KR20100137363A - Liquid processing apparatus, liquid processing method and storage medium - Google Patents

Abstract

PURPOSE: A liquid processing apparatus, a liquid processing method, and a storage media are provided to protect a liquid processing process by prevent processing liquid from being dropped. CONSTITUTION: A nozzle(40) is arranged at the lower side of a nozzle head(34). The nozzle head is the tip end of an arm(33). A plurality of liquid processing parts is serially arranged to a transversal direction. A nozzle bath is installed to hold the nozzle. A supporting unit is arranged at the upper region of the liquid processing parts and between the nozzle baths. A driving unit moves the supporting unit.

Description

LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD AND STORAGE MEDIUM}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid processing apparatus, a liquid processing method, and a storage medium for supplying a processing liquid to a substrate to perform liquid processing.

In the photoresist step, which is one of the semiconductor manufacturing steps, a resist is applied to the surface of a semiconductor wafer (hereinafter referred to as a wafer), and the resist is exposed in a predetermined pattern and then developed to form a resist pattern. Such a process is generally performed using the system which connected the exposure apparatus to the coating and developing apparatus which apply | coats and develops a resist.

This coating and developing apparatus is provided with various liquid processing modules for supplying a processing liquid to a wafer and performing liquid processing. As this liquid processing module, there exists a resist coating module (resist coating apparatus) which apply | coats a resist, for example to a wafer. The resist coating module is provided with a spin chuck holding a wafer, and a coating processing section including a cup provided with a draining means and an exhausting means provided to surround the wafer held by the spin chuck. In addition, the resist coating module includes a resist ejection nozzle for ejecting a resist onto a wafer, and a thinner ejection nozzle for improving the wettability of the resist by ejecting a processing liquid, for example, thinner, onto the wafer before supplying the resist. These resist discharge nozzles and thinner discharge nozzles are mounted to arms supporting them, and move between the cup top and a nozzle bath provided on the outside of the cup for waiting each nozzle.

By the way, in recent years, several types of resist from which concentration or a component differs may be used separately, by the request of small quantity production of many varieties. Since the resists are used in this manner, it is possible to consider changing the plurality of resist ejection nozzles each connected to a plurality of lines for supplying different kinds of resists each time the arm switches the processing. However, in order to simplify the device configuration, there may be a case in which a collective nozzle in which these plurality of resist discharge nozzles and thinner discharge nozzles are combined into one arm is mounted and driven.

Further, in order to simplify the device configuration, in a single resist coating module, for example, a plurality of coating processing units provided with the cups may be provided in parallel. In this case, each of these application | coating process parts and a nozzle bath is arrange | positioned on a straight line, for example, and the said arm common to each application process part performs a resist application process, moving between a nozzle bath and a cup. Since the arm is required to move from the moving start point to the end point in the shortest distance for improving the throughput, the arm moves in a straight line in parallel with the arrangement direction of the coating processing section and the nozzle bath. Therefore, in the resist coating module configured as described above, each nozzle crosses the cup phase due to its structure.

By the way, in order to start discharging resist and thinner immediately after moving each nozzle on a wafer, it is necessary to fill these liquids to the vicinity of the tip of a nozzle. However, if the nozzle of the resist coating module configured as described above is moved in the state where the liquid is filled in this way, the vibration may occur at the time of driving the arm, or the internal pressure fluctuation of the line for supplying the resist and thinner may cause the respective angles to be out of the target position during the movement. Liquid condensation from the tip of the nozzle, and further, drop of liquid, may occur. As described above, when each nozzle traverses the cup, if the droplets drop on the spin chuck or before or after the treatment, the particles may be generated due to contamination of the spin chuck or poor application of the product wafer may cause a decrease in yield. There is concern.

Patent Literature 1 and Patent Literature 2 describe monitoring the state of the chemical liquid discharged from the moving nozzle during application by an optical sensor and a camera system, respectively. However, these are for the purpose of detecting the abnormality of the discharge state or discharge timing of a chemical liquid, and the monitoring area of a chemical liquid state is limited before and after chemical liquid discharge. Thus, these optical sensors and cameras do not monitor nozzles moving outside the cup. In addition, Patent Documents 1 and 2 do not describe the means for avoiding the droplet drop at the time of abnormal occurrence. Therefore, these patent documents 1 and 2 cannot solve the said problem. On the other hand, Patent Document 3 does not describe the problem that occurs when the nozzle moves between the cups, and is insufficient to solve the described problem. On the other hand, Patent Document 4 has to be analyzed by a constant camera in order to solve the above problem, there is a fear that a load on the program.

Japanese Patent Laid-Open No. 2008-307465 Japanese Patent Laid-Open No. 2002-316080 Japanese Patent Laid-Open No. 2008-313822 Japanese Patent Laid-Open No. 2008-135679

SUMMARY OF THE INVENTION The present invention has been made under such circumstances, and an object thereof is to provide a plurality of liquid processing portions having substrate holding portions arranged in a row in a transverse direction, and a plurality of processing liquid nozzles which are common to these liquid processing portions and are provided along the arrangement direction of the liquid processing portions. In the liquid processing apparatus provided with the above, it is providing the liquid processing apparatus, the liquid processing method, and the storage medium which can suppress the fall of the processing liquid from the said processing liquid nozzle to a board | substrate, and can prevent a fall of a yield.

The liquid processing apparatus of this invention is comprised by providing the board | substrate holding | maintenance part which hold | maintains a board | substrate horizontally in the cup in which the opening part was formed in the upper side, respectively, the some liquid processing part arrange | positioned in the horizontal direction mutually, and the said some liquid processing part And a plurality of processing liquid nozzles provided on the support along the arrangement direction of the liquid processing unit for supplying different kinds of processing liquids to the substrate, the nozzle bath provided for waiting the processing liquid nozzles, and the liquid processing unit. A support drive mechanism for moving each processing liquid nozzle along the column of the liquid processing section between the upper region and the nozzle bath via the support, and an arrangement direction of the processing liquid nozzle below each processing liquid nozzle; And an optical sensor that forms an optical axis, and the optical axis is blocked by the optical sensor when each processing liquid nozzle is not in use. When a state is detected, it is characterized by including a means for determining that liquid condensation or dripping of the processing liquid has occurred and outputting a determination signal, and a countermeasure for performing a countermeasure operation based on the output of the determination signal.

The countermeasure includes: imaging means for imaging the distal end of the processing liquid nozzle, and determining means for determining which liquid solution condensation or dripping of the processing liquid has occurred on which processing liquid nozzle based on the imaging result by the imaging means; The judgment by the judging means may be performed based on the output of the judging signal. In this case, the coping means includes a drainage region provided on an extension line in the arrangement direction of the liquid processing portion or between the liquid processing portions in the arrangement direction; The drainage area may be provided with a control means for outputting a control signal to discharge the processing liquid from the processing liquid nozzle which has been determined by the determination means that liquid formation or dripping of the processing liquid has occurred.

