201040556 六、發明說明： 【發明所屬之技術句域】 發明領域 本發明係關於測試處理機之載置模組的發明，更詳細 而論，係關於要測試已生產完了之半導體元件的性能時， 以不損傷已形成在半導體元件底面之引線或焊點等，而能 使其正確地與測試插座接觸之測試處理機之載置模組的發 明。 【先前冬奸;3 發明背景 一般而a ’在生產製程中，將已生產完了之一個或複 數個元件轉送到處理機的測試部，並使元件的引線或焊點 電性接觸已設置於測試部之連接器，以藉由測試器來辨別 兀件的特性，依據該測試的結果來挑選元件為良品與不良 品，良品的元件可出貨而不良品被廢棄處理。 第1圖係顯示習知使用於測試處理機之載置模組的立 體圖，第lb至第Id圖係顯示習知使用於測試處理機之使多 式多樣種類的元件固定狀態的一部分立體圖。 盤11係多數相（預定的框形）13以平行且等間隔形成於 四角形的框12，該相13於與兩側相13對向的框12的豎起部 12a、12b分別沿著多數附著片Μ而於載置收納部15分別收 納有一個1C載體16，該1C載體16藉由緊固螺栓17分別被固 定於各兩個附著片14。 各個1C載體16的外形為同一形狀且隔著一定的間隔而 3 201040556 構成，1C載體16可收納1C元件18。該1C載體16之1C收納部 19的形狀可對應如此被收納之1C元件18的形狀來決定。在 此說明，1C收納部19形成為四角形的凹部。 1C載體16的兩端部分別形成有附著片14的附著用孔21 與導引銷插入孔22。 安裝有1C載體16之盤11通過1C載體之轉送裝置的中央 時，收納1C元件18並安裝於1C載體16之後，接著施加預定 的試驗溫度。 其後，進行與該1C元件對應的試驗後，因應該試驗結 果而使1C元件18收納於取出用盤。 為了使其不會從1C載體16内的1C元件18的位置脫離， 習知技術如第1 b及第1 d圖所示於IC載體16之體2 7設置有一 個對應的閂扣23。 習知的閂扣23係所對應的閂扣23與上方體27 —體地從 1C收納部19的底面突出，利用構成1C載體16之體27的樹脂 材，將1C元件18收納於1C收納部19，又，可從1C收納部19 取出，而對與吸著1C元件18之1C吸著墊24同時移動的閂扣 解鎖機構25，將兩個閂扣23的間隔設得寬之後，收納或取 出1C元件18。顯示從閂扣23分離閂扣解鎖機構25後，閂扣 23藉由前述彈力而回復到原狀態’而利用兩側使業經收納 之1C元件18的上面固定的狀態。 習知其他實施例，如第Id圖所示，與1C收納部19之側 壁對應設置的閂扣23之一端形成一體’而對向設置成其端 部可移動於業經收納之1C上面的兩側面’又’具有與1C元 201040556 件18上面對向的控制片26。 【發明内容】 發明欲解決的課題 惟，前述習知的載置模組，為了對應多樣化的厚度與 大小的元件，必須有適合於個別元件之另外設置的載置模 組，因此，為了要更換適合於各元件的載置模組，乃存在 著需要花費大量時間的問題點。 而，元件與閂扣之間接觸時，因閂扣而會導致元件擦 傷或破損等情形，所以也存在著會使製品可靠度降低的問 題點。 因此，本發明的測試處理機之載置模組係用以決解如 此的問題點而研究出的發明，其目的點在於提供建構成能 適合於具有多樣化的厚度與大小的元件，且能減少因元件 大小所導致需要更換載置模組的時間的測試處理機之載置 模組。 本發明之另一目的點在於提供簡單地構成載置插入體 及閂扣，而能有效率地將半導體元件把持/解鎖的測試處 理機之載置模組。 本發明之另外一目的點在於提供能容易與閂扣敞開塊 結合那般地使閃扣敞開/解鎖的測試處理機之載置模組。 本發明之另外一目的點在於提供於閂扣形成反轉防止 凸起以防止閂扣的反轉，而可容易達到閂扣穩定地開敞及 解鎖的測試處理機之載置模組。 本發明之另外一目的點在於提供藉由可插設導引銷之 5 201040556 第1導引孔與第2導引孔相互形成於不同方向，能正確地把 持閂扣以使其不會自由落下，而能防止因閂扣自由落下造 成已形成在半導體元件下部之引線或焊點等損傷的測試處 理機之載置模組。 用以欲解決課題之手段 本發明之測試處理機之載置模組，其特點在於包含 有：載置插入體，其係於業經收納之半導體元件的兩側部 具有用以收納閂扣之閂扣收納部者；及，至少一個以上的 閂扣，其係形成有長孔及導引孔者，該長孔係用以收納第1 導引構件者，且該第1導引構件係為了收納半導體元件而嵌 插於前述載置插入體之閃扣收納部者，而該導引孔係形成 於其後面且用以插入彈性構件者；建構成閂扣藉由其兩側 為插入導引銷與複數個閂扣開啟銷隔著間隔設置之閂扣開 啟塊的前述閂扣開啟銷而可開啟（敞開）。 本發明之測試處理機之載置模組，其特點在於包含 有：載置插入體，其係具有用以收納閂扣之閂扣收納部者； 閂扣，其係具有複數個傾斜面，而一個傾斜面之前端部設 置有缓衝材，且其側面形成有用以收納第1導引構件的長 孔，而其後面形成有導引孔者；彈性構件，其係在閂扣收 納部之内彈性地支撐閂扣，且插設於閂扣導引孔者；及， 輔助導引銷，其係用以在閂扣收納部之内支撐及導引閂扣 者；建構成閂扣藉由具有插入導引銷與閂扣開啟銷之閂扣 開啟塊的前述閂扣開啟銷而可開啟（敞開）。 本發明之測試處理機之載置模組，其特點在於包含 201040556 有：載置插入體，其係於中央具有用以收納半導體元件的 空間部、及於前述空間部的兩側具有收納部者；至少一個 以上的閂扣，其係於其一側形成有用以嵌合閂扣固定銷的 閂扣固定孔，於另一側朝縱向形成有長孔，且於其上部一 側形成有用以防止閂扣反轉之反轉防止凸起者；及，按鈕， 其係於其一側形成有用以嵌合按鈕固定銷的按鈕固定孔， 而於另一側形成有用以插設彈性構件之至少一個以上的 溝，且具有設置於前述溝並用以提供彈力之至少一個以上 的彈性構件者。 本發明之測試處理機之載置模組，其特點在於包含 有：載置體，其係形成有用以收納半導體元件的空間部， 且於空間部之一側與另一側分別形成有收納部者；多數個 按鈕，其係分別設置於載置體的收納部者；多數個導引銷 (guide pin)，其係可分別插設於按鈕者；多數個閂扣(latch)， 其係於第1方向形成有可插設導引銷之第1導引孔，且於與 第1方向不同的第2方向形成有可與第1導引孔連通之第2導 引孔者；及，多數個彈性構件，其係分別連結於收納部與 多數個按鈕，且對按鈕提供彈力者；導引銷藉由按鈕的移 動而沿著第1導引孔與第2導引孔移動以將閂扣予以敞開/ 閉鎖。 發明效果 如以上所說明，本發明之測試處理機之載置模組也具 有在元件的厚度與大小不同的情形下，即使不使用另外設 置的載置模組，也能容易地運用的優點，且也具有不必要 7 201040556 求更換時間的優點。 又，本發明之測試處理機之載置模組，由於載置插入 體及具有閂扣的構造非常簡單，因此容易締結半導體元件 並能於測試後解鎖，所以可節省整體的作業時間，藉此， 具有可提升作業效率的優點。 本發明之測試處理機之載置模組具有將可插入導引銷 之第1導引孔與第2導引孔形成於相互不同的方向，能正確 地把持閂扣以使其不會自由落下，而能防止因閂扣落下造 成已形成在半導體元件下部之引線或焊點等損傷的優點。 