 73 each including the lamp 71 and the reflecting mirror 72, high resolution is obtained and the output of the light source unit can be increased. The exposure time can be shortened.

Moreover, the illumination optical system 70 is equipped with the some cassette 81 which can respectively mount a predetermined number of light source parts 73, and the support body 82 which can mount the some cassette 81, The aperture 40 is carried out. Consists of one aperture that partially shields each exit surface, including the central portion of each exit surface of the entire predetermined number of light source units mounted in the cassette 81, thereby facilitating the replacement operation of the aperture 40. can do.

34A and 34B show a light intensity adjusting unit that is a modification of the third embodiment. That is, in this modification, each of the lens elements 74A is formed on each incident surface 74A1 of the plurality of lens elements 74A arranged vertically and horizontally with the same optical mechanism that constitutes the fly's eye integrator 74. A plurality of apertures 40 are partially disposed, including the central portion of the incident surface 74A1.

Also in this modified example, the illuminance distribution in the collimation angle of the light on the exposure surface is changed in the same manner as in the above embodiment, the width of the exposure light can be narrowed, and the resolution is improved without using an expensive mask. It is possible to.

In this modified example, the case where the aperture as the light intensity adjusting member is applied to the fly-eye integrator has been described. Even when the integrator is a rod integrator, the aperture is the incident surface of the rod integrator. What is necessary is just to comprise the center part of the shielding.

(Fourth Embodiment)

Next, the proximity scan exposure apparatus which concerns on 4th Embodiment of this invention is demonstrated with reference to FIGS. 35-40.

As shown in FIG. 38, the proximity scan exposure apparatus 101 includes a plurality of masks in which a pattern P is formed on a substantially rectangular substrate W conveyed in a predetermined direction while approaching the mask M ( The light L for exposure is irradiated through M), and the pattern P is exposed and transferred to the board | substrate W. FIG. That is, the exposure apparatus 101 employs a scan exposure method in which exposure transfer is performed while the substrate W is relatively moved with respect to the plurality of masks M. As shown in FIG. Moreover, the size of the mask used by this embodiment is set to 350 mm x 250 mm, and the X direction length of the pattern P corresponds to the X direction length of an effective exposure area | region.

As shown in FIGS. 35 and 36, the proximity scan exposure apparatus 101 floats and supports the substrate W, and transports the substrate W in a predetermined direction (X direction in the drawing). The plurality of mask holders 171 which hold the conveyance mechanism 120 and the plurality of masks M, respectively, and are arranged in two rows in a zigzag shape along a direction intersecting with a predetermined direction (in the drawing, the Y direction) are provided. A plurality of irradiating portions 180 serving as illumination optical systems which are respectively disposed on the mask holding mechanism 170 to be provided, the plurality of mask holding portions 171, and irradiates the light L for exposure, a plurality of irradiating portions 180, and It is provided between the some mask holding | maintenance part 171, and is provided with the some light shielding device 190 which shields the exposure light L radiate | emitted from the irradiation part 180. As shown in FIG.

These board | substrate conveyance mechanisms 120, the mask holding mechanism 170, the some irradiation part 180, and the light shielding device 190 are on the apparatus base 102 provided in the ground via a level block (not shown). Is placed on. Here, as shown in FIG. 36, in the area | region where the board | substrate conveyance mechanism 120 conveys the board | substrate W, the area | region where the mask holding | maintenance mechanism 170 is arrange | positioned above is replaced with the mask arrangement | positioning area EA and the mask arrangement | positioning area | region ( The region on the upstream side with respect to EA) is referred to as the substrate carry-in side region IA and the region downstream on the mask placement region EA is referred to as the substrate carry-out region OA.

The board | substrate conveyance mechanism 120 is arrange | positioned on the carrying-in frame 105, the precision frame 106, and the carrying out frame 107 provided on the apparatus base 102 via another level block (not shown), A frame provided on the device base 102 via another level block 108 on the floating unit 121 as the substrate holding unit for floating the substrate W and supporting it on the Y-direction side of the floating unit 121. It is arrange | positioned on the 109, and is equipped with the board | substrate drive unit 140 which conveys the board | substrate W in the X direction, while holding the board | substrate W.

As shown in FIG. 37, the floating unit 121 has a plurality of long exhausts, each of which has a plurality of connecting rods 122 extending upward from an upper surface of the carry-out and precision frames 105, 106, and 107, respectively. Air from the air pads 123 (see FIG. 36) and the plurality of long intake and exhaust air pads 125a and 125b and the plurality of exhaust holes 126 formed in the air pads 123, 124, 125a and 125b. For air suction system 132 for sucking air from the air discharge system 130 for discharging air and the pump 131 for air discharge, and the intake hole 127 formed in the intake and exhaust air pads 125a and 125b. The pump 133 is provided.

In addition, the intake and exhaust air pads 125a and 125b have a plurality of exhaust holes 126 and a plurality of intake holes 127, and are provided between the support surface 134 and the substrate W of the air pads 125a and 125b. The air pressure can be balanced and set with high precision at a predetermined flotation amount, and can be horizontally supported at a stable height.

As shown in FIG. 36, the substrate drive unit 140 includes a holding member 141 for holding the substrate W by vacuum suction and a linear guide 142 for guiding the holding member 141 along the X direction. And the drive motor 143 and the ball screw mechanism 144 for driving the gripping member 141 along the X direction, and the frame 109 in the substrate loading side region IA so as to protrude from the upper surface of the frame 109. A plurality of work collision preventing rollers 145 are mounted on the side of the side to be movable in the Z direction and can rotate freely, and support the lower surface of the transfer standby substrate W with respect to the mask holding mechanism 170.

Moreover, the board | substrate conveyance mechanism 120 is formed in the board | substrate carrying-in side area | region IA, and the board | substrate prealignment mechanism 150 which performs prealignment of the board | substrate W waited in this board | substrate carrying-in side area IA, and And a substrate alignment mechanism 160 for aligning the substrate W. FIG.

36 and 37, the mask holding mechanism 170 is formed for each of the plurality of mask holding portions 171 and the mask holding portions 171 described above, and the mask holding portions 171 are formed by X, And a plurality of mask drivers 172 for driving around the Y, Z, and θ directions, that is, the vertical direction with respect to the horizontal plane with the predetermined direction, the crossing direction, the predetermined direction and the crossing direction, and the normal of the horizontal plane.

The plurality of mask holding portions 171 arranged in two rows in a zigzag shape along the Y direction is provided with a plurality of upstream side mask holding portions 171a (six in this embodiment) arranged on the upstream side and downstream. Between the pillar part 112 (refer FIG. 35) comprised of the several downstream mask holding | maintenance part 171b (in this embodiment, six) arrange | positioned and standing in the Y direction both sides of the apparatus base 2, arrange | positioned It is supported by the mask drive part 172 on the main frame 113 hypothesized by the upstream and downstream two, respectively. Each mask holding | maintenance part 171 has the opening 177 which penetrates in a Z direction, and the mask M is vacuum-suctioned by the lower surface of the peripheral part.

The mask driver 172 is mounted on the main frame 113, is mounted on the front end of the X direction driver 173 and X direction driver 173 moving along the X direction, and is driven in the Z direction. 174, the Y-direction driver 175 mounted to the Z-direction driver 174 and driving in the Y-direction, and the θ-direction driver 176 mounted to the Y-direction driver 175 and driven in the θ direction. The mask holding part 171 is attached to the front-end | tip of the (theta) direction drive part 176. As shown in FIG.

39 and 40, the plurality of irradiation units 180 includes a light irradiation apparatus 80A, an integrator lens 74, and an optical control unit configured in the casing 181 in the same manner as in the first embodiment. 76, a collimation mirror 77, and an exposure control shutter 78, between the light source unit 73A and the exposure control shutter 78, and an integrator lens 74 and a collimation mirror 77. And planar mirrors 280, 281, 282 disposed between them. In addition, the declination angle correction means which can change the curvature of a mirror manually or automatically may be provided in the collimation mirror 77 or the planar mirror 282 as a reflection mirror.

The light irradiation apparatus 80A has four straight cassettes 81A including six light source portions 73 in three columns and two rows each including an ultrahigh pressure mercury lamp 71 and a reflector 72. It has the aligned support 82A. Similarly to the first embodiment, in the cassette 81A, by attaching the lamp press cover 84 to the light source support part 83 on which the six light source parts 73 are supported, the light of the six light source parts 73 is irradiated. The distance of each optical axis L to each incident surface and the incident surface of the integrator lens 74 in which about 80% -100% of light is irradiated among the light irradiated from the six light source parts 73 is substantially constant. The light source portion 73 is positioned.

In addition, similarly to the second embodiment, each of the cassettes 81A has a predetermined number of light source portions 73 such that the intersection p of each of the main optical axes L of the light emitted from the predetermined number of light source portions 73 substantially coincides. Is fitted. In addition, the main optical axis L of the light emitted from the plurality of light source portions 73 of each cassette 81 is distributed approximately equally around the position shifted from the center of the integrator 74, that is, around the integrator 74. To be incident, the cassette 81A is mounted to the support 82. Thereby, the light incident on the integrator 74 becomes uniform through the integrator 74, and can be made the same illuminance distribution as shown in FIG. 7 of 1st Embodiment, and the width | variety of exposure light is narrowed. As a result, high resolution can be achieved.

Moreover, the wiring route from each light source part 73 and the cooling structure in a support body are comprised similarly to 2nd Embodiment, and the lighting control method of the lamp 71 is also the same as 2nd Embodiment.

As shown in FIG. 37, the plurality of light blocking devices 190 has a pair of plate-shaped blind members 208 and 209 for changing the inclination angle, and the pair of blind members (blind drive unit 192). The inclination angles of 208 and 209 are changed. Thereby, in the vicinity of the mask M held by the mask holding | maintenance part 171, while shielding the light L for exposure emitted from the irradiation part 180, and in the predetermined direction which light-shields the light L for exposure, The light shielding width of, i.e., the projection area seen in the Z direction can be made variable.

In addition, the proximity scan exposure apparatus 101 drives a pair of mask tray portions (not shown) holding the mask M in the Y direction, so that the upstream and downstream mask holding portions 171a and 171b are provided. While the mask changer 220 for replacing the held mask M is formed, the positioning pin (not shown) is applied to the mask (not shown) while pressing the lifted-up mask M against the mask tray portion before replacing the mask. The mask prealignment mechanism 240 which performs prealignment by making contact with M) is formed.

37, the proximity scan exposure apparatus 101 includes a laser displacement meter 260, a mask alignment camera (not shown), a tracking camera (not shown), a tracking light 273, and the like. Various detection means are arranged.

Next, the exposure transfer of the board | substrate W is demonstrated using the proximity scan exposure apparatus 101 comprised as mentioned above. In addition, in this embodiment, when drawing any pattern of R (red), G (green), and B (blue) with respect to the color filter board | substrate W on which the base pattern (for example, black matrix) was drawn. Explain about.

The proximity scan exposure apparatus 101 floats and supports the board | substrate W conveyed to the board | substrate loading area IA with the air from the exhaust air pad 123 by the loader etc. which are not shown in figure, and the board | substrate W is supported. After performing the pre-alignment operation and the alignment operation, the substrate W chucked by the gripping member 141 of the substrate driving unit 140 is conveyed to the mask arrangement area EA.

Thereafter, the substrate W moves in the X direction along the linear guide 142 by driving the drive motor 143 of the substrate drive unit 140. Then, the substrate W is moved on the exhaust air pad 124 and the intake / exhaust air pads 125a and 125b formed in the mask arrangement area EA, and is floated and supported in the state where vibration is excluded as much as possible. And when the exposure light L is radiate | emitted from the light source in the irradiation part 180, this exposure light L will pass through the mask M hold | maintained in the mask holding | maintenance part 171, and a pattern will be sent to the board | substrate W. FIG. Exposure transfer.

Moreover, since the said exposure apparatus 101 has a tracking camera (not shown) or the laser displacement meter 260, it detects and detects the relative position shift of the mask M and the board | substrate W during an exposure operation. The mask drive part 172 is driven based on the relative position shift which has been made, and the position of the mask M is followed by the board | substrate W in real time. At the same time, the gap between the mask M and the substrate W is detected, the mask driver 172 is driven based on the detected gap, and the gap between the mask M and the substrate W is corrected in real time.

As described above, by performing continuous exposure in the same manner, the entire pattern W can be exposed to the pattern. Since the mask M held by the mask holding | maintenance part 171 is arrange | positioned in zigzag shape, even if the mask M hold | maintained by the mask holding | maintenance parts 171a and 171b of an upstream or downstream side is spaced apart and aligned. The pattern can be formed in the substrate W without a gap.

Moreover, when cutting out several panel from the board | substrate W, the non-exposed area | region which does not irradiate the exposure light L in the area | region corresponding between adjacent panels is formed. For this reason, during the exposure operation, the pair of blind members 208 and 209 are opened and closed so that the blind members 208 and 209 are positioned in the non-exposed area, in accordance with the transfer speed of the substrate W. The blind members 208 and 209 are moved in the same direction as the conveying direction.

Therefore, also in the proximity scan exposure apparatus and the light irradiation apparatus 80 for exposure apparatuses similar to this embodiment, each cassette 81 has the intersection of each main optical axis L of the light radiate | emitted from the predetermined number of light source parts 73. A predetermined number of light source portions 73 are mounted so that (p) substantially coincides, and the support 82 has an intersection point of each main optical axis L of the light emitted from the predetermined number of light source portions 73 of each cassette 81 ( Since a plurality of cassettes 81 are mounted so that p) is at a different position, in a state where a predetermined gap is formed between the substrate W and the mask M, from the illumination optical system 70 with respect to the substrate W, When irradiating light through the mask M, the illuminance distribution in the collimation angle of the light in an exposure surface changes, and it can thin the width of exposure light. Thereby, while it is possible to improve the resolution without using an expensive mask, even if the light source part 73 is replaced for every cassette 81, the said effect can be easily achieved.

(Fifth Embodiment)

Next, a proximity scan exposure apparatus according to a fifth embodiment of the present invention will be described with reference to FIGS. 41 and 42. Moreover, the proximity scan exposure apparatus 101 of 5th Embodiment applies the light irradiation apparatus of 3rd Embodiment to the proximity scan exposure apparatus of 4th Embodiment. Therefore, since this embodiment is only different from 4th embodiment in the structure of 80 A of light irradiation apparatuses, the other code | symbol is attached | subjected about other structure, and description is abbreviate | omitted or simplified.

As shown in FIG. 41, the light irradiation apparatus 80A includes an ultrahigh pressure mercury lamp 71 and a reflector 72, for example, a cassette 81A including eight light source sections 73 in four rows and two rows. ) Has a support 82A in which three are arranged in a straight line. Similarly to the third embodiment, in the cassette 81A, the lamp pressing cover 84 is attached to the light source support part 83 on which the eight light source parts 73 are supported, whereby the light of the eight light source parts 73 is irradiated. The distance of each optical axis L between each irradiation surface and the incidence surface of the integrator lens 74 in which about 80% -100% of light is irradiated among the light irradiated from eight light source parts 73 is substantially constant. The light source portion 73 is positioned. Moreover, also in this embodiment, it exits from an emission surface by partially shielding in the vicinity of the opening part 72b of the reflecting mirror 72 which is the emission surface of the light source part 73, including the center part of the emission surface (opening part 72b). The apertures 40 for adjusting the intensity of the light to be formed are respectively formed.

Each cassette 81A is attached to the plurality of cassette mounting portions 90 of the support 82A, so that each irradiation surface to which the light of all the light source portions 73 irradiates, and the integrator lens into which the light of the light source portion 73 is incident Each cassette 81A is positioned so that the distance of each optical axis L to the incident surface of 74 becomes substantially constant. Moreover, the route of the wiring from each light source part 73 and the cooling structure in a support body are comprised similarly to 3rd Embodiment, and the lighting control method of the lamp 71 is also the same as 3rd Embodiment.

Therefore, also in the proximity scan exposure apparatus like this embodiment, the aperture 40 which adjusts the intensity of the light radiate | emitted from an emission surface by partially shielding in the vicinity of the emission surface of the light source part 73 including the center part of an emission surface is shown. ), The resolution can be improved without using an expensive mask.

In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably.

For example, although the lamp press cover 84 of this embodiment was made into the concave box shape, it is not limited to this, If it can position-fix a light source part by a contact part, even if it is a mesh shape, for example, do. Moreover, when each light source part 73 is fitted to the light source support part 83 and it is further fixed, it is also possible to comprise without forming the lamp press cover 84. FIG.

In addition, the shape of the support cover 92 can also be arbitrarily designed according to the arrangement of the illumination optical system 70.

Moreover, the light source part 73 arrange | positioned at the cassette 81 is eight or more, and all the light source parts arrange | positioned at the support body 82 are eight to about 800 pieces. If it is about 800 pieces, practicality and efficiency will improve. In addition, the number of the cassettes 81 mounted on the support body 82 is preferably 5% or less of the total number of the light source portions 73, and in this case, the light source portions 73 disposed on one cassette 81 ) Is more than 5%.

Moreover, the cassette mounting part 90 in which the cassette 81 is mounted in the surface shape to which the light source part 73 of the support body 82 of 1st Embodiment is mounted, or the support body 82 and 82A of 2nd and 4th embodiment is mounted. The shape of the plane 90b may be arbitrarily set as long as the main optical axis L of the light emitted from the plurality of light source units 73 enters the position shifted from the center of the integrator 74.

Moreover, the light source part 73 in which the light intensity adjustment part in 3rd Embodiment and 5th Embodiment is formed has provided the support body 82 with the some cassette 81 in which the predetermined number of light source parts 73 is mounted. Although the case where it applies to the some light source part 73 was demonstrated, it is of course applicable also when the some light source part 73 is directly attached to the single support body 82, as shown in FIG. In addition, even when the light intensity adjusting unit is applied to the light source unit 73 using the single high pressure mercury lamp 71, it is possible to exhibit the effect of the present invention.

In addition, each light source unit 73 attached to the single support 82 as in the first embodiment may be provided with a mechanism capable of changing the direction of the optical axis, respectively, as in the second to fifth embodiments. The mechanism may be provided in each light source unit 73 attached to the cassette 81 provided in the cassette.

As shown in FIG. 43, a diffusion lens 210 may be formed between the light source unit 73 and the integrator 74 of the illumination optical system 70 to diffuse the light from the light source unit 73. As shown, for example, the diffusion lens 210 is arranged on the integrator 74 side with the first lens surface 212 to which light is incident and receives light incident from the first lens surface 212. The thing which has the 2nd lens surface 214 of the uneven | corrugated shape which spreads to the outside is applied, It is not limited to this, You may apply a well-known diffused lens (for example, a concave lens). Thus, by forming the diffusion lens 210 which diffuses light between the light source part 73 and the integrator 74, it becomes possible to make light inject into the edge part of the integrator 74, as shown in FIG.

In this way, the light incident on the integrator 74 via the diffusion lens 210 is uniformized through the integrator 74, and the illuminance distribution in the collimation angle of the light on the exposure surface is shown in FIG. As shown, it distributes so that the roughness of the center vicinity may become low. By setting it as such illuminance distribution, since the width | variety of exposure light becomes thin, high resolution can be achieved.

For example, in the said embodiment, although the dividing sequential proximity exposure apparatus and the scanning proximity exposure apparatus were demonstrated as a proximity exposure apparatus, it is not limited to this, It is not limited to this, Any proximity exposure apparatus, such as a batch type, a sequential type, a scanning type, Applicable

Example 1

46 and 47 are shown in FIG. 6 using an illumination optical system as a comparative example in which the main optical axis L of the light emitted from the plurality of light source units 73 is incident on the center of the integrator 74. The difference of the line | wire width of exposure light with the case where the illumination optical system of this invention as described above was used was confirmed. Moreover, the exposure gap of a mask and a board | substrate shall be 100 micrometers, a mask opening width shall be 8 micrometers, and a collimation angle shall be 2 degrees. 6 and 47 show portions to which light is irradiated.

In the illumination optical system of the present invention, the illuminance distribution in the collimation angle of the exposure surface is lowered in the illuminance near the center as shown in FIG. 7, while in the illumination optical system of the comparative example, as shown in FIG. 48. Illuminance in the vicinity increases. As a result, as shown in FIG. 49, when the exposure threshold value is 0.5, in the case of the illumination optical system of the present invention, the width of the exposure light is about 9 µm, whereas in the case of the illumination optical system of the comparative example, the width of the exposure light is It became about 11 micrometers. Thereby, it was confirmed that high resolution can be achieved by using the illumination optical system of the present invention.

Example 2

In the illumination optical system 70 using the single high pressure mercury lamp 71 as shown in FIG. 50A, exposure is performed when the aperture 40 is used and when the aperture is not used. The difference in the line width of the light was confirmed. As shown in FIG. 50B, the aperture 40 includes the center portion of the lamp exit port and shields 40% of the diameter of the exit port. In addition, the exposure gap of a mask and a board | substrate shall be 100 micrometers, a mask opening width shall be 8 micrometers, and a collimation angle shall be 2 degrees.

As shown in FIG. 51, when there was no aperture, when the exposure threshold value was 0.5, the width of exposure light was 7.0 micrometers, whereas when there was an aperture, the width of exposure light was 4.8 micrometers. This confirmed that high resolution can be achieved by using an aperture.

When the light from the lamp reaches the exposure surface, the light passes through several openings such as a cover of the lamp cassette, a fly eye lens, a photomask, and the like. The larger the aperture, the wider the periphery of the aperture, so that the diffracted light concentrates near the center of the diffraction image. As shown in Fig. 52, the amplitude of light passing through the periphery of the aperture contributes to the intensity near the center of the diffraction image, while the amplitude of light near the center of the aperture contributes to the intensity around the diffraction image. Therefore, when the light passing near the center of the opening is reduced by the light shielding plate or the filter, the intensity in the peripheral portion of the intensity distribution decreases. Since the size of the opening does not change, the intensity of the center portion does not change, and as a result, the center portion is narrowed, so that the optical image can be improved.

(Sixth Embodiment)

53 is a perspective view showing a partially disassembled exposure apparatus according to a sixth embodiment of the present invention. As shown in FIG. 53, the exposure apparatus 301 is the illumination optical system 303 which irradiates light (light for exposure) to the glass substrate 300W through the mask 300M at the time of exposure, and the mask 300M. ), The work stage 305 holding the glass substrate (exposed material) 300W, and the device base 306 supporting the mask stage 304 and the work stage 305. Equipped. The exposure apparatus 301 exposes the glass substrate 300W a plurality of times (ie, at a plurality of positions) by using the mask 300M while relatively moving the mask stage 304 and the work stage 305. It is the division sequential exposure apparatus which manufactures several patterns which transferred (exposure) the mask 300M to one glass substrate 300W. In addition, the exposure apparatus 301 performs exposure by bringing the glass substrate 300W into close proximity to the mask 300M.

Here, the glass substrate 300W (hereinafter, simply referred to as "substrate 300W") is a plate provided with light transmitting properties, and the photosensitive agent (on the surface facing the mask 300M at the time of mounting on the exposure apparatus 301) ( Photosensitive material) is applied. By exposing in the state which the photosensitive agent of the board | substrate 300W and the mask 300M oppose, the mask pattern drawn on the mask 300M can be exposed-transferred to the photosensitive agent.

First, the illumination optical system 303 is a high-pressure mercury lamp 331 which is a light source for ultraviolet irradiation, the concave mirror 332 which condenses the light irradiated from the high-pressure mercury lamp 331, and the vicinity of the focal point of the concave mirror 332. Two types of optical integrators 333 disposed so as to be freely switchable to the camera, an exposure control shutter 334 disposed on an optical path of the irradiation light passing through the optical integrator 333 and controlling the opening and closing, and an exposure control shutter ( A planar mirror 335, a planar mirror 336, and a spherical mirror 337, which guide the light passing through the 334 to the exposure position, are provided.

The illumination optical system 303 opens the exposure control shutter 334 so that the light irradiated from the high-pressure mercury lamp 331 passes through the optical path 300L shown in FIG. 53 and serves as the pattern exposure light as the mask stage 304. The surface of the substrate 300W held by the mask 300M and the work stage 305 hold | maintained at (circle)) is irradiated. At this time, the light irradiated to the mask 300M and the substrate 300W becomes parallel light perpendicular to the mask 300M and the substrate 300W. As a result, the mask pattern 300P of the mask 300M is exposed and transferred onto the substrate 300W. In addition, the illumination optical system 303 closes the exposure control shutter 334 to block the light emitted from the high-pressure mercury lamp 331 in the middle of the optical path 300L, and the irradiation light is applied to the mask 300M and the substrate. (300W) can not be reached. Thereby, even if the high-pressure mercury lamp 331 is kept in the lit state, it is possible to prevent the irradiation light from reaching the mask 300M and the substrate 300W before the exposure.

In addition, the illumination optical system 303 is not limited to this embodiment, If it can irradiate irradiation light to the board | substrate 300W and can expose, it can be set as various structure (optical system).

Next, the mask stage 304 includes a mask stage base 310 and a plurality of mask stage props whose one end is fixed to the apparatus base 306 and the other end is fixed to the mask stage base 310. 311, the mask holding frame 312, and the mask position adjusting means 313 are provided. In addition, the mask stage base 310 of the mask stage 304 includes four gap sensors 314 for measuring the gap between the mask 300M and the opposing surface of the substrate 300W, and the alignment with the mask 300M. Two alignment cameras 315 for detecting a reference plane deviation amount are arranged. The mask stage 304 supports the mask stage base 310 by the mask stage support 311, and the mask stage 304 is disposed above the work stage 305 (upstream side of the optical path 300L). It is. Hereinafter, the mask stage 304 will be described in detail with reference to FIGS. 53, 54, 55, and 56. 54 is an enlarged perspective view of the mask stage shown in FIG. 53. FIG. 55 is a sectional view taken along the line LV-LV in FIG. 54, and FIG. 56 is a top view showing the mask position adjusting means in FIG. 55.

The mask stage base 310 is substantially rectangular shape, and the opening 310a is formed in the center part.

The mask holding frame 312 is attached to the periphery of the opening 310a so as to be movable in the X and Y axis directions. As shown in FIG. 55, the mask holding frame 312 mounts the flange 312a formed in the outer periphery of the upper end in the upper surface of the vicinity of the opening 310a of the mask stage base 310, The opening 310a is inserted through a predetermined gap between the inner circumference. As a result, the mask holding frame 312 can move in the X and Y axis directions by this gap.

The chuck portion 316 is fixed to the lower surface of the mask holding frame 312 via the spacer 320, and can move in the X and Y axis directions with respect to the mask stage base 310 together with the mask holding frame 312. Do. 55, the suction nozzle 316a for adsorption-fixing the mask 300M is arrange | positioned at the chuck | zipper part 316. As shown in FIG. The chuck 316 holds the mask 300M in the mask holding frame 312 by sucking the mask 300M by the suction nozzle 316a. In addition, the mask stage base 310 can attach and detach the mask 300M by controlling the suction by the suction nozzle 316a.

The mask position adjusting means 313 is formed on the upper surface of the mask stage base 310 (surface opposite to the surface on which the chuck portion 316 is disposed). The mask position adjusting means 313 moves the mask holding frame 312 in the XY plane based on the detection result by the alignment camera 315 described later or the measurement result by the laser measuring device 360 described later. Then, the position and attitude of the mask 300M held in this mask holding frame 312 are adjusted.

As shown in FIGS. 53 and 54, the mask position adjusting means 313 is an X axis direction driving device 313x attached to one side (that is, parallel) along the Y axis direction of the mask holding frame 312. And two Y-axis direction driving devices 313y mounted on one side of the mask holding frame 312 along the X-axis direction.

As shown to FIG. 55 and FIG. 56, the X-axis-direction drive apparatus 313x is a drive actuator (for example, electric actuator) 431 which has the rod 431r extended and contracted in an X-axis direction, and a mask holding frame The linear guide (linear bearing guide) 433 attached to the edge part along the Y-axis direction of 312 is provided. The guide rail 433r of the linear guide 433 extends in the Y-axis direction and is fixed to the mask holding frame 312. Moreover, the slider 433s attached to the guide rail 433r so that movement is possible is connected to the front-end | tip of the rod 431r fixedly formed to the mask stage base 310 via the pin support mechanism 432. As shown in FIG.

