KR20120002603A - 반력 보상 시스템 - Google Patents

반력 보상 시스템 Download PDF

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Publication number
KR20120002603A
KR20120002603A KR1020117025375A KR20117025375A KR20120002603A KR 20120002603 A KR20120002603 A KR 20120002603A KR 1020117025375 A KR1020117025375 A KR 1020117025375A KR 20117025375 A KR20117025375 A KR 20117025375A KR 20120002603 A KR20120002603 A KR 20120002603A
Authority
KR
South Korea
Prior art keywords
motor
stage
reaction force
laser beam
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117025375A
Other languages
English (en)
Korean (ko)
Inventor
마크 티 코스모스키
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20120002603A publication Critical patent/KR20120002603A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Position Or Direction (AREA)
  • Machine Tool Units (AREA)
KR1020117025375A 2009-03-27 2010-02-26 반력 보상 시스템 Withdrawn KR20120002603A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16438209P 2009-03-27 2009-03-27
US61/164,382 2009-03-27
US12/510,630 US8735774B2 (en) 2009-03-27 2009-07-28 Force reaction compensation system
US12/510,630 2009-07-28

Publications (1)

Publication Number Publication Date
KR20120002603A true KR20120002603A (ko) 2012-01-06

Family

ID=42781748

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117025375A Withdrawn KR20120002603A (ko) 2009-03-27 2010-02-26 반력 보상 시스템

Country Status (6)

Country Link
US (1) US8735774B2 (OSRAM)
JP (1) JP5718894B2 (OSRAM)
KR (1) KR20120002603A (OSRAM)
CN (1) CN102349147A (OSRAM)
TW (1) TW201039957A (OSRAM)
WO (1) WO2010110990A2 (OSRAM)

Families Citing this family (14)

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JP2014229787A (ja) * 2013-05-23 2014-12-08 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6308852B2 (ja) * 2014-04-15 2018-04-11 キヤノン株式会社 駆動装置、リソグラフィ装置、および物品の製造方法
JP6618921B2 (ja) * 2014-04-17 2019-12-11 エーエスエムエル ネザーランズ ビー．ブイ． 位置決めシステム、物体振動補償方法、リソグラフィ装置及びデバイス製造方法
TWI616269B (zh) * 2016-08-01 2018-03-01 Reaction force elimination platform device
US10367436B2 (en) 2017-02-21 2019-07-30 Invetech, Inc. Single-axis linear motion system
US10374530B2 (en) 2017-02-21 2019-08-06 Invetech, Inc. Dual-axis linear motion system
KR102449594B1 (ko) 2017-09-04 2022-10-04 에이에스엠엘 네델란즈 비.브이. 전자 빔 검사 장치 스테이지 위치설정
DE102018122717A1 (de) 2018-09-17 2020-03-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur schneidenden Bearbeitung von Rohren in einer Laserrohrschneidmaschine sowie Laserrohrschneidmaschine
NL2022539B1 (en) * 2019-02-08 2020-08-19 Dutch United Instr B V Positioning system for positioning an object
US11209373B2 (en) 2019-06-21 2021-12-28 Kla Corporation Six degree of freedom workpiece stage
CN110711958B (zh) * 2019-11-15 2021-11-02 安徽同兴科技发展有限责任公司 抗扰度高精密直线电机驱动的激光切割机及其控制方法
CN116324011B (zh) * 2020-10-19 2025-10-17 应用材料公司 供应布置、真空处理系统和在真空处理系统中向移动装置进行供应的方法
CN118180660B (zh) * 2024-05-16 2024-09-06 江苏盛捷半导体材料有限公司 一种半导体器件加工用激光切割设备
CN121346137B (zh) * 2025-12-19 2026-03-13 季华实验室 高速重载平台驱动反力抑制装置及其控制方法

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
US5363029A (en) * 1993-04-19 1994-11-08 Kabushiki Kaisha Yaskawa Denki Laser-beam machine using two-dimensional stepping motor
JP3548353B2 (ja) * 1996-10-15 2004-07-28 キヤノン株式会社 ステージ装置およびこれを用いた露光装置ならびにデバイス製造方法
JPH10293611A (ja) 1997-04-21 1998-11-04 Canon Inc 位置決め装置
GB2328636A (en) * 1997-08-29 1999-03-03 Rye Machinery Ltd A support for a laser tool
US6408045B1 (en) 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
JPH11147192A (ja) * 1997-11-12 1999-06-02 Koike Sanso Kogyo Co Ltd レーザー切断装置
US6040553A (en) * 1998-10-29 2000-03-21 Gebo Conveyors Consultants & Systems, Inc. Method of manufacturing air conveyor panels by laser ablation drilling
JP3312297B2 (ja) * 1999-07-02 2002-08-05 住友重機械工業株式会社 ステージ位置制御装置
DE10117460A1 (de) * 2001-04-06 2002-11-07 Siemens Ag Impulsgekoppelter Transmissionsantrieb
JP4223714B2 (ja) * 2001-11-30 2009-02-12 住友重機械工業株式会社 ステージ装置
JP2004304034A (ja) 2003-03-31 2004-10-28 Nikon Corp ステージ装置、露光装置及びデバイスの製造方法
JP2005203567A (ja) * 2004-01-15 2005-07-28 Canon Inc 駆動装置、露光装置及びデバイス製造方法
WO2006006730A1 (ja) * 2004-07-15 2006-01-19 Nikon Corporation 平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法
JP2006032788A (ja) 2004-07-20 2006-02-02 Canon Inc 露光装置及び半導体デバイスの製造方法
JP2006049384A (ja) * 2004-07-30 2006-02-16 Laserfront Technologies Inc ガントリー型ｘｙステージ
US20060170382A1 (en) * 2005-01-28 2006-08-03 Nikon Corporation Linear motor force ripple identification and compensation with iterative learning control
KR101248964B1 (ko) * 2005-03-29 2013-03-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 조사 장치 및 반도체 소자의 제조 방법
WO2007026270A1 (en) * 2005-08-29 2007-03-08 Koninklijke Philips Electronics, N.V. Ironless magnetic linear motors having levitating and transversal force capacities
US7603785B2 (en) * 2007-02-20 2009-10-20 Electro Scientific Industries, Inc. Air bearing assembly for guiding motion of optical components of a laser processing system
US7889322B2 (en) * 2007-02-20 2011-02-15 Electro Scientific Industries, Inc. Specimen inspection stage implemented with processing stage coupling mechanism
JP2009037391A (ja) * 2007-08-01 2009-02-19 Nikon Corp 温度調整装置、露光装置、アクチュエータ装置、保持装置、及びデバイス製造方法
JP4970410B2 (ja) * 2008-12-02 2012-07-04 住友重機械工業株式会社 ステージ装置及び半導体検査装置

Also Published As

Publication number Publication date
TW201039957A (en) 2010-11-16
JP2012522373A (ja) 2012-09-20
CN102349147A (zh) 2012-02-08
WO2010110990A2 (en) 2010-09-30
US20100243622A1 (en) 2010-09-30
US8735774B2 (en) 2014-05-27
WO2010110990A3 (en) 2011-01-06
JP5718894B2 (ja) 2015-05-13

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St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000