JP5165800B2 - 活性有機材料を含む電子デバイスのための気密シール - Google Patents
活性有機材料を含む電子デバイスのための気密シール Download PDFInfo
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- JP5165800B2 JP5165800B2 JP2011552990A JP2011552990A JP5165800B2 JP 5165800 B2 JP5165800 B2 JP 5165800B2 JP 2011552990 A JP2011552990 A JP 2011552990A JP 2011552990 A JP2011552990 A JP 2011552990A JP 5165800 B2 JP5165800 B2 JP 5165800B2
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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Description
a)内側基板表面、外側基板表面、及び該内側基板表面上の外周の内側に形成されるデバイスとを有する基板と、
b)第1の表面濡れ性を有し、前記デバイスと前記外周との間の前記内側基板表面上に配置される第1の基板ストリップと、
c)前記第1の表面濡れ性とは異なる第2の表面濡れ性を有し、前記デバイスと前記第1の基板ストリップとの間の前記内側基板表面上に配置され、前記第1の基板ストリップと接触している第2の基板ストリップと、
d)前記第1の基板濡れ性を有し、前記外周の内側に前記第1の基板ストリップから離隔して配置される第1のカバーストリップと、
e)前記第2の基板濡れ性を有し、前記第2の基板ストリップから離隔して配置され、前記第1のカバーストリップと接触している第2のカバーストリップと、
f)前記第1の基板ストリップ及び前記第1のカバーストリップを濡らすが、前記第2の基板ストリップ及び前記第2のカバーストリップは濡らさず、前記第1の表面濡れ性を有する前記第1の基板ストリップ及び前記第1のカバーストリップに接着されるが、前記第2の表面濡れ性を有する前記第2の基板ストリップ及び前記第2のカバーストリップには接着されない封止部材と、
g)前記第1のカバーストリップ及び前記第2のカバーストリップ上に配置されるカバーと、
を備える、デバイスのための気密シールが提供される。
d2 第2のカバー又は基板距離
10 基板
12 内側基板表面
14 外側基板表面
16 エッジ
16’ エリア
20 OLED材料
22 電極
30 第1の基板ストリップ
32 第2の基板ストリップ
34 電極絶縁層
40 封止部材
44 局所加熱器
50 保護カバー
52 内側カバー表面
54 外側カバー表面
60 スペーサー素子
70 乾燥剤材料
72 接着剤
80 第1のカバーストリップ
82 第2のカバーストリップ
Claims (20)
- a)内側基板表面、外側基板表面、及び該内側基板表面上の外周の内側に形成されるデバイスとを有する基板と、
b)第1の表面濡れ性を有し、前記デバイスと前記外周との間の前記内側基板表面上に配置される第1の基板ストリップと、
c)前記第1の表面濡れ性とは異なる第2の表面濡れ性を有し、前記デバイスと前記第1の基板ストリップとの間の前記内側基板表面上に配置され、前記第1の基板ストリップと接触している第2の基板ストリップと、
d)前記第1の基板濡れ性を有し、前記外周の内側に前記第1の基板ストリップから離隔して配置される第1のカバーストリップと、
e)前記第2の基板濡れ性を有し、前記第2の基板ストリップから離隔して配置され、前記第1のカバーストリップと接触している第2のカバーストリップと、
f)前記第1の基板ストリップ及び前記第1のカバーストリップを濡らすが、前記第2の基板ストリップ及び前記第2のカバーストリップは濡らさず、前記第1の表面濡れ性を有する前記第1の基板ストリップ及び前記第1のカバーストリップに接着されるが、前記第2の表面濡れ性を有する前記第2の基板ストリップ及び前記第2のカバーストリップには接着されない封止部材と、
g)前記第1のカバーストリップ及び前記第2のカバーストリップ上に配置及び直接接触して配置されるカバーと、
