KR20100104667A - Carrier module for test handler - Google Patents

Abstract

PURPOSE: A carrier module of a test handler is provided to reduce the entire working time by simply constituting the structure of a carrier insert body and a latch. CONSTITUTION: A carrier insert body(220) includes a latch holder for storing a latch in both side parts of a semiconductor element. A long hole(240) stores a first guide member(230) for storing a semiconductor element in the latch storing part of the carrier insert body. The latch(270) forms a guide hole(250) for the insertion of an elastic member(260).

Description

Carrier module for test handler

The present invention relates to a carrier module of a test handler, and more particularly, to test the performance of a finished semiconductor device, a test that can be accurately connected to a test socket without damaging leads or balls formed on the bottom of the semiconductor device. It relates to a carrier module of a handler.

In general, the characteristics of the device are determined by the tester by transferring one or several devices produced in the production process to the test part of the handler and electrically connecting the leads or balls of the device to the connectors installed in the test part. As a result, the device is sorted as good or defective, the good is shipped, and the bad is discarded.

1A is a perspective view illustrating a carrier module used in a conventional test handler, and FIGS. 1B to 1D are partial perspective views illustrating a state of fixing various kinds of devices used in the conventional test handler.

In the tray 11, a plurality of images (predetermined frame shapes) 13 are formed in parallel at equal intervals in a rectangular frame 12, and the images 13 are formed in a frame facing the two images 13 ( One IC carrier 16 is housed in the carrier housing 15, respectively, at the beginnings 12a and 12b of 12), respectively, and the two IC carriers 16 are respectively provided. It is fixed to the attachment piece 14 by the fastener 17.

The outer shape of each of the IC carriers 16 is formed in the same shape at regular intervals, and the IC element 18 is housed in the IC carrier 16. The shape of the IC receiving portion 19 of the IC carrier 16 is determined corresponding to the shape of the IC element 18 accommodated in this way. Here, the IC accommodating portion 19 is formed with a rectangular recess.

The both ends of the IC carrier 16 are provided with the attachment hole 21 and the guide pin insertion hole 22 of the attachment piece 14, respectively.

The tray 11, on which the IC carrier 16 is mounted, passes through the center of the IC carrier transfer device, and accommodates the IC element 18 in the IC carrier 16 in the middle, and then applies a predetermined test temperature.

Then, the test corresponding to the IC element is performed, and the IC element 18 is accommodated in the take-out tray according to the test result.

In order not to dislodge from the position of the IC element 18 in the IC carrier 16, conventionally, one corresponding latch 23 as shown in FIGS. 1B and 1D is provided with the body 27 of the IC carrier 16. ) Is installed.

The conventional latch 23 is formed of a resin material constituting the body 27 of the IC carrier 16 in which the latch 23 corresponding to the lower body of the IC housing portion 19 protrudes integrally with the upward body 27. By using elasticity, the IC element 18 is accommodated in the IC accommodating part 19, and it is taken out from the IC accommodating part 19, and moves simultaneously with the IC adsorption pad 24 which adsorbs the IC element 18. FIG. After the two latches 23 are widely spaced in the latch release mechanism 25, the IC element 18 is accommodated or taken out. The latch release mechanism 25 is detached from the latch 23, and the latch 23 is returned to its original state by the elastic force, and the upper surface of the accommodated IC element 18 is fixed to both sides.

As shown in FIG. 1D, another conventional embodiment, one end of the latch 23 provided corresponding to the side wall of the IC housing portion 19 is integrally formed, and the upper surface of the housed IC element 18 is disposed at both ends thereof. The control piece 26 which faces the upper surface of the IC element 18 is provided so that it may move so that it may move.

Since the conventional carrier module requires a separate carrier module suitable for each device for devices of various thicknesses and sizes, there is a problem in that it takes a long time to replace a carrier module suitable for each device.

In addition, when the contact between the device and the latch, the device may be scratched or damaged by the latch, thereby lowering the reliability of the product.

Accordingly, the carrier module of the test handler of the present invention has been devised to solve such a problem, and is configured to be suitable for devices having various thicknesses and sizes, thereby reducing the replacement time of the carrier module according to the size of the device. The present invention provides a carrier module.

Another object of the present invention is to provide a carrier module of a test handler which can simply configure the carrier insert body and the latch to efficiently grasp / release the semiconductor element.

It is still another object of the present invention to provide a carrier module of a test handler that can be opened / released to facilitate latch engagement with the latch open block.

The carrier module of the test handler of the present invention comprises: a carrier insert body having a latch receiving portion for receiving a latch on both sides of the semiconductor device; A long hole for receiving a first guide member fitted to receive a semiconductor element in a latch receiving portion of the carrier insert body, and at least one latch formed on a rear surface thereof and having a guide hole for inserting an elastic member, The latch is configured to be openable (opened) by the latch open pin of the latch open block provided at both sides of the insert guide pin and the plurality of latch open pins.

