KR20100108392A - 전자 소자용 평판 캡슐화 어셈블리 - Google Patents

전자 소자용 평판 캡슐화 어셈블리 Download PDF

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Publication number
KR20100108392A
KR20100108392A KR1020107016134A KR20107016134A KR20100108392A KR 20100108392 A KR20100108392 A KR 20100108392A KR 1020107016134 A KR1020107016134 A KR 1020107016134A KR 20107016134 A KR20107016134 A KR 20107016134A KR 20100108392 A KR20100108392 A KR 20100108392A
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KR
South Korea
Prior art keywords
electronic device
encapsulation assembly
barrier
substrate
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107016134A
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English (en)
Korean (ko)
Inventor
매튜 듀이 휴버트
제임스 다니엘 트레멜
카일 디. 프리슈네트
누젠트 트루옹
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20100108392A publication Critical patent/KR20100108392A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020107016134A 2007-12-21 2008-12-20 전자 소자용 평판 캡슐화 어셈블리 Withdrawn KR20100108392A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1580207P 2007-12-21 2007-12-21
US61/015,802 2007-12-21

Publications (1)

Publication Number Publication Date
KR20100108392A true KR20100108392A (ko) 2010-10-06

Family

ID=40824689

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107016134A Withdrawn KR20100108392A (ko) 2007-12-21 2008-12-20 전자 소자용 평판 캡슐화 어셈블리

Country Status (6)

Country Link
US (1) US20100270919A1 (enExample)
EP (1) EP2225767A4 (enExample)
JP (1) JP2011508437A (enExample)
KR (1) KR20100108392A (enExample)
TW (1) TW201002126A (enExample)
WO (1) WO2009086228A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8624487B2 (en) 2009-12-31 2014-01-07 Samsung Display Co., Ltd. Barrier film composite, display apparatus including the barrier film composite, method of manufacturing barrier film composite, and method of manufacturing display apparatus including the barrier film composite
US8987758B2 (en) 2009-12-31 2015-03-24 Samsung Display Co., Ltd. Barrier film composite and display apparatus including the barrier film composite
US9412970B2 (en) 2009-12-31 2016-08-09 Samsung Display Co., Ltd. Barrier film composite, display apparatus including the barrier film composite, and method of manufacturing display apparatus including the barrier film composite
KR20200024298A (ko) * 2017-07-04 2020-03-06 아르끄마 프랑스 전자 소자를 보호하기 위한 흡착재