For example, the coping means includes a liquid receiving member for receiving liquid condensation and a drop falling from each processing liquid nozzle and the liquid receiving member below the liquid processing nozzle when liquid condensation or dropping of the processing liquid is detected. May be provided with a moving means for moving from the retracted area outside of the liquid receiving area to the liquid receiving area for receiving the liquid, wherein the coping means moves the support drive mechanism and discharge of the processing liquid from the processing liquid nozzle. A stop means for stopping may be provided. Moreover, the said coping means may be equipped with the alarm generating means. The said support drive mechanism is comprised so that the said support body may be raised and lowered, and the said optical sensor is installed in the fixed part fixed with respect to the said support drive mechanism, for example.

The substrate processing method of this invention is equipped with the board | substrate holding | maintenance part which hold | maintains a board | substrate horizontally in the cup in which the opening part was formed in the upper side, respectively, and is common to the some liquid processing part arrange | positioned in the horizontal direction mutually, and the arrangement of the said liquid processing part A step of supplying different types of processing liquids from the plurality of processing liquid nozzles provided on the support along the direction to the substrate, the process of waiting the processing liquid nozzles in the nozzle bath, and the upper portion of each of the liquid processing portions by the support driving mechanism. Moving each processing liquid nozzle along the column of the liquid processing unit via the support between the area and the nozzle bath, and an optical axis along the arrangement direction of the processing liquid nozzles under each processing liquid nozzle by an optical sensor; And a state in which the optical axis is blocked by the optical sensor when each processing liquid nozzle is not in use. Is judged that the liquid condensation or addition of the treatment solution occurred, and based on the step of outputting the determination signal and the output of the determination signal characterized in that it comprises a step of carrying out coping behavior.

For example, the step of performing the coping operation includes the step of picking up the tip portion of the processing liquid nozzle by the imaging means and the formation or dropping of the processing liquid to a certain processing liquid nozzle based on the imaging result by the imaging means. And judging by the judging means based on the output of the judging signal, and may be included on an extension line in the arrangement direction of the liquid processing unit or in the arrangement direction. A process of discharging the processing liquid from the processing liquid nozzle which is determined by the determination means that liquid condensation or dropping has occurred in the liquid discharge region provided between the liquid processing units, and controlled by the control means to perform the discharge of the processing liquid. It may include the step of outputting a signal.

In addition, the step of performing the coping action includes a step for receiving a liquid condensation and a drop of the processing liquid from each of the processing liquid nozzles by the liquid receiving member, and the liquid receiving when the liquid condensation or dropping of the processing liquid is detected. It may include the process of moving a member from the evacuation area | region of the outer side of the said liquid receiving area to the liquid receiving area for receiving liquid below a liquid processing nozzle by a moving means.

The storage medium of the present invention is a storage medium in which a computer program used in a liquid processing apparatus for performing liquid processing on a substrate is stored, wherein the computer program is for performing the above-described liquid processing method.

According to the present invention, an optical sensor for forming an optical axis in an array direction of the processing liquid nozzle below the processing liquid nozzle provided along the arrangement direction of the liquid processing unit, and by the optical sensor when each processing liquid nozzle is not in use. Means for outputting a determination signal upon determining that liquid condensation or dripping of the processing liquid has occurred when detecting a state in which the optical axis is blocked, and a coping means for performing a coping operation based on the output of the determination signal; have. Therefore, when each processing liquid nozzle moves on each liquid processing part arranged in the horizontal direction, it is suppressed that a processing liquid drips into a board | substrate or a board | substrate holding part, and interrupts normal processing or becomes a particle. As a result, the fall of yield is suppressed.

1 is a perspective view of a resist coating apparatus according to the present invention.
2 is a plan view of the resist coating apparatus.
3 is a configuration diagram of a coating processing unit of the resist coating apparatus.
4 is a perspective view of a resist supply part of the resist coating device.
5A and 5B are plan views of the tip side of the arm of the resist supply unit.
6 is a perspective view of the back side of the arm.
It is explanatory drawing which shows the state which liquid condensation generate | occur | produced from the collection nozzle of the said arm.
8A and 8B are process charts showing a process in which a resist is applied to a wafer.
9 is a configuration diagram of a control unit of the resist coating apparatus.
FIG. 10 is an explanatory diagram showing a state in which chemical liquid discharge is performed to a nozzle bath. FIG.
It is explanatory drawing which shows the relationship between the position of an arm at the time of abnormality, and the nozzle bath which an arm moves.
12 is a flowchart showing an operation in abnormality.
13 is a perspective view illustrating a resist supply unit according to another embodiment.
14A and 14B are side views of the resist supply portion.
15 is a plan view of the coating and developing apparatus including the resist coating apparatus.
16 is a perspective view of the coating and developing apparatus.
17 is a vertical plan view of the coating and developing apparatus.

(First embodiment)

The resist coating apparatus 1 which is an example of the liquid processing apparatus of this invention is demonstrated with reference to FIGS. 1 and 2 which are the perspective view and the top view, respectively. The resist coating apparatus 1 is adapted to hold three nozzles of the three coating treatment portions 11a, 11b, 11c, the resist supply portion 3, the peripheral edge removal mechanisms 61a, 61b, 61c of the resist film and the resist supply portion 3; A nozzle bath 30 is provided. In addition, although illustration is abbreviate | omitted, on each coating process part 11a-11c, the gas supply part for supplying gas downward and generating the air flow (downflow) downward is provided.

The coating treatments 11a to 11c are arranged in a row in the transverse direction. Each coating processing part 11a-11c is comprised in the same, respectively, and it demonstrates here with reference to FIG. 3 which shows the longitudinal side surface, taking the coating processing part 11a as an example. The coating processing part 11a is equipped with the spin chuck 12a which is a board | substrate holding | maintenance part which adsorb | sucks and maintains horizontally the center part of the back surface of the wafer W, respectively, and the spin chuck 12a rotates through the rotating shaft 13a. It is connected with the drive mechanism 14a. The spin chuck 12a is configured to be rotatable about a vertical axis with the wafer W held by the rotation drive mechanism 14a, and is set such that the center of the wafer W is located on the rotation axis. . The rotation drive mechanism 14a receives the control signal from the control part 7 mentioned later, and controls the rotation speed of the spin chuck 12a.

Around the spin chuck 12a, a cup 21a having an opening 20a is provided to surround the wafer W on the spin chuck 12a, and the upper end side of the side surface of the cup 21a is The inclined portion 22a inclined inward is formed. On the bottom side of the cup 21a, the liquid receiving part 23a which forms a recessed part shape is formed, for example. The liquid receiving portion 23a is partitioned into the outer region and the inner region over the entire circumference of the lower portion of the wafer W by the partition wall 24a. A drain port 25a for discharging the drain of the stored resist or the like is formed at the bottom of the outer region, and exhaust ports 26a and 26a for exhausting the processing atmosphere are formed at the bottom of the inner region.

One end of the exhaust pipe 27a is connected to the exhaust ports 26a and 26a, and the other end of the exhaust pipe 27a is connected to an exhaust damper 28a, for example, in a factory where the resist coating device 1 is installed. It is connected to the exhaust passage. The exhaust damper 28a receives the control signal from the control unit 7 to control the amount of exhaust in the cup 21a.

