CN102439750B - 具有第一和第二基板的构件及其制造方法 - Google Patents

具有第一和第二基板的构件及其制造方法 Download PDF

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Publication number
CN102439750B
CN102439750B CN201080019111.7A CN201080019111A CN102439750B CN 102439750 B CN102439750 B CN 102439750B CN 201080019111 A CN201080019111 A CN 201080019111A CN 102439750 B CN102439750 B CN 102439750B
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CN
China
Prior art keywords
substrate
component
connecting material
weight
filler
Prior art date
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Application number
CN201080019111.7A
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English (en)
Chinese (zh)
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CN102439750A (zh
Inventor
安杰拉·埃贝哈特
乌尔丽克·比尔
约阿希姆·维尔特-朔恩
埃瓦尔德·珀斯尔
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication of CN102439750A publication Critical patent/CN102439750A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
CN201080019111.7A 2009-04-30 2010-04-28 具有第一和第二基板的构件及其制造方法 Active CN102439750B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009019518 2009-04-30
DE102009019518.1 2009-04-30
DE102009036395.5 2009-08-06
DE102009036395A DE102009036395A1 (de) 2009-04-30 2009-08-06 Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung
PCT/DE2010/000491 WO2010124682A1 (de) 2009-04-30 2010-04-28 Bauteil mit einem ersten und einem zweiten substrat und verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
CN102439750A CN102439750A (zh) 2012-05-02
CN102439750B true CN102439750B (zh) 2016-04-06

Family

ID=42813791

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080019111.7A Active CN102439750B (zh) 2009-04-30 2010-04-28 具有第一和第二基板的构件及其制造方法

Country Status (7)

Country Link
US (1) US20120187447A1 (https=)
EP (1) EP2425469B1 (https=)
JP (1) JP2012525312A (https=)
KR (1) KR20120030398A (https=)
CN (1) CN102439750B (https=)
DE (1) DE102009036395A1 (https=)
WO (1) WO2010124682A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8835912B2 (en) * 2012-10-18 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd Organic light-emitting diode and display device having the same
EP2992063B1 (en) * 2013-05-03 2019-06-26 FMC Kongsberg Subsea AS Elastomeric seal
KR102049369B1 (ko) * 2013-05-21 2019-11-29 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
CN1703123A (zh) * 2004-05-27 2005-11-30 株式会社日立显示器 有机电致发光显示装置及其制造方法
CN1798710A (zh) * 2003-04-16 2006-07-05 康宁股份有限公司 用玻璃料密封的玻璃外壳及其制造方法

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US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
JPS5918132A (ja) 1982-07-23 1984-01-30 Iwaki Glass Kk 封着用硝子組成物
JPH02120259A (ja) * 1988-10-28 1990-05-08 Toshiba Corp ガラスの封止接合体およびその製造方法
US4997718A (en) * 1989-11-08 1991-03-05 Vlsi Packaging Materials, Inc. Silver phosphate glass die-attach composition
DE4128804A1 (de) 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
JPH05147974A (ja) * 1991-11-25 1993-06-15 Nippon Electric Glass Co Ltd 封着材料
US5334558A (en) * 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
JP2001126863A (ja) * 1999-10-27 2001-05-11 Nippon Seiki Co Ltd 有機エレクトロルミネッセンス素子
JP2003007453A (ja) * 2001-06-26 2003-01-10 N S G Glass Components:Kk 有機ｅｌ素子
JP3843912B2 (ja) * 2001-10-22 2006-11-08 株式会社村田製作所 多層回路基板用ガラスセラミック材料および多層回路基板
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
US7304429B2 (en) * 2002-06-28 2007-12-04 Canon Kabushiki Kaisha Image display apparatus with first and second substrates in a hermetic container sealed by a conductive bonding member therebetween
US20040188859A1 (en) * 2003-03-25 2004-09-30 Intel Corporation Filler compositions, apparatus, systems, and processes
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
US20060290261A1 (en) * 2005-06-17 2006-12-28 Yuichi Sawai Bonding material
JP2007043080A (ja) * 2005-06-29 2007-02-15 Fujifilm Holdings Corp 有機電界発光素子を用いた光源
DE102005044523A1 (de) * 2005-09-16 2007-03-29 Schott Ag Verfahren zum Verbinden von Elementen mit Glaslot
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
JP2009067632A (ja) * 2007-09-13 2009-04-02 Nippon Electric Glass Co Ltd 光部品用封着ガラスおよび光部品の封着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
CN1798710A (zh) * 2003-04-16 2006-07-05 康宁股份有限公司 用玻璃料密封的玻璃外壳及其制造方法
CN1703123A (zh) * 2004-05-27 2005-11-30 株式会社日立显示器 有机电致发光显示装置及其制造方法

Also Published As

Publication number Publication date
CN102439750A (zh) 2012-05-02
EP2425469A1 (de) 2012-03-07
KR20120030398A (ko) 2012-03-28
US20120187447A1 (en) 2012-07-26
DE102009036395A1 (de) 2010-11-04
JP2012525312A (ja) 2012-10-22
WO2010124682A1 (de) 2010-11-04
EP2425469B1 (de) 2019-01-09

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
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Effective date of registration: 20160527

Address after: Regensburg, Germany

Patentee after: OSRAM OPTO SEMICONDUCTORS GMBH

Address before: Regensburg, Germany

Patentee before: Osram Opto Semiconductors GmbH