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010141493A2 (en) * 2009-06-01 2010-12-09 Add-Vision, Inc. Formulations for improved electrodes for electronic devices
US8568184B2 (en) * 2009-07-15 2013-10-29 Apple Inc. Display modules
KR101074805B1 (ko) * 2009-12-04 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR101074807B1 (ko) * 2009-12-10 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
US20110195540A1 (en) * 2010-02-05 2011-08-11 Hitachi Chemical Company, Ltd. Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell
US20110256658A1 (en) * 2010-02-05 2011-10-20 Hitachi Chemical Company, Ltd. Method for producing photovoltaic cell
EP2558426B1 (en) * 2010-04-15 2020-04-08 Ferro Corporation Low-melting lead-free bismuth sealing glasses
NZ605079A (en) * 2010-06-03 2015-08-28 Alnylam Pharmaceuticals Inc Biodegradable lipids for the delivery of active agents
JP5724684B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セル及び発光デバイス
JP5724685B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セルの製造方法及び発光デバイスの製造方法
RU2638070C2 (ru) * 2011-09-13 2017-12-11 Ферро Корпорейшн Индукционная пайка неорганических подложек
US20130098675A1 (en) * 2011-10-21 2013-04-25 Qualcomm Mems Technologies, Inc. Method and apparatus for application of anti-stiction coating
RU2638993C2 (ru) * 2011-11-02 2017-12-19 Ферро Корпорэйшн (Сша) Микроволновое уплотнение неорганических подложек с использованием низкоплавких стекольных систем
CA2856742A1 (en) 2011-12-07 2013-06-13 Alnylam Pharmaceuticals, Inc. Biodegradable lipids for the delivery of active agents
CN105637267B (zh) * 2013-08-16 2018-11-13 三星电子株式会社 用于制造光学部件的方法、光学部件及包括其的产品
US10454062B2 (en) * 2014-07-29 2019-10-22 Boe Technology Group Co., Ltd. Functional material, its preparation method, and organic light emitting diode display panel
CN104157798A (zh) * 2014-08-21 2014-11-19 深圳市华星光电技术有限公司 Oled的封装方法及结构
CN104810484B (zh) * 2015-05-07 2017-01-04 合肥鑫晟光电科技有限公司 封装胶、封装方法、显示面板及显示装置
WO2017139542A1 (en) 2016-02-11 2017-08-17 Skyworks Solutions, Inc. Device packaging using a recyclable carrier substrate
US20170243739A1 (en) * 2016-02-24 2017-08-24 Skyworks Solutions, Inc. 3d micromold and pattern transfer
US10453763B2 (en) 2016-08-10 2019-10-22 Skyworks Solutions, Inc. Packaging structures with improved adhesion and strength
US12377639B2 (en) * 2022-11-23 2025-08-05 LuxWall, Inc. Vacuum insulated panel with seal material thermal diffusivity and/or conductivity
TWI862281B (zh) * 2023-11-16 2024-11-11 世界先進積體電路股份有限公司 微機電封裝及其製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049167A (en) * 1997-02-17 2000-04-11 Tdk Corporation Organic electroluminescent display device, and method and system for making the same
JPH11195487A (ja) * 1997-12-27 1999-07-21 Tdk Corp 有機ｅｌ素子
JP2000003783A (ja) * 1998-06-12 2000-01-07 Tdk Corp 有機ｅｌ表示装置
WO2001018886A2 (de) * 1999-09-09 2001-03-15 Siemens Aktiengesellschaft Organische lichtemittierende diode und herstellungsverfahren
EP1336207A1 (en) * 2000-11-08 2003-08-20 Koninklijke Philips Electronics N.V. Electro-optical device
US20060087230A1 (en) * 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP4605499B2 (ja) * 2004-10-28 2011-01-05 富士電機ホールディングス株式会社 有機ｅｌディスプレイの封止構造
JP2007005060A (ja) * 2005-06-22 2007-01-11 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法
US7564185B2 (en) * 2006-02-20 2009-07-21 Samsung Mobile Display Co., Ltd. Organic electroluminescence display device and manufacturing method thereof
EP1999177B1 (en) * 2006-03-29 2016-05-11 Henkel AG & Co. KGaA Radiation-or thermally-curable barrier sealants
TWI421607B (zh) * 2006-08-24 2014-01-01 Creator Technology Bv 可撓性裝置上的滲透阻障
KR100858811B1 (ko) * 2006-11-10 2008-09-17 삼성에스디아이 주식회사 전자 방출 표시 소자의 제조 방법
US8115326B2 (en) * 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8624487B2 (en) 2009-12-31 2014-01-07 Samsung Display Co., Ltd. Barrier film composite, display apparatus including the barrier film composite, method of manufacturing barrier film composite, and method of manufacturing display apparatus including the barrier film composite
US8963423B2 (en) 2009-12-31 2015-02-24 Samsung Display Co., Ltd. Barrier film composite, display apparatus including the barrier film composite, method of manufacturing barrier film composite, and method of manufacturing display apparatus including the barrier film composite
US8987758B2 (en) 2009-12-31 2015-03-24 Samsung Display Co., Ltd. Barrier film composite and display apparatus including the barrier film composite
US9412970B2 (en) 2009-12-31 2016-08-09 Samsung Display Co., Ltd. Barrier film composite, display apparatus including the barrier film composite, and method of manufacturing display apparatus including the barrier film composite
KR20200024298A (ko) * 2017-07-04 2020-03-06 아르끄마 프랑스 전자 소자를 보호하기 위한 흡착재

Also Published As

Publication number Publication date
TW201002126A (en) 2010-01-01
US20100270919A1 (en) 2010-10-28
WO2009086228A1 (en) 2009-07-09
JP2011508437A (ja) 2011-03-10
EP2225767A1 (en) 2010-09-08
EP2225767A4 (en) 2011-09-28

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Date Code Title Description
PA0105 International application

Patent event date: 20100720

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid