KR20120029647A - MANUFACTURING METHOD OF Cu SHEET AND Cu ALLOYS SHEET WITH HIGH ELECTRICAL CONDUCTIVITY AND HIGH TENSILE STRENGTH - Google Patents

MANUFACTURING METHOD OF Cu SHEET AND Cu ALLOYS SHEET WITH HIGH ELECTRICAL CONDUCTIVITY AND HIGH TENSILE STRENGTH Download PDF

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KR20120029647A
KR20120029647A KR1020100091572A KR20100091572A KR20120029647A KR 20120029647 A KR20120029647 A KR 20120029647A KR 1020100091572 A KR1020100091572 A KR 1020100091572A KR 20100091572 A KR20100091572 A KR 20100091572A KR 20120029647 A KR20120029647 A KR 20120029647A
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South Korea
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alloy
plate
tensile strength
manufacturing
sheet
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KR1020100091572A
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Korean (ko)
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김기태
조훈
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한국생산기술연구원
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Priority to KR1020100091572A priority Critical patent/KR20120029647A/en
Publication of KR20120029647A publication Critical patent/KR20120029647A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: A method for manufacturing a Cu plate and a Cu alloy plate with high electric conductivity and strength is provided to secure 30% enhanced tensile strength of a Cu plate and a Cu alloy plate with 5% or less reduction of electric conductivity and to enable application of the Cu plate and the Cu alloy plate as essential materials for electric and electronic lead frames, connectors, switches, terminals, and busbars. CONSTITUTION: A method for manufacturing a Cu plate and a Cu alloy plate with high electric conductivity and strength is as follows. A Cu plate with the purity of 99.9% is dipped in liquid nitrogen and cold-rolled in order to secure 46% enhanced tensile strength and 4% reduced electric conductivity electric conductivity compared to a Cu plate with the purity of 99.9%, which is cold-rolled without dipping in liquid nitrogen.

Description

Manufacturing method of Cu sheet and Cu alloys sheet with high electrical conductivity and high tensile strength}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing high conductivity and high strength Cu and Cu alloy plates, and in particular, before cold rolling the Cu and Cu alloy sheets, they are usually cold rolled without immersion in liquid nitrogen by rolling in liquid nitrogen. Compared to a Cu plate and a Cu alloy plate, the present invention relates to a high-k conductivity and high-strength Cu plate and Cu alloy plate having a high tensile strength of 30% or more and a low electrical conductivity of only 5% or less.

In general, Cu is used as a core material for electrical and electronic lead frames, connectors, switches, terminals, busbars, and wires because of its excellent electrical conductivity, and according to the strength and conductivity characteristics required for various components, pure Cu and Various Cu alloys are applied.

However, according to the miniaturization, multifunctionalization, and high integration of electric and electronic products, application of Cu and Cu alloy materials having higher tensile strength and electrical conductivity is urgently required for conductive parts such as lead frames and connectors.

On the other hand, when the metal is strengthened by various reinforcing mechanisms such as solid solution strengthening, precipitation strengthening, processing strengthening and dispersion strengthening to increase the tensile strength of the metal, lattice defects such as solid solution of alloy element, vacancy and dislocation (Lattice defect) is introduced or a second phase such as a precipitate, intermetallic compound is introduced, there is a problem that the electrical conductivity of the metal is lowered.

First, the precipitation-reinforced alloy may not only have high tensile strength but also excellent heat resistance by dispersing and depositing fine precipitates in a matrix structure.

In addition, according to the type and the amount of the alloy element, the solid solution-reinforced alloy rapidly decreases the electrical conductivity and hardly obtains high tensile strength.

On the other hand, work-hardened alloys can maintain high electrical conductivity compared to other hardening mechanisms such as solid solution strengthening and precipitation hardening, and can obtain high strength in proportion to the increase in dislocation density introduced into the alloy base structure according to plastic working. have.

Most of the reinforcement methods applied to Cu and Cu alloy plates, which are core materials for conductive parts such as lead frames and connectors, are precipitation reinforcement by fine precipitates and processing reinforcement by cold rolling.