【實施方式3 用以實施發明之具體的内容 參照所附圖式來詳鈿說明本發明之一實施例所構成之 測試處理機之載置模組。 首先，本發明之測試處理機之載置模組如第2a圖及第 2b圖所示，係以載置插入體220與閂扣270所構成，又，更 具有可使閂扣270開啟/解鎖之閂扣開啟塊300(參照第4 圖）。 前述載置插入體220於其中央形成四角形狀的空間部 208。在前述空間部208的兩側且為載置插入體220之側， 即，於載置插入體220的内側分別形成縱向的側壁212。而， 於前述側壁212形成用以收納各閂扣270之對向的閂扣收納 部210。又，前述載置插入體220於其外側的兩側並於對角 線方向形成突出部222，前述突出部222形成長方體形狀。 且，於前述突出部222形成用以插入將於後述之插入導引銷 201040556 280的貫穿孔224。又，分別形成較突出部222的高度低非常 多的落差部225並與前述突出部222連結。 前述閂扣270如第2b圖所示構成拱形狀，並依順序形成 第1傾斜面272、第2傾斜面274及第3傾斜面276。而，構成 前述第1至第3傾斜面(272、274、276)的傾斜度依順序變大。 即，第1至第3傾斜面（272、274、276)在將閂扣27〇置於水平 面的狀態下，最好是建構成第1至第3傾斜面（272、274、 所形成的傾斜角（未以圖式顯示）依順序變大。於與前述第i 傾斜面272連結的前端部275設置有矽膠那般的緩衝材 277 ’以建構成可避免與半導體元件202(參照第3圖）接觸時 造成的損傷。 又，前述閂扣270於其側面245形成用以收納第1導引構 件230的長孔240 ’而該第1導引構件230係用以收納半導體 元件202時嵌合於載置插入體220的閂扣收納部21〇者。前述 第1導引構件230係可彼合於閂扣270之長孔240的導引銷。 而’於閃扣270的後面23 2形成用以插入彈性構件260的導引 孔 250。 另一方面，用以開啟（敞開）前述閂扣270的閂扣開啟塊 300如第3圖所示，於其兩側隔著間隔設置插入導引銷28〇與 複數個閂扣開啟销(282、282)。而，前述閂扣270建構成藉 由閂扣開啟銷(282、282)能開啟(敞開）。前述插入導引銷28〇 最好是形成較閂扣開啟銷(282、282)大得多。又，前述載置 插入體220的閂扣收納部210可插設用以支撐閂扣27〇之後 面232的輔助導引銷216。前述辅助導引銷216沿著形成在閃 9 201040556 扣收納部210内的長孔（未以圖式顯示）而移動。 參照圖式來說明依據前述那般構成之本發明的一實施 例所構成的測試處理機之載置模組的動作關係。 如第2a圖、第3圖及第4圖所示，以載置插入體22〇與問 扣開啟塊300相互分離的狀態，當以頭（未以圖式顯示）插入 載置插入體220之空間部208内時，構成閂扣270把持半導體 元件202的狀態。即’構成設置於閂扣270之前端部275的緩 衝材277把持半導體元件202的狀態。此時，第1導引構件23〇 如第3圖所示位於閂扣270之長孔240的後方。而，已嵌合於 閂扣270後面232之導引孔250的彈性構件260以適切的彈力 推壓閂扣270。且，位於前述閂扣270後面232之下側部的輔 助導引銷216具有在問扣收納部210内導引閂扣270後面232 的作用。 如此一來，以載置插入體220與閂扣開啟塊300相互分 離的狀態（參照第3圖），閂扣開啟塊300如第4圖所示，構成 當插入載置插入體220時，能將半導體元件202予以解鎖的 狀態。