On the other hand, the Y-axis direction drive device 313y also has the same configuration as the X-axis direction drive device 313x, and has a drive actuator (for example, an electric actuator) 431 having a rod 431r that is stretched and contracted in the Y-axis direction. And a linear guide (direct bearing guide) 433 attached to the edge portion of the mask holding frame 312 along the X axis direction. The guide rail 433r of the linear guide 433 extends in the X-axis direction and is fixed to the mask holding frame 312. Moreover, the slider 433s attached to the guide rail 433r so that movement is possible is connected to the front-end | tip of the rod 431r via the pin support mechanism 432. As shown in FIG. Then, the X axis direction of the mask holding frame 312 is adjusted by the X axis direction driving device 313x, and the Y axis direction of the mask holding frame 312 is controlled by the two Y axis direction driving devices 313y. And the θ axis direction (sliding around the Z axis).

Next, two gap sensors 314 and one alignment camera 315 are disposed inside two sides that face each other in the X axis direction of the mask holding frame 312. Specifically, two gap sensors 314 and one alignment camera 315 are disposed on one side parallel to the X axis of the opening 310a inner circumference, and the other parallel to the X axis of the opening 310a inner circumference. Two gap sensors 314 and one alignment camera 315 are also arranged on the side of. The gap sensor 314 and the alignment camera 315 formed in each side are all movable in the X-axis direction via the moving mechanism 319.

As shown in FIG. 54, two moving mechanisms 319 are arrange | positioned at the upper surface side of the two sides which mutually oppose to the X-axis direction of the mask holding frame 312. As shown in FIG. One moving mechanism 319 extends in the Y-axis direction, is provided with a holding mount 491 for holding two gap sensors 314 and one alignment camera 315, and Y of the holding mount 491. For driving which is formed at the end part of the side separated from the axial drive apparatus 313y, and supports the holding mount 491, and moves the holding stand 491 along the linear guide 492. The actuator 493, the linear guide 492, and the drive actuator 493 are supported, and the drive mechanism 494 which moves them is provided. The linear guide 492 is provided with the guide rail 492r provided on the mask stage base 310 extended along an X-axis direction, and the slider which moves on the guide rail 492r. As for the linear guide 492, the edge part of the holding mount 491 is being fixed to the slider. Moreover, the drive actuator 493 consists of a motor and a ball screw, and moves the slider of the linear guide 492 along the guide rail 492r. In addition, the drive mechanism 494 includes a holding mount 495, a linear guide 496, and a driving actuator 497. The holding mount 495 supports the linear guide 492 and the driving actuator 493. In addition, the linear guide 496 and the drive actuator 497 are the same drive mechanism as the linear guide 492 and the drive actuator 493. Moreover, the linear guide 496 is arrange | positioned in the direction orthogonal to the linear guide 492.

The moving mechanism 319 drives the actuator 493 for driving and moves the holding stand 491 along the linear guide 492, so that the gap sensor 314 and the alignment camera (fixed to the holding stand 491) are fixed. 315) in the X axis direction. As a result, the movement mechanism 319 can move the gap sensor 314 and the alignment camera 315 outside the region of the mask holding frame 312. In addition, the movement mechanism 319 drives the drive mechanism 494 and moves the holding mount 495 to move the gap sensor 314 and the alignment camera 315 fixed to the holding mount 491 in the Y axis direction. Move to.

As shown in FIG. 57, the gap sensor 314 measures the gap between the mask 300M and the opposing surface of the substrate 300W. More specifically, the gap sensor 314 is a position of the surface of the mask 300M on the substrate 300W side and the mask 300M of the substrate 300W in a direction perpendicular to the mounting surface of the substrate W. As shown in FIG. The position of the surface on the () side is detected, and the distance between the two surfaces is detected. The gap sensor 314 sends the detected information to the control device 380.

The alignment camera 315 is a photographing apparatus such as a CCD camera, and as shown in FIG. 56, the alignment mark 401 of the mask 300M held on the lower surface of the mask stage and the alignment mark of the substrate W ( 402 is optically detected. The alignment camera 315 is moved close to the mask 300M by the focus adjustment mechanism 451 so that the focus adjustment can be performed. The alignment camera 315 sends the detected information to the control apparatus 380.

Moreover, the masking aperture (shielding plate) 317 is arrange | positioned at the both ends of the X-axis direction of the opening 310a of the mask stage base 310, respectively, as shown to FIG. 53 and FIG. The masking aperture 317 is disposed above the mask 300M (upstream of the optical path 300L) and downstream of the gap sensor 314 and the alignment camera 315. The masking aperture 317 is movable in the X-axis direction by the masking aperture drive device 318 which consists of a motor, a ball screw, and a linear guide, so that both ends (gap sensor 314 and alignment camera) of the mask 300M can be moved. The shielding area of the side where the side 315 is disposed can be adjusted.

Returning to FIG. 53, the description of the exposure apparatus 301 is continued. The work stage 305 is provided on the apparatus base 306 and has a Z-axis feed table (gap adjusting means) 305A for adjusting the gap between the mask 300M and the opposing surface of the substrate 300W to a predetermined amount. ), A work stage feed mechanism 305B disposed on the Z-axis feed table 305A for moving the work stage 305 in the XY axis direction, and a substrate ( A work chuck 308 for supporting 300W is provided. The work stage 305 will be described below with reference to FIGS. 53 and 58. 58 is a front view of the exposure apparatus shown in FIG. 53.

As shown in FIG. 58, the Z-axis feeder 305A is supported by the up-and-down coarse apparatus 321 which stood up on the apparatus base 306, and the up-and-down coarse apparatus 321 so that coarse support to the Z-axis direction is possible. The Z axis coarse motion stage 322, the vertical motion microscopic device 323 provided on the Z axis coarse motion stage 322, and the Z axis fine motion stage 324 supported through the vertical motion microscopic device 323 are provided. The up-and-down coordination apparatus 321 uses the electric actuator which consists of a motor, a ball screw, etc., or a pneumatic cylinder, for example, and raises and lowers the Z-axis coordination stage 322 by performing a simple up-down operation. Here, in this embodiment, the vertical coarse motion device 321 raises and lowers the Z-axis coarse motion stage 322 to the preset position, without measuring the clearance gap between the mask 300M and the board | substrate 300W.

As illustrated in FIG. 53, the vertical movement device 323 includes a motor 3231 provided on the upper surface of the Z axis coarse motion stage 322, a screw shaft 3322 rotated by the motor 3231, and a screw shaft. It is a movable wedge mechanism having a ball screw nut 3233 screwed to a 3232 and engaged between the support of the lower surface of the Z axis fine stage 324 and the Z axis coarse stage 322. Moreover, the support part of the lower surface of the Z-axis fine motion stage 324 is the wedge 541 inclined with respect to the surface of the Z-axis coarse motion stage 322. As shown in FIG. In addition, the surface where the ball screw nut 3233 contacts the wedge 541 also becomes the inclined surface inclined at the same angle as the wedge 541.

When the vertical motion device 323 rotates the screw shaft 3322 of the ball screw, the ball screw nut 3333 moves horizontally in the Y-axis direction, and this horizontal fine motion moves the ball screw nut 3233 and the wedge ( 541) is converted into high-precision vertical fine motion by the slope action. That is, by moving the ball screw nut 3333, the total height of the ball screw nut 3333 and the wedge 541 can be changed, and the Z axis fine movement stage 324 can be moved to an up-down direction.

In addition, two vertical movement devices 323 are provided on one end side (front side of FIG. 53) of the Z-axis fine movement stage 324 in the Y-axis direction, and one unit (not shown) and three in total on the other end side. Each of them is independently driven and controlled. Thereby, the up-and-down fine motion device 323 is equipped with the tilt function. In short, the vertical motion device 323 finely adjusts the height of the Z-axis fine motion stage 324 based on the measurement result of the gap between the mask 300M and the substrate 300W by the four gap sensors 314. The mask 300M and the substrate 300W can be opposed to each other in parallel and via a predetermined gap. In addition, the up-and-down coarse motion device 321 and the up-down motion control device 323 may be provided in the part of the Y-axis feed stand 352. As shown in FIG.

Next, as shown in FIG. 58, the work stage feed mechanism 305B is disposed on the upper surface of the Z axis fine movement stage 324 so as to be spaced apart from each other in the Y axis direction, and each of the two sets of clouds formed along the X axis direction. Linear guide 341 which is a kind of guide, X-axis feeder 342 attached to slider 341a of this linear guide 341, and X-axis which moves X-axis feeder 342 to an X-axis direction X-axis to a ball screw nut 733 having a feed drive device 343 and screwed to a ball screw shaft 3432 rotatably driven by a motor 3431 of the X-axis feed drive device 343. The transfer table 342 is connected.

Moreover, on the upper surface of this X-axis feed stand 342, the linear guide 351 which is one kind of two sets of rolling guides arrange | positioned to each other in the X-axis direction and extended along the Y-axis direction, respectively, and the linear guide 351 Y-axis feed table (352) attached to the slider 351a of the &lt; RTI ID = 0.0 &gt;) &lt; / RTI &gt; and a Y-axis feed drive device 353 for moving the Y-axis feed table 352 in the Y-axis direction. A Y-axis feeder 352 is connected to a ball screw nut (not shown) that is screwed to a ball screw shaft 355 that is rotationally driven by the motor 354 of the 353. The work stage 305 is attached to the upper surface of the Y-axis feed table 352.

And the laser measuring device 360 as a movement distance measuring part which detects the X-axis and Y-axis position of the work stage 305 is formed in the apparatus base 306. As shown in FIG. In the work stage 305 configured as described above, it is caused by an error such as the shape of the ball screw or the linear guide itself, or a mounting error thereof, and the like, such as a positioning error, yawing, straightness, etc., when the work stage 305 is moved. It is inevitable. Therefore, it is this laser measuring device 360 which aims at measuring these errors. As shown in FIG. 53, the laser length measuring device 360 is provided with a pair of Y-axis interferometers 362 and 363 formed opposite to the Y-axis direction end portion of the work stage 305 and provided with a laser, and the work stage. One X-axis interferometer 364 formed at the X-axis direction end of 305 and provided with a laser, and a Y-axis mirror disposed at a position opposite to the Y-axis interferometers 362, 363 of the work stage 305 ( 366 and the X-axis mirror 368 arrange | positioned in the position which opposes the X-axis interferometer 364 of the work stage 305. As shown in FIG.

Thus, by forming two Y-axis interferometers 362, 363 in the Y-axis direction, not only the information of the Y-axis direction position of the work stage 305, but also the position data of the Y-axis interferometers 362, 363. The yaw error can also be known by the difference of. Regarding the Y-axis direction position, it can be calculated by appropriately adding the average value of both to the X-axis direction position and yaw error of the work stage 305 and correcting it.

And in the step of sending the substrate 300W to the next area when connecting and exposing the next pattern subsequent to the exposure of the XY axis direction position of the work stage 305, the Y-axis feeder 352, and also the previous pattern. As illustrated in FIG. 59, the detection signal output from each interferometer 362 to 364 is input to the control device 380. This control apparatus 380 controls the X-axis feed drive device 343 and the Y-axis feed drive device 353 in order to adjust the movement amount of the XY axis direction for split exposure based on this detection signal, Based on the detection result by the X-axis interferometer 364 and the detection result by the Y-axis interferometers 362, 363, the positioning correction amount for the connection exposure is calculated, and the calculation result is converted into the mask position adjusting means 313 ( And output to upper and lower fine motion devices 323 as necessary. Thereby, the mask position adjusting means 313 etc. are driven according to this correction amount, and positioning error, straightness error, yaw, etc. by the X-axis feed drive device 343 or the Y-axis feed drive device 353 are performed. The influence is eliminated. The exposure apparatus 301 has the above configuration. Moreover, the control apparatus 380 moves the relative position of the board | substrate 300W and the mask 300M by the up-and-down coarse motion apparatus 321 based on the setting previously input.

Next, the mask 300M is demonstrated using FIG. 60 is a front view illustrating an example of a mask. The mask 300M shown in FIG. 60 is the alignment mark 411 formed around the exposure pattern 410 and the exposure pattern 410 in which the transparent plate-shaped base material 409 and the pattern which expose to the board | substrate 300W were formed. 412, and gap measurement windows 414, 416, 418, 419. In the exposure pattern 410, a portion through which light is transmitted is formed, and a light shielding material (for example, chromium) is disposed at a portion not to be exposed. For example, when exposing the pattern of one color of a color filter, the exposure pattern 410 has a part in which the color is formed of light transmitting material, and other parts (parts in which other colors are arranged). Or the portion where the black matrix is disposed) is shielded. Moreover, in this embodiment, since the base material 409 of the mask 300M is made into the transparent plate-shaped member, the exposure pattern 410 is made to the surface (surface or back surface) which opposes the to-be-exposed board | substrate of the base material 409. It is formed by arranging the light shielding material.

As described above, the alignment mark 411 and the alignment mark 412 are photographed by the alignment camera 315 at the time of exposure, so that the cover for performing alignment of the substrate 300W and the mask 300M. to be. In addition, although the alignment mark 411 and the alignment mark 412 were made into different code | symbols in order to demonstrate an arrangement position, it is the same as the alignment mark 410 mentioned above. The alignment mark 411 and the alignment mark 412 are arrange | positioned adjacent to the both ends of the X-axis direction of the exposure pattern 410, in other words, the side parallel to the X-axis direction of the exposure pattern 410. As shown in FIG. The alignment mark 411 and the alignment mark 412 are disposed outside the exposure pattern 410. In addition, the alignment mark 411 is adjacent to one side among two sides parallel to the X-axis direction of the exposure pattern 410, and the alignment mark 412 is the X-axis direction of the exposure pattern 410. It is adjacent to the other side of two parallel sides. In addition, in this embodiment, although the alignment mark 411 and the alignment mark 412 were made the same shape, you may make a different shape.

Here, the alignment mark 411 and the alignment mark 412 are arrange | positioned in the position which the position in the direction parallel to a Y axis does not overlap. That is, the alignment mark 411 and the alignment mark 412 are arrange | positioned at the coordinate which differs in Y-axis coordinate. In addition, the alignment mark 411 and the alignment mark 412 are adjacent to the substantially center part of the side parallel to the X-axis direction of the exposure pattern 410.

Next, the gap measurement window 414, the gap measurement window 416, the gap measurement window 418, and the gap measurement window 419 include the substrate 300W by the gap sensor 44 described above. It is a window for use in detecting the gap of the mask 300M, and is formed of a transparent material. That is, the gap measurement window 414 is comprised only by the base material 409, and the gap sensor 314 is the structure which can detect the board | substrate 300W through a gap measurement window. In addition, the gap measurement window 418 may be configured to form a mark for measuring the position of the mask 300M.

The gap measurement window 414, the gap measurement window 416, the gap measurement window 418, and the gap measurement window 419 are both ends of the exposure pattern 410 in the X-axis direction, that is, the exposure pattern 410. It is arrange | positioned adjacent to the side parallel to the X-axis direction of (). The gap measurement window 414, the gap measurement window 416, the gap measurement window 418, and the gap measurement window 419 are also disposed outside the exposure pattern 410. In addition, the gap measurement window 414 and the gap measurement window 418 are adjacent to one side among two sides parallel to the X-axis direction of the exposure pattern 410. In other words, the gap measurement window 414 and the gap measurement window 418 are disposed on the same side as the alignment mark 411. The gap measurement window 416 and the gap measurement window 419 are adjacent to the other side of two sides parallel to the X axis direction of the exposure pattern 410. In other words, the gap measurement window 416 and the gap measurement window 419 are disposed on the same side as the alignment mark 412. In addition, the gap measurement window 414 and the gap measurement window 416 are arrange | positioned in the vicinity of one edge part of the side parallel to the X-axis direction of the exposure pattern 410, and the gap measurement window 418 and the gap measurement window 419 is arrange | positioned in the vicinity of the other edge part of the side parallel to the X-axis direction of the exposure pattern 410. FIG. That is, the gap measurement window 414 and the gap measurement window 418 are arrange | positioned through the alignment mark 411, and the gap measurement window 416 and the gap measurement window 419 are the alignment mark 412. It is arranged to interpose.

In addition, the gap measurement window 414 and the gap measurement window 416 are arrange | positioned in the position which the position in the direction parallel to a Y axis does not overlap. That is, the gap measurement window 414 and the gap measurement window 416 are arrange | positioned in the coordinate which differs in Y-axis coordinate. In addition, the gap measurement window 418 and the gap measurement window 419 are arrange | positioned in the position which the position in the direction parallel to a Y axis does not overlap. That is, the gap measurement window 418 and the gap measurement window 419 are arrange | positioned in the coordinate which differs in Y-axis coordinate. Thus, the gap measurement windows to which the position in the vicinity of the edge part of the side surface parallel to the X-axis direction of the exposure pattern 410, in other words, the direction parallel to the Y-axis do not overlap also is formed.

As described above, the mask 300M includes an alignment mark 411, an alignment mark 412, a gap measurement window 414, a gap measurement window 416, a gap measurement window 418, and a gap measurement window. (419) The positions in the direction parallel to all the Y-axis are arrange | positioned in the position which does not overlap.

Next, the board | substrate 300W is demonstrated using FIG. 61 and FIG. 62. FIG. FIG. 61: is a front view which shows an example of a board | substrate, and FIG. 62 is an enlarged view of the vicinity of the gap measurement area shown in FIG. Moreover, the board | substrate 300W shown in FIG. 61 is a board | substrate with which at least 1 time exposure was completed. As shown in FIG. 61, four patterns 420a, 420b, 420c, and 420d are formed in the substrate 300W. Moreover, the pattern 420a and the pattern 420b are adjacent to the X-axis direction, the pattern 420a and the pattern 420c are adjacent to the Y-axis direction, and the pattern 420c and the pattern 420d are , It is adjacent to the X axis direction. In other words, four patterns are arranged on the grid in the substrate W. As shown in FIG.

In the substrate 300W, an alignment mark and a gap measurement region are formed around each of the four patterns 420a, 420b, 420c, and 420d similarly to the mask 300M. In addition, the alignment mark and the gap measurement area are respectively formed in correspondence with the alignment mark and the gap measurement window of the mask 300M, and the same functions as those of each part of the mask, that is, the alignment mark, the mask 300M and the substrate ( It becomes a reference | standard of the alignment of 300W), and the area | region for gap measurement becomes a reference | standard of the gap of the mask 300M and the board | substrate 300W.

Here, the alignment mark 421a, the gap measurement area | region 424a, and the gap measurement area | region 428a are formed in the position adjacent to one side among two sides parallel to the Y-axis of the pattern 420a, The alignment mark 422a, the gap measurement region 426a, and the gap measurement region 429a are formed at positions adjacent to the other side among two sides parallel to the Y axis of the pattern 420a. . In the substrate 300W, the pattern 420a, the alignment marks 421a and 422a, and the gap measurement regions 424a, 426a, 428a, and 429a become one short unit. Here, one short unit is a part used or exposed by one exposure. Further, at a position adjacent to one side of two sides parallel to the Y axis of the pattern 420b, an alignment mark 421b, a gap measurement region 424b, and a gap measurement region 428b are formed. The alignment mark 422b, the gap measurement region 426b, and the gap measurement region 429b are formed at positions adjacent to the other side among two sides parallel to the Y axis of the pattern 420b. . Similarly, alignment marks 421c and 422c and gap measurement areas 424c, 426c, 428c and 429c are formed in the position corresponding to the pattern 420c, and the alignment mark is located in the position corresponding to the pattern 420d. 421d and 422d and gap measurement regions 424d, 426d, 428d, and 429d are formed. In other words, in the substrate 300W, one pattern, two alignment marks, and four gap measurement regions become one short unit.

Here, the two alignment marks and the four gap measurement regions formed corresponding to one pattern formed on the substrate 300W are the same as the alignment marks and the gap measurement window of the mask 300M described above in the Y axis direction. It is formed in the position which a position does not overlap. Therefore, alignment marks 421b and 422a formed between two patterns adjacent to the X-axis direction, for example, between the other side of the pattern 420a and one of the patterns 420b, and the gap measurement regions 424b and 426a. , 428b, 429a) can be prevented from overlapping. As shown in a result, FIG. 63, the mask (300M ₁₎ and the substrate (300W ₁₎ a respective alignment mark, a gap measurement window Y overlap the position of the axial position (i.e., co-located with the Y-axis coordinate) formed in the It is possible to make the interval between the pattern 420a and the pattern 420b smaller than in the case where it is. 63 is a front view which shows the other example of a board | substrate. In short, the distance L ₂ of the substrate (300W) as shown in Fig. 61 and 62 is, the distance L ₁ of the pattern adjacent to the pattern, to the outside of the alignment mark from the end of the pattern (provided on the side away from the end of the pattern) Since the pattern is formed at an arrangement interval shorter than twice, i.e., an arrangement interval satisfying 0 < L ₁ < 2L ₂ , the interval is shorter than the interval between the pattern of the substrate 300W ₁ and the pattern.

As mentioned above, the board | substrate 300W arrange | positions the position in the direction (Y-axis direction) parallel to the side in which the alignment mark is formed, forming the alignment mark in the adjacent pattern at the same position, and adjacent pattern The spacing of can be made small. Thereby, a pattern can be efficiently formed in the board | substrate 300W, and more patterns can be formed in the board | substrate 300W. Moreover, since the area | region which can be exposed increases, the magnitude | size of one pattern can be made larger even when the same number of patterns are formed. Moreover, since alignment mark is formed corresponding to each pattern, alignment of the mask 300M and the board | substrate 300W can be performed more appropriately at the time of manufacture, and the pattern with less misalignment can be formed more. have.

In addition, which of the alignment mark and the gap measuring region correspond to one side of the pattern, and which corresponds to the other side of the pattern, both sides of the substrate, that is, a plurality of patterns are formed, the alignment mark And by comparing both sides of the side where the gap measurement region is formed. That is, the alignment mark and gap measurement area | region formed in one side of a board | substrate are the corresponding alignment mark and gap measurement area | region of one side of a pattern, and the alignment mark and gap measurement area formed in the other side of a board | substrate. The area is the area for gap alignment and the corresponding alignment mark on the other side of the pattern.

Moreover, the board | substrate 300W similarly forms the gap measurement area | region, and positions the position in the direction (Y-axis direction) parallel to the side in which the gap measurement area | region is formed, in the same position. It can arrange | position and can make the space | interval of the adjacent pattern small. Thereby, a pattern can be efficiently formed in the board | substrate 300W, and more patterns can be formed in a board | substrate. Moreover, since the area | region which can be exposed increases, the magnitude | size of one pattern can be made larger even when forming the same number of patterns. In addition, since the gap measurement region is formed corresponding to each pattern, the alignment of the mask and the substrate in the height direction can be performed more appropriately at the time of manufacture, that is, the pattern with less blurring, that is, less displacement Can be formed.

In addition, the mask 300M is aligned with the substrate 300W by having the shape in which the alignment mark 411, the alignment mark 412, and the position in the direction parallel to the Y axis are arranged at positions not overlapping with each other. While aligning the mark, and forming the alignment mark on the substrate 300W, the position in the direction (Y axis direction) parallel to the side on which the alignment mark is formed is arranged at the same position, and the interval between adjacent patterns Can be made small. As a result, a plurality of patterns can be efficiently formed on the substrate 300W, and more patterns can be formed on the substrate. Moreover, since the area | region which can be exposed increases, the magnitude | size of one pattern can be made larger even when forming the same number of patterns.

In addition, the mask 300M is a position where the gap measurement window 414, the gap measurement window 416, the gap measurement window 418, and the gap measurement window 419 are all in parallel with the Y axis. By setting the shape arranged at a position not overlapping with each other, the position in the direction (Y axis direction) parallel to the side on which the gap measurement window is formed while aligning the position with the substrate 300W in the gap measurement window is located at the same position. It can arrange | position and can make the space | interval of the adjacent pattern small. As a result, a plurality of patterns can be efficiently formed on the substrate 300W, and more patterns can be formed on the substrate. Moreover, since the area | region which can be exposed increases, the magnitude | size of one pattern can be made larger even when forming the same number of patterns. In addition, in the said embodiment, although the alignment mark, the gap measurement window, and the gap measurement area | region were arrange | positioned adjacent to the side parallel to the Y axis of the board | substrate 300W and the mask 300M, this invention is not limited to this. The alignment mark, the gap measurement window, and the gap measurement region may be arranged adjacent to the side parallel to the X axis. In short, even when the XY coordinates are switched, the same effect can be obtained by setting the corresponding shape.

Next, the exposure operation by the exposure apparatus will be described with reference to FIGS. 64 to 66. 64 to 66 are explanatory diagrams for explaining the operation of the exposure apparatus, respectively. First, as shown in FIG. 64, the exposure apparatus 301 exposes the next pattern in numerical order in the figure with respect to the board | substrate 300W in which four patterns (each pattern is the same pattern) were formed. In short, the next pattern is repeatedly exposed to each of the four patterns. For example, the pattern of R is formed in the board | substrate 300W in which the pattern of a black matrix is formed. The exposure apparatus 301 moves the mask stage 304 and the work stage 305 relatively at the time of exposure, and as shown in FIG. 65, on the pattern of "1" of the board | substrate 300W, mask 300M In other words, the mask 300M and the substrate 300W are moved relative to the position where the pattern of "1" and the exposure pattern of the mask 300M overlap. Moreover, at this time, the exposure apparatus 301 uses the alignment camera 315 to adjust the alignment mark of the alignment mark formed corresponding to the pattern of "1" of the board | substrate 300W, and the alignment mark of the mask 300M. Further, the mask 300M and the substrate were formed using the gap sensor 314, the gap measurement region formed corresponding to the pattern of "1" of the substrate 300W, and the gap measurement window of the mask 300M. Set the position of (300W).

When the alignment of the pattern of "1" of the mask 300M and the board | substrate 300W is completed, the exposure apparatus 301 is provided with the alignment mark and gap measurement window of the mask 300M as shown in FIG. The masking aperture 317 overlaps the area. When the exposure apparatus 301 overlaps the masking aperture 317 in the area where the alignment mark and the gap measurement window of the mask 300M are formed, the exposure apparatus 301 performs exposure, and the exposure pattern of the mask 300M is exposed to the substrate 300W. It transfers on the pattern of "1". Thereby, in the photosensitive material on the pattern of "1", the area | region corresponding to the part without the light shielding plate of an exposure pattern is exposed, and the area | region other than that is not exposed. In addition, since the masking aperture 317 overlaps with the alignment mark of the mask 300M and the area | region corresponding to a gap measurement window, the board | substrate 300W does not expose.

The exposure apparatus 301 can form a pattern in the board | substrate 300W efficiently by exposing the board | substrate 300W using the mask 300M as mentioned above. Moreover, since the exposure apparatus 301 supports the alignment camera 315 and the gap sensor 314 in a movable state, it can move to the position of an alignment mark and a gap measurement window. Thereby, it can use with respect to the mask of various shift amounts.

In addition, when the exposure apparatus 301 forms a pattern on the substrate 300W in which no patterns are formed, the mask 300M is used to align the interval of the pattern adjacent to the pattern from the end of the pattern. Patterns are formed at placement intervals shorter than twice the distance to the outside of the mark (end of the side away from the end of the pattern). The exposure apparatus 301 can shorten the space | interval of a pattern and a pattern by forming a pattern in a board | substrate as mentioned above. Moreover, even when a pattern is formed in this way, by using the mask 300M, it can suppress that an alignment mark overlaps.

Here, FIG. 67 is explanatory drawing for demonstrating an example of the relationship of an alignment mark and a pattern, and FIG. 68 is explanatory drawing for demonstrating another example of the relationship of an alignment mark and a pattern. 69 is explanatory drawing for demonstrating the exposure operation of the exposure apparatus. In the said embodiment, as shown in FIG. 67, the alignment mark 422a corresponding to the pattern 420a and the alignment mark 421b corresponding to the pattern 420b are parallel, in other words, X to the board | substrate 300W. Although it arrange | positioned in the position which becomes axial coordinate, the present invention is not limited to this. As shown in FIG. 68, the alignment mark formed in the board | substrate 300W 'arranges the alignment mark 422a' corresponding to the pattern 420a near the pattern 420b which adjoins rather than the pattern 420a. It is preferable to arrange the alignment mark 421b 'corresponding to the pattern 420b near the pattern 420a adjacent to the pattern 420b. That is, it is preferable that the alignment mark interposed between patterns makes the space | interval with an adjacent pattern smaller than the space | interval with a corresponding pattern. The same applies to the gap measurement window (area for gap measurement).

Here, as above-mentioned, the board | substrate covers the alignment mark and the gap measurement window by the masking aperture 317 at the time of exposure, as shown in FIG. In addition, in FIG. 69, in order to simplify drawing, illustration of a gap measurement window and the area | region for gap measurement is abbreviate | omitted, and only an alignment mark is shown. In addition, the same effect can be obtained by making the gap measurement window and the gap measurement area into the same arrangement position as the alignment mark. In addition, in FIG. 69, the pattern used as the exposure target of the board | substrate 300W and the alignment mark corresponding to the pattern are shown by the solid line, and the pattern which does not become the exposure target and the alignment mark corresponding to the pattern are shown by the dotted line. Here, since the masking aperture 317 is arrange | positioned at the position different from the mask 300M, the light which passed the edge part of the masking aperture 317 by a fixed distance from the edge part of the masking aperture 317 becomes wider. It becomes an area. That is, by arranging the masking aperture 317, the intensity | strength of the irradiation light which reaches | attains a board | substrate becomes an intensity different from another area | region. That is, it becomes an area | region which cannot expose uniformly. For this reason, the alignment mark 422a and the pattern 420a which need to be hidden at the time of exposure are arrange | positioned in the area | region which an influence affects, and the position separated by arrange | positioning the masking aperture 317 as shown in FIG. desirable.

On the other hand, since the alignment mark 421b which is not used at the time of the exposure of the pattern 420a is hidden by the mask 300M at the time of exposure of the pattern 420a, the alignment mark is exposed by the exposure of the pattern 420a. Exposing 421b can be suppressed. In addition, even when the alignment mark 421b is used as an alignment mark, the masking aperture 317 is arrange | positioned between the alignment mark and the pattern to expose at the time of exposure. For this reason, even if the pattern 420a and the alignment mark 421b adjoin, it does not affect exposure of a pattern. For this reason, the space | interval of an unmatched pattern and an alignment mark can be shortened. In addition, by arranging the masking aperture 317 between the alignment mark and the pattern to be exposed, it is possible to suppress the light reaching at the time of exposure from reaching the alignment mark.

As mentioned above, the alignment mark interposed between patterns can expose a pattern preferably by making the space | interval with an adjacent pattern smaller than the space | interval with a corresponding pattern, and can form a pattern in a board | substrate more efficiently. Can be. In short, the area | region in which the pattern of a board | substrate is not formed can be reduced, and a board | substrate can be used efficiently.

In addition, in the said embodiment, although one masking aperture 317 was overlapped with respect to the alignment mark and the gap measurement window at the time of exposure, the alignment mark and the gap measurement window were not exposed, but this invention is not limited to this. . For example, a plurality of light shielding materials, that is, other light shielding materials may be superposed on the alignment mark and the gap measurement window during exposure. Moreover, some light shielding materials may be common.

If necessary, the light may be exposed in a state where the alignment mark and the gap measurement window do not overlap with the light shielding material. For example, when performing exposure to the board | substrate 300W for the first time (for example, when exposing a black matrix), it is necessary to form the alignment mark on a board | substrate, so that it may not overlap with an alignment mark with a light shielding material. It exposes and an alignment mark is formed in a board | substrate. The light shielding material may be repeatedly exposed only to the gap measurement window without overlapping the light shielding material on the alignment mark.

In addition, in the said embodiment, although both the mask and the board | substrate did not overlap the position in the Y-axis direction of both the alignment mark and the gap measurement window (gap measurement area | region), this invention is not limited to this. For example, the alignment mark may not overlap the position in the Y axis direction, and the gap measurement window may be a position where the position in the Y axis direction overlaps. Moreover, in the board | substrate, you may use the gap measurement area | region in the position interposed in the pattern as the area | region for gap measurement of both adjacent patterns. Hereinafter, it demonstrates using FIG. 70 and FIG. Here, FIG. 70 is a front view which shows the other example of a mask, and FIG. 71 is the front view which shows another example of a board | substrate.

The mask 300M ₂ shown in FIG. 70 includes the substrate 409, the exposure pattern 410 formed on the surface of the substrate 409, the alignment marks 411a and 412a, the gap measurement windows 414a and 416a, 418a, 419a). Moreover, the mask 300M ₂ differs only in the arrangement relationship of each part, and the function is the same as that of the mask 300M.

The alignment mark 411a and the alignment mark 412a of the mask 300M ₂ are arrange | positioned in the position which does not overlap with the position in the direction parallel to a Y axis. That is, the alignment mark 411a and the alignment mark 412a are arrange | positioned in the coordinate which differs in Y-axis coordinate. Moreover, the alignment mark 411a and the alignment mark 412a adjoin the substantially center part of the side parallel to the X-axis direction of the exposure pattern 410. As shown in FIG.

On the other hand, the gap measurement window 414a and the gap measurement window 416a are arrange | positioned in the position where the position in the direction parallel to a Y-axis overlaps. That is, the gap measurement window 414a and the gap measurement window 416a are arrange | positioned at the coordinate which becomes Y-axis coordinate. In addition, the gap measurement window 418a and the gap measurement window 419a are also arrange | positioned in the position where the position in the direction parallel to a Y-axis overlaps. That is, the gap measurement window 418a and the gap measurement window 419a are arrange | positioned at the coordinate which becomes Y-axis coordinate.

Next, the substrate (300W ₂₎ is, there, is formed of four patterns (420a, 420b, 420c, 420d ) , as shown in Figure 71. Substrate (300W ₂₎ 4 of patterns, there corresponding to each of the pattern for the alignment mark and the gap measuring area is formed, a pattern (420a) and pattern (420b) of for the gap measuring region interposed between the pattern of the The gap measurement region interposed between 420c and the pattern 420d is used as the gap measurement region in both adjacent two patterns. Specifically, the alignment mark 621a, the gap measurement area | region 624, and the gap measurement area | region 626 are formed in the vicinity of one side of the pattern 420a, and the other side of the pattern 420a is provided. The alignment marks 621b and 622a, the gap measurement region 628, and the gap measurement region 630 are formed between one side of the pattern 420b. Moreover, the alignment mark 622a is the alignment mark corresponding to the pattern 420a, and the alignment mark 621b is the alignment mark corresponding to the pattern 420b. Moreover, the alignment mark 622b, the gap measurement area | region 634, and the gap measurement area | region 636 are formed in the one other vicinity of the pattern 420b.

Also for the patterns 420c and 420d, the alignment marks 621c, 621d, 622c and 622d and the gap measurement areas 624 ', 626', 628 ', 630' and 634 'are the same as the patterns 420a and 420b. 636 ') is formed.

Substrate (300W ₂₎ has a configuration as described above, if the alignment of the substrate (300W ₂₎ and the mask (300M ₂₎ for exposure of the pattern (420a), the alignment marks (621a, 622a), and a gap Measurement areas 624, 626, 628, 630 are used. In addition, when aligning the substrate 300W ₂ and the mask 300M ₂ for the exposure of the pattern 420b, the alignment marks 621b and 622b and the gap measurement areas 628, 630, 634 and 636. ). In this way, the position of the alignment mark is shifted, and even when a part of the gap measurement region is shared, the distance between adjacent patterns can be shortened. Thereby, a board | substrate can be utilized efficiently.

In addition, even if only the alignment mark is shifted like the mask 300M ₂ , as shown in the substrate 300W ₂ , the interval between the pattern and the pattern can be shortened, so that the pattern can be efficiently formed on the substrate. have.

In the above embodiment, the gap measuring window (gap measuring area), that is, four points for measuring the gap were used. If the gap can be measured at at least three points, the gap measuring window (gap measuring area) is used. The number of is not limited.

In addition, in the said embodiment, although the gap measurement window (gap measurement area | region) was formed in the exposure pattern of a mask or the outer side of a board | substrate pattern, this invention is not limited to this. When a part of an exposure pattern has an exposure area | region (in other words, the area | region in which the light shielding material is not arrange | positioned) of the fixed area or more, you may make it use as an gap measurement window.

Here, FIG. 72 is a schematic diagram which shows an example of the pattern formed in a board | substrate. FIG. 73 is an enlarged schematic diagram showing an enlarged portion of the pattern shown in FIG. 72. 74 is a schematic diagram illustrating an example of an exposure pattern. For example, when exposing to manufacture a color filter of a liquid crystal panel, first, as shown in FIG. 72, a black matrix is formed as a pattern 650 on a board | substrate. 72 and 73, the pattern 650 has a grid inside (grid for arranging color filters), and an outer circumferential portion 652 whose outer peripheral side is thicker than a line of the grid is formed.

The line of the grid and the outer circumferential portion 652 are regions where a pattern remains. Therefore, as shown in FIG. 74, in the exposure pattern 654 of a mask, since the area | region which this pattern remains becomes transparent, the area | region 656 corresponding to an outer peripheral part becomes transparent. Therefore, the area 656 becomes an area | region which can confirm a board | substrate even when a mask is arrange | positioned. For this reason, by using this area | region 656 as a gap measurement window, it is unnecessary to form a gap measurement window on the outer side of a pattern. Moreover, it is preferable that the exposure area used as a gap measurement window is near the short side of an exposure pattern like the area | region 656.

Moreover, when using the inner area | region of the exposure pattern 654 as a gap measurement window in this way, at the time of alignment, the gap sensor is moved to the area | region corresponding to an area | region, and the exposure pattern 654 is not arrange | positioned at the time of exposure. Evacuate the gap sensor to the unoccupied area.

In addition, various patterns can be used for the exposure pattern of a mask. For example, when making a color filter into an exposure pattern, you may make it use the exposure pattern which can expose a some color filter with one mask. Here, FIG. 75 is a front view which shows another example of a mask, FIG. 76 is a front view which shows another example of a board | substrate, and FIG. 77 is an enlarged front view which expands and shows the vicinity of the alignment mark of a board | substrate. More specifically, as shown in Figure 75, as an exposure pattern 650 of the mask ₍₃ 300M), there is a pattern of three jangbun exposing the color filter is formed to be used for television. Further, alignment marks 654a and gap measurement windows 656a and 658a are formed on one side of the outer circumference of the exposure pattern 650, and alignment marks 654b and gap measurement windows 656b and 658b on the other side thereof. ) Is formed. Moreover, each part is arrange | positioned so that the position in the direction parallel to the formed side may not overlap.

By carrying out a plurality of times the exposure for the substrate by using the mask (300M _3), the substrate (300W ₃₎ shown in Fig. 76 and the like, the mask (300M ₃₎ a zone pattern and the alignment marks and the gap measured in the 660 response to A dragon zone is formed. The substrate 300W ₃ is a case where six exposures are performed using the mask 300M ₃ , and the order of shots shown in the pattern in FIG. 76 and the numbers displayed inside the alignment and gap measurement area are as follows. It shows in which exposure is formed in the board | substrate by the 1st thru | or 6th time.

In this way, by carrying out exposure using a mask (300M _3), it can be made as shown in Fig. 76 and Fig. 77, the distance La of the adjacent pattern. Specifically, as shown in FIG. 77, the interval Lb of the alignment mark and the pattern corresponding to the suppression of the masking aperture is set, the width Lc of the alignment mark, and the interval Ld of the pattern that does not correspond to the alignment mark. La = Lb + Lc + Ld. Here, the distance Ld <distance Lb. Thereby, the space | interval between patterns can be shortened. In other words, when the alignment mark is arranged at a position at which the Y-axis coordinates become the same coordinate, La = 2Lb + 2Lc + α. Here, the width α is the distance between the alignment mark and the alignment mark. In addition, when the alignment mark is arrange | positioned in parallel like FIG. 67, it becomes larger among La = 2Lb + Lc or La = Lc + 2Ld. Therefore, as shown in FIG. 77, by shifting the position of the alignment mark and setting the interval between the pattern and the pattern Lb + Lc + Ld, the interval between patterns can be shortened more than in any case.

In addition, in the said embodiment, although the whole surface of the mask was made to transfer to the board | substrate multiple times, this invention is not limited to this, You may include exposure which only transfers a part of mask to a board | substrate. In other words, even if the space of the substrate is not an integer multiple of the mask, for example, only half of the mask and one third of the mask may be exposed on the substrate. In this case, it is preferable to arrange the alignment mark in the region to be transferred. The mask portion not transferred to the substrate is preferably blocked by an aperture (light shielding plate) or the like. Thereby, a pattern can be formed in a board | substrate more efficiently. Moreover, when only a part of mask is transferred to a board | substrate, it is preferable to set it as the area | region corresponded to an integer number of units, for example, one color filter.

Hereinafter, it demonstrates concretely using FIGS. 78-80. FIG. 78 is a front view illustrating another example of the mask, FIG. 79 is a front view illustrating another example of the substrate, and FIG. 80 is a front view illustrating the relationship between the mask and the aperture during exposure. The mask 300M ₅ shown in FIG. 78 is provided with the exposure pattern 670 and the alignment marks 676a and 676b. In addition, the exposure pattern 670 is comprised by two units (for example, color filter) 672 and 674 of the same shape. In addition, the alignment marks 676a and 676b are disposed in the region adjacent to the side of the unit 674. In addition, the alignment mark 676a and the alignment mark 676b are formed in the side which opposes each other of the unit 674, respectively. In addition, the alignment mark 676a and the alignment mark 676b become a position where the position in the direction parallel to the side which the alignment mark adjoins among the sides of the exposure pattern 670 does not overlap. In addition, in this embodiment, the opening part which becomes more than a fixed area among the units 672 and 674 is used as a gap measurement window.

Next, the substrate (300L ₅₎ shown in Fig. 79 is a substrate which can be exposed to the pattern by a mask (300M _5), and is a pattern corresponding to a forming unit 6. The substrate (300L ₅₎ is, by exposing four times with a mask (300M _5), it is possible to form any pattern. Specifically, the substrate (300L ₅₎ is, the second region corresponding to the units of the region (678a) to the exposure (shot) of the first time and the exposure, corresponding to the two units of the region (678b) to the exposure for the second time The area | region to expose is exposed. In addition, the alignment mark contained in each area | region is exposed and manufactured at the time of initial exposure and the manufacture of a black matrix, but is hidden by an aperture at the other exposure. Next, the substrate (300L ₅₎ is, the region corresponding to one unit in the region (678c) to the exposure of the third time is exposed, the region where the exposure corresponding to one unit of area (678d) to the exposure of the fourth do. Moreover, the alignment mark of the area | region in which the area | region 678a and area | region 678b overlapped, and the alignment mark of the area | region in which the area | region 678c and area | region 678d overlapped, is the same structure as the alignment mark between the patterns mentioned above. Thereby, the clearance between units can be made small.

