KR20110120728A - Side view optical package and manufacturing method of the same - Google Patents

Abstract

PURPOSE: A side view optical package and a manufacturing method thereof are provided to reduce the volume and the thickness of an entire package by forming a package with a lead frame mode into a side view optical package using a tape substrate. CONSTITUTION: An insulating layer(110), which includes a hole, is formed on a metal layer(120). A solder resist layer is formed in the upper side of the insulating layer. A connection unit(160) electrically connects an optical device and a circuit pattern. A resin unit(170) fills an optical device and the connection unit. A bent unit(180) is formed in an area in which the resin unit is not formed.

Description

Side view optical package and its manufacturing method {SIDE VIEW OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a side-view optical package and a method of manufacturing the same, and more particularly, to an optical package and a method of manufacturing the same, which improves the light efficiency as well as reducing the volume and thickness of the package and the density and the density of the package.

Light Emitting Diodes (LEDs) produce a small number of carriers (electrons or holes) injected using the pn junction structure of a semiconductor, and intermetallic compound junctions that emit light by converting electrical energy into light energy by recombination. Refers to a diode. In other words, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move through the junction of the anode and the cathode and recombine with each other, which is less energy than when the electrons and holes are separated. Release. Such LEDs are applied to a wide range of applications, such as not only general display devices but also lighting devices or backlight devices of LCD displays. In particular, LED has the advantage of low heat generation and long life due to high energy efficiency while being able to drive at a relatively low voltage, and most of the currently used technologies have been developed to provide high brightness of white light, which was difficult to implement in the past. It is expected to replace the light source device.

1A shows a cross-sectional view of an LED package according to one embodiment of the prior art. Referring to FIG. 1A, the LED package is configured to conduct conductive wires through bonding a gold wire 102 to a light emitting GaN chemical chip and to form heat sinks 10 at a lower portion thereof to allow heat emission. In addition, the external support and the LED package portion of the metal lead 20 through the wire bonding to the electricity and the structure that can shine. This structure forms a package for each individual chip 60.

Such a conventional LED package is in the form of a lead frame type package. However, the lead frame type does not have a high package utilization area, making it difficult to integrate LED chips, having a narrow orientation angle, and a relatively large package size compared to the chip size. none.

In addition, in order to dissipate the heat generated by the LED chip, a separate heat sink is required, thereby increasing thickness and volume.

1B shows a cross-sectional view of an LED package according to another embodiment of the prior art. Referring to FIG. 1B, a plastic lens 25 is used to increase linearity and light efficiency to light after applying a phosphor and a resin composite in an encapsulation process to protect the bonding of the wire 102. This acts as a cause of the limitation of the miniaturization of the LED package described above, and causes a cost problem in the process.

Therefore, there is a need for a technology capable of manufacturing LED packages that can be miniaturized at a lower cost and simplify the process.

The present invention has been made to solve the above-described problems, the object of the present invention is to reduce the volume of the optical package itself and reduce the thickness and the outer volume of the final product at a lower cost, as well as miniaturization and integration Through the wide angle of view, the number of packages constituting the backlight unit is reduced, and the metal layer serving as the heat sink and the support plate is plated with the light reflecting layer, and the white layer or the metal reflecting layer and the plating layer are formed on the surface of the insulating layer to absorb light to the insulating layer. The present invention provides a side view optical package and a method of manufacturing the same that reduce and increase light efficiency.

The configuration of the present invention provided to solve the above problems is a metal layer formed circuit pattern; An insulating layer formed on the metal layer and including a hole; An optical element mounted by die bonding to the layer exposed by the hole and a connection part electrically connecting the optical element and a circuit pattern; A resin part filling the optical element and the connection part; A bent portion formed in an area where the resin portion is not formed; provides a side view optical package, and realizes miniaturization and integration of the optical package using a tape type insulating film without using a lead frame, Azimuth angle and small volume can be achieved.