即，閂扣開啟塊300之一對插入導引銷280嵌合於載 置插入體220的貫穿孔(224、224)，當閂扣開啟塊300之兩對 閂扣開啟銷282推壓於已插設在載置插入體220之閂扣270 之第1至第3傾斜面（272、274、276)之下面部的預定部位時， 閂扣270 —面被敞開一面能將半導體元件202予以解鎖。 此時，第1導引構件230由閂扣270之長孔240後方朝前 方移動（即，在長孔240内，第1導引構件230由第3圖的狀態 變成第4圖的狀態）。而，已嵌合於閂扣270後面232之導引 10 201040556 孑L 250的彈性構件260進一步壓縮閂扣270以達到推壓閃扣 270。即，相當於分別設於閂扣開啟塊300兩側之一對閃扣 開啟銷282推壓第1至第3傾斜面（272、274、276)之下部面之 力的力量壓縮彈性構件260。前述縮彈性構件260嵌合於導 引孔250内，因此被壓縮也不能脫離。又’在於前述閂扣270 之後面232之下部側的輔助導引銷216具有在閂扣收納部 210内導引閂扣270之後面232的作用。前述輔助導引銷216 比較於第3圖而如第4圖進一步朝前方移動’以支撐及導引 〇 接觸閂扣270之後面232的部分。 參照圖式來說明依據本發明之另一實施例所構成的測 試處理機之載置模組。 ，:. 首先，本發明之測試處理機之載置模組大幅地以載置 .；； 插入體1250、閂扣1300及按叙1350來構成。 載置插入體1250如第5圖及第6圖所示’於其中央形成 用以收納半導體元件1200的空間部1210、及形成於前述空 間部1210兩側的收納部1220。在此說明，第6圖係第5圖所 〇 示之載置模組的A—A剖面圖。 前述空間部1210主要是用以收納四角形狀的半導體元 件1200，最好是以長方形的形態來形成。而’前述空間部 1210的兩側形成朝縱向以長方形的形態形成的收納部 1220，前述收納部1220可收納將於後述的閂扣1300及按鈕 1350 等。 閂扣1300如第6圖、第7a圖及第7b圖所示，於其一侧形 • 成用以嵌合閂扣固定銷1230的閂扣固定孔1232，於其另一 11 201040556 側朝縱向形成長孔1242，而於其上部一側形成用以防止閂 扣反轉的反轉防止凸起1260。而，於閂扣1300的上部形成 延長於反轉防止凸起1260的平坦面1280，平坦面1280構成 可插設並安置於按鈕1350的插入部1330。前述反轉防止凸 起1260的一側形成導引部1288，反轉防止凸起1260的另一 側形成略平面狀的平坦面1280。而，於與前述平坦面1280 對向的面形成拱狀部1284，前述拱狀部1284形成愈朝閂扣 1300内側進入則愈凹陷。 前述反轉防止凸起1260用以防止閂扣反轉，最好是反 轉防止凸起1260的高度dl形成較閂扣下部的高度d2小。在 此說明，最好是dl為0.3〜0.4mm ’ d2為0.55〜0.7mm，然而’ 運用了 dl為0.4mm，d2為0.6mm。 按鈕1350如第7a圖及第7b圖所示，於其一側形成用以 嵌合按鈕固定銷1240的按鈕固定孔1252，於其另一側形成 用以插設彈性構件1310之至少一個以上的溝1272。而，為 了提供按鈕1350移動時的彈力，於前述溝1272設置一個以 上的彈性構件1310。因應使用者的要求，前述溝1272與彈 性構件1310也可如第7a圖所示設置一個，也可如第7b圖所 示設置複數個。 參照第6圖至第8圖來說明依據前述那般構成之本發明 的另一實施例所構成的測試處理機之載置模組的動作關 係。 首先，從藉由閂扣1300把持著半導體元件1200的狀態 來說明。