In the figure, 15a is a lifting pin configured to be movable up and down, and three are provided in the cup 21a (only two are shown in FIG. 1 and FIG. 3 for convenience). According to the operation of the substrate conveying means (not shown) which conveys the wafer W to the resist coating apparatus 1, the lifting mechanism 16a raises and lowers the lifting pins 15a in accordance with a control signal output from the control unit 7. The wafer W is transferred between the substrate transfer means and the spin chuck 12a.

For the portions corresponding to the respective portions of the coating treatment portion 11a with respect to the coating treatment portions 11b and 11c, the same numerals as those used for the description of the coating treatment portion 11a are used, and b and c are given instead of a. Are shown in each drawing. In addition, each cup of each coating process part 11a-11c carries out the discharge process of the liquid from the nozzle which caused this liquid condensation between each cup at the time of liquid condensation generation, and performs liquid condensation removal, as mentioned later. Arranged at intervals.

Next, the structure of the resist supply part 3 is demonstrated with reference to FIG. The resist supply section 3 includes a drive mechanism (support drive mechanism) 32, an arm 33 as a support extending in the horizontal direction from the drive mechanism 32, an assembly nozzle 40, and a bracket 50 as a fixing member. Doing. 3A in FIG. 1 is a base which supports the drive mechanism 32, and is provided with the guide 31 extended in the arrangement direction of the coating process parts 11a-11c. The drive mechanism 32 moves along the longitudinal direction of the guide 31. The aggregate nozzle 40 is supported at the lower side of the nozzle head 34 forming the tip of the arm 33, and each of the ten resist discharge nozzles 41 for supplying ten kinds of resists having different concentrations or components, and a wafer. A thinner discharge nozzle 42 for supplying a processing liquid, for example, thinner, to easily spread the resist on (W). Here, resist and thinner are collectively called chemical liquid. Each nozzle 41 and 42 is arranged in parallel with the direction of movement of these nozzles 41 and 42 by the arm 33.

In addition, the arm 33 is comprised by the drive mechanism 32 so that lifting and lowering is possible, and FIG. 5A and FIG. 5B show the state in which the arm 33 is in an up position and a down position, respectively. In order to prevent interference with each of the coating treatment parts 11a to 11c, the peripheral edge removing mechanisms 61a to 61c, and the nozzle bath 30, the arm 33 is moved in the horizontal direction in this raised state, and the assembly nozzle 40 At the time of supplying the chemical liquid to the wafer W, the chemical liquid is moved to the lowered position so that the distance between the wafer W and the nozzles 41 and 42 becomes a predetermined size in order to suppress generation of mist.

Each nozzle 41 and 42 is provided with the discharge port of the chemical liquid opened vertically downward. Each of the nozzles 41 and 42 can move on the center of the wafer W according to the movement of the drive mechanism 32 in the lateral direction, and discharge the chemical liquid from each discharge port to the center of the wafer W that rotates about the vertical axis. do. The discharged chemical liquid is applied to the entire surface of the wafer W by so-called spin coating which is diffused to the periphery of the wafer W by centrifugal force.

43 in FIG. 3 is a chemical liquid supply unit. The chemical liquid supply unit 43 has a chemical liquid supply mechanism 44 including a tank in which the chemical liquid supplied to each of the nozzles 41 and 42 is stored, and a liquid feeding means for pressurizing the inside of the tank to feed the chemical liquid into the nozzle. It is comprised by 11 and 11 chemical liquid supply mechanisms 44 which are the same number as the nozzles 41 and 42 are provided. 45 in FIG. 3 is a chemical liquid supply line which connects nozzles 41 and 42 and each chemical liquid supply mechanism 44, and each chemical liquid supply line 45 is provided with the flow control part 47 including the valve 46. In FIG. have. In response to the control signal from the control unit 7, the opening and closing of each valve 46 is controlled, and ten kinds of resists and thinners can be switched and supplied to the wafer W. FIG.

FIG. 6 shows the rear surface of the arm 33, and a camera 35 and a light source 36, which are image sensors (imaging means) for acquiring an image, are provided on the rear surface side of the arm 33. As shown in FIG. The camera 35 is equipped with a wide-angle lens, for example, and captures the tip portions of these nozzles 41 and 42 from a direction substantially orthogonal to the arrangement direction of the nozzles 41 and 42, causing liquid condensation and dropping. The nozzle can be specified. When imaging is performed, the light source 36 illuminates the nozzles 41 and 42. The camera 35 is constantly transmitting an image to the control unit 7 during the resist coating process, and the analysis of the image data is carried out to reduce the load on the CPU 74 by executing the analysis program described later. Only when is detected.

Here, the liquid confinement means a state in which the liquid droplets are exposed downward from the tip of the nozzle, and the drop of liquid (dropping of the treatment liquid) means that the chemical liquid is separated from the distal end as a result of the growth of the liquid condensation. In addition, the control part 7 is No. 1, No. 2, in order from the left side, for example, when viewed from the front end side of the arm 33. The nozzle number is assigned like No. 11, and the abnormal occurrence situation is managed for each number as described later.

Next, the bracket 50 will be described. The base side of the bracket 50 is fixed to the drive mechanism 32, and the tip side of the bracket 50 extends along the arm 33. 5A and 5B, the tip end portion 51 of the bracket 50 has side plates 52a and 52b sandwiching the nozzle head 34 from side to side when viewed from the tip side of the arm 33. As shown in FIG. Doing. The side plates 52a and 52b are provided with a transmissive optical sensor (light sensor) 53 constituted by a light transmitting portion 53a and a light receiving portion 53b which are paired with each other. Accordingly, the arm 33 can move in the Y direction (arrangement direction of the coating processing units 11a to 11b) and the height direction (Z direction) in FIG. 1 as described above, whereas the optical sensor 53 drives the drive mechanism 32. ) Moves integrally with the arm 33 in the Y direction but does not move in the Z direction. If the optical sensor 53 is also lowered together with the arm 33 when the chemical liquid is discharged to the wafer W, and the distance to the wafer W becomes close, the light transmitting portions 53a and 53b are contaminated by the chemical liquid. There is a concern that the light emission amount and the light reception amount may decrease. Therefore, the optical sensor 53 is not lowered regardless of the lowering of the arm 33, so that the risk of false detection of liquid build-up and droplet drop is reduced.

When the arm 33 is in the raised position, the light transmitting portion 53a and the light receiving portion 53b are located below the nozzles 41 and 42, and the light transmitting portion 53a as shown by the dashed line arrow in FIG. 5A. ) Is irradiated along the arraying direction of the nozzles 41 and 42 to the light receiving part 53b so as to pass below the tip of these nozzles 41 and 42, and the optical axis L1 shown by the dashed line arrow in the figure is Is formed. As the light transmitting portion 53a, it is preferable to irradiate light in a long wavelength region such as visible light in order to suppress the risk of photoresist being exposed. In addition, the light irradiated in this way may be more directional such as a laser. The distance L between the optical axis L1 and the lower ends of the nozzles 41 and 42 is, for example, 0.5 mm to 1.5 mm.