を備える、デバイスのための気密シール。 - 前記第1のカバーストリップ若しくは前記第2のカバーストリップ、又は前記第1の基板ストリップ若しくは前記第2の基板ストリップは、前記カバー又は前記基板の材料とは異なる材料から形成される、請求項1に記載のシール。
- 前記第1の基板ストリップは、前記基板の無コーティング部分である、請求項1に記載のシール。
- 前記第2の基板ストリップは、前記基板の無コーティング部分である、請求項1に記載のシール。
- 前記第1のカバーストリップは、前記カバーの無コーティング部分である、請求項1に記載のシール。
- 前記第2のカバーストリップは、前記カバーの無コーティング部分である、請求項1に記載のシール。
- 前記封止部材は金属又は合金から形成される、請求項1に記載のシール。
- 前記合金は、インジウム、スズ、ビスマス、鉛若しくははんだを含むか、又は前記合金は、50:50、52:48、48:52、55:45若しくは45:55の比率のインジウム及びスズを含む、請求項4に記載のシール。
- 前記デバイスは、温度に敏感な有機材料を含み、前記シールを形成する材料の融点は、該温度に敏感な有機材料が損傷を受ける温度よりも低い、請求項1に記載のシール。
- 前記第1のカバーストリップ若しくは前記第2のカバーストリップ、又は前記第1の基板ストリップ若しくは前記第2の基板ストリップは金属、金属酸化物、銀、銅、酸化アルミニウム又は樹脂でコーティングされる、請求項1に記載のシール。
- 前記第1のカバーストリップ及び前記第1の基板ストリップはガラス、銀又は銅表面を含み、前記第2のカバーストリップ及び前記第2の基板ストリップは酸化アルミニウム又は樹脂表面を含み、前記封止材料はスズ及びインジウムを含む合金である、請求項1に記載のシール。
- 前記第1のカバーストリップ及び前記第1の基板ストリップは金属表面又は金属酸化物表面を含み、前記第2のカバーストリップ及び前記第2の基板ストリップはガラス表面を有し、前記封止材料ははんだ合金である、請求項1に記載のシール。
- 前記第1の基板ストリップ及び前記第1のカバーストリップは実質的に同じ幅を有し、前記第2の基板ストリップ及び前記第2のカバーストリップは実質的に同じ幅を有する、請求項1に記載のシール。
- 電極であって、該電極は前記内側基板表面と前記シールとの間の前記内側基板表面上に延在する、電極と、該電極と前記シールとの間に配置される電極絶縁層とをさらに備える、請求項1に記載のシール。
- 前記内側基板表面と前記内側カバー表面との間に設けられる接着剤及び乾燥剤をさらに備える、請求項1に記載のシール。
- 請求項1に記載の封止部材を作製する方法であって、基板及びカバーを溶融封止材料内に浸漬し、その後、該基板及び該カバーを取り出し、それにより、該封止材料が冷却し、硬化できるようにすることによって、該封止部材を作製する、方法。
- 請求項1に記載の封止部材を作製する方法であって、基板とカバーとの間に溶融封止材料を堆積し、その後、該封止材料が冷却し、硬化できるようにすることによって、該封止部材を作製する、方法。
- 請求項1に記載の封止部材を作製する方法であって、基板とカバーとの間に封止材料を堆積し、該封止材料を加熱し、その後、該封止材料が冷却し、硬化できるようにすることによって、該封止材料を作製する、方法。
- 請求項1に記載の封止部材を作製する方法であって、封止材料をペースト又は分散系として塗布することによって、該封止部材を作製する、方法。
- 請求項1に記載の封止部材を作製する方法であって、第1の基板ストリップと第1のカバーストリップとの間の空間内に金属ワイヤを位置決めし、該金属ワイヤを溶融し、該溶融した材料を冷却して、該封止部材を形成することによって、該封止部材を作製する、方法。
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PCT/US2010/025364 WO2010101763A1 (en) | 2009-03-04 | 2010-02-25 | Hermetic seal for an electronic device comprising an active organic material |
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US20100225231A1 (en) | 2010-09-09 |
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