In particular, the bent portion may be formed by bending a hole or a groove in the insulating layer.

In addition, the light reflecting layer may further include a light reflecting layer on the upper metal layer exposed by the hole or the lower metal layer on which the circuit pattern is formed, wherein the light reflecting layer is silver (Ag) or a plating layer containing silver. It may be characterized by.

The method may further include a solder resist layer formed on an upper surface of the insulating layer.

In addition, the insulating layer may further include a white reflective layer formed on the upper surface or the insulating layer surface.

In particular, the white reflective layer formed on the surface of the insulating layer may be characterized in that the side of the insulating layer is buried in a thickness of 10㎛ ~ 100㎛, the white reflective layer preferably has an inclined surface on the side of the insulating layer.

In addition, the white reflective layer may increase light efficiency by printing any one of a silver paste, a white solder resist, or a white epoxy.

In addition, the metal reflection layer formed on the surface of the insulating layer; The metal reflection layer and the plating layer formed on the metal layer; may be characterized in that it further comprises, the metal reflection layer is printed by applying a silver (Ag) paste, the plating layer is a silver (Ag) or a plating layer containing silver Is preferably.

In addition, the metal layer is a copper (Cu) layer, the insulating layer may be characterized in that the polyimide film (polyimide film).

In addition, the resin part may be characterized in that it comprises a convex lens-shaped phosphor and a transparent resin (Resin).

Method for manufacturing a side view optical package according to the present invention comprises the steps of (a) forming a hole or groove for forming the hole and the bent portion for the optical device mounting and wire bonding in the insulating layer; (b) laminating a metal layer under the insulating layer and forming a circuit pattern; (c) mounting an optical device on a layer exposed by the hole and electrically connecting the optical device and a circuit pattern through gold (Au) wire bonding; (d) embedding the optical device and the gold wire to form a resin part; (e) bending the via hole to form a bent part.

In particular, after step (b), forming a solder resist layer on the insulating layer; And forming a light reflection layer on the metal layer exposed by the hole and the lower metal layer on which the circuit pattern is formed.

Further, after the step (b), (b-1) forming a white reflective layer on the upper surface or the surface of the insulating layer; And (b-2) forming a light reflection layer on the upper metal layer exposed by the hole and the lower metal layer on which the circuit pattern is formed.

In addition, after the step (b), forming a metal reflection layer on the surface of the insulating layer; And forming a plating layer on the metal reflection layer and the metal layer.

In addition, the insulating layer of step (a) is a polyimide film (polyimide film), the metal layer of the step (b) may be characterized in that the copper (Cu) layer.

The step (c) may include mounting an LED chip as an optical device, and the step (d) may form a convex lens-shaped resin part by over-coating a phosphor and a transparent resin.

According to the present invention, by forming a package according to the conventional lead frame method as a side view package using a tape substrate, to realize a wide orientation angle and a small volume to reduce the number of packages constituting the backlight unit, and to reduce the volume and thickness of the entire package Can be reduced. In addition, it is possible to form a package of the surface emitting method in the point emission method it is possible to produce a package of high integration. Furthermore, by simultaneously producing the bag and the lens, the cost can be reduced and the process can be simplified to increase the productivity, and the light efficiency can be improved through the light reflection layer formed on the metal layer and the white reflection layer or metal reflection layer or plating layer formed on the surface of the insulating layer.

1A is a cross-sectional view of an LED package according to one embodiment of the prior art.
1B is a cross-sectional view of an LED package according to another embodiment of the prior art.
2A-2C are cross-sectional views of side view light packages according to another embodiment of the present invention.
3A-3C are cross-sectional views of a side view optical package manufacturing process according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings are exaggerated in order to emphasize a clearer description, and elements denoted by the same symbols in the drawings denote the same elements.

2A-2C are cross-sectional views of side view light packages according to another embodiment of the invention. Referring to FIG. 2A, in the structure of the present invention, an insulating layer 110 including holes 115 and 116 is formed on a metal layer 120 on which a circuit pattern is formed, and punching the insulating layer 110. A resin unit 170 having a bent portion 180 formed by forming a hole or a groove 117 and bending the same, and embedding the optical element 150 and the connection unit 160 and the optical element 150 and the connection unit 160. ). In this case, it is preferable to further include a solder resist layer 131 on the insulating layer 110, the insulating layer 110 is preferably a polyimide film, the metal layer 120 is a copper layer It is preferable. In addition, the light reflecting layer 140 may be further included in the upper metal layer or the lower metal layer on which the circuit patterns exposed by the holes 115 and 116 are formed. The plating of the light reflecting layer 140 may include silver (Ag) or It is preferable to include silver. In this way, the silver plating layer 140 is formed by excluding gold plating for wire bonding, thereby improving brightness and increasing thermal conductivity, thereby increasing heat dissipation effect due to heat generated from the LED chip, and increasing reflectance to prevent light absorption. The light efficiency can be maximized. In addition, the present invention is mounted LED chip as the optical element 150 in the light reflecting layer 140 to perform gold (Au) wire bonding for the electrical connection between the chip 150 and the circuit pattern and the LED chip ( 150) and the gold wire 160 is formed in the form of a side view tape type LED package for embedding through the resin unit 170. In this case, the resin unit 170 is formed in a convex lens shape and includes a phosphor and a transparent resin (Resin), the transparent resin is preferably silicon (Si). In addition, the bent portion in the present invention is formed by bending the hole or the groove 117 in the insulating layer through which it is possible to secure a wider angle of view. As described above, the present invention can realize a side view optical package in which the bent portion is miniaturized and integrated through the film-type insulating layer and the lower circuit pattern layer without using the lower heat sink and the metal lead portion. Through this, the number of packages constituting the backlight unit can be reduced. In addition, a circuit pattern layer is formed under the insulating layer, and the circuit pattern layer serves as a heat sink as well as a circuit board. In addition, in the case of wire bonding, the bonding force is excellent due to the difference in RZ according to the roughness of the surface.

Referring to FIG. 2B, according to another embodiment of the present invention, an insulation layer 110 including holes 115 and 116 is formed on a metal layer 120 on which a circuit pattern is formed. The white reflective layer 132 is formed on the surface of the (110), the light reflective layer 140 is plated on the metal layer 120 exposed by the holes 115 and 116, and the holes or grooves are formed in the insulating layer 110. And a bending part 180 formed by forming and bending 117, and includes an optical device 150 and a connection part 160, and a resin part 170 in which the optical device 150 and the connection part 160 are embedded. do. In this case, the insulating layer 110 is preferably a polyimide film, and the metal layer 120 is preferably a copper (Cu) layer. In addition, in the present invention, unlike the FIG. 2A, the white reflective layer 132 is formed on the surface of the insulating layer 110, that is, the upper surface and the side surface, and the white reflective layer 132 is formed only on the upper surface of the insulating layer 110. Of course it is possible. In this case, the white reflective layer 132 is preferably formed by printing any one of a silver paste, a white solder resist or a white epoxy. Since the general polyimide is brown or yellow based, it absorbs light rather than reflecting light, so that the luminance is lowered. Therefore, the white reflective layer 132 is formed on the side of the insulating layer 110 as well as on the upper surface of the insulating layer 110 instead of the green solder resist. In this way, the luminance can be increased. At this time, the white reflective layer 132 is preferably buried in the side of the insulating layer 110 to a thickness of 10㎛ ~ 100㎛ in order to increase the brightness, the insulating layer 110 to be buried in a rectangular shape of the partition wall type. Although it may be, as shown in the figure, it is preferable that the partition wall is formed on the side of the insulating layer 110, that is, the inclined surface is present, and the distance between the side surface of the insulating layer 110 and the lower surface of the inclined surface of the white reflective layer 132. That is, it is preferable that X in a figure is 10 micrometers-100 micrometers in thickness. Thus, the light generated from the optical device 150 through the inclined surface of the white reflective layer 132 is reflected to the upper portion of the optical device by the inclined surface to increase the light efficiency, and the white reflective layer 132 serves as a reflective layer to improve the light efficiency. Not only increases, but also serves to separate the role of the barrier and the boundary when forming the resin part 170 thereafter. In addition, the light reflection layer 140 may be plated with the light reflection layer 140 on the metal layer 120 exposed by the holes 115 and 116 of the metal layer 120 where the white reflection layer 132 is not formed. As shown in the drawing, the insulating layer 110 may be plated on the back surface of the metal layer 120 in which the layers are stacked. The plating of the light reflection layer 140 may include silver (Ag) or silver. As such, by removing the gold plating for wire bonding and forming the silver plating layer 140, the luminance is improved, the thermal conductivity is increased, and the heat dissipation effect due to the heat generated from the LED chip is increased, and the reflectance is increased to prevent light absorption. The light efficiency can be maximized. Since the optical device 150, the connection part 160, the resin part 170, and the bent part 180, which are the components of the present invention, are the same as in FIG. 2A, description thereof will be omitted.

