JP2012525312A - 第１及び第２の基板を有する素子並びにその製造方法 - Google Patents

第１及び第２の基板を有する素子並びにその製造方法 Download PDF

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Publication number
JP2012525312A
JP2012525312A JP2012507603A JP2012507603A JP2012525312A JP 2012525312 A JP2012525312 A JP 2012525312A JP 2012507603 A JP2012507603 A JP 2012507603A JP 2012507603 A JP2012507603 A JP 2012507603A JP 2012525312 A JP2012525312 A JP 2012525312A
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JP
Japan
Prior art keywords
substrate
connecting material
filler
optoelectronic element
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2012507603A
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English (en)
Japanese (ja)
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JP2012525312A5 (https=
Inventor
エーバーハート アンゲラ
ベーア ウルリケ
ヴィアト−シェーン ヨアヒム
ペスル エーヴァルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2012525312A publication Critical patent/JP2012525312A/ja
Publication of JP2012525312A5 publication Critical patent/JP2012525312A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
JP2012507603A 2009-04-30 2010-04-28 第１及び第２の基板を有する素子並びにその製造方法 Pending JP2012525312A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009019518 2009-04-30
DE102009019518.1 2009-04-30
DE102009036395.5 2009-08-06
DE102009036395A DE102009036395A1 (de) 2009-04-30 2009-08-06 Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung
PCT/DE2010/000491 WO2010124682A1 (de) 2009-04-30 2010-04-28 Bauteil mit einem ersten und einem zweiten substrat und verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
JP2012525312A true JP2012525312A (ja) 2012-10-22
JP2012525312A5 JP2012525312A5 (https=) 2013-02-14

Family

ID=42813791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012507603A Pending JP2012525312A (ja) 2009-04-30 2010-04-28 第１及び第２の基板を有する素子並びにその製造方法

Country Status (7)

Country Link
US (1) US20120187447A1 (https=)
EP (1) EP2425469B1 (https=)
JP (1) JP2012525312A (https=)
KR (1) KR20120030398A (https=)
CN (1) CN102439750B (https=)
DE (1) DE102009036395A1 (https=)
WO (1) WO2010124682A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140136737A (ko) * 2013-05-21 2014-12-01 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8835912B2 (en) * 2012-10-18 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd Organic light-emitting diode and display device having the same
EP2992063B1 (en) * 2013-05-03 2019-06-26 FMC Kongsberg Subsea AS Elastomeric seal

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120259A (ja) * 1988-10-28 1990-05-08 Toshiba Corp ガラスの封止接合体およびその製造方法
JPH02293344A (ja) * 1989-04-19 1990-12-04 Natl Starch & Chem Corp 電子的用途に使用するのに好適な低軟化点金属酸化物ガラス
JPH05147974A (ja) * 1991-11-25 1993-06-15 Nippon Electric Glass Co Ltd 封着材料
JPH08502468A (ja) * 1992-10-19 1996-03-19 ディーマット・インコーポレイテッド 改良された熱応力特性を有する低温ガラスおよびその使用方法
JP2001126863A (ja) * 1999-10-27 2001-05-11 Nippon Seiki Co Ltd 有機エレクトロルミネッセンス素子
JP2003007453A (ja) * 2001-06-26 2003-01-10 N S G Glass Components:Kk 有機ｅｌ素子
JP2006524419A (ja) * 2003-04-16 2006-10-26 コーニング インコーポレイテッド フリットにより密封されたガラスパッケージおよびその製造方法
JP2007043080A (ja) * 2005-06-29 2007-02-15 Fujifilm Holdings Corp 有機電界発光素子を用いた光源
JP2008044839A (ja) * 2006-08-18 2008-02-28 Corning Inc 発光素子ディスプレイの気密封止のためのホウケイ酸ガラスフリット
JP2008517446A (ja) * 2004-10-20 2008-05-22 コーニング インコーポレイテッド 有機発光ダイオード（ｏｌｅｄ）ディスプレイを封止するためのパラメータの最適化
JP2009067632A (ja) * 2007-09-13 2009-04-02 Nippon Electric Glass Co Ltd 光部品用封着ガラスおよび光部品の封着方法

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Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
JPS5918132A (ja) 1982-07-23 1984-01-30 Iwaki Glass Kk 封着用硝子組成物
US4997718A (en) * 1989-11-08 1991-03-05 Vlsi Packaging Materials, Inc. Silver phosphate glass die-attach composition
DE4128804A1 (de) 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
JP3843912B2 (ja) * 2001-10-22 2006-11-08 株式会社村田製作所 多層回路基板用ガラスセラミック材料および多層回路基板
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
US7304429B2 (en) * 2002-06-28 2007-12-04 Canon Kabushiki Kaisha Image display apparatus with first and second substrates in a hermetic container sealed by a conductive bonding member therebetween
US20040188859A1 (en) * 2003-03-25 2004-09-30 Intel Corporation Filler compositions, apparatus, systems, and processes
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
JP2005340020A (ja) 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
US20060290261A1 (en) * 2005-06-17 2006-12-28 Yuichi Sawai Bonding material
DE102005044523A1 (de) * 2005-09-16 2007-03-29 Schott Ag Verfahren zum Verbinden von Elementen mit Glaslot
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120259A (ja) * 1988-10-28 1990-05-08 Toshiba Corp ガラスの封止接合体およびその製造方法
JPH02293344A (ja) * 1989-04-19 1990-12-04 Natl Starch & Chem Corp 電子的用途に使用するのに好適な低軟化点金属酸化物ガラス
JPH05147974A (ja) * 1991-11-25 1993-06-15 Nippon Electric Glass Co Ltd 封着材料
JPH08502468A (ja) * 1992-10-19 1996-03-19 ディーマット・インコーポレイテッド 改良された熱応力特性を有する低温ガラスおよびその使用方法
JP2001126863A (ja) * 1999-10-27 2001-05-11 Nippon Seiki Co Ltd 有機エレクトロルミネッセンス素子
JP2003007453A (ja) * 2001-06-26 2003-01-10 N S G Glass Components:Kk 有機ｅｌ素子
JP2006524419A (ja) * 2003-04-16 2006-10-26 コーニング インコーポレイテッド フリットにより密封されたガラスパッケージおよびその製造方法
JP2008517446A (ja) * 2004-10-20 2008-05-22 コーニング インコーポレイテッド 有機発光ダイオード（ｏｌｅｄ）ディスプレイを封止するためのパラメータの最適化
JP2007043080A (ja) * 2005-06-29 2007-02-15 Fujifilm Holdings Corp 有機電界発光素子を用いた光源
JP2008044839A (ja) * 2006-08-18 2008-02-28 Corning Inc 発光素子ディスプレイの気密封止のためのホウケイ酸ガラスフリット
JP2009067632A (ja) * 2007-09-13 2009-04-02 Nippon Electric Glass Co Ltd 光部品用封着ガラスおよび光部品の封着方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140136737A (ko) * 2013-05-21 2014-12-01 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102049369B1 (ko) 2013-05-21 2019-11-29 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법

Also Published As

Publication number Publication date
CN102439750B (zh) 2016-04-06
CN102439750A (zh) 2012-05-02
EP2425469A1 (de) 2012-03-07
KR20120030398A (ko) 2012-03-28
US20120187447A1 (en) 2012-07-26
DE102009036395A1 (de) 2010-11-04
WO2010124682A1 (de) 2010-11-04
EP2425469B1 (de) 2019-01-09

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