However, in accordance with the miniaturization, multifunctionality, and high integration of electric and electronic products, application of Cu and Cu alloy plates having higher tensile strength and electrical conductivity to conductive parts such as lead frames and connectors is required. There has been a need for an innovative Cu and Cu alloy sheet rolling method that can improve the tensile strength by 30% or more while minimizing the electrical conductivity lower than 5% compared to the cold rolling method, but has not yet been developed.

The present invention has been made to solve the above problems, Cu and Cu alloy can improve the tensile strength by 30% or more while minimizing the electrical conductivity lower than 5% compared to the cold rolling method, which is a conventional sheet production method It is an object of the present invention to provide a method for producing a sheet material.

The high electroconductivity and high strength Cu and Cu alloy plate manufacturing method according to the present invention for achieving the above object is, before cold rolling the Cu and Cu alloy sheet material, first immersed in liquid nitrogen and then rolled.

Further, according to the present invention, the method of manufacturing high-k conductivity and high-strength Cu and Cu alloy sheet materials is usually cold-rolled Cu without immersion in liquid nitrogen by immersing Cu and Cu alloy sheets in liquid nitrogen and then rolling them before cold rolling. Compared with the Cu alloy sheet, high conductivity and high strength Cu and Cu alloy sheets can be manufactured with a tensile strength of 30% or more and an electric conductivity of only 5% or less.

The high electroconductivity and high-strength Cu and Cu alloy plate manufacturing method according to the present invention configured as described above, high tensile conductivity is 30% or more while the electrical conductivity is less than 5% high conductivity and high strength compared to the cold rolling method which is a conventional sheet production method By providing Cu and Cu alloy plates, it is possible to use a variety of core materials such as lead frames for electrical and electronics, connectors, switches, terminals, busbars, and the like.

In the method for producing high electroconductivity and high strength Cu and Cu alloy sheet according to the present invention, before cold rolling the Cu and Cu alloy sheet, it is first dipped in liquid nitrogen and then rolled.

That is, the present invention, before cold rolling the Cu and Cu alloy sheet material, first immersed in liquid nitrogen and then rolled, and the tensile strength while minimizing the electrical conductivity lower than the conventional cold rolled Cu and Cu alloy sheet without immersing in liquid nitrogen It is possible to provide a high conductivity and high strength Cu and Cu alloy plate material.

The cold rolling method, which is a conventional method of manufacturing Cu and Cu alloy sheet, is a method of rolling a sheet at room temperature, and the tensile strength of Cu and Cu alloy sheet is exhibited due to the dynamic recovery of Cu and Cu alloy sheet due to the processing heat generated during the rolling process. There is a limit to increasing the strength.

However, the method of manufacturing the high conductivity and high strength Cu and Cu alloy sheet according to the present invention is a method of first immersing Cu and Cu alloy sheets in liquid nitrogen and then rolling them before cold rolling, which is represented by the processing heat generated during the rolling process. And by restraining the dynamic recovery phenomenon of the Cu alloy sheet as possible, and also maximize the dislocation density introduced into the Cu base metal in accordance with the rolling process, it is possible to effectively improve the tensile strength while minimizing the electrical conductivity.

Hereinafter, a preferred embodiment of the present invention will be described in detail with respect to the high conductivity and the high strength Cu and Cu alloy sheet manufacturing method according to the present invention.

In order to manufacture the Cu and Cu alloy sheet according to the present invention, 99.9% Cu and Cu-0.9% Cr alloys were first prepared by using a conventional melt stirred copper alloy manufacturing method.

That is, 99.9% Cu and Cu-0.9% Cr alloys were respectively dissolved in the air by using a high frequency melting furnace, and then cast to a mold at a temperature of 1,200 ° C. to prepare billets having a diameter of 160 mm and a length of 500 mm, respectively.

The billet was hot-extruded at a temperature of 850 ° C. to prepare a slab having a width of 55 mm and a thickness of 10 mm. Particularly, the Cu-0.9% Cr alloy slab was subjected to a solution treatment for 1 hour at a temperature of 980 ° C., and then again to 480 ° C. Aging was performed at a temperature of 3 hours.

