KR20100114111A - 연성 인쇄 회로 기판의 접속 방법 및 이에 의해 얻어진 전자 소자 - Google Patents

연성 인쇄 회로 기판의 접속 방법 및 이에 의해 얻어진 전자 소자 Download PDF

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Publication number
KR20100114111A
KR20100114111A KR1020107019207A KR20107019207A KR20100114111A KR 20100114111 A KR20100114111 A KR 20100114111A KR 1020107019207 A KR1020107019207 A KR 1020107019207A KR 20107019207 A KR20107019207 A KR 20107019207A KR 20100114111 A KR20100114111 A KR 20100114111A
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KR
South Korea
Prior art keywords
circuit board
conductive interconnects
flexible printed
printed circuit
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107019207A
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English (en)
Korean (ko)
Inventor
야수히로 요시다
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20100114111A publication Critical patent/KR20100114111A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020107019207A 2008-02-05 2009-02-04 연성 인쇄 회로 기판의 접속 방법 및 이에 의해 얻어진 전자 소자 Withdrawn KR20100114111A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-025438 2008-02-05
JP2008025438A JP2009188114A (ja) 2008-02-05 2008-02-05 フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器

Publications (1)

Publication Number Publication Date
KR20100114111A true KR20100114111A (ko) 2010-10-22

Family

ID=40952665

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107019207A Withdrawn KR20100114111A (ko) 2008-02-05 2009-02-04 연성 인쇄 회로 기판의 접속 방법 및 이에 의해 얻어진 전자 소자

Country Status (7)

Country Link
US (1) US20100321916A1 (https=)
EP (1) EP2248400A4 (https=)
JP (1) JP2009188114A (https=)
KR (1) KR20100114111A (https=)
CN (1) CN101940073A (https=)
TW (1) TW200942115A (https=)
WO (1) WO2009100103A2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104412719B (zh) * 2012-06-29 2018-01-26 3M创新有限公司 柔性印刷电路和制造柔性印刷电路的方法
CN103200788B (zh) * 2013-04-10 2016-08-03 合肥京东方光电科技有限公司 一种压接头和压接装置
EP3415021A4 (en) * 2016-02-12 2019-10-09 Toyobo Co., Ltd. ELECTRONIC WEARABLE DEVICE AND METHOD FOR PRODUCING AN ELECTRONIC WEARABLE DEVICE
KR102750572B1 (ko) * 2017-01-06 2025-01-07 삼성디스플레이 주식회사 표시 장치
CN107072077B (zh) * 2017-03-21 2018-06-01 常州安泰诺特种印制板有限公司 5g通讯用高频多层印制线路板制作工艺及其制成的线路板
WO2019120583A1 (en) 2017-12-22 2019-06-27 Huawei Technologies Co., Ltd. Flex on board anisotropic conductive adhesive interconnection
JP7373703B2 (ja) * 2019-07-18 2023-11-06 パナソニックＩｐマネジメント株式会社 ケーブルの接合方法
TWI710295B (zh) * 2020-01-02 2020-11-11 峻立科技股份有限公司 塑膠元件與電路板的結合方法
KR20210094195A (ko) 2020-01-20 2021-07-29 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법
US11991824B2 (en) * 2020-08-28 2024-05-21 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
CN114430626B (zh) * 2020-10-29 2024-07-19 鹏鼎控股(深圳)股份有限公司 印刷线路板对印刷线路板连接结构及其制作方法
TWI881025B (zh) * 2021-01-25 2025-04-21 優顯科技股份有限公司 電子裝置及其製造方法
EP4255129A1 (en) 2022-03-31 2023-10-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Interconnection of printed circuit boards with nanowires

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055675Y2 (https=) * 1988-05-24 1993-02-15
JPH08293656A (ja) * 1995-04-25 1996-11-05 Kyocera Corp 配線接続構造
JP2000012609A (ja) * 1998-06-17 2000-01-14 Shinko Electric Ind Co Ltd 回路基板への半導体チップの実装方法
US6527162B2 (en) * 2000-08-04 2003-03-04 Denso Corporation Connecting method and connecting structure of printed circuit boards
US6921869B2 (en) * 2001-09-26 2005-07-26 Fujikura Ltd. Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof
JP2004319703A (ja) * 2003-04-15 2004-11-11 Shin Etsu Polymer Co Ltd リジット基板とフレキシブル基板との電極接続構造
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法

Also Published As

Publication number Publication date
EP2248400A4 (en) 2011-06-15
EP2248400A2 (en) 2010-11-10
CN101940073A (zh) 2011-01-05
WO2009100103A3 (en) 2009-11-05
JP2009188114A (ja) 2009-08-20
US20100321916A1 (en) 2010-12-23
TW200942115A (en) 2009-10-01
WO2009100103A2 (en) 2009-08-13

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PA0105 International application

Patent event date: 20100830

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid