KR20110041406A - 열 수송 디바이스, 열 수송 디바이스의 제조 방법 및 전자 기기 - Google Patents

열 수송 디바이스, 열 수송 디바이스의 제조 방법 및 전자 기기 Download PDF

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Publication number
KR20110041406A
KR20110041406A KR1020100097591A KR20100097591A KR20110041406A KR 20110041406 A KR20110041406 A KR 20110041406A KR 1020100097591 A KR1020100097591 A KR 1020100097591A KR 20100097591 A KR20100097591 A KR 20100097591A KR 20110041406 A KR20110041406 A KR 20110041406A
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KR
South Korea
Prior art keywords
mesh
capillary
heat
mesh member
container
Prior art date
Application number
KR1020100097591A
Other languages
English (en)
Korean (ko)
Inventor
가즈나오 오니끼
히로유끼 료손
고지 히라따
Original Assignee
소니 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 주식회사 filed Critical 소니 주식회사
Publication of KR20110041406A publication Critical patent/KR20110041406A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020100097591A 2009-10-15 2010-10-07 열 수송 디바이스, 열 수송 디바이스의 제조 방법 및 전자 기기 KR20110041406A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009238054A JP2011085311A (ja) 2009-10-15 2009-10-15 熱輸送デバイス、熱輸送デバイスの製造方法及び電子機器
JPJP-P-2009-238054 2009-10-15

Publications (1)

Publication Number Publication Date
KR20110041406A true KR20110041406A (ko) 2011-04-21

Family

ID=43878406

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100097591A KR20110041406A (ko) 2009-10-15 2010-10-07 열 수송 디바이스, 열 수송 디바이스의 제조 방법 및 전자 기기

Country Status (5)

Country Link
US (1) US20110088877A1 (zh)
JP (1) JP2011085311A (zh)
KR (1) KR20110041406A (zh)
CN (1) CN102042779B (zh)
TW (1) TW201116795A (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI530654B (zh) 2011-12-26 2016-04-21 鴻準精密工業股份有限公司 扁平熱管
CN103185479B (zh) * 2011-12-27 2016-05-11 富瑞精密组件（昆山）有限公司 扁平热管
US10598442B2 (en) * 2012-03-12 2020-03-24 Cooler Master Development Corporation Flat heat pipe structure
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
KR101642625B1 (ko) 2012-04-16 2016-07-25 후루카와 덴키 고교 가부시키가이샤 히트 파이프
US20140131013A1 (en) * 2012-11-15 2014-05-15 Chin-Hsing Horng Low-profile heat pipe
CN103868386A (zh) * 2012-12-17 2014-06-18 富瑞精密组件（昆山）有限公司 平板热管及其制造方法
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
US20160069616A1 (en) * 2014-09-05 2016-03-10 Asia Vital Components Co., Ltd. Heat pipe with complex capillary structure
US10082340B2 (en) 2014-11-12 2018-09-25 Asia Vital Components Co., Ltd. Heat pipe structure
CN107509368A (zh) * 2017-09-08 2017-12-22 广东智科精创科技股份有限公司 一种均温散热器及均温板生产方法
JP6944588B2 (ja) * 2018-03-13 2021-10-06 信越ポリマー株式会社 放熱構造体およびそれを装着したバッテリー
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
WO2020026908A1 (ja) 2018-07-31 2020-02-06 株式会社村田製作所 ベーパーチャンバー
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
JP7275735B2 (ja) * 2019-03-26 2023-05-18 日本電気株式会社 冷却装置及び冷却方法
CN112867335B (zh) * 2019-11-12 2023-10-20 台达电子工业股份有限公司 均温板及其组装方法
TWI746010B (zh) * 2020-06-15 2021-11-11 李克勤 熱管及其製造方法
WO2022230295A1 (ja) * 2021-04-28 2022-11-03 株式会社村田製作所 熱拡散デバイス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1087502A (zh) * 1992-12-04 1994-06-08 韩立达 折叠纸巾的方法及纸巾盒
JPH07208884A (ja) * 1994-01-19 1995-08-11 Fujikura Ltd 平板型ヒートパイプ
JP2000161878A (ja) * 1998-11-30 2000-06-16 Furukawa Electric Co Ltd:The 平面型ヒートパイプ
JP2002141449A (ja) * 2000-10-31 2002-05-17 Denso Corp 沸騰冷却器
TWM246562U (en) * 2003-10-31 2004-10-11 Hon Hai Prec Ind Co Ltd Heat pipe
KR100581115B1 (ko) * 2003-12-16 2006-05-16 엘에스전선 주식회사 판형 열전달 장치 및 그 제조 방법
CN100395505C (zh) * 2005-04-07 2008-06-18 富准精密工业(深圳)有限公司 烧结式热管及其制造方法
JP2008045820A (ja) * 2006-08-17 2008-02-28 Kiko Kagi Kofun Yugenkoshi 平板式ヒートパイプの製造方法
CN101398272A (zh) * 2007-09-28 2009-04-01 富准精密工业(深圳)有限公司 热管

Also Published As

Publication number Publication date
TW201116795A (en) 2011-05-16
CN102042779B (zh) 2013-03-27
US20110088877A1 (en) 2011-04-21
CN102042779A (zh) 2011-05-04
JP2011085311A (ja) 2011-04-28

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