Referring to FIG. 2C, in the structure of the present invention, a metal layer 120 having a circuit pattern is formed under the insulating layer 110 having the holes 115 and 116, and the insulating layer 110. The metal reflection layer 133 is formed on the surface of the metal sheet), and the plating layer 141 is formed on the metal layer 120 exposed by the metal reflection layer 133 and the holes 115 and 116, and the insulating layer 110 is formed. And a bent portion 180 formed by forming a hole or a groove 117 in the bend), and the optical element 150 and the connecting portion 160 and the optical element 150 and the connecting portion 160 are embedded. Branch 170 is included. In this case, the insulating layer 110 is preferably a polyimide film, and the metal layer 120 is preferably a copper (Cu) layer. 2A and 2B, the metal reflection layer 133 is formed on the surface of the insulating layer 110, that is, on the top and side surfaces thereof. The metal reflection layer 133 may be formed of silver (Ag) or nickel (Ni). ), Copper (Cu), palladium (Pd), platinum (Pt), gold (Au) and other conductive pastes are preferably applied and printed, of which silver paste is most preferred. Since a general polyimide is a brown or yellow series and absorbs light rather than reflecting light, there is a problem that the luminance is lowered, thereby forming the metal reflection layer 133 and the plating layer 141 not only on the upper surface of the polyimide 110 but also on the side thereof. It is possible to reduce the light absorption to the mead 110 and increase the light efficiency. In this case, the metal reflection layer 133 may be buried in a rectangular shape of the partition layer 110, but as shown in the figure, it is preferable that the partition wall is formed on the side of the insulating layer 110, that is, the inclined surface is present. Do. In this way, the light generated from the optical device 150 through the inclined surface of the metal reflection layer 133 is reflected by the inclined surface to the upper portion of the optical device 150 to increase the light efficiency. In addition, the plating layer 141 may be formed on the metal layer 120 exposed by the metal reflection layer 133 and the holes 115 and 116 as described above, and the insulating layer 110 may be formed as shown in the drawing. It is preferable to also plate the back surface of the stacked metal layer 120, and the plating layer 141 is preferably a plating layer containing silver (Ag) or silver. In this way, the silver plating layer 141 is formed by excluding gold plating for wire bonding, thereby improving brightness and increasing thermal conductivity, thereby increasing heat dissipation effect due to heat generated from the LED chip, and increasing reflectance to prevent light absorption. The light efficiency can be maximized. Since the optical device 150, the connection part 160, the resin part 170, and the bent part 180, which are the components of the present invention, are the same as in FIG. 2A, description thereof will be omitted.