The carrier module of the test handler of the present invention comprises: a carrier insert body having a latch receiving portion for receiving a latch; A latch having a plurality of inclined surfaces, one end of which is provided with a cushioning material, a long hole for accommodating the first guide member on a side thereof, and a guide hole formed on a rear surface thereof; An elastic member elastically supporting the latch in the latch receiving portion and inserted into the guide hole of the latch; An auxiliary guide pin for supporting and guiding the latch in the latch receiving portion, wherein the latch is configured to be opened (opened) by the latch open pin of the latch open block having an insert guide pin and a latch open pin. Is in.

As described above, the carrier module of the test handler of the present invention has an advantage that it can be easily applied without using a separate carrier module when the thickness and size of the device are different, and also has the advantage that no replacement time is required.

In addition, the carrier module of the test handler of the present invention has a very simple structure of the carrier insert body and the latch, so that the semiconductor device can be easily fastened and released after the test, thereby saving the overall work time and thereby increasing the work efficiency. have.

(Example)

The carrier module of the test handler of the present invention will be described in detail with reference to the accompanying drawings.

First, as shown in FIGS. 2A and 2B, the carrier module of the test handler of the present invention includes a carrier insert body 220 and a latch 270, and a latch open block for opening and releasing the latch 270. It is further provided with (300).

The carrier insert body 220 has a rectangular space portion 208 formed in the center thereof. Longitudinal sidewalls 212 are formed on the inner side of the carrier insert body 220 from both sides of the space portion 208 to the carrier insert body 220. In addition, the side walls 212 are formed to face the latch receiving portion 210 for receiving the latch 270, respectively. In addition, the carrier insert body 220 has protrusions 222 formed in diagonal directions on both outer sides thereof, and the protrusions 222 are formed in a rectangular parallelepiped shape. In addition, the protrusion 222 is formed with a through hole 224 to insert the insert guide pin 280 to be described later. In addition, the stepped portion 225 having a significantly lower height than the protrusion 222 is formed to be connected to the protrusion 222, respectively.

The latch 270 has an arch shape, and the first inclined surface 272, the second inclined surface 274, and the third inclined surface 276 are sequentially formed. The first to third inclined surfaces 272, 274 and 276 are sequentially configured to have a large inclination. That is, the first to third inclined surfaces 272, 274, and 276 are inclined angles (not shown) formed by the horizontal plane and the first to third inclined surfaces 272, 274, and 276 with the latch 270 placed on a horizontal surface. It is preferable to construct large in sequence. An end portion 275 connected to the first inclined surface 272 is provided with a cushioning material 277 such as silicon rubber to prevent damage when contacting the semiconductor element 202 (see FIG. 3).

In addition, the latch 270 is configured to accommodate the first guide member 230 inserted into the latch receiving portion 210 of the carrier insert body 220 on the side surface 245 to accommodate the semiconductor element 202. Long hole 240 is formed. The first guide member 230 is a guide pin fitted to the long hole 240 of the latch 270. In addition, a guide hole 250 for inserting the elastic member 260 is formed in the rear surface 232 of the latch 270.

On the other hand, the latch open block 300 for opening (opening) the latch 270, as shown in Figure 3, the insert guide pin 280 and the plurality of latch open pins (282, 282) on both sides of the gap Put and installed. In addition, the latch 270 is configured to be opened (opened) by the latch open pins 282 and 282. The insert guide pin 280 may be formed to be larger than the latch open pins 282 and 282. In addition, an auxiliary guide pin 216 is inserted into the latch receiving portion 210 of the carrier insert body 220 to support the rear surface 232 of the latch 270. The auxiliary guide pin 216 moves along a long hole (not shown) formed in the latch receiving portion 210.

Now, an operation relationship of the carrier module of the test handler of the present invention configured as described above will be described with reference to FIGS. 3 and 4.

3 is a cross-sectional view illustrating a state in which the latch 270 grips (grips) the semiconductor device 202, and FIG. 4 illustrates that the latch 270 is connected to the latch open pin 282 of the latch open block 300 by a semiconductor device. It is sectional drawing which showed the state which canceled (disassembled) 202.

When the carrier insert body 220 and the latch open block 300 are separated from each other, the latch is inserted when the semiconductor element 202 is inserted into the space 208 of the carrier insert body 220 by a head (not shown). 270 grips the semiconductor device 202. That is, the buffer material 277 provided at the end portion 275 of the latch 270 holds the semiconductor element 202. In this case, as shown in FIG. 3, the first guide member 230 is positioned at the rear (back side) of the long hole 240 of the latch 270. In addition, the elastic member 260 inserted into the guide hole 250 of the rear surface 232 of the latch 270 presses the latch 270 with an appropriate elastic force. In addition, the auxiliary guide pin 216 at the lower side of the rear surface 232 of the latch 270 serves to guide the rear surface 232 of the latch 270 in the latch receiving portion 210.