In the third and fourth exposures, the unit on the unexposed side of the mask 300M ₅ is shielded by the aperture 679 as shown in FIG. 80. Thereby, for example, in the third exposure, the unit 672 of the mask 300M ₅ is in a state of facing the area 678b, but the unit 672 is transferred to the substrate 300W ₅ . It can be suppressed. Thus, by exposing using only a part of mask, the pattern of a unit can be efficiently formed in a board | substrate.

78 and 79, by aligning the alignment mark on the unit side used for the third and fourth times, even when only a part of the mask is used for exposure, the alignment mark is appropriately positioned. Can be adjusted. Thereby, a pattern can be formed in a board | substrate, suppressing position shift. That is, by forming the alignment mark corresponding to the case where the substrate is exposed using only a part of the mask, it is possible to form a pattern of a unit in which position shift is suppressed. In addition, since the exposure using only a part of the mask can be performed, the degree of freedom in designing the mask can be increased.

In addition, in the said embodiment, since a board | substrate can be utilized more effectively, the position in the direction parallel to the side which the alignment mark adjoins among the sides of the exposure pattern 670 was made into the position which does not overlap, but it is not limited to this. Do not. Even if the mask and the substrate are arranged at positions where the alignment marks overlap in the parallel direction, the alignment mark is formed in an area used when exposing using only a part of the mask, thereby suppressing the position shift. The pattern can be formed on a substrate. Here, FIG. 81 is a front view which shows the other example of a mask, and FIG. 82 is a front view which shows another example of a board | substrate. The mask 300M ₆ shown in FIG. 81 is provided with the exposure pattern 670 and the alignment marks 682a and 682b which consist of two units (for example, color filters) 672 and 674 of the same shape. . In addition, the alignment marks 682a and 682b are disposed in an area adjacent to the side of the unit 674. In addition, the alignment mark 682a and the alignment mark 682b are formed in the side which opposes each other of the unit 674, respectively. In addition, the alignment mark 682a and the alignment mark 682b become a position where the position in the direction parallel to the side which the alignment mark adjoins among the sides of the exposure pattern 670 overlaps. Moreover, also in this embodiment, the opening part which becomes more than a fixed area among the units 672 and 674 is used as a gap measurement window.

Next, the substrate (300L ₆₎ shown in Fig. 82 is a substrate which can be exposed to the pattern by a mask (300M _6), and is a pattern corresponding to a forming unit 6. The substrate (300L ₆₎ are, by the same manner as the substrate (300L _5), four times the exposure by the mask (300M _6), it is possible to form any pattern. Specifically, the substrate (300L ₆₎ is, the second region corresponding to the units of the region (684a) to the exposure (shot) of the first time and the exposure, corresponding to the two units of the region (684b) to the exposure for the second time The area | region to expose is exposed. In addition, the alignment mark contained in each area | region is exposed and manufactured at the time of initial exposure and the manufacture of a black matrix, but is hidden by an aperture at the other exposure. Next, the substrate (300L ₅₎ is, the region corresponding to one unit in the region (684c) to the exposure of the third time is exposed, the region where the exposure corresponding to one unit of area (684d) to the exposure of the fourth do.

In this case non-exposed side of the unit of Fig third time, the fourth time during exposure, a mask (300M ₆₎ of the, the shield aperture cheoro. Thereby, for example, in the third exposure, the unit 672 of the mask 300M ₆ is in a state facing the region 684b, but the unit 672 is transferred to the substrate 300W ₆ . It can be suppressed. Thus, by exposing using only a part of mask, the pattern of a unit can be formed in a board | substrate efficiently. In this way, even when the alignment mark is disposed at a position where the positions in the parallel direction overlap, the distance between the units becomes larger than that of the substrate 300L ₅ , but is used when the exposure is performed using only a part of the mask. By forming an alignment mark in the area | region to become, a pattern can be formed in a board | substrate, suppressing position shift. In addition, since the exposure using only a part of the mask can be performed, the degree of freedom in designing the mask can be increased.

(Seventh Embodiment)

Here, FIG. 83 is a top view which shows the exposure apparatus which concerns on 7th Embodiment of this invention in the state which removed the irradiation part. FIG. 84 is a front view of the exposure apparatus in FIG. 83.

First, the schematic structure of the exposure apparatus 801 of 7th Embodiment is demonstrated. As shown in FIG. 83 and shown in Figure 84, the exposure apparatus 801 includes a substrate (300W ₄₎ injury to the supporting box and with a substrate transport mechanism 810 for transporting in a predetermined direction (X-axis direction of FIG. 83) , Each holding a plurality of masks 300M ₄ and arranged in two rows in a zigzag shape along a direction intersecting with a predetermined direction (Y-axis direction in FIG. 83) (in the embodiment shown in FIG. 83, each left and right each 6 Of the mask holding unit 811, the mask driving unit 812 for driving the mask holding unit 811, and the plurality of irradiation units for irradiating light for exposure, respectively, disposed on the plurality of mask holding units 811. 814 (refer FIG. 84) and the control apparatus 815 which controls the operation | movement of each operation part of the exposure apparatus 801 are mainly provided.

A substrate transport mechanism (810) includes a substrate (300W _4), the X axis area for conveying in a direction, that is, formed in the lower region, and the region spanning the X-axis direction on both sides from the lower region of the plurality of mask holding portion 811 maintaining the portion unit 816 and the substrate (300W ₄₎ Y-axis direction side (upper side in FIG. 83) of the substrate provided with a driving unit (817) for carrying the X-axis direction. The floating unit 816 includes a plurality of air pads 820 that simultaneously perform exhaust or intake at the same time, each of which is formed on the plurality of frames 819, and includes a pump (not shown) or a solenoid valve (not shown). Air is exhausted or exhausted from the air pad 820 via the &quot; not shown &quot; As shown in FIG. 83, the substrate drive unit 817 includes a suction pad 822 which holds one end of the substrate 300W ₄ that is floated and supported by the floating unit 816, and includes a motor 823, the ball screw 824, and the nut along the guide rail 826 by the X-axis of a ball screw mechanism 825, direction transport mechanism consisting of a (not shown), the substrate (300W ₄₎ is conveyed in the X-axis direction. 84, the some frames 819 are arrange | positioned via the other level block 828 on the apparatus base 827 provided through the level block 818 in the ground. In addition, the substrate (300W ₄₎ has, in place of the ball screw mechanism 825, it may be carried by a linear servo actuator.

The mask driver 812 is mounted to a frame (not shown), and is provided at an end of the X axis direction driver 831 and the X axis direction driver 831 for driving the mask holding part 811 along the X axis direction. And mounted at the distal end of the Y axis direction driver 832 and Y axis direction driver 832 for driving the mask holder 811 along the Y axis direction, and the mask holder 811 in the θ direction (X). And the θ direction driving unit 833 and the θ direction driving unit 833 which are rotated in the normal plane of the horizontal plane formed in the Y axis direction, and attached to the distal end of the θ direction driving unit 833. It has a Z direction drive part 834 to drive in the vertical direction of the horizontal plane). Thereby, the mask holding | maintenance part 811 attached to the front-end | tip of the Z direction drive part 834 can be driven by the mask drive part 812 to X, Y, Z, (theta) direction. The order of arranging the X direction driver 831, the Y direction driver 832, the θ direction driver 833, and the Z direction driver 834 can be changed as appropriate. In this embodiment, the mask driving unit 812, the alignment camera based on the alignment marks of the alignment mark and the mask (300M ₄₎ of the substrate (300W ₄₎ picked up by the 835, the mask (300M ₄₎ and constitute a correction means for correcting the relative displacement of the substrate (300W _4).

Further, a mask of, Y-axis, the upstream and downstream sides of between each of the mask holding unit (811a, 811b), each of the mask holding portion 811 arranged in a respective straight line in a direction as shown in Fig. 83 (300M ₄ ) Is provided with a mask changer 802 that can be exchanged at the same time. The finished or unused mask 300M ₄ conveyed by the mask changer 802 is handed over by the mask loader 805 between the mask stockers 803 and 804. In addition, while the water supply is performed by the mask stocker 803 and the mask changer 802, the mask 300M ₄ is prealigned by a mask prealignment mechanism (not shown).

As shown in FIG. 84, the irradiation part 814 arrange | positioned above the mask holding | maintenance part 811 is a light source 841 which consists of an ultrahigh pressure mercury lamp which emits the exposure light EL containing an ultraviolet-ray, and the light source 841 An optical integrator 843 having a concave mirror 842 for condensing light emitted from the light source, a mechanism movable in the optical path direction near the focal point of the concave mirror 842, and a planar mirror for changing the direction of the optical path. 845 and spherical mirror 846, and a shutter 844 for controlling the opening and closing of the irradiation light path disposed between the plane mirror 845 and the optical integrator 843.

85 is a plan view illustrating an example of a mask. In addition, in FIG 85, there shown the convenience of three masks (300M _{4a, 4b} 300M, 300M _4c) of explanation, the mask according to one embodiment of the invention, sheet 12 as described above. As shown in FIG. 85, the mask 300M _4a held by the mask holding part 811 includes the exposure pattern 881a and both ends of the exposure pattern 881a in the Y-axis direction, that is, the exposure pattern 881a. Alignment mark 882a arrange | positioned in the vicinity of one side among two sides parallel to the conveyance direction of a board | substrate, and alignment arrange | positioned in the vicinity of the other side among two sides parallel to the conveyance direction of the board | substrate of exposure pattern 881a. Has a mark 884a. The mask 300M _4b also has the exposure pattern 881b and the alignment marks 882b and 884b in the same manner, and the mask 300M _4c also has the exposure pattern 881c and the alignment marks 882c and 884c. ) In addition, 300M _4a , 300M _4b , and 300M _4c differ only in arrangement positions, and an exposure pattern etc. are the same shape. In addition, the exposure pattern may have a different shape in each mask.

Here, the alignment mark 882a of the mask 300M _4a and the alignment mark 884a are arrange | positioned in the position which does not overlap with the position in the direction parallel to an X axis. That is, the alignment mark 411 and the alignment mark 412 are arrange | positioned at the coordinate which differs in X-axis coordinate. In addition, the masks 300M _4b and 300M _4c have the same configuration.

In addition, in the mask 300M _4a and the mask 300M _4b , the masks adjacent to the Y-axis direction have a distance between the exposure pattern 881a and the exposure pattern 881b in the Y-axis direction. It is arrange | positioned at the arrangement | sequence interval shorter than 2 times of the distance from the alignment mark to the outer side (end of the side separated from the end of a pattern).

Here, FIG. 86 is a top view which shows an example of schematic structure of a board | substrate. Next, the substrate (300W ₄₎ is, a pattern (890a), the pattern (890b), the pattern (890c) is formed, as shown in Figure 86. Further, 86 is, and represents only a portion of the substrate (300W _4), the substrate (300W _4), there are three or more pattern is formed. Moreover, the alignment mark 892a arrange | positioned in the vicinity of one side among the two sides parallel to the conveyance direction of the board | substrate of the pattern 890a of the Y-axis direction of the pattern 890a, and the pattern 890a, It has the alignment mark 894a arrange | positioned in the vicinity of the other side among two sides parallel to the conveyance direction of a board | substrate. Similarly, the pattern 890b has alignment marks 892b and 894b, and the pattern 890c also has alignment marks 892c and 894c. Moreover, on the other side of the pattern 890c, the alignment mark 892d corresponding to the adjacent pattern is formed.

In addition, the arrangement | positioning interval of the patterns of board | substrates also arrange | positions in the arrangement | positioning interval whose distance in a Y-axis direction is shorter than twice the distance from the end of a pattern to the outer side of the alignment mark (the end of the side separated from the end of a pattern). It is. Moreover, the arrangement | positioning interval of a pattern and the arrangement | positioning interval of an exposure pattern are the same.

Further, the above a substrate (300W ₄₎ and the imaging means of the alignment camera 835 for detecting the relative position of the mask (300M ₄₎ of the mask holding unit 811, can observe the alignment marks of the mask (300M ₄₎ In the position, it is arrange | positioned for every some mask holding part 811. Of the alignment camera (835) may include, and applied to a known arrangement, the substrate, the substrate (300W ₄₎ and the mask (300M ₄₎ from the position of the alignment mark of the position and the mask (300M ₄₎ of the alignment mark of (300W ₄₎ Detect the relative position.

Next, using this exposure apparatus 801, and coloring in black substrate (300W ₄₎ the matrix is formed of layers R, G, FIG. As for the method of exposing the transfer any of B 87, see FIG. 88 to FIG. 91 Explain. Here, FIG. 87 is a flowchart which shows the operation | movement of the exposure apparatus shown in FIG. 88-91 is explanatory drawing for demonstrating the operation | movement of the exposure apparatus shown in FIG. 83, respectively. In addition, in FIG. 88 to FIG. 91, for simplicity, and the upstream and downstream sides of the mask (300M _4), each of the three. First, the exposure apparatus 801 turns on the substrate 300W ₄ by the air flow of the air pad 820 of the floating unit 816 in the state where the light source 841 of the irradiation unit 814 is turned on and the shutter 344 is closed. ) to maintain the injury, and the absorption end of the substrate (300W ₄₎ to the substrate drive unit 817 is conveyed in the X-axis direction (step S312). And, as shown in Figure 88, the substrate (300W ₄₎ is when you get to the step movement start position (step S314), then step movement of the substrate (300W ₄₎ (step S316). The exposure apparatus 801, followed by step movement of the substrate (300W ₄₎ in step S316, the substrate (300W ₄₎ enters the lower portion of the mask holding portion (811a) on the upstream side, by each of the alignment camera 835, the substrate and imaging the alignment marks of the alignment mark and the mask (300M ₄₎ of (300W ₄₎ to observe the relative position displacement to process the image obtained by (step S318), the image pickup (step S320). Then, by driving the mask driving unit 812 on the basis of the data of the position displacement, and correct the misalignment of the mask (300M ₄₎ and the substrate (300W ₄₎ the position of the mask (300M ₄₎ and the substrate (300W ₄₎ (Step S322).