3A to 3C are cross-sectional views of a side view optical package manufacturing process according to another embodiment of the present invention. Referring to FIG. 3A, first, holes 115 and 116 for optical device mounting and wire bonding and holes or grooves 117 for forming bent portions are formed by punching the insulating film 110 (S ₁₁ ). In this case, the insulating film 110 is preferably a polyimide film, and the holes 115 and 116 supply power to the device hole 115 and the optical device 150, which are central holes in which the optical device is to be located. In order to include a hole 116 to which a wire is to be bonded as the connection portion 160. In addition, the metal layer 120 is laminated, but the metal layer 120 is preferably a copper (Cu) layer (S ₁₂ ). Then, after activating the surface through various chemical treatments, a photoresist is applied, and an exposure and development process are performed. After the development process is completed, the circuit pattern layer 120 is formed by forming a necessary circuit through the etching process and peeling off the photoresist. Next, the solder resist layer 131 may be formed on the insulating layer 110, that is, by applying and printing a solder resist except for the surface 115 for bonding and the hole 116 for external power supply ( S ₁₃ ), the metal layer 120 exposed by the holes 115 and 116 is plated to form a light reflection layer 140, thereby performing surface treatment to enable bonding (S ₁₄ ). In this case, the light reflection layer 140 may be plated on the circuit surface that is the back surface of the metal layer 120 in which the insulating layer 110 is stacked. In addition, the plating of the light reflection layer 140 preferably includes silver (Ag) or silver. In this way, silver plating is performed without gold plating, thereby reducing light absorption to the polyimide film 110 and increasing light efficiency. Thereafter, die bonding is performed on the plated light reflecting layer 140 where the optical device is to be located among the holes 115 and 116 formed in the insulating layer 110 to mount the optical device 150. The optical device is an LED chip 150. It is preferable to mount the chip 150 by using an adhesive as (). Thereafter, the wire pattern 160 is bonded to the silver-plated light reflecting layer 140 to electrically connect the circuit pattern layer 120 and the LED chip 150 (S ₁₅ ), and the LED chip 150 and the wire 160. ) To form a resin portion 170 (S ₁₆ ). In more detail, the convex lens-shaped resin part 170 is formed by over-coating a phosphor and a transparent resin manufactured for white LEDs at the boundary of the solder resist 131. In the case where the phosphor and the transparent resin are over-coated, the convex lens-shaped resin portion 170 is formed as shown due to the surface tension. As a result, an existing encapsulation and a plastic lens can be simultaneously formed. Thereafter, the via hole 117 formed by punching the insulating layer 110 is bent to form the bent portion 180, thereby completing the side view optical package, and bonding the light guide plate 190 becomes a module of the backlight unit (see FIG. S ₁₇ ). Thus, by forming the bent portion 180, the present invention can realize a wide directing angle and a small volume as compared with the lead frame package.