As such, when the carrier insert body 220 and the latch open block 300 are separated from each other (see FIG. 3), the latch open block 300 is inserted into the carrier insert body 220 as shown in FIG. 4. The semiconductor element 202 can be released. That is, the pair of insert guide pins 280 of the latch open block 300 are fitted into the through holes 224 and 224 of the carrier insert body 220, and the pair of latch open pins of the latch open block 300 ( When 282 presses a predetermined portion of the lower surface of the first to third inclined surfaces 272, 274 and 276 of the latch 270 inserted into the carrier insert body 220, the latch 270 is opened to release the semiconductor device 202. You can do it.

At this time, the first guide member 230 moves forward from the rear of the long hole 240 of the latch 270 (that is, the first guide member 230 in the long hole 240 in the state of FIG. 3). 4). In addition, the elastic member 260 inserted into the guide hole 250 of the rear surface 232 of the latch 270 further compresses the latch 270 to press the latch 270. That is, the latch open pins 282 provided in pairs on both sides of the latch open block 300 compress the elastic member 260 by a force corresponding to the force pressing the lower surfaces of the first to third inclined surfaces 272, 274, 276. do. Since the elastic member 260 is fitted in the guide hole 250, the elastic member 260 is not separated even when compressed. In addition, the auxiliary guide pin 216 at the lower side of the rear surface 232 of the latch 270 serves to guide the rear surface 232 of the latch 270 in the latch receiving portion 210. The auxiliary guide pin 216 moves further forward in FIG. 4 than in FIG. 3 to support and guide a portion corresponding to the rear surface 232 of the latch 270.

The carrier module of the test handler of the present invention is applied to the field of test handlers for testing semiconductor devices, and is also widely applicable to the field of semiconductor devices for holding (grips) semiconductor devices or other components.

1A to 1D are cross-sectional views showing a conventional carrier module.

2A and 2B are exploded perspective views illustrating the carrier insert body and the main parts of the latch, respectively, without the latch open block of the carrier module of the test handler of the present invention;

3 is a cross-sectional view showing a closed state of the latch of the carrier module of the test handler of the present invention;

4 is a cross-sectional view showing an open state of the latch of the carrier module of the test handler of the present invention.

Explanation of symbols on the main parts of the drawings

202: semiconductor element 210: latch receiving portion

216: auxiliary guide pin 220: carrier insert body

222: protrusion 230: first guide member

240: long man 250: guideman

260: elastic member 270: latch

280: latch open pin 300: latch open block

Claims (8)

A carrier insert body 220 having a latch accommodating portion 210 for accommodating the latches on both sides of the semiconductor element 202 accommodated therein; A long hole 240 for receiving a first guide member 230 fitted to accommodate the semiconductor element 202 in the latch receiving portion 210 of the carrier insert body 220 and a rear surface 232 of the carrier insert body 220. At least one latch 270 formed with a guide hole 250 for inserting the elastic member 260, The latch 270 is configured to be opened (opened) by the latch open pin of the latch open block 300 provided with insert guide pins 280 and a plurality of latch open pins 282 and 282 spaced apart from each other. Carrier module of the test handler, characterized in that the. According to claim 1, The carrier insert body 220 has a protrusion 222 is formed on both sides thereof, the protrusion 222 is formed with a through hole 224 for insertion of the insert guide pin 280 A carrier module of a test handler, characterized in that. The test handler of claim 1, wherein an auxiliary guide pin 216 is inserted into the latch receiving portion 210 of the carrier insert body 220 to support the rear surface 232 of the latch 270. Carrier module. According to claim 1, wherein the first guide member 230 is a carrier module of the test handler, characterized in that the guide pin is fitted into the long hole of the latch (270). A carrier insert body 220 having a latch receiving portion for receiving a latch; A latch 270 having a plurality of inclined surfaces, one end of which is provided with a cushioning material, a long hole for accommodating the first guide member on a side thereof, and a guide hole formed on a rear surface thereof; An elastic member 260 elastically supporting the latch in the latch receiving portion and inserted into a guide hole of the latch; It consists of an auxiliary guide pin 216 for supporting and guiding the latch in the latch receiving portion, The latch 270 may be opened (opened) by the latch open pin of the latch open block 300 including the insert guide pin 280 and the latch open pins 282 and 282. Carrier module. 6. The carrier module of claim 5, wherein the carrier insert body has a protrusion 222 formed on the outside thereof in a diagonal direction, and a through hole for inserting the insert guide pin is formed in the protrusion. 6. The carrier module of a test handler according to claim 5, wherein the plurality of inclined surfaces of the latch are first to third inclined surfaces (272, 274, 276), and their inclinations are sequentially increased. 6. The carrier module of claim 5, wherein the first guide member of the latch is a guide pin, and the guide pin is configured to be movable according to the operation of the latch in the long hole (240).

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