Next, as shown in Fig. 1, 99.9% Cu and 0.9% Cu-0.9% Cr alloy slabs were soaked in liquid nitrogen for 3 minutes, and then taken out and rolled at a rolling reduction of 10%. The rolled slabs were again immersed in liquid nitrogen for 3 minutes, taken out and rolled at a rolling reduction of 10%. This process was repeated repeatedly until a 99.9% Cu and a Cu-0.9% Cr alloy sheet material having a thickness of 1 mm were produced, thereby obtaining a test piece.

[Figure 1]

Figure pat00001

The test on the test piece and its method are as follows.

First, tensile strength was measured at room temperature with a tensile tester, and electrical conductivity was measured at room temperature with a conductivity meter.

[Table 1]

Figure pat00002

As shown in Table 1, the 99.9% Cu plate according to the present invention has an electrical conductivity of 96% IACS and a tensile strength of 550MPa at room temperature, whereas the 99.9% Cu plate according to a conventional cold rolling method (comparative example) is The conductivity is 100% IACS and the tensile strength is 377MPa. Accordingly, the 99.9% Cu plate according to the present invention is about 46% higher in tensile strength and only 4% lower in electrical conductivity than the 99.9% Cu plate according to the conventional cold rolling method.

In addition, as shown in Table 1, the Cu-0.9% Cr alloy sheet according to the present invention has an electrical conductivity of 76% IACS and a tensile strength of 729MPa at room temperature, whereas Cu-0.9% Cr according to a conventional cold rolling method The alloy plate (comparative example) has an electrical conductivity of 80% IACS and a tensile strength of 558 MPa. Therefore, the Cu-0.9% Cr alloy sheet according to the present invention is about 31% higher in tensile strength and only 5% lower in electrical conductivity than the Cu-0.9% Cr alloy sheet according to the conventional cold rolling method.

In the above, the high electroconductivity and the manufacturing method of the high strength Cu and Cu alloy plate materials by this invention were demonstrated.

It will be understood by those skilled in the art that the technical features of the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

Therefore, the above-described embodiments are to be understood in all respects as illustrative and not restrictive, the scope of the present invention being indicated by the following claims rather than the foregoing description, and the meanings of the claims and All changes or modifications derived from the scope and equivalent concepts thereof should be construed as being included in the scope of the present invention.

Claims (3)

In the method of manufacturing high-k conductivity and high-strength Cu sheet material,
The cold rolled 99.9% Cu plate was immersed in liquid nitrogen before rolling, and then rolled, which is 46% higher in tensile strength and 4% lower in electrical conductivity than the cold rolled 99.9% Cu plate without immersion in liquid nitrogen. Manufacturing method.
In the method of manufacturing high electroconductivity and high strength Cu alloy sheet,
The Cu-0.9% Cr alloy sheet is immersed in liquid nitrogen before cold rolling and then rolled, thereby exhibiting a 31% higher tensile strength and a 5% lower electrical conductivity than the cold rolled Cu-0.9% Cr alloy sheet without immersion in liquid nitrogen. Method for manufacturing conductivity and high strength Cu-0.9% Cr alloy sheet.
In the method of manufacturing high conductivity and high strength Cu and Cu alloy sheet,
By dipping Cu or Cu alloy plates in liquid nitrogen before cold rolling and rolling them, high-conductivity and low electrical conductivity of less than 5% and high electrical conductivity and 30% higher tensile strength than Cu and Cu alloy plates cold rolled without immersion in liquid nitrogen Method for producing high strength Cu and Cu alloy sheets.
KR1020100091572A 2010-09-17 2010-09-17 MANUFACTURING METHOD OF Cu SHEET AND Cu ALLOYS SHEET WITH HIGH ELECTRICAL CONDUCTIVITY AND HIGH TENSILE STRENGTH KR20120029647A (en)

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KR1020100091572A KR20120029647A (en) 2010-09-17 2010-09-17 MANUFACTURING METHOD OF Cu SHEET AND Cu ALLOYS SHEET WITH HIGH ELECTRICAL CONDUCTIVITY AND HIGH TENSILE STRENGTH

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105039758A (en) * 2015-06-11 2015-11-11 大连理工大学 Precipitation strengthening type high-strength and high-conductivity CuZr alloy and preparing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105039758A (en) * 2015-06-11 2015-11-11 大连理工大学 Precipitation strengthening type high-strength and high-conductivity CuZr alloy and preparing method thereof

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