In the following description with reference to FIG. 3B, the following description will focus on the step S ₂₃ , which is different from the manufacturing process of FIG. 3A. First, holes (115, 116) for mounting the optical device and wire bonding and holes or grooves (117) for forming bent portions are formed by punching the insulating film (110) (S ₂₁ ), and the metal layer 120 is laminated. By forming a circuit pattern (S ₂₂ ). In addition, the white reflective layer 132 is formed not only on the upper surface of the insulating layer 110 but also on the side surface (S ₂₃ ). In general, the polyimide is electrically stable, but the color is brown or yellow based, and thus the reflectance is not good. Therefore, the light efficiency is decreased, so that the color can be coated through the white reflective layer 132 to increase the light efficiency. 132 may be printed by applying any one of silver paste, white solder resist, or white epoxy, which is not a general green solder resist. In this case, embedding the side surface of the insulating layer 110 in a thickness of 10 μm to 100 μm may increase the light efficiency. The white reflective layer 132 may also fill the insulating layer 110 in a right angle shape of a partition wall type. However, it is preferable to form an inclined surface on the side of the insulating layer 110 to reflect the light from the optical device 150 to the upper portion of the optical device 150, as shown in the figure, the side of the insulating layer 110 And the distance between the bottom surface of the inclined surface of the white reflective layer 132, that is, X in the drawing, are preferably 10 μm to 100 μm thick. Thereafter, the metal layer 120 of the metal layers 120 exposed by the holes 115 and 116 is not plated with the white metal layer 120, thereby forming a light reflective layer 140, thereby performing surface treatment to enable bonding. (S ₂₄ ). In this case, as shown in the drawing, the light reflecting layer 140 may be plated on a circuit surface that is the back surface of the metal layer 120 on which the insulating layer 110 is stacked. In addition, the plating of the light reflection layer 140 is preferably silver (Ag) plating. By removing the gold (Au) plating in this way it is possible to reduce the light absorption to the polyimide film 110 and increase the light efficiency. Next, an LED chip is mounted as the optical device 150 by die bonding on the plated light reflection layer 140 where the optical device 150 is to be located among the holes formed in the insulating layer 110. By bonding the wire 160 to the 140, the circuit pattern layer 120 and the LED chip 150 may be electrically connected to each other (S ₂₅ ), and the resin part may be embedded to fill the LED chip 150 and the wire 160. 170 is formed (S ₂₆ ). Subsequently, the side view optical package is completed by bending the hole or groove 117 formed by punching the insulating layer 110 to form the bent portion 180, and bonding the light guide plate 190 to the module of the backlight unit (S ₂₇ ).

In the following description with reference to FIG. 3C, the following description will focus on the step S ₃₃ , which is different from the manufacturing process of FIGS. 3A and 3B. First, holes are formed in the insulating film 110 to form holes 115 and 116 for mounting an optical device and wire bonding and via holes 117 for forming bent portions (S ₃₁ ), and the metal layer 120 is laminated to form a circuit. A pattern is formed (S ₃₂ ). In addition, the metal reflection layer 133 is formed on the side surface as well as the upper surface of the insulating layer 110 (S ₃₃ ). The metal reflective layer 133 is preferably coated by applying a conductive paste such as silver (Ag), nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt), gold (Au), and carbon. Among them, the silver paste is most preferable, and the insulating layer 110 may be buried in a right-angled shape in the form of a partition wall, but as shown in the drawing, an inclined surface is formed on the side of the insulating layer 110 in the optical device 150. It is desirable to be able to reflect the light to the top of the optical device. Subsequently, the plating layer 141 is formed on the metal layer 120 exposed by the metal reflection layer 133 and the holes 115 and 116, thereby performing surface treatment to enable bonding (S ₃₄ ). In this case, the plating layer 141 is preferably formed on the circuit surface that is the back surface of the metal layer 120 in which the insulating layer 110 is laminated as shown in the figure. In addition, the plating layer 141 is preferably a plating layer containing silver (Ag) or silver. In general, the polyimide is electrically stable, but the color is brown or yellow series, and the reflectance is not good, so there is a problem in light efficiency. When the silver paste is applied as in the present invention, the polyimide region 110 disappears and the silver is as described above. Glossiness is higher through the plating layer 140 to further increase the light efficiency. Next, die bonding is performed on the plating layer 141 where the optical device 150 is to be located among the holes formed in the insulating layer 110 to mount an LED chip as the optical device 150, and then onto the plating layer 141. Bonding the circuit pattern layer 120 and the LED chip 150 by bonding gold (Au) wires 160 (S ₃₅ ) and the resin part to fill the LED chip 150 and the wires 160. To form 170 (S ₃₆ ). Subsequently, the side view optical package is completed by bending the hole or groove 117 formed by punching the insulating layer 110 to form the bent portion 180, and bonding the light guide plate 190 to the module of the backlight unit (S ₂₇ ).

