KR20120030398A - 제 1 기판 및 제 2 기판을 갖는 부품 및 그의 제조 방법 - Google Patents

제 1 기판 및 제 2 기판을 갖는 부품 및 그의 제조 방법 Download PDF

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Publication number
KR20120030398A
KR20120030398A KR1020117028546A KR20117028546A KR20120030398A KR 20120030398 A KR20120030398 A KR 20120030398A KR 1020117028546 A KR1020117028546 A KR 1020117028546A KR 20117028546 A KR20117028546 A KR 20117028546A KR 20120030398 A KR20120030398 A KR 20120030398A
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KR
South Korea
Prior art keywords
substrate
connecting material
component
optoelectronic device
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020117028546A
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English (en)
Korean (ko)
Inventor
안젤라 에버하르트
울리케 비어
요아힘 비어트-쇤
에발트 푀슬
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20120030398A publication Critical patent/KR20120030398A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
KR1020117028546A 2009-04-30 2010-04-28 제 1 기판 및 제 2 기판을 갖는 부품 및 그의 제조 방법 Ceased KR20120030398A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102009019518 2009-04-30
DE102009019518.1 2009-04-30
DE102009036395.5 2009-08-06
DE102009036395A DE102009036395A1 (de) 2009-04-30 2009-08-06 Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
KR20120030398A true KR20120030398A (ko) 2012-03-28

Family

ID=42813791

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117028546A Ceased KR20120030398A (ko) 2009-04-30 2010-04-28 제 1 기판 및 제 2 기판을 갖는 부품 및 그의 제조 방법

Country Status (7)

Country Link
US (1) US20120187447A1 (https=)
EP (1) EP2425469B1 (https=)
JP (1) JP2012525312A (https=)
KR (1) KR20120030398A (https=)
CN (1) CN102439750B (https=)
DE (1) DE102009036395A1 (https=)
WO (1) WO2010124682A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8835912B2 (en) * 2012-10-18 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd Organic light-emitting diode and display device having the same
EP2992063B1 (en) * 2013-05-03 2019-06-26 FMC Kongsberg Subsea AS Elastomeric seal
KR102049369B1 (ko) * 2013-05-21 2019-11-29 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
JPS5918132A (ja) 1982-07-23 1984-01-30 Iwaki Glass Kk 封着用硝子組成物
JPH02120259A (ja) * 1988-10-28 1990-05-08 Toshiba Corp ガラスの封止接合体およびその製造方法
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
US4997718A (en) * 1989-11-08 1991-03-05 Vlsi Packaging Materials, Inc. Silver phosphate glass die-attach composition
DE4128804A1 (de) 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
JPH05147974A (ja) * 1991-11-25 1993-06-15 Nippon Electric Glass Co Ltd 封着材料
US5334558A (en) * 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
JP2001126863A (ja) * 1999-10-27 2001-05-11 Nippon Seiki Co Ltd 有機エレクトロルミネッセンス素子
JP2003007453A (ja) * 2001-06-26 2003-01-10 N S G Glass Components:Kk 有機ｅｌ素子
JP3843912B2 (ja) * 2001-10-22 2006-11-08 株式会社村田製作所 多層回路基板用ガラスセラミック材料および多層回路基板
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
US7304429B2 (en) * 2002-06-28 2007-12-04 Canon Kabushiki Kaisha Image display apparatus with first and second substrates in a hermetic container sealed by a conductive bonding member therebetween
US20040188859A1 (en) * 2003-03-25 2004-09-30 Intel Corporation Filler compositions, apparatus, systems, and processes
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
JP2005340020A (ja) 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
US20060290261A1 (en) * 2005-06-17 2006-12-28 Yuichi Sawai Bonding material
JP2007043080A (ja) * 2005-06-29 2007-02-15 Fujifilm Holdings Corp 有機電界発光素子を用いた光源
DE102005044523A1 (de) * 2005-09-16 2007-03-29 Schott Ag Verfahren zum Verbinden von Elementen mit Glaslot
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
JP2009067632A (ja) * 2007-09-13 2009-04-02 Nippon Electric Glass Co Ltd 光部品用封着ガラスおよび光部品の封着方法

Also Published As

Publication number Publication date
CN102439750B (zh) 2016-04-06
CN102439750A (zh) 2012-05-02
EP2425469A1 (de) 2012-03-07
US20120187447A1 (en) 2012-07-26
DE102009036395A1 (de) 2010-11-04
JP2012525312A (ja) 2012-10-22
WO2010124682A1 (de) 2010-11-04
EP2425469B1 (de) 2019-01-09

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