The light receiving unit 53b transmits an output signal corresponding to the amount of light received by the control unit 7. As shown in Fig. 5A, when liquid condensation D occurs or droplet drop occurs when the arm 33 is in the raised position, the droplet irradiates the light irradiated from the light transmitting portion 53a to the light receiving portion 53b. The amount of light received by the light receiving portion 53b by blocking is reduced, and the signal output by the light receiving portion 53b changes according to the decrease.

Next, the coating-film peripheral part removal mechanism 61a-61c is demonstrated. The coating film peripheral part removal mechanisms 61a-61c are provided in order to remove the peripheral part of the resist film formed in each wafer W of the coating process parts 11a-11c, and to prevent peeling of the film | membrane of the said peripheral part. Each of the coating film peripheral edge removal mechanisms 61a to 61c includes a thinner discharge nozzle 62 for supplying thinner, which is a solvent of resist, to the periphery of the wafer W, an arm 63 for holding the thinner discharge nozzle 62; The drive mechanism 64 holding the arm 63 is provided. The drive mechanism 64 raises and lowers the arm 63 and moves along the guide 65 in the Y direction. In the figure, 66a-66c is a nozzle bath formed in the cup shape which opened the upper side, and is provided along the row | line | column of the coating process parts 11a-11c. Each thinner discharge nozzle 62 is housed in the nozzle baths 66a to 66c when the process is not performed, and then moves on the periphery of the wafer W of the coating treatment parts 11a to 11c corresponding to the process. do.

The nozzle bath 30 is provided in the one end side of the Y direction which the aggregation nozzle 40 moves, and is formed in the cup shape which opened the upper side. The collective nozzle 40 is accommodated in the nozzle bath 30 and waits when the wafer W is not processed. In addition, when liquid formation and droplet drop are detected, the chemical liquid may be discharged into these nozzle baths 30, 66a to 66c constituting the drainage region, and the discharged chemical liquid may be discharged into the nozzle baths 30, 66a to 66c. A drain passage, not shown, for draining is formed.

Next, the process of apply | coating a resist to the wafer W by the resist coating apparatus 1 is demonstrated. Wafer W conveyed to the coating process part 11a by the conveyance means external to the coating device 1 is transferred to the spin chuck 12a by the lifting pin 15a, for example. Thereafter, the assembly nozzle 40 waiting in the nozzle bath 30 rises by the arm 33 and exits the nozzle bath 30, and then moves in the Y direction so that the thinner discharge nozzle 42 moves to the wafer ( When placed on the center of W (FIG. 8A), the arm 33 is lowered. In parallel with the movement of the arm 33, the spin chuck 12a is rotated, and thinner is supplied onto the rotating wafer W. As shown in FIG. After the thinner is spin coated, the arm 33 moves in the Y direction so that the resist discharge nozzle 41 used in the process is located on the center of the wafer W. As shown in FIG. In parallel with this movement operation, the number of rotations of the wafer W increases, the resist R is supplied onto the wafer W, and the resist R is applied to the entire surface of the wafer W by spin coating (FIG. 8B). ).

After the supply of the resist R is stopped, the rotation speed of the wafer W is lowered to make the thickness of the resist R uniform, and then the rotation speed is increased again to shake off the coated resist R to form a resist film. do. In the meantime, after the arm 33 moves to a raise position, it moves to the nozzle bath 30 laterally, and it descends and waits in the said nozzle bath 30 after that. On the other hand, with respect to the wafer W on which rotation drying is completed, thinner is supplied from the thinner discharge nozzle 2 while the wafer W rotates, and the resist film applied to the periphery of the wafer W is removed. Thereafter, as in the case of the resist film, a thinner is subjected to rotational drying to complete a series of liquid treatments.

After the thinner discharge nozzle 2 is retracted to the nozzle bath 66a of the peripheral portion removal mechanism 61a, the wafer W is transferred to the conveying means outside the apparatus 1 by the lifting pins 15a, and the resist coating device It is taken out from (1). In this way, the wafers W are sequentially transferred to the respective coating treatment units 11a to 11c at predetermined intervals by the transfer means, for example, in accordance with a transfer cycle of the wafer W set in advance, and the arm 33 is coated. Similarly to when it moved to the processing part 11a, it moves also to another coating process part, and the same process is performed.

In this example, the arm 33 first moves from the nozzle bath 30 to the coating treatment units 11a to 11c to which the wafer W has been conveyed and finishes the liquid processing there, and then returns to the nozzle bath 30 once, Later, the wafer W moves to the coating processing units 11a to 11c conveyed. However, after moving from the nozzle bath 30 to one application processing part 11a-11c, it does not return to the nozzle bath 30, but moves to another application processing part 11a-11c, and performs processing, for example, The arm 33 may be operated so as to return to the nozzle bath 30 after moving between the plaster applications 11a to 11c.

In this resist coating apparatus 1, the control part 7 which comprises the coping means which consists of computers, for example is provided. The structure of the control part 7 is demonstrated with reference to FIG. In the figure, 70 is a bus, and the control part 7 is the process program 71, the analysis program 7A, the 1st memory 72, the 2nd memory 73, and the CPU 74 connected to these buses 70. And an operation unit 75 and a display unit 76. The analysis program 7A constituting the judging means performs an analysis process of the image transmitted from the camera 35 when an abnormality occurs, and the process program 71 performs other processes.

The first memory 72 includes an area in which processing parameter values such as processing temperature, processing time, supply amount of each chemical liquid or power value are written, and when the CPU 74 executes each instruction of the processing program 71. These processing parameters are read out, and a control signal corresponding to this parameter value is sent to each part of this resist coating apparatus 1. The operation of the processing program 71 also includes operations relating to the input operation or display of these processing parameters. The processing program 71 and the analysis program 7A are stored in a program storage unit 77 constituted by computer storage media such as, for example, a flexible disk, a compact disk, a hard disk, a MO (magnet) disk, and a memory card. And is installed in the control unit 7.

In the second memory 73, image data at the tip of the collecting nozzle 40 transmitted from the camera 35 and various types of data to be described later used by the user for maintenance are stored. The stored image data is deleted by the processing program 71 from the second memory 73 after a predetermined time elapses, for example, in order to suppress the use capacity of the second memory 73. The operation part 75 is comprised by a mouse, a keyboard, etc., For example, setting of the process parameter described is performed by this operation part 75. As shown in FIG. Further, as a countermeasure taken by the user when liquid formation and droplet drop are detected, the discharging process (dummy dispensing) which is not intended for the coating process of the chemical liquid to the nozzle bath, and the processing in the resist coating apparatus 1 are stopped. Either one can be performed or it can select from the operation part 75. The display unit 76 is configured as a display, for example.

In addition, the control part 7 has ID of the wafer W conveyed to the resist coating apparatus 1 from the host computer which controls conveyance of the wafer W, the timing with which this wafer W is conveyed, and the like, for example. The application processing unit serving as the transfer destination and the type data of the resist to be applied are transmitted. Based on this data, the processing program 71 moves the assembly nozzle 40 to the respective application processing units 11a to 11c, and the wafer W The resist coating process is performed by the nozzle according to the present invention.

An alarm generator 79 is connected to the bus 70. The alarm generating unit 79 outputs an alarm when detecting the occurrence of liquid condensation and dropping, detecting an abnormality of the apparatus, and when a maintenance recommendation time has come. In addition, the bus 70 is connected with a camera 35, a light source 36, a driving mechanism 32, a chemical liquid supply unit 43, a flow rate control unit 47, and the like, which are coated with a resist on the wafer W. It is possible to execute a predetermined coping action in accordance with the processing and the formation of the liquid and the drop of the liquid.

Here, a description will be given of the steps of the occurrence of liquid condensation and the drop of the droplets and the respective detection operations of the device abnormality and the occurrence of the alarm corresponding thereto. As described above, when the light irradiated from the light-transmitting section 53a is blocked and the amount of light received by the light-receiving section 53b is lowered, a signal (referred to as a light amount reduction signal for convenience) is output from the light-receiving section 53b. In addition, as shown in FIG. 5B, when the arm 33 is in the lowered position, a signal for positioning the arm 33 at the lowered position (called a lowered signal for convenience) is output by the processing program 71. The light quantity reduction signal is output to the control unit 7. At this time, the processing program 71 does not determine that liquid condensation and droplet drop have occurred.

And as shown in FIG. 7, when the arm 33 is in a raised position, the process program 71 outputs the signal (referred to as a rise signal for convenience) which positions the arm 33 in this raised position. When the light amount reduction signal is output while the rising signal is output in this manner, the processing program 71 determines that liquid condensation and droplet drop have occurred, and generates an alarm indicating the effect by the alarm generating unit 79. Let's do it. The arm 33 is in the raised position during the transverse direction between the nozzle bath 30 and each of the coating units 11a to 11c and on the coating units 11a to 11c and the nozzle bath 30, respectively. While waiting to descend after moving. Therefore, the occurrence of liquid condensation and droplet drop is monitored in these sections. In this way, the nozzles 41 and 42 are unused while moving in the transverse direction from the raised position and waiting in the raised position. When the light amount reduction signal is not output when the falling signal is output, the processing program 71 determines that the device 1 or more is generated, and the alarm generating unit 79 generates an alarm indicating the effect.

In addition, when detecting the occurrence of liquid condensation and droplet drop (abnormal) as described above, the nozzles 41 and 42 for the nozzles 41 and 42 that are identified as causing an abnormality as described later in detail. The number and the time are associated with each other and stored in the second memory 73. Then, the processing program 71 calculates, for example, the average of the intervals between these time points at the time when abnormalities occur in the past for each nozzle, and uses the average as the period in which liquid buildup and droplet drop occur. ) Is displayed on the display unit 76. The processing program 71 adds this period to the time when the latest abnormality has occurred, calculates the timing at which nozzles are expected to occur next, for each nozzle, and stores the calculated timing in the second memory 73. Displayed on the display unit 76. In addition, when the timing calculated in this way approaches, the processing program 71 judges that the maintenance recommendation time is on, and generates the notification alarm by the alarm generating unit 79. The user can perform maintenance of the apparatus 1 based on this alarm.

In addition, when the process program 71 detects the formation of liquid buildup and droplet drop, the processing program 71 associates data on the position of the arm 33 and the operation direction of the arm 33 at this time with the number of the nozzle that caused the abnormality. The second memory 73 is stored. For example, the display unit 76 displays the positions where liquid condensation and droplet drop have occurred in the past for each nozzle, and the operation direction at this time, while the user operates the arm with reference to this display when performing the maintenance. You can check the nozzle status.

The processing program 71 also stores, in the second memory 73, the ID of the wafer placed on the spin chucks 12a to 12c of the respective coating processing units 11a to 11c at the time of liquid formation and droplet drop detection. The stored ID is also displayed on the display unit 76, and the user selects and inspects the wafer W based on this display, for example, in an inspection process performed after resist application.

Next, when liquid formation and droplet drop are detected as mentioned above, the discharge process (dummy dispense) of the chemical liquid performed by the user's selection to a nozzle bath is demonstrated. This ejection process is a process of specifying a nozzle which causes liquid condensation and droplet drop by imaging, ejecting liquid droplets from this nozzle to remove the chemical liquid in the ejection opening to prevent the liquid drop, and further flowing the liquid condensation. . In performing this process, in order to prevent the droplets from falling until the ejection of the chemical liquid, the nozzle moves on the nozzle bath at the shortest distance from the position at which liquid condensation is detected and moves to a predetermined height from the nozzle bath. It descends and discharges chemical liquid as shown in FIG. Specifically, for example, when an abnormality is detected in the nozzle when the arm is located in the regions T1, T2, T3, and T4 enclosed by the broken lines in FIG. 11, the arm 33 has the nozzle bath 30, respectively. Move to locate on 66a, 66b, 66c. Although the chemical liquid is discharged to the nozzle bath 66a in FIG. 10, the chemical liquid is discharged similarly to another nozzle bath.

Next, when the coating process is performed on the wafer W as described above, the operation when liquid condensation and droplet drop occur will be described with reference to the flowchart of FIG. 12. At this time, it is set to perform the discharge process to the said nozzle bath by a user, and the stop of the process in the resist coating apparatus 1 shall not be set. For example, when the arm 33 is directed from the nozzle bath 30 to the coating processing part 11b as described above, No. Liquid condensation has occurred in the nozzle of 3, and in the coating process part 11b which is a moving destination, No. It is assumed that the resist is supplied from the nozzle of 5. As described above, the amount of light received by the light receiving portion 53b decreases due to liquid condensation, and the processing program 71 determines that liquid condensation and droplet drop have occurred based on the output signal from the light receiving portion 53b. (Step S1), the alarm is generated by the alarm generating unit 79 (step S2).

In parallel with the occurrence of the alarm, the determination of the occurrence of abnormality by the processing program 71 triggers and the analysis program 7A is started (step S3). On the basis of the image transmitted from the 35 to the control unit 7 and stored in the second memory 73, it is determined which nozzle is causing an abnormality (step S4). After the determination, the operation of the analysis program 7A stops, and based on the determination result, the processing program 71 determines the position of the arm 33 at the time of this abnormality detection, the operation direction of the arm 33, and the time at the time of abnormality detection. The data for the time was the No. determined to be abnormal. The second memory 73 is stored in correspondence with the three nozzles. In addition, the ID of the wafer W conveyed to the resist coating apparatus 1 at the time of abnormality detection is also stored in the 2nd memory 73 (step S5).

This processing program 71 is the time at which the abnormality is detected at this time and the No. 2 stored in the second memory 73 until then. Based on the time at the time of abnormality detection of the nozzle of 3, this No. The period in which the nozzle of 3 causes an abnormality and the timing at which an abnormality occurs next are calculated, and the result of this calculation is displayed on the display unit 76. It is determined whether the nozzle of 3 is a nozzle to be used for the coating process immediately after the abnormality detection (step S6).