Then, in the state where the position of the substrate 300W ₄ is aligned and stopped, the shutter 844 of the irradiation unit 814 is controlled to be opened (step S326), and the light EL for exposure from the irradiation unit 814 is a mask 300M _4. ) Is irradiated to the substrate 300W ₄ , and the pattern 885 of the mask 300M ₄ is transferred (exposure) to the color resist applied to the substrate 300W ₄ at the leading exposed portion (step S328). . Then, when the exposure transfer is performed for a predetermined amount of light, the shutter 644 is closed and controlled (step S330).

As a result, when the exposure transfer of the first to-be-exposed part is completed, the substrate until the next to-be-exposed part subjected to the next exposure-transfer is at the position below the pattern 883 of the mask 300M _{4 in the} same manner as above. Step 300W ₄ is moved, and then alignment is performed (see Fig. 90). By opening / closing the shutter 844, the exposure light EL is irradiated onto the substrate 300W ₄ by a predetermined amount of light to a subsequent exposed portion, and exposure transfer is performed.

In addition, the exposed area existing between the transfer pattern (883) exposed by the mask (300M ₄₎ on the upstream side, and the portion to be exposed Pinot transferred through the mask (300M ₄₎ on the downstream side. Therefore, by step movement, a substrate (300W ₄₎ is when the user moves to the lower position of the downstream-side mask holding portion (811b) of the mask of the exposure and in synchronization with the downstream side of the mask at the upstream side (300M ₄₎ (300M _The position of the mask holding part 811 in the X-axis direction is set so that exposure by ₄ ) may be performed. When the step movement operation is performed, the downstream mask driver 812 also performs alignment of the mask with respect to the Y axis direction, and when the step movement is stopped, the exposure transfer is performed even in the downstream mask 300M ₄ . Is carried out (see FIG. 91).

It is determined in step S332 whether such exposure has been performed on the entire substrate 300W ₄ , and when it is determined in step S332 not to be performed on the entire substrate 300W ₄ (No), the flow proceeds to step S316. In this manner, the step movement operation, the positioning operation, and the exposure operation are repeatedly performed until the entire substrate 300W ₄ is exposed. In addition, the exposure apparatus 801 ends the process when it is determined (Yes) that it has been performed on the entire substrate 300W ₄ in step S332. As a result, by repeating the operation of both over the entire exposure area of the substrate (300W _4), the colored layer which is transferred to an exposure the substrate.

In addition, by performing such an exposure operation for each of the colors R, G, and B, three color patterns are exposed and transferred to the black matrix. In addition, when subjected to the exposure transfer of the remaining colors, when carrying by shifting the position of the Y-axis direction of the substrate (300W _4), it can be used the same mask (300M _4).

As described above, according to exposure apparatus 801, and a proximity exposure method of this embodiment, under the control of the controller 815, by moving the substrate (300W _4), Pinot portion of the substrate (300W ₄₎ each The exposure light EL is interposed between the step movement to stop at the position below the pattern 883 of the mask 300M ₄ and the substrate 300W ₄ stopped in each step movement via the plurality of masks 300M ₄ . because to illuminate, and repeating the exposure operation for exposing a pattern (883) of each mask (300M ₄₎ to the substrate (300W _4), it is possible to expose a random repeating pattern.

In addition, when forming a plurality of masks as in the exposure apparatus 801 and exposing a pattern while carrying a short conveyance of a board | substrate in one direction, the position of the alignment mark of a mask is shifted, and also the distance between exposure patterns. By adjusting, the pattern can be efficiently formed on the substrate. Moreover, the same mask can be used for several masks. Here, FIG. 92 is a top view which shows the other example of the arrangement position of a mask. For the example, in the case of using a mask (300M ₅₎ position has a becomes equal to the alignment mark in a direction parallel to the direction in which the substrate (300W ₅₎ As shown in Fig. 92, the substrate (300W ₅₎ Since the positions of the alignment marks to be formed are the same, the distance between the pattern portion and the pattern portion is equal to the distance from the end of the pattern from the end of the pattern to the outside of the alignment mark (end of the side away from the end of the pattern). It needs to be more than twice the distance. Therefore, although the space | interval of a pattern part and a pattern part becomes wide, in this embodiment, the space | interval of this pattern part and a pattern part can be narrowed more.

In addition, each irradiator 814 includes a light source 841 made of an ultra-high pressure mercury lamp, and a shutter 844 that can shield the light EL for exposure between the light source 841 and the mask holder 811, thereby providing a YAG. It can be configured at a relatively low cost compared with the case of using a flash laser light source. Moreover, the photoresist which is a photoresist used for a color filter can also apply the normal thing optimized when a mercury lamp is exposed, and it is necessary to adjust the photoresist required when using a YAG flash laser light source. none. Moreover, since such an effect can be acquired, it is preferable to use a mercury lamp, but you may use a flash laser light source. In addition, the illumination optical system 3 of the exposure apparatus shown in FIG. 53 is also the same.

In the exposure apparatus 801, the mask 300M ₄ is used. Although 12 pieces of were arranged, the sum of the masks is not limited to this and may be two or more pieces. In addition, the arrangement | positioning method of a mask is not limited to zigzag arrangement | positioning of 2 steps, either. For example, the zigzag arrangement in three stages may be used.

Here, in the above embodiment, one alignment mark and two gap measurement windows are formed on one side corresponding to one exposure pattern, and one alignment mark and one side corresponding to one pattern part. Although two gap measurement areas were formed, the number of the alignment mark, gap measurement window, and gap measurement area | region formed in one side is not specifically limited. For example, alignment marks may be formed in two (two locations) on one side of the exposure pattern of a mask or the pattern part of a to-be-exposed board | substrate, or four alignment marks may be formed. In addition, even when a plurality of alignment marks are formed, the distance between the pattern portions of the substrate to be exposed is provided by arranging the positions in the direction parallel to the Y axis so as not to overlap with each other so that the positions of all the alignment marks do not overlap. Can be shortened. Moreover, the arrangement | positioning method in the case of arrange | positioning a some alignment mark in one side is not specifically limited, You may arrange | position at equal intervals or you may arrange | position at the edge part of a side.

In addition, in the said embodiment, although the outer periphery was made into the shape which an outer edge becomes a rectangular shape, the exposure pattern of a mask and the board | substrate of a board | substrate are not limited to this invention. The exposure pattern and pattern portion of the mask may be, for example, a shape in which the outer periphery is trapezoidal, polygonal, and part of which is curved. In either case, one alignment mark is formed adjacent to the exposure pattern and the first side of the pattern portion, the other alignment mark is formed on the second side opposite to the first side, and the first side and the second side are By arranging one alignment mark and the other alignment mark in the position which does not overlap with each other in the direction parallel to a center line (ie, when viewed from the direction orthogonal to a center line), the same effect as the above can be acquired. Moreover, the centerline of a 1st side and a 2nd side is a line parallel to the average line of the side which a pattern and an adjacent pattern face. In other words, the first side and the second side are opposed to each other to form a centerline when the outer edge of the exposure pattern and the pattern portion is approximated to a rectangular shape. Moreover, in the method of approximating the outer edge of an exposure pattern or a pattern part to a rectangular shape, the rectangular shape is made into the outer edge of an exposure pattern or a pattern part so that the opposing side may circumscribe | circulate the 1st side and the opposing other side may circumscribe | circulate the 2nd side. Circumscribe to In addition, you may change the angle of a 1st side and a 2nd side at the time of approximation. Moreover, a center line is a direction orthogonal to the direction to which a board | substrate and a mask move relatively, when forming a pattern in the position adjacent to the side in which the alignment mark is formed at the time of exposure. Thus, when exposing several times irrespective of the exposure pattern of a mask and the shape of the pattern part of a board | substrate, the space of a board | substrate can be utilized more effectively by shifting the position of the alignment mark from a symmetrical position, and making it into a position which does not overlap. . The gap measurement window and the gap measurement area are also the same.

Moreover, when a mask and a to-be-exposed board | substrate see the formation position of the alignment mark, the gap measurement window, and the gap measurement area | region respectively formed in the two opposing sides, at least in a step direction (that is, the direction orthogonal to a step direction) In other words, the coordinates in the axial direction orthogonal to the step direction) may be formed at positions not overlapping with each other. Here, a step direction is a direction parallel to the line segment which connected the same position between the pattern and the adjacent pattern in the surface of the mask and the relative movement of a board | substrate. The same applies to the mask.

In addition, in the said embodiment, when the exposure pattern of a mask and the pattern part of a board | substrate were approximated to a rectangle, alignment was formed only in the two opposing sides of a rectangle, You may form an alignment mark also in the side orthogonal to the two opposing sides. That is, the alignment mark may be formed in three or more sides of the rectangle when the pattern part of a board | substrate is approximated to a rectangle, and an alignment mark may be formed in all four sides. Moreover, when forming an alignment mark in four sides, since a board | substrate can be utilized effectively, it is preferable to arrange | position so that each alignment mark of two sets of opposing sides may not mutually overlap, but one set of opposing sides is You may arrange | position an alignment mark at the position which overlaps.

In addition, all the said embodiment demonstrated the case where the alignment mark was formed in the two opposite sides at least. Here, when a mask and a to-be-exposed board | substrate approximate a rectangle of the exposure pattern of a mask and the pattern part of a board | substrate, you may arrange | position an alignment mark in the position which adjoins two sides orthogonal to each other. Hereinafter, the description will be given with reference to FIGS. 93 and 94. 93 is a front view which shows the other example of a mask, and FIG. 94 is a front view which shows another example of a board | substrate. In addition, both the exposure pattern of the mask shown in FIG. 93 and the pattern part of the board | substrate shown in FIG. 94 are rectangular shape. In addition, since the exposure pattern of the mask, the alignment mark, the gap measurement window, the pattern of the substrate, the alignment mark, and the gap measurement region differ only in the arrangement position, they are the same as the above-described mask and substrate, and thus the detailed description thereof will be omitted. .

The mask 300M ₇ shown in FIG. 93 has the transparent plate-shaped base material 909, the exposure pattern 910 in which the pattern exposed to the board | substrate 300W was formed, and the alignment mark 911 formed around the exposure pattern 910. 912, and gap measurement windows 914, 916, 918, and 919.

The alignment mark 911 is disposed adjacent to the side parallel to the X axis direction of the exposure pattern 910. The alignment mark 912 is disposed adjacent to the side parallel to the Y axis direction of the exposure pattern 910. That is, the alignment mark 911 and the alignment mark 912 are arrange | positioned adjacent to the mutually orthogonal side of the exposure pattern 910, respectively. In addition, the alignment mark 911 and the alignment mark 912 are arrange | positioned outside the exposure pattern 910.

The gap measurement window 914 and the gap measurement window 916 are disposed adjacent to sides parallel to the X axis direction of the exposure pattern 910. In addition, the gap measurement window 918 and the gap measurement window 919 are arrange | positioned adjacent to the side parallel to the Y-axis direction of the exposure pattern 910. The gap measurement window 914, the gap measurement window 916, the gap measurement window 918, and the gap measurement window 919 are also disposed outside the exposure pattern 910. In addition, the gap measurement window 914 and the gap measurement window 918 are arrange | positioned at the same side as the alignment mark 911. As shown in FIG. In addition, the gap measurement window 916 and the gap measurement window 919 are arrange | positioned at the same side as the alignment mark 912. As shown in FIG. In addition, the gap measurement window 914 and the gap measurement window 918 are arrange | positioned through the alignment mark 911, and the gap measurement window 916 and the gap measurement window 919 are the alignment mark 912. It is arranged to interpose.

Next, with reference to FIG 94, a description is given to the substrate (300W _7). Substrate (300W ₇₎ is, it, is formed of four patterns (920a, 920b, 920c, 920d ) , as shown in Figure 94. Moreover, the pattern 920a and the pattern 920b are adjacent to the X-axis direction, the pattern 920a and the pattern 920c are adjacent to the Y-axis direction, and the pattern 920c and the pattern 920d are , It is adjacent to the X axis direction. In other words, four patterns are arranged on the grid in the substrate 300W.

In addition, the substrate (300W ₇₎ are, respectively, the periphery of the four patterns (920a, 920b, 920c, 920d ), in the same manner as the mask (300M _7), there are alignment marks and, for measuring gap region is formed.

Here, the alignment mark 921a and the gap measurement area 924a are located at a position adjacent to one of the two sides parallel to the Y axis of the pattern 920a (the side not facing the pattern 920b). And the gap measurement region 928a, and the alignment mark 922a at a position adjacent to one side (side facing the pattern 920c) of two sides parallel to the X axis of the pattern 920a. ), A gap measurement region 926a and a gap measurement region 929a are formed. Further, in the substrate (300W _7), the pattern (920a) and the alignment marks (921a, 922a), a gap region (924a, 926a, 928a, 929a ) for the measurement is a one shot unit. The alignment mark 921b and the gap measurement region 924b are located at positions adjacent to one of the two sides parallel to the Y axis of the pattern 920b (the side facing the pattern 920a). An alignment mark 922b is formed at a position adjacent to the other side (the side opposite to the pattern 920d) of the two sides parallel to the X axis of the pattern 920b, having a gap measurement region 928b formed therein. And a gap measurement region 926b and a gap measurement region 929b are formed. Similarly, alignment marks 921c and 922c and gap measurement regions 924c, 926c, 928c and 929c are formed at positions corresponding to the pattern 920c, and alignment marks are formed at positions corresponding to the pattern 920d. 921d and 922d and gap measurement regions 924d, 926d, 928d and 929d are formed.

Here, the substrate 300W ₇ also has a pattern spaced at a spacing interval shorter than twice the distance from the end of the pattern to the outside of the alignment mark (the end of the side away from the end of the pattern). can be formed, the distance is shorter than the interval of the pattern to the pattern on the substrate (300W _7).

Like the mask 300M ₇ and the substrate 300W ₇ , an alignment mark and / or a gap measurement window (gap measurement region) are formed only on two sides that are orthogonal to each other among the four sides, so that the pattern and the pattern between the patterns, The alignment mark and / or gap measurement window (gap measurement area | region) of the short unit of one pattern can be formed. As a result, the alignment mark and / or the gap measurement window (gap measurement area) can be configured so as not to overlap. As mentioned above, the distance between a pattern and a pattern can also be shortened by providing an alignment mark and / or a gap measurement window (gap measurement area | region) only in two sides orthogonal to four sides.

