SG142402A1 - Apparatus and method for multiple substrate processing - Google Patents

Apparatus and method for multiple substrate processing

Info

Publication number
SG142402A1
SG142402A1 SG200803452-2A SG2008034522A SG142402A1 SG 142402 A1 SG142402 A1 SG 142402A1 SG 2008034522 A SG2008034522 A SG 2008034522A SG 142402 A1 SG142402 A1 SG 142402A1
Authority
SG
Singapore
Prior art keywords
substrates
tables
cutting
substrate processing
receiving
Prior art date
Application number
SG200803452-2A
Other languages
English (en)
Inventor
Jong Jae Jung
Deok Chun Jang
Chang Hwan Ha
Chong Chen Lim
Seung Ho Baek
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Priority to SG200803452-2A priority Critical patent/SG142402A1/en
Priority to US12/990,491 priority patent/US20110036339A1/en
Priority to JP2011507379A priority patent/JP5420640B2/ja
Priority to CN2009801165598A priority patent/CN102046344A/zh
Priority to KR1020107027093A priority patent/KR20110013440A/ko
Priority to PCT/SG2009/000158 priority patent/WO2009134212A1/en
Publication of SG142402A1 publication Critical patent/SG142402A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
SG200803452-2A 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing SG142402A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing
US12/990,491 US20110036339A1 (en) 2008-05-02 2009-05-04 Apparatus and method for multiple substrate processing
JP2011507379A JP5420640B2 (ja) 2008-05-02 2009-05-04 複数基板の処理装置及びその方法
CN2009801165598A CN102046344A (zh) 2008-05-02 2009-05-04 处理多基底的装置和方法
KR1020107027093A KR20110013440A (ko) 2008-05-02 2009-05-04 복수의 기판을 처리하는 장치 및 방법
PCT/SG2009/000158 WO2009134212A1 (en) 2008-05-02 2009-05-04 Apparatus and method for multiple substrate processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing

Publications (1)

Publication Number Publication Date
SG142402A1 true SG142402A1 (en) 2009-11-26

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing

Country Status (6)

Country Link
US (1) US20110036339A1 (cg-RX-API-DMAC10.html)
JP (1) JP5420640B2 (cg-RX-API-DMAC10.html)
KR (1) KR20110013440A (cg-RX-API-DMAC10.html)
CN (1) CN102046344A (cg-RX-API-DMAC10.html)
SG (1) SG142402A1 (cg-RX-API-DMAC10.html)
WO (1) WO2009134212A1 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001232B1 (ko) * 1984-12-27 1990-03-05 가부시끼 가이샤 디스코 반도체 웨이퍼 방형절단기
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

Also Published As

Publication number Publication date
CN102046344A (zh) 2011-05-04
JP5420640B2 (ja) 2014-02-19
JP2011520256A (ja) 2011-07-14
KR20110013440A (ko) 2011-02-09
US20110036339A1 (en) 2011-02-17
WO2009134212A1 (en) 2009-11-05

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