In this case, the coating treatment unit 11b, which is the moving destination of the assembly nozzle 40, is No. 1. Since the nozzle of 5 is used, it is determined in step S6 that the nozzle is not used for the coating process immediately after the abnormality detection. Then, the arm 33 moves on the nozzle bath corresponding to the position when liquid condensation and droplet drop are detected. For example, when the arm 33 is located in the area T3 of FIG. 11 at the time of liquid condensation and droplet drop detection, the arm 33 is abnormal on the nozzle bath 66b corresponding to this area T3. No. that caused the Move to position the nozzle of 3. And the arm 33 falls toward the nozzle bath 66b, and after that, the abnormality No. The chemical liquid is discharged from the nozzle of 3 to the nozzle bath 66b (step S7). After the chemical liquid is discharged, the processing program 71 determines that the nozzle has recovered from the abnormal state, and the operation before the step S1 is resumed, and the arm 33 moves to the coating processing unit 11b again to perform the coating process. .

On the other hand, when it determines with the nozzle used for the application | coating process immediately after abnormality detection in the said step S6, the movement to the application | coating process part 11b and the application | coating process of a normal resist are performed (step S8), and this application | coating process is carried out. By discharging the chemical liquid from the nozzle in which the abnormality occurs, liquid condensation is removed and the liquid drop does not easily occur. After this chemical liquid discharge, the processing program 71 determines that the nozzle has recovered from the abnormal state, and then the coating process is performed. In this way, steps S7 and S8 are executed and the coating process is continued, for example, after processing a predetermined number of wafers W, and the user stops the apparatus 1 by, for example, the operation unit 75. And maintenance. After maintenance, for example, a user performs predetermined processing through the operation part 75, stops generation of an alarm, and resumes application | coating process.

The case where the user selected to perform chemical liquid discharge to the nozzle bath was demonstrated. However, in the case where the processing stop of the apparatus 1 is selected to be performed instead of the selection in this way, after the above steps S1 to S5 are executed, the control unit 7 controls each of the resist coating apparatus 1. The control signal is transmitted to the negative direction, the movement of the drive mechanism 32 is stopped, and each processing performed by the coating processing units 11a to 11c is stopped. Moreover, a control signal is transmitted to the control part which controls the operation | movement of a board | substrate conveyance means, and conveyance of the wafer W to the resist coating apparatus 1 is stopped. Then, after the user performs the maintenance of the apparatus 1, for example, by performing a predetermined process through the operation unit 75, the processing program 71 determines that the nozzle has recovered from the abnormal state, and the occurrence of an alarm is prevented. It stops and application | coating process is resumed.

According to the above embodiment, the light-transmitting part 53a which irradiates light along the arrangement direction of the nozzles 41 and 42 which comprise the said collecting nozzle 40 under the collecting nozzle 40, and this light is received. And a control unit 7 which determines that liquid condensation or dripping of the chemical liquid has occurred when the optical sensor 53 including the light receiving unit 53b to be detected and the optical axis of the optical sensor 53 are blocked. On the basis of this determination result, (7) stops the resist coating process due to the generation of an alarm and the discharge of the chemical liquid to the nozzle bath or the stop of the drive mechanism 32. Therefore, when the assembly nozzle 40 moves on each of the coating portions 11a to 11c, the chemical liquid is dropped onto the wafer W or the spin chucks 12a to 12c, thereby inhibiting normal processing or becoming particles. . As a result, the fall of the yield of a product can be suppressed.

In addition, in the above embodiment, the analysis program 7A operates only when it is determined that the liquid formation and the drop of the droplet have occurred, and the analysis of the image transmitted from the camera 35 to the control unit 7 is performed. Since the load of 7A) can be suppressed, it is preferable. In the above example, the power supply is always turned on during the resist coating process in order to quickly capture an image in the above example, and image data is always transmitted to the control unit 7. However, the power supply may be turned on only when it is determined that the above-mentioned liquid condensation and the drop of the droplet have occurred, and transmission of image data to the control unit 7 may be performed.

In the above embodiment, the front end of each nozzle constituting the collective nozzle 40 is collectively monitored by the optical sensor 53, the liquid condensation and the drop of the chemical liquid are detected and an alarm is output. And since the movement of the arm 33 which supports the aggregation nozzle 40 at the time of a normal resist coating process is not influenced by the monitoring by this optical sensor 53, the fall of the throughput by performing such monitoring is performed. Can be suppressed. Moreover, the collective nozzle 40 is collectively monitored by the optical sensor 53 which consists of a pair of light transmitting part 53a and the light receiving part 53b. Thus, by setting it as the structure which monitors a some nozzle by one sensor, the increase of the number of components of an apparatus can be suppressed. In addition, in the above embodiment, the space to be monitored does not change even if the number of nozzles and chemical supply lines 45 used for processing is changed after the mounting of the optical sensor 53, so that the mounting position of the optical sensor 53 is changed. It is preferable because no change or adjustment work is required. In addition, since the period in which the abnormality occurs for each nozzle is calculated and an alarm is output based on this period, the user can be informed of the timing of proper maintenance, and as a result, the user can suppress the decrease in yield more reliably. .

(Second embodiment)

Next, another Example of the resist coating apparatus 1 is demonstrated centering on difference with 1st Example. Fig. 13 is a perspective view of the resist supply section 3 in the second embodiment, and a drive mechanism 81 having, for example, a cylinder 82 is provided at the tip end portion 51 of the bracket 50, and the cylinder is provided. A support plate 83 in the form of a standing plate is connected to 82, and a support plate 84 constituting the liquid receiving member is provided horizontally.

The drive mechanism 81 is fixed with respect to the bracket 50, and the receiving pan 84 moves integrally with the arm 33 in the Y direction, but does not move in the Z direction (up-down direction). By not lowering the receiving plate 84 together with the arm 33 in this manner, the receiving plate 84 interrupts the downflow of the resist coating device 1 directly above the wafer W, thereby reducing the wafer W. As shown in FIG. Influence on the coating film thickness on () or the number of particle generation is prevented. The receiving plate 84 is configured to be movable in the X direction (extension direction of the arm 33) by the drive mechanism 81, and retracts away from directly under the collecting nozzle 40 shown in Fig. 14A. It moves between a position and the liquid receiving position directly under the aggregation nozzle 40 shown in FIG. 14B. Usually, the receiving pan 84 stands by at the retracted position so as not to disturb the lifting and lowering of the collecting nozzle 40 by the arm 33.

In this second embodiment described above, a processing step in the case where liquid condensation and droplet drop occurs will be described. After the steps S1 and S2 are performed as in the first embodiment, the receiving pan 84 is moved to the liquid receiving position and the steps S3 to S6 are performed in the same manner. And when it is determined that the nozzle in which the abnormality occurred in step S6 is not a nozzle used for the next application | coating process, the arm 33 has an abnormality in step S1 with the receiving pan 84 located in the liquid receiving position. Move onto the nozzle bath corresponding to the detected position. And when the nozzle which an abnormality was located is located on a nozzle bath, the receiving pan 84 will move from a liquid receiving position to a retracted position, and then the arm 33 will descend | fall and the chemical | medical solution to the nozzle bath of step S7 may be carried out. Discharge is performed. After the discharge of the chemical liquid, the processing program 71 determines that the nozzle has recovered from the abnormal state, and the coating process is continuously performed while the receiving pan 84 is positioned at the retracted position.

In addition, when it is determined in step S6 that the nozzle having an abnormality is a nozzle to be used for the next coating treatment, the arm 33 moves to the coating treatment portions 11a to 11c while the receiving dish 84 is located at the liquid receiving position. Move. And when the nozzle which the abnormality generate | occur | produced is located on the wafer W of these application processing parts 11a-11c, the receiving pan 84 will move to the retracted position from the liquid receiving position, and the wafer W of step S8 will be The normal process is performed, and the program 71 determines that the nozzle has recovered from the abnormal state, and subsequently the coating process of the next wafer W is performed while the receiving pan 84 is positioned at the retracted position.

In this second embodiment, physical avoidance of the drop of the liquid due to the output of the alarm and the movement of the receiving pan 84 is performed, and thus has the same effect as the first embodiment. In addition, by placing the receiving plate 84 in the liquid receiving position only at the time of abnormality detection in this manner, the receiving plate 84 avoids the arm 33 every time the arm 33 moves up and down during normal processing. There is no need to move, and the fall of the throughput according to the movement of this receiving plate 84 can be suppressed. If no abnormality of the nozzle is detected by the optical sensor 53 at the stage where liquid condensation is formed at the front end of the collecting nozzle 40, and the receiving dish 84 is moved directly under the nozzle until the droplet falls, there is no problem. In this way, a sufficient effect can be obtained by setting the receiving plate 84 to be normally positioned at the retracted position. In addition, in the second embodiment, since the receiving dish 84 and one mechanism for operating the same are provided in the apparatus, the number of parts of the apparatus is suppressed as compared with the case where, for example, a means for preventing liquid condensation is provided for each nozzle. Preferred at

In addition, in the second embodiment, after the alarm is generated, for example, the liquid is not discharged to the nozzle bath, and the liquid is placed in the drop position while the arm is in the up position and in the retracted position while in the down position. Each time the arm 33 moves up and down, the receiving plate 84 may be moved to perform the coating process. In this case, for example, after the predetermined number of wafers have been processed, the user may perform maintenance work to return the nozzle to the normal state and release the movement of the receiving dish 84. Also in this case, since the nozzle moves in the lateral direction and passes through the respective coating treatment parts 11a to 11c, the drop of the droplets to the wafer W and the spin chuck 12 can be prevented. As described above, in the second embodiment, the receiving dish 84 is moved until the nozzles 41 and 42 recover from the abnormal state to the normal state by discharging or maintaining the chemical liquid to the nozzle bath. After the recovery of the furnace, it is preferable to reduce the throughput caused by the movement of the receiving plate 84 by moving the receiving plate 84 to the retracted position again and subsequently applying the coating process. In addition, in each embodiment, each nozzle bath and application | coating process part may be arrange | positioned in the circumferential direction rather than a linear direction as mentioned above, and the arm 33 which supported the aggregation nozzle 40 may move in this arrangement direction. In addition, the optical sensor is not limited to a transmissive type, but an optical axis may be formed using a reflective type.

Hereinafter, the coating and developing apparatus 110 on which the resist coating apparatus 1 is mounted will be described. FIG. 15 shows a plan view of a resist pattern forming system in which the exposure apparatus C4 is connected to the coating and developing apparatus 110, and FIG. 16 is a perspective view of this system. 17 is a longitudinal cross-sectional view of the coating and developing apparatus 110. Carrier block C1 is provided in this application | coating development apparatus 110, and the transfer arm 112 takes out the wafer W from the sealed carrier C mounted on this mounting base 111, and a process block is carried out. It transfers to (C2), and it is comprised so that the delivery arm 112 may receive the processed wafer W from the process block C2 and return it to the carrier C. FIG. The carrier C includes a plurality of wafers W, and each wafer W is conveyed to the processing block C2 in turn.

As shown in Fig. 16, the processing block C2 performs the process of forming the antireflection film formed under the first block (DEV layer) B1 and the resist film for development in this example. The second block (BCT layer) B2, the third block (COT layer) B3 for applying the resist film, and the fourth block (ITC layer) for forming the protective film formed on the upper layer side of the resist film. (B4) is laminated | stacked in order from the bottom, and is comprised.

Each layer of the processing block C2 is configured in the same manner in plan view. Taking the third block (COT layer) B3 as an example, the COT layer B3 is formed of a resist coating module 113 for forming a resist film as a coating film and a process performed by the resist coating module 113. Wafers are provided between the shelf units U1 to U4 constituting the heating and cooling system processing module group for pretreatment and post-treatment, and the resist coating module and the processing module group for the heating and cooling system. It is comprised by the conveyance arm A3 which delivers (W). The resist coating device 1 described by the resist coating module 113 corresponds to the substrate conveying means described by the conveying arm A3.

The shelf units U1 to U4 are arranged along the conveyance region R1 where the conveyance arm A3 moves, and are configured by stacking the above-described heating module and cooling module, respectively. The heating module has a heating plate for heating the placed wafer, and the cooling module has a cooling plate for cooling the placed wafer.

As for the second block (BCT layer) B2 and the fourth block (ITC layer) B4, an antireflection film forming module and a protective film forming module corresponding to the resist coating module are provided, respectively. It is the same structure as COT layer B3 except that the chemical liquid for anti-reflective film formation and the chemical liquid for protective film formation are respectively supplied to the wafer W as a coating liquid.

As for the first block (DEV layer) B1, two development modules corresponding to a resist coating module are stacked in one DEV layer B1, and three developing units or each nozzle described in the common case are placed. It is included. Further, the DEV layer B1 is provided with shelf units U1 to U4 constituting a group of processing modules for heating and cooling systems for pretreatment and post-treatment of the developing module. And in the DEV layer B1, the conveyance arm A1 for conveying the wafer W to these two stage development modules and the said heating / cooling processing module is provided. In other words, the transfer arm A1 is commonly used for the two-stage developing module.

15 and 17, the shelf unit U5 is provided in the processing block C2, and the wafer W from the carrier block C1 is one of the shelf units U5. The conveying unit, for example, is conveyed to the conveying unit CPL2 corresponding to the second block (BCT layer) B2 in turn. The transfer arm A2 in the second block (BCT layer) B2 receives the wafer W from the transfer unit CPL2 and transfers it to each unit (antireflection film forming module and processing unit group of a heating / cooling system). In these units, an anti-reflection film is formed on the wafer W. FIG.

Thereafter, the wafer W is conveyed to the transfer unit BF2 of the shelf unit U5, the transfer arm D1, and the transfer unit CPL3 of the shelf unit U5, and the temperature is adjusted to 23 ° C., for example. After that, it is carried in to the 3rd block (COT layer) B3 by the conveyance arm A3, and a resist film is formed in a resist coating module. In addition, the wafer W is transferred to the transfer unit BF3 in the shelf unit U5 via the transfer arm A3 → the transfer unit BF3 of the shelf unit U5 → the transfer arm D1. In the wafer W on which the resist film is formed, a protective film may be further formed at the fourth block (ITC layer) B4. In this case, the wafer W is transferred to the transfer arm A4 via the transfer unit CPL4, and is transferred to the transfer unit TRS4 by the transfer arm A4 after the protective film is formed.