This application is Japanese Patent Application No. 2010-039025, filed February 24, 2010, Japanese Patent Application No. 2010-040353, filed February 25, 2010, Japanese Patent Application No. 2010-042532, filed February 26, 2010 Japanese Patent Application No. 2011-031272, filed February 16, 2011, and Japanese Patent Application No. 2011-031273, filed February 16, 2011, the contents of which are incorporated herein by reference.

10: mask stage
18: alignment camera
20: substrate stage
40: aperture (light intensity adjustment unit)
70: illumination optical system
71: lamp
72: reflector
73: light source
74: integrator lens (integrator)
76: optical control unit (control unit)
80, 80A: light irradiation device
81, 81A: Cassette
82, 82A: support
83 light source support
84: lamp pressurized cover
87: lamp pressurization mechanism
90: cassette mounting portion
91: support body
92: support cover
96a: timer
101: proximity scan exposure apparatus (exposure apparatus)
120: substrate transfer mechanism
121: floating unit
140: substrate drive unit
150: substrate alignment mechanism
160: substrate alignment mechanism
170: mask holding mechanism
171: mask holding unit
172: mask driving unit
180: research unit
190: light shielding device
210: Diffusion Lens
301, 501: exposure apparatus
303: Illumination Optical System
304: mask stage
305: work stage
410: exposure pattern
411, 112: alignment mark
414, 416, 418, 419: gap measurement window
M, 300M: mask
p: pattern
PE: Sequential proximity exposure device (exposure device)
W, 300W: glass substrate (exposed material, substrate, exposed substrate)

Claims (34)

A substrate holding part for holding a substrate as an exposed material;
A mask holding part for holding a mask so as to face the substrate;
A plurality of light source units each including a light emitting unit and a reflection optical system that emits light emitted from the light emitting unit by directivity, an integrator into which light from the plurality of light source units is incident, and light emitted from the integrator is substantially parallel And an illumination optical system having a collimation mirror for converting the light and a shutter for controlling the opening and closing to transmit or block the light from the light source unit,
A proximity exposure apparatus for irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask,
The light emitted from at least one of the plurality of light source units is incident on the integrator through a position where the main optical axis thereof is shifted from the center of the integrator. The method of claim 1,
The illumination optical system includes a plurality of cassettes each capable of mounting a predetermined number of the light source units, and a support on which the plurality of cassettes can be mounted.
Each said cassette is equipped with said predetermined number of light source parts so that the intersection of each main optical axis of the light radiate | emitted from the said predetermined number of light source parts may substantially correspond,
And the plurality of cassettes are mounted on the support such that the intersections of the respective main optical axes of the light emitted from the predetermined number of light source units of the cassettes are at different positions. A substrate holding part for holding a substrate as an exposed material;
A mask holding part for holding a mask so as to face the substrate;
A light source unit including a light emitting unit and a reflection optical system that emits light emitted from the light emitting unit by directivity, an integrator in which light from the light source unit is incident, and a collie for converting light emitted from the integrator into approximately parallel light. An illumination optical system having a simulation mirror and a shutter for controlling opening and closing to transmit or block light from the light source unit,
A proximity exposure apparatus for irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask,
And a light intensity adjusting unit for adjusting the intensity of light emitted from the emitting surface, in the vicinity of the emitting surface of the light source unit. The method of claim 3, wherein
And the light intensity adjusting unit is an aperture including a central portion of the exit surface to partially shield the light. The method according to claim 3 or 4,
The light source unit includes a plurality of light source units each including the light emitting unit and the reflective optical system,
The light intensity adjusting unit is formed in the plurality of light source units, respectively, characterized in that the proximity exposure apparatus. The method of claim 5, wherein
The illumination optical system includes a plurality of cassettes each capable of mounting a predetermined number of the light source units, and a support on which the plurality of cassettes can be mounted.
And the light intensity adjusting unit is an aperture that partially shields each exit surface, including a central portion of each exit surface of the entire predetermined number of light source units mounted in the cassette. A substrate holding part for holding a substrate as an exposed material;
A mask holding part for holding a mask so as to face the substrate;
A light source unit including a light emitting unit and a reflection optical system that emits light emitted from the light emitting unit by directivity, an integrator in which light from the light source unit is incident, and a collie for converting light emitted from the integrator into approximately parallel light. An illumination optical system having a simulation mirror and a shutter for controlling opening and closing to transmit or block light from the light source unit,
A proximity exposure apparatus for irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask,
And a light intensity adjuster for adjusting the intensity of light incident on the incident surface on the incident surface of the integrator. The method of claim 7, wherein
The integrator is a fly-eye integrator or a rod integrator in which a plurality of lens elements are arranged in a vertical and horizontal direction,
And the light intensity adjusting unit is a plurality of apertures partially shielding including a central portion of an incident surface of each lens element. The method according to any one of claims 1 to 8,
A diffusion lens for diffusing light from the light source unit is formed between the light source unit and the integrator. A plurality of light source parts each including a light emitting part and a reflection optical system which emits light by directing the light generated from the light emitting part;
A plurality of cassettes each capable of mounting a predetermined number of the light source units;
And a support on which the plurality of cassettes can be mounted,
Each said cassette is equipped with said predetermined number of light source parts so that the intersection of each main optical axis of the light radiate | emitted from the said predetermined number of light source parts may substantially correspond,
And the plurality of cassettes are mounted on the support such that the intersections of the respective main optical axes of the light emitted from the predetermined number of light source units of the respective cassettes are at different positions. A plurality of light source parts each including a light emitting part and a reflection optical system which emits light by directing the light generated from the light emitting part;
A plurality of cassettes each capable of mounting a predetermined number of the light source units;
A support capable of mounting the plurality of cassettes,
And a plurality of apertures respectively formed in each of the cassettes, and including a plurality of apertures partially shielding each exit surface, including a central portion of each exit surface of the entire predetermined number of light source units mounted in the cassette. Light irradiation device. The method of claim 11,
The aperture is a light irradiation apparatus for an exposure apparatus, characterized in that mounted to be detachably attached to the cassette. A plurality of substrate holding portions each holding a substrate as an object to be exposed, a mask holding portion holding a mask so as to face the substrate, and a reflecting optical system that emits light by emitting light from the light emitting portion and the light emitting portion; A light source unit of the light source unit, an integrator into which light from the plurality of light source units is incident, a collimation mirror that converts light emitted from the integrator into approximately parallel light, and a shutter that controls opening and closing to transmit or block light from the light source unit. As a proximity exposure method using the proximity exposure apparatus provided with the illumination optical system to have,
Arranging the plurality of light source parts such that light emitted from at least one of the plurality of light source parts is incident on the integrator through a position in which the main optical axis thereof is displaced from the center of the integrator;
And a step of irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask. A light source unit including a substrate holding unit for holding a substrate as an object to be exposed, a mask holding unit for holding a mask so as to face the substrate, a light emitting unit and a reflecting optical system which emits light by directing light emitted from the light emitting unit; And an illumination optical system having an integrator in which light from the light source unit is incident, a collimation mirror for converting light emitted from the integrator into substantially parallel light, and a shutter for opening and closing control to transmit or block light from the light source unit. As a proximity exposure method using the proximity exposure apparatus to
Forming a light intensity adjusting unit for adjusting the intensity of light emitted from the emitting surface in the vicinity of the emitting surface of the light source unit;
And a step of irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask. 15. The method of claim 14,
The light intensity adjusting unit includes a plurality of apertures, each of which has a shielding area that partially shields, including a central portion of the emission surface, according to the exposed substrate,
The desired exposure method is formed in the vicinity of the emission surface of the light source unit according to the exposed substrate. A light source unit including a substrate holding unit for holding a substrate as an object to be exposed, a mask holding unit for holding a mask so as to face the substrate, a light emitting unit and a reflecting optical system which emits light by directing light emitted from the light emitting unit; And an illumination optical system having an integrator in which light from the light source unit is incident, a collimation mirror for converting light emitted from the integrator into substantially parallel light, and a shutter for opening and closing control to transmit or block light from the light source unit. As a proximity exposure method using the proximity exposure apparatus to
Forming a light intensity adjusting unit on the incidence surface of the integrator to adjust the intensity of light incident on the incidence surface;
And a step of irradiating light from said illumination optical system to said substrate through said mask, with a predetermined gap formed between said substrate and said mask. The method according to any one of claims 13 to 16,
A diffusion exposure lens is formed between the light source unit and the integrator to diffuse light from the light source unit. It manufactures using the proximity exposure method in any one of Claims 13-17. The manufacturing method of the board | substrate characterized by the above-mentioned. A mask for exposing a pattern to the to-be-exposed substrate by moving relative to the to-be-exposed substrate in a step direction;
An exposure pattern having a pattern exposed on the exposed substrate,
A first alignment mark formed at a position adjacent to a first side of the exposure pattern outer edge;
Has a second alignment mark formed at a position adjacent to a second side opposite the first side of the exposure pattern outer edge,
The said 1st alignment mark is arrange | positioned in the position which does not overlap with the position in which the said 2nd alignment mark is formed, when seen from the said step direction. The method of claim 19,
A first measurement window formed at a position adjacent to the first side;
And a second measurement window formed at a position adjacent the second side. 21. The method of claim 20,
The mask which is formed in the position which does not overlap with the said 1st measurement window and the position where the said 2nd measurement window is formed, when it sees from the said step direction. In the mask which exposes a pattern to a to-be-exposed board | substrate,
An exposure pattern having a pattern exposed on the exposed substrate,
A first alignment mark formed at a position adjacent to a first side of the exposure pattern outer edge;
And a second alignment mark formed at a position adjacent to a second side extended in a direction different from said first side of said exposure pattern outer periphery. A to-be-exposed board | substrate with which a pattern is formed by moving relative to a mask and a step direction,
With a transparent plate member,
A pattern portion having a pattern formed on a surface of the plate member, a first alignment mark formed at a position adjacent to a first side of the pattern portion outer circumference of the plate member surface, and the first portion of the pattern region outer circumference of the plate member surface It has a short unit comprised of the 2nd alignment mark formed in the position adjacent to the 2nd side opposite to 1 side,
The said 1st alignment mark is formed in the position which does not overlap with the position in which the said 2nd alignment mark is formed, when seen from the said step direction. The to-be-exposed board | substrate characterized by the above-mentioned. The method of claim 23,
The short unit includes: a first measurement area formed at a position adjacent to the first side;
And a second measurement region formed at a position adjacent to said second side. The method of claim 24,
The said 1st measuring area | region is formed in the position which does not overlap with the position in which the said 2nd measuring window is formed, when seen from the said step direction. With a transparent plate member,
A pattern portion having a pattern formed on a surface of the plate member, a first alignment mark formed at a position adjacent to a first side of the pattern portion outer circumference of the plate member surface, and the first portion of the pattern region outer circumference of the plate member surface A to-be-exposed board | substrate which has a short unit comprised from the 2nd alignment mark formed in the position adjacent to the 2nd side extended in a direction different from a 1 side. 27. The method according to any one of claims 23 to 26,
Having a plurality of the short unit,
The interval between the pattern portion and the pattern portion disposed adjacent to the first side or the second side is L ₁ ,
If the distance from the end of the pattern portion to the end of the alignment mark separated from the end of the pattern portion is L ₂ ,
An exposed substrate, wherein 0 <L ₁ <2L ₂ . The method according to any one of claims 23 to 27,
The alignment mark has an adjacent pattern closer to the corresponding pattern portion. A mask based on any one of claims 19 to 22,
A mask support mechanism for supporting the mask,
A substrate holding mechanism supporting the substrate to be exposed,
A moving mechanism for relatively moving said mask and said exposed substrate,
An irradiation optical system for irradiating the light passed through the mask to the exposed substrate;
It has a control apparatus which controls the movement of the said moving mechanism, and irradiation of the light by the said irradiation optical system,
The control device is adjacent to a side corresponding to the second side of the pattern portion exposed on the exposed substrate, the first side of the exposure pattern of the mask, and the exposure position of the exposure pattern and the exposed side. When the distance between the pattern portion is L ₁ and the distance from the end of the pattern portion to the end away from the end of the pattern portion of the alignment mark is L ₂ , the mask and the position are placed at a position where 0 <L ₁ <2L _2. An exposure apparatus which moves a to-be-exposed board | substrate relatively and exposes the said exposure pattern to the to-be-exposed board | substrate. The method of claim 29,
And an alignment camera formed on the exposed substrate, an alignment camera for acquiring an image of the alignment mark formed on the mask, and a camera moving mechanism for moving the alignment camera,
And the control device relatively moves the mask and the substrate to be exposed by the moving mechanism based on the position of the alignment mark of the image acquired by the alignment camera. 32. The method according to claim 29 or 30,
And a gap sensor for measuring the distance between the mask and the substrate to be exposed. The method of any one of claims 29 to 31,
The mask support mechanism maintains the mask at a position proximate to the exposed substrate. An exposure method in which the mask and the pinot substrate are moved relatively in the step direction, and the exposure pattern formed on the mask is exposed to a plurality of positions of one exposed substrate,
A first alignment mark formed at a position adjacent to a first side of the exposure pattern outer edge, a second alignment mark formed at a position adjacent to a second side opposite to the first side of the exposure pattern outer periphery, and the first alignment mark In the case where the mark is viewed from the step direction, using a mask disposed at a position not overlapping with the position at which the second alignment mark is formed,
The first side of the exposure pattern of the mask is adjacent to the side corresponding to the second side of the pattern portion exposed on the exposed substrate, and the exposure position of the exposure pattern and the interval between the exposed pattern portions are L; ₁ and the distance from the end of the pattern portion to the end of the alignment mark separated from the end of the pattern portion is L ₂ , the mask and the substrate to be exposed at a position where 0 <L ₁ <2L _2. Relatively to the step direction and exposing the exposure pattern to the exposed substrate. The method of claim 33, wherein
And exposing the exposure pattern to an alignment mark adjacent to the pattern portion exposed to the exposed substrate than to the alignment mark of the mask on the exposed substrate.

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