KR20110005256A - 1액형 에폭시계 구조용 접착제 - Google Patents

1액형 에폭시계 구조용 접착제 Download PDF

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Publication number
KR20110005256A
KR20110005256A KR1020107025016A KR20107025016A KR20110005256A KR 20110005256 A KR20110005256 A KR 20110005256A KR 1020107025016 A KR1020107025016 A KR 1020107025016A KR 20107025016 A KR20107025016 A KR 20107025016A KR 20110005256 A KR20110005256 A KR 20110005256A
Authority
KR
South Korea
Prior art keywords
adhesive
polyhydroxy
polyoxy
minutes
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107025016A
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English (en)
Korean (ko)
Inventor
크리스토퍼 제이 캄프벨
알폰수스 브이 포시우스
일야 고로디셔
바부 엔 가드담
웨인 에스 마호니
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20110005256A publication Critical patent/KR20110005256A/ko
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086Triazines; Melamines; Guanamines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020107025016A 2008-04-11 2009-04-10 1액형 에폭시계 구조용 접착제 Withdrawn KR20110005256A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12392708P 2008-04-11 2008-04-11
US61/123,927 2008-04-11

Publications (1)

Publication Number Publication Date
KR20110005256A true KR20110005256A (ko) 2011-01-17

Family

ID=41162260

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025016A Withdrawn KR20110005256A (ko) 2008-04-11 2009-04-10 1액형 에폭시계 구조용 접착제

Country Status (6)

Country Link
US (1) US20110024039A1 (https=)
EP (1) EP2268759A1 (https=)
JP (1) JP2011516694A (https=)
KR (1) KR20110005256A (https=)
CN (1) CN102057010A (https=)
WO (1) WO2009126862A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101324481B1 (ko) * 2012-06-21 2013-11-01 김정태 방열 접착제 조성물, 이를 이용하여 제조된 발광체 방열회로기판, 및 이의 제조방법
WO2019124713A1 (ko) * 2017-12-21 2019-06-27 주식회사 동성화학 1액형 에폭시계 접착제 조성물 및 이를 이용한 물품