The best embodiments have been disclosed in the drawings and specification above. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: heat sink 20: metal lead portion
30: stitch bond 40: silicon sub-mount
50: ball bond 60: LED chip
70: solder ball 90: electrically / thermally conductive epoxy
102: gold wire 110: insulating layer
120: metal layer 131: solder resist layer
132: white reflective layer 133: metal reflective layer
140: light reflection layer 141: plating layer
150: optical element 160: connection portion
170: resin portion 180: bend portion
190: light guide plate

Claims (19)

A metal layer on which a circuit pattern is formed;
An insulating layer formed on the metal layer and including a hole;
An optical element mounted by die bonding to the layer exposed by the hole and a connection part electrically connecting the optical element and a circuit pattern;
A resin part filling the optical element and the connection part;
A bent portion formed in a region where the resin portion is not formed;
Side view optical package comprising a.
The method according to claim 1,
The bent portion,
And forming a hole or a groove in the insulating layer to bend the side view optical package.
The method according to claim 1,
And a light reflecting layer on the upper metal layer exposed by the hole or the lower metal layer on which the circuit pattern is formed.
The method according to claim 3,
The light reflection layer,
Side view optical package, characterized in that the plating layer containing silver (Ag) or silver.
The method according to claim 3,
Side view optical package, characterized in that it further comprises a solder resist layer formed on the insulating layer.
The method according to claim 3,
And a white reflective layer formed on an upper surface of the insulating layer or a surface of the insulating layer.
The method of claim 6,
The white reflective layer formed on the surface of the insulating layer,
Side-view optical package, characterized in that for embedding the insulating layer side to a thickness of 10㎛ ~ 100㎛.
The method according to claim 7,
The white reflective layer,
And a sloped surface is present at the side of the insulating layer.
The method of claim 6,
The white reflective layer,
A side view optical package characterized by printing any one of silver paste, white solder resist or white epoxy.
The method according to claim 1,
A metal reflection layer formed on a surface of the insulating layer; And
A plating layer formed on the metal reflection layer and the metal layer;
Side view light package, characterized in that it further comprises.
The method according to claim 10,
The metal reflection layer is printed by applying a silver (Ag) paste,
The plating layer is a side view optical package, characterized in that the plating layer containing silver (Ag) or silver.
The method according to claim 1,
The metal layer is a copper (Cu) layer,
The insulating layer is a side view optical package, characterized in that the polyimide film (polyimide film).
The method according to claim 1,
The resin unit comprises a convex lens-shaped phosphor and a transparent resin (Resin) side view optical package, characterized in that.
(a) forming a hole or a groove for forming a hole and a bent portion for mounting an optical device and wire bonding in the insulating layer;
(b) laminating a metal layer under the insulating layer and forming a circuit pattern;
(c) mounting an optical device on the layer exposed by the hole and electrically connecting the optical device and a circuit pattern through wire bonding;
(d) embedding the optical device and the wire to form a resin part;
(e) bending the via holes to form bends;
Side view optical package manufacturing method comprising a.
The method according to claim 14,
After step (b),
Forming a solder resist layer on the insulating layer; And
Forming a light reflection layer on the metal layer exposed by the hole and the lower metal layer on which the circuit pattern is formed;
Side view optical package manufacturing method further comprising.
The method according to claim 14,
After step (b),
(b-1) forming a white reflective layer on the insulating layer or on the insulating layer surface; And
(b-2) forming a light reflection layer on the upper metal layer exposed by the hole and the lower metal layer on which the circuit pattern is formed;
Side view optical package manufacturing method further comprising.
The method according to claim 14,
After step (b),
Forming a metal reflection layer on the surface of the insulating layer; And
Forming a plating layer on the metal reflection layer and the metal layer;
Side view optical package manufacturing method further comprising.
The method according to claim 14,
The insulating layer of step (a) is a polyimide film (polyimide film),
The metal layer of step (b) is a side view optical package manufacturing method, characterized in that the copper (Cu) layer.
The method according to claim 14,
Step (c) is to mount the LED chip as an optical device,
The step (d) is a side view optical package manufacturing method, characterized in that to form a convex lens-shaped resin portion by over-coating a phosphor and a transparent resin.

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