On the other hand, in the upper part of DEV layer B1, it is an exclusive conveyance means for directly conveying the wafer W from the delivery part 115 provided in the shelf unit U5 to the delivery part 116 provided in the shelf unit U6. The shuttle 117 is provided. The resist film or the wafer W on which the protective film is further formed is transferred from the transfer units BF3 and TRS4 to the transfer unit 115 by the transfer arm D1, from which the shelf unit U6 is transferred by the shuttle 117. It is conveyed directly to the delivery unit 116 of the and is introduced into the interface block (C3). In addition, the transfer unit given with CPL in FIG. 17 also serves as a cooling unit for temperature regulation, and the transfer unit with BF also serves as a buffer unit in which a plurality of wafers W can be placed.

Subsequently, the wafer W is conveyed to the exposure apparatus C4 by the interface arm 118, and after the predetermined exposure process is performed, the wafer W is placed on the transfer unit TRS6 of the shelf unit U6 and processed into the processing block C2. Is returned. The returned wafer W is subjected to development in the first block (DEV layer) B1, and is transferred to the transfer unit TRS1 of the shelf unit U5 by the transfer arm A1. Thereafter, it is returned to the carrier C by the delivery arm 112.

Although the liquid processing apparatus of this invention is comprised as a resist coating apparatus in the above-mentioned example, it is comprised, for example as a developing module and the anti-reflective film forming module provided in this coating and developing apparatus 1, and respond | corresponds to each module instead of a resist. The chemical liquid may be discharged, or the present invention may be configured as an apparatus for supplying other processing liquid to the substrate.

1 resist coating device
11a to 11c coating treatment
12a-12c spin chuck
21a to 21c cup
3 resist supply
30 nozzle bath
33 cancer
40 sets nozzle
41 Resist Discharge Nozzle
42 thinner discharge nozzle
50 bracket
53 optical sensor
66a to 66c nozzle bath
7 control unit
71 processing programs
7A analysis program

Claims (14)

A plurality of liquid processing portions each provided with a substrate holding portion for holding the substrate horizontally in a cup having an opening formed at an upper side thereof, and arranged in a row in the transverse direction to each other;
A plurality of processing liquid nozzles common to the plurality of liquid processing units and installed on a support along an arrangement direction of the liquid processing unit for supplying different kinds of processing liquids to the substrate,
A nozzle bath provided for waiting the processing liquid nozzle,
A support driving mechanism for moving each processing liquid nozzle along the column of the liquid processing unit via the support between the upper region of each of the liquid processing unit and the nozzle bath;
An optical sensor which forms an optical axis in an array direction of the processing liquid nozzle below each processing liquid nozzle;
Means for outputting a determination signal by determining that liquid condensation or dripping of the processing liquid has occurred when detecting a state in which the optical axis is blocked by the optical sensor when each processing liquid nozzle is not in use;
Coping means for performing a coping operation based on the output of the determination signal;
Liquid processing apparatus comprising a.
The method of claim 1,
The coping means includes: imaging means for imaging the tip of the processing liquid nozzle;
Determination means for judging which process liquid nozzles are formed or dripping the processing liquid based on the imaging result by the imaging means.
And a judgment by a judging means is performed based on the output of said judging signal.
The method of claim 2,
The coping means includes a drainage region provided on an extension line in an arrangement direction of the liquid processing unit or between the liquid processing units in the arrangement direction;
Control means for outputting a control signal to discharge the processing liquid from the processing liquid nozzle which has been judged that liquid condensation or dripping of the processing liquid has occurred in the drainage area by the determination means;
Liquid processing apparatus comprising a.
The method of claim 3, wherein
And the drainage area is constituted by the nozzle bath.
The method according to any one of claims 1 to 4,
The coping means includes: a liquid receiving member for receiving liquid condensation of the processing liquid from each processing liquid nozzle and falling droplets;
And moving means for moving the liquid receiving member from the evacuation region outside of the liquid receiving region to the liquid receiving region for receiving the liquid from below the liquid processing nozzle when liquid condensation or dripping of the processing liquid is detected. Liquid processing apparatus.
The method of claim 1,
The said coping means is equipped with the stop means which stops the movement of a support body drive mechanism, and discharge of the process liquid from a process liquid nozzle.
The method according to any one of claims 1 to 4,
And the coping means comprises an alarm generating means.
The method according to any one of claims 1 to 4,
And the support drive mechanism is configured to elevate and support the support, and the optical sensor is provided in a fixed portion fixed to the support drive mechanism.
A plurality of substrate holding portions each holding a substrate horizontally in a cup having an opening formed thereon, shared with a plurality of liquid processing portions arranged in a row in the transverse direction, and provided in a support along the arrangement direction of the liquid processing portion; Supplying different kinds of treatment liquids from the treatment liquid nozzles to the substrate, respectively;
Placing the processing liquid nozzle in a nozzle bath;
Moving each processing liquid nozzle along the column of the liquid processing unit via the support between the upper region of the liquid processing unit and the nozzle bath by the support driving mechanism;
Forming an optical axis along the array direction of the processing liquid nozzles under each processing liquid nozzle by an optical sensor;
When detecting that the optical axis is blocked by the optical sensor when each processing liquid nozzle is not in use, determining that liquid condensation or dropping of the processing liquid has occurred and outputting a determination signal;
Performing a countermeasure operation based on the output of the determination signal
Liquid treatment method comprising a.
The method of claim 9,
The step of performing the coping action includes a step of picking up the tip of the processing liquid nozzle by the imaging means;
A step of judging by a judging means which liquid solution is formed or dripping of a process liquid on which process liquid nozzle on the basis of the imaging result by said imaging means;
A process of judging by the judging means based on the output of the judging signal
Liquid treatment method comprising a.
The method of claim 10,
A step of discharging the processing liquid from the processing liquid nozzle determined that liquid condensation or dropping of the processing liquid has occurred by the judging means on an extension line in the arrangement direction of the liquid processing unit or between the liquid processing units in the arrangement direction. and,
Outputting a control signal from a control means in order to discharge the processing liquid
Liquid treatment method comprising a.
The method of claim 11,
The step of performing the coping action,
Imaging the distal end of the processing liquid nozzle by the imaging means;
Determining, by the judging means, which liquid treatment liquid dripping or dropping of the processing liquid has occurred in which processing liquid nozzle based on the imaging by the imaging means only when the liquid formation or dripping of the processing liquid is detected;
And outputting a control signal by the control means to discharge the processing liquid from the processing liquid nozzle which has been determined that liquid formation or dropping of the processing liquid has occurred.
The method according to any one of claims 9 to 12,
The step of performing the coping action,
A process for receiving the liquid condensation and the dropped droplets of the processing liquid from each processing liquid nozzle by the liquid receiving member; and when the liquid condensation or dripping of the processing liquid is detected, the liquid receiving member is moved by the moving means to A step of moving from the evacuation region outside of the liquid receiving region to the liquid receiving region for receiving the liquid from below
Liquid treatment method comprising a.
As a storage medium in which a computer program used for a liquid processing apparatus for performing liquid processing on a substrate is stored,
The said computer program is for implementing the liquid processing method in any one of Claims 9-12. The storage medium characterized by the above-mentioned.

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