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010011714A2 (en) * 2008-07-23 2010-01-28 3M Innovative Properties Company Reactive liquid modifiers
CN102159615B (zh) 2008-07-23 2014-10-01 3M创新有限公司 两部分的环氧基结构粘合剂
EP2321370B1 (en) 2008-07-23 2017-03-15 3M Innovative Properties Company Two-part epoxy-based structural adhesives
US9528035B2 (en) 2009-09-11 2016-12-27 3M Innovative Properties Company Curable and cured adhesive compositions
WO2011031399A1 (en) 2009-09-11 2011-03-17 3M Innovative Properties Company Curable and cured adhesive compositions
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Dnpファインケミカル 接着組成物および硬化性接着シートの製造方法
CN103068946B (zh) * 2010-08-10 2015-05-06 3M创新有限公司 环氧树脂结构粘合剂
EP2638093B1 (en) 2010-11-12 2018-08-01 3M Innovative Properties Company Curable compositions
CN103189411B (zh) 2010-11-12 2015-11-25 3M创新有限公司 可固化组合物和已固化组合物
BR112013014592A2 (pt) 2010-12-29 2016-09-20 3M Innovative Properties Co adesivos híbridos estruturais
CN102191002B (zh) * 2011-04-02 2014-04-09 烟台德邦科技有限公司 一种耐高湿高热单组分环氧胶粘剂及其制备方法
US9840070B2 (en) * 2012-03-23 2017-12-12 Dow Global Technologies Llc Crash-durable adhesive with enhanced stress durability
TWI558787B (zh) * 2012-08-03 2016-11-21 Lg化學股份有限公司 黏合膜及使用彼之有機電子裝置的包封產品
KR101481263B1 (ko) * 2013-04-29 2015-01-13 전북대학교산학협력단 강인화 에폭시 수지 조성물, 이의 제조방법 및 강인화 에폭시 수지
US9518907B2 (en) * 2014-01-16 2016-12-13 The Boeing Company Methods and apparatus to determine integrity of composite structures
CN107001898B (zh) * 2014-11-28 2020-10-27 大日本印刷株式会社 粘合剂组合物和使用该粘合剂组合物的粘合片材
CN107207936A (zh) * 2015-02-03 2017-09-26 泽菲罗斯有限公司 单组分环氧基组合物
WO2017044359A1 (en) * 2015-09-10 2017-03-16 Dow Global Technologies Llc High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
DE102015220311A1 (de) * 2015-10-19 2017-04-20 Tesa Se Tangentiales Fügeverfahren
CN105368010B (zh) * 2015-11-13 2020-04-28 中航复合材料有限责任公司 一种室温长贮存期环氧树脂及其制备方法
US10683441B2 (en) 2016-03-02 2020-06-16 3M Innovative Properties Company Composition including epoxy adhesive and aluminum flakes and method for using the same
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
FR3068979B1 (fr) 2017-07-12 2020-07-31 Arkema France Composition d'adhesif (meth)acrylique, son procede de preparation et son utilisation
FR3068980B1 (fr) * 2017-07-12 2020-10-02 Arkema France Composition d'adhesif epoxy comprenant un polymere a etapes multiples et un polymere (meth)acrylique, son procede de preparation et son utilisation
FR3068977B1 (fr) 2017-07-12 2020-09-04 Arkema France Composition comprenant un polymere a phases multiples et un polymere (meth)acrylique, son procede de preparation et son utilisation
EP3781634A1 (en) 2018-04-20 2021-02-24 3M Innovative Properties Company Tapes with elastomeric backing layers
EP3781635A1 (en) 2018-04-20 2021-02-24 3M Innovative Properties Company Method of applying an hvof-resistant tape
CN109054665B (zh) * 2018-06-25 2020-12-01 湖北工业大学 一种高粘接强度耐热水浸泡的金属/塑料复合带制备方法
WO2021059050A1 (en) 2019-09-25 2021-04-01 3M Innovative Properties Company Multi-phase adhesive articles and methods thereof
JP7444048B2 (ja) * 2020-12-22 2024-03-06 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1164124A (en) * 1980-07-15 1984-03-20 Kurt Munk Pourable solid mixture
JPS62501299A (ja) * 1985-06-26 1987-05-21 ザ ダウ ケミカル カンパニ− ゴム改質エポキシ化合物
US4906722A (en) * 1987-12-02 1990-03-06 Ciba-Geigy Corporation Thermosetting reactive systems
EP0511162A1 (de) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
WO1993000381A1 (de) * 1991-06-26 1993-01-07 Teroson Gmbh Reaktiver schmelzklebstoff
WO1994024212A1 (fr) * 1993-04-20 1994-10-27 Dainippon Ink And Chemicals, Inc. Composition durcissable et procede pour produire un film a partir de cette composition
US5629380A (en) * 1994-09-19 1997-05-13 Minnesota Mining And Manufacturing Company Epoxy adhesive composition comprising a calcium salt and mannich base
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) * 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
JP2000290348A (ja) * 1999-04-12 2000-10-17 Toagosei Co Ltd 硬化性樹脂組成物
US6554936B1 (en) * 1999-09-08 2003-04-29 Alliant Techsystems Inc. Method of constructing insulated metal dome structure for a rocket motor
US6664318B1 (en) * 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
DE10006592A1 (de) * 2000-02-09 2001-08-23 Schill & Seilacher Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte
CN1250665C (zh) * 2000-04-10 2006-04-12 汉高两合股份公司 抗冲击环氧树脂组合物
US6872762B2 (en) * 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
DE10138127A1 (de) * 2001-08-03 2003-02-27 Henkel Kgaa Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften
US6849589B2 (en) * 2001-10-10 2005-02-01 3M Innovative Properties Company Cleaning composition
EP1431325A1 (de) * 2002-12-17 2004-06-23 Sika Technology AG Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit
JP2004256781A (ja) * 2003-02-28 2004-09-16 Toshiba Corp コーティング用エポキシ樹脂組成物およびそれを用いた電子機器
US20040191523A1 (en) * 2003-03-24 2004-09-30 Jihong Kye Reactive hot melt adhesive formulation for joining stamped metal and plastic parts
ES2336244T3 (es) * 2005-05-12 2010-04-09 Hempel A/S Procedimiento para la creacion de un revestimiento de pintura epoxidica resistente al agrietamiento y composiciones de pintura adecuadas para dicho procedimiento.
DE602005020260D1 (de) * 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
CN101903483B (zh) * 2007-12-18 2014-09-10 陶氏环球技术公司 对玻璃粘合剂具有增强的粘合性的窗玻璃用保护涂层

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101324481B1 (ko) * 2012-06-21 2013-11-01 김정태 방열 접착제 조성물, 이를 이용하여 제조된 발광체 방열회로기판, 및 이의 제조방법
WO2019124713A1 (ko) * 2017-12-21 2019-06-27 주식회사 동성화학 1액형 에폭시계 접착제 조성물 및 이를 이용한 물품

Also Published As

Publication number Publication date
WO2009126862A1 (en) 2009-10-15
CN102057010A (zh) 2011-05-11
JP2011516694A (ja) 2011-05-26
US20110024039A1 (en) 2011-02-03
EP2268759A1 (en) 2011-01-05

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Date Code Title Description
PA0105 International application

Patent event date: 20101108

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid