KR20110013440A - 복수의 기판을 처리하는 장치 및 방법 - Google Patents

복수의 기판을 처리하는 장치 및 방법 Download PDF

Info

Publication number
KR20110013440A
KR20110013440A KR1020107027093A KR20107027093A KR20110013440A KR 20110013440 A KR20110013440 A KR 20110013440A KR 1020107027093 A KR1020107027093 A KR 1020107027093A KR 20107027093 A KR20107027093 A KR 20107027093A KR 20110013440 A KR20110013440 A KR 20110013440A
Authority
KR
South Korea
Prior art keywords
substrate
cutting
station
substrates
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107027093A
Other languages
English (en)
Korean (ko)
Inventor
종재 정
덕천 장
창환 하
총첸 림
성호 백
Original Assignee
록코 벤처스 피티이 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 록코 벤처스 피티이 리미티드 filed Critical 록코 벤처스 피티이 리미티드
Publication of KR20110013440A publication Critical patent/KR20110013440A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
KR1020107027093A 2008-05-02 2009-05-04 복수의 기판을 처리하는 장치 및 방법 Withdrawn KR20110013440A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200803452-2 2008-05-02
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing

Publications (1)

Publication Number Publication Date
KR20110013440A true KR20110013440A (ko) 2011-02-09

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107027093A Withdrawn KR20110013440A (ko) 2008-05-02 2009-05-04 복수의 기판을 처리하는 장치 및 방법

Country Status (6)

Country Link
US (1) US20110036339A1 (cg-RX-API-DMAC10.html)
JP (1) JP5420640B2 (cg-RX-API-DMAC10.html)
KR (1) KR20110013440A (cg-RX-API-DMAC10.html)
CN (1) CN102046344A (cg-RX-API-DMAC10.html)
SG (1) SG142402A1 (cg-RX-API-DMAC10.html)
WO (1) WO2009134212A1 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001232B1 (ko) * 1984-12-27 1990-03-05 가부시끼 가이샤 디스코 반도체 웨이퍼 방형절단기
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비

Also Published As

Publication number Publication date
SG142402A1 (en) 2009-11-26
CN102046344A (zh) 2011-05-04
JP5420640B2 (ja) 2014-02-19
JP2011520256A (ja) 2011-07-14
US20110036339A1 (en) 2011-02-17
WO2009134212A1 (en) 2009-11-05

Similar Documents

Publication Publication Date Title
KR102380422B1 (ko) 웨이퍼 처리 시스템
US7878336B2 (en) System and method for inspection of chips on tray
US9508570B2 (en) Singulation apparatus and method
KR100814284B1 (ko) 쏘잉 앤 플레이스먼트 장비의 비전 시스템
EP4454801A1 (en) Processing device and method for manufacturing processed article
JP5420640B2 (ja) 複数基板の処理装置及びその方法
KR100550238B1 (ko) Ｃｓｐ 기판 분할 장치
JP2009130342A (ja) 基板の切断方法及び装置
TWI477374B (zh) 分離電子組件之設備及方法
JP2006086524A (ja) 電子部品を取り扱うための装置及び方法
KR100833283B1 (ko) 소잉소터 시스템용 리버싱 장치
JP2011520256A5 (cg-RX-API-DMAC10.html)
JP2009286089A (ja) インライン加工装置及び方法
US20060105477A1 (en) Device and method for manufacturing wafer-level package
WO2010056209A2 (en) Dicing system and method
KR101411053B1 (ko) 패키지 개별화 장치
JP2003225717A (ja) 打抜加工用金型及び打抜板の製造方法
KR101007924B1 (ko) 기판 이송 장치
US20250087503A1 (en) Semiconductor package cutting system and method
KR102483224B1 (ko) 반도체 칩 반송 장치 및 이를 구비하는 소잉 소터 시스템
KR100845187B1 (ko) 반도체 제조장치
KR100990938B1 (ko) 반도체 패키지 제조 장치
JP2003168775A (ja) 半導体装置のリード電極切断装置及び方法
KR20160099380A (ko) 에지 그라인딩 시스템 및 그라인드 에지 검사 방법
JP2008198963A (ja) 半導体装置の製造方法およびそれに用いるウェハ識別補助装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000