JP2012525312A5 - - Google Patents

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Publication number
JP2012525312A5
JP2012525312A5 JP2012507603A JP2012507603A JP2012525312A5 JP 2012525312 A5 JP2012525312 A5 JP 2012525312A5 JP 2012507603 A JP2012507603 A JP 2012507603A JP 2012507603 A JP2012507603 A JP 2012507603A JP 2012525312 A5 JP2012525312 A5 JP 2012525312A5
Authority
JP
Japan
Prior art keywords
substrate
filler
glass
connecting material
connection material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012507603A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012525312A (ja
Filing date
Publication date
Priority claimed from DE102009036395A external-priority patent/DE102009036395A1/de
Application filed filed Critical
Publication of JP2012525312A publication Critical patent/JP2012525312A/ja
Publication of JP2012525312A5 publication Critical patent/JP2012525312A5/ja
Pending legal-status Critical Current

Links

JP2012507603A 2009-04-30 2010-04-28 第１及び第２の基板を有する素子並びにその製造方法 Pending JP2012525312A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009019518 2009-04-30
DE102009019518.1 2009-04-30
DE102009036395.5 2009-08-06
DE102009036395A DE102009036395A1 (de) 2009-04-30 2009-08-06 Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung
PCT/DE2010/000491 WO2010124682A1 (de) 2009-04-30 2010-04-28 Bauteil mit einem ersten und einem zweiten substrat und verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
JP2012525312A JP2012525312A (ja) 2012-10-22
JP2012525312A5 true JP2012525312A5 (https=) 2013-02-14

Family

ID=42813791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012507603A Pending JP2012525312A (ja) 2009-04-30 2010-04-28 第１及び第２の基板を有する素子並びにその製造方法

Country Status (7)

Country Link
US (1) US20120187447A1 (https=)
EP (1) EP2425469B1 (https=)
JP (1) JP2012525312A (https=)
KR (1) KR20120030398A (https=)
CN (1) CN102439750B (https=)
DE (1) DE102009036395A1 (https=)
WO (1) WO2010124682A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8835912B2 (en) * 2012-10-18 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd Organic light-emitting diode and display device having the same
EP2992063B1 (en) * 2013-05-03 2019-06-26 FMC Kongsberg Subsea AS Elastomeric seal
KR102049369B1 (ko) * 2013-05-21 2019-11-29 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
JPS5918132A (ja) 1982-07-23 1984-01-30 Iwaki Glass Kk 封着用硝子組成物
JPH02120259A (ja) * 1988-10-28 1990-05-08 Toshiba Corp ガラスの封止接合体およびその製造方法
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
US4997718A (en) * 1989-11-08 1991-03-05 Vlsi Packaging Materials, Inc. Silver phosphate glass die-attach composition
DE4128804A1 (de) 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
JPH05147974A (ja) * 1991-11-25 1993-06-15 Nippon Electric Glass Co Ltd 封着材料
US5334558A (en) * 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
JP2001126863A (ja) * 1999-10-27 2001-05-11 Nippon Seiki Co Ltd 有機エレクトロルミネッセンス素子
JP2003007453A (ja) * 2001-06-26 2003-01-10 N S G Glass Components:Kk 有機ｅｌ素子
JP3843912B2 (ja) * 2001-10-22 2006-11-08 株式会社村田製作所 多層回路基板用ガラスセラミック材料および多層回路基板
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
US7304429B2 (en) * 2002-06-28 2007-12-04 Canon Kabushiki Kaisha Image display apparatus with first and second substrates in a hermetic container sealed by a conductive bonding member therebetween
US20040188859A1 (en) * 2003-03-25 2004-09-30 Intel Corporation Filler compositions, apparatus, systems, and processes
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
JP2005340020A (ja) 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
US20060290261A1 (en) * 2005-06-17 2006-12-28 Yuichi Sawai Bonding material
JP2007043080A (ja) * 2005-06-29 2007-02-15 Fujifilm Holdings Corp 有機電界発光素子を用いた光源
DE102005044523A1 (de) * 2005-09-16 2007-03-29 Schott Ag Verfahren zum Verbinden von Elementen mit Glaslot
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
JP2009067632A (ja) * 2007-09-13 2009-04-02 Nippon Electric Glass Co Ltd 光部品用封着ガラスおよび光部品の封着方法

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