KR20110060922A - 프로브 블록 조립체 - Google Patents

프로브 블록 조립체 Download PDF

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Publication number
KR20110060922A
KR20110060922A KR1020117007747A KR20117007747A KR20110060922A KR 20110060922 A KR20110060922 A KR 20110060922A KR 1020117007747 A KR1020117007747 A KR 1020117007747A KR 20117007747 A KR20117007747 A KR 20117007747A KR 20110060922 A KR20110060922 A KR 20110060922A
Authority
KR
South Korea
Prior art keywords
probe
block
ground
probes
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117007747A
Other languages
English (en)
Korean (ko)
Inventor
스티븐 펠드만
조셉 엔 카스티글리온
아베이 알 조시
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20110060922A publication Critical patent/KR20110060922A/ko
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020117007747A 2008-09-08 2009-09-03 프로브 블록 조립체 Withdrawn KR20110060922A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/206,565 2008-09-08
US12/206,565 US7740508B2 (en) 2008-09-08 2008-09-08 Probe block assembly

Publications (1)

Publication Number Publication Date
KR20110060922A true KR20110060922A (ko) 2011-06-08

Family

ID=41797849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117007747A Withdrawn KR20110060922A (ko) 2008-09-08 2009-09-03 프로브 블록 조립체

Country Status (6)

Country Link
US (1) US7740508B2 (https=)
EP (1) EP2340555A4 (https=)
JP (1) JP2012502277A (https=)
KR (1) KR20110060922A (https=)
CN (1) CN102197469A (https=)
WO (1) WO2010028136A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20160128668A (ko) * 2015-04-29 2016-11-08 주식회사 한라정밀엔지니어링 엘이디검사용 프로브 및 이를 포함하는 콘텍장치

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EP2197254B1 (de) * 2008-12-09 2011-08-31 Siemens Aktiengesellschaft Elektronikmodul für ein Anlagenmodul
US7909646B2 (en) * 2009-08-10 2011-03-22 3M Innovative Properties Company Electrical carrier assembly and system of electrical carrier assemblies
US7927144B2 (en) * 2009-08-10 2011-04-19 3M Innovative Properties Company Electrical connector with interlocking plates
US7850489B1 (en) 2009-08-10 2010-12-14 3M Innovative Properties Company Electrical connector system
US7997933B2 (en) 2009-08-10 2011-08-16 3M Innovative Properties Company Electrical connector system
US8187035B2 (en) * 2010-05-28 2012-05-29 Tyco Electronics Corporation Connector assembly
US8052470B1 (en) * 2011-01-12 2011-11-08 Cheng Uei Precision Industry Co., Ltd. Probe connector
US8083548B1 (en) * 2011-01-13 2011-12-27 Cheng Uei Precision Industry Co., Ltd. Probe connector
US8888531B2 (en) * 2011-10-11 2014-11-18 Tyco Electronics Corporation Electrical connector and circuit board assembly including the same
JP5857892B2 (ja) 2012-07-03 2016-02-10 株式会社オートネットワーク技術研究所 多極コネクタ
JP5847663B2 (ja) * 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
WO2014132274A1 (en) * 2013-02-27 2014-09-04 Power-One Italy S.P.A. Programming connector
CN104345184B (zh) * 2013-07-26 2019-03-01 苏州普源精电科技有限公司 一种多通道获取探头及具有多通道获取探头的测量仪器
TWM482874U (zh) * 2014-04-01 2014-07-21 Insert Entpr Co Ltd Rf射頻連接器
CN104600443A (zh) * 2015-01-21 2015-05-06 谢博 一种接地线电极
TWI704352B (zh) * 2015-03-13 2020-09-11 義大利商探針科技公司 測試頭之接觸探針
DE102015109022B4 (de) * 2015-06-08 2018-08-23 Infineon Technologies Ag Modulares Messgerät zum Testen von Prüflingen mittels Schnittstellenelementen
US9979112B2 (en) * 2016-03-29 2018-05-22 Aces Electronics Co., Ltd. Press-type connector
US10283899B2 (en) * 2016-10-10 2019-05-07 Cisco Technology, Inc. Cable header
KR101906575B1 (ko) * 2016-11-29 2018-10-11 리노공업주식회사 카메라모듈 검사장치
MY202728A (en) * 2017-07-28 2024-05-17 Nhk Spring Co Ltd Contact probe and probe unit
TWI626453B (zh) * 2017-09-29 2018-06-11 中華精測科技股份有限公司 探針組件及其空間轉換介面板
CN109581005B (zh) * 2017-09-29 2021-01-22 中华精测科技股份有限公司 探针组件及其空间转换介面板
KR102015788B1 (ko) 2017-11-30 2019-08-29 리노공업주식회사 검사장치
US10476196B2 (en) * 2018-02-28 2019-11-12 Ohio Associated Enterprises, Llc Electrical connector with contacts holding spring-loaded pins
US10938139B2 (en) * 2018-08-21 2021-03-02 Te Connectivity Corporation Electrical connector with retractable contacts
EP3850712B1 (en) * 2018-09-13 2025-08-06 HARTING Electric Stiftung & Co. KG Plug-in connector with ground terminal region
US11567102B2 (en) * 2019-09-04 2023-01-31 Chien Wen Chang Auxiliary device for functional expansion and signal acquisition of testing system
CN112240947B (zh) * 2020-12-18 2021-04-30 苏州和林微纳科技股份有限公司 一种超高频弹簧探针测试组件的装配方法
US11835567B2 (en) * 2020-12-18 2023-12-05 Suzhou Uigreen Micro&Nano Technology Co. Ltd. Method for assembling ultrahigh-frequency spring probe test assembly
CN115021001A (zh) * 2022-06-30 2022-09-06 北京华峰测控技术股份有限公司 线缆连接结构、探针块、信号扩展装置和半导体测试机
US12517171B2 (en) * 2023-04-06 2026-01-06 Western Digital Technologies, Inc. Apparatus and method for coupling to an electrical interface of a circuit board
CN116879586A (zh) * 2023-07-28 2023-10-13 上海捷策创电子科技有限公司 一种用于半导体测试的同轴高速接口装置
CN116754814B (zh) * 2023-08-11 2023-10-24 杭州朗迅科技股份有限公司 一种高密度探针卡及制备方法、测试方法

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US4734046A (en) 1984-09-21 1988-03-29 International Business Machines Corporation Coaxial converter with resilient terminal
US5485140A (en) * 1994-06-24 1996-01-16 Bussin; George N. Vehicle obstacle detector and alarm system
US6498506B1 (en) * 2000-07-26 2002-12-24 Gore Enterprise Holdings, Inc. Spring probe assemblies
US6447328B1 (en) 2001-03-13 2002-09-10 3M Innovative Properties Company Method and apparatus for retaining a spring probe
US6551126B1 (en) * 2001-03-13 2003-04-22 3M Innovative Properties Company High bandwidth probe assembly
US6902416B2 (en) * 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6824427B1 (en) 2003-05-13 2004-11-30 3M Innovative Properties Company Coaxial probe interconnection system
US7015708B2 (en) 2003-07-11 2006-03-21 Gore Enterprise Holdings, Inc. Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
US7371128B2 (en) 2003-10-14 2008-05-13 Precision Interconnect, Inc. Cable terminal with air-enhanced contact pins
US7553187B2 (en) 2006-01-31 2009-06-30 3M Innovative Properties Company Electrical connector assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160128668A (ko) * 2015-04-29 2016-11-08 주식회사 한라정밀엔지니어링 엘이디검사용 프로브 및 이를 포함하는 콘텍장치

Also Published As

Publication number Publication date
US20100062629A1 (en) 2010-03-11
WO2010028136A8 (en) 2010-07-22
EP2340555A2 (en) 2011-07-06
WO2010028136A2 (en) 2010-03-11
CN102197469A (zh) 2011-09-21
JP2012502277A (ja) 2012-01-26
WO2010028136A3 (en) 2010-06-03
US7740508B2 (en) 2010-06-22
EP2340555A4 (en) 2012-08-22

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000