當半導體元件1200被閂扣1300把持時，如第6圖所 12 201040556 - 示係相對於前述半導體元件12〇〇,閂扣1200以維持著略水 - 平狀態的狀態來把持。又，當半導體元件1200被閂扣1300 把持時，閂扣1300的平坦面128〇以密接狀態插入按鈕135〇 的插入部1330，閂扣13〇〇的反轉防止凸起126〇藉由按鈕 1350而可被適切地推壓。而，按鈕135〇藉由設置在按鈕135〇 上部之至少一個以上的彈性構件131〇而能以適切地接受彈 力狀態被推壓。 Q 如此的狀態下，當驅動源（未以圖式顯示）將按紐1350 的下部朝第8圖所示的箭頭方向推壓時，按紐固定銷胸推 著問扣1300之同時並沿著閃扣13〇〇的拱形部1284移動。當 、 心固定銷1240持續推壓閃扣時，相對於閃扣13〇〇之 反轉防止凸起1260，隨著按紐固定銷mo推壓按姐1350之 也ΊΡ1284的力量漸漸增加，問扣13⑻—面朝順時鐘方向 I轉面從按紐1350解鎖。如此一來，閃扣13〇〇如第8圖所 不’在藉由撿出||(未以圖式顯示）或其他吸著機構把持著半 ❹ 導體讀職的狀態下，當卩-1扣1細的導㈣I288成為垂 直狀態時’可將半導體元件12⑽解鎖。 …另方面，在第8圖所示的狀態下，再度將閂扣13〇〇朝 逆時鐘方向旋轉日夺，按紐固定銷1240在收納部1220内朝第6 圖所不前頭方向自由落下。此時，閃扣1300沿著按紐1350 垂入相取讀巾’—旦独丨⑽安置射〗扣丨的平 面28()時卜止旋轉。即’按紐1:^50超過閃扣1300的反轉 防止凸起s — —面緊密地安置於平坦面1280而閂扣1300 —面再度_半導體树12〇〇。 13 201040556 參照所附圖式來詳細說明依據本發明的另外一實施例 所構成的測試處理機之載置模組。 第9圖係本發明之測試處理機之載置模組的平面圖，第 10圖係顯示第9圖所示之閂扣為閉鎖狀態之載置模組的剖 面圖。特別是第10圖係顯示第9圖所示之載置模組的A —A 剖面圖。 本發明之測試處理機之載置模組如第9圖及第1〇圖所 示’以載置體2210、多數個按紐2220、多數個導引銷2230、 多數個閂扣2240及多數個彈性構件2250所構成。 載置體2210、係用以全面性地支撐本發明之載置模組 的構件’且形成有用以收納半導體元件的空間部2211， 空間部2211的一側與另一側分別形成收納部2212。多數個 按鈕2220分別設置於載置體2210的收納部2212，多數個導 引銷2230分別插設於按紐2220。如此的導引銷2230藉由按 鈕2220的移動而沿著第1導引孔2240a與第2導引孔2240b移 動以將閂扣2240敞開/閉鎖。多數個閂扣2240分別形成可 插設導引銷2230的第1導引孔2240形成於第！方向X，而於與 第1方向X不同的第2方向γ形成可與第i導引孔224〇a連通 的第2導引孔2240b。多數個彈性構件225〇分別與收納部 2212及多數個按鈕2220連結而可對按鈕222〇提供彈性力。 更詳細說明依據具有前述構成之本發明的另外—實施 例所構成之載置模組的構成時，則如以下所述。 載置體2210其中央形成用以收納半導體元件(p)的空間 部2211 ’空間部2211的兩側，即於一側與另一側分別形成 201040556 收納部2212。空間部2211主要用以收納四角形狀的半導體 元件(P)，因此最好以長方形的形態來形成。形成在空間部 2211兩側的收納部2212分別可設置將於後述的按鈕2220、 導引銷2230、閂扣2240及彈性構件2250。 多數個按鈕2220分別如第10圖、第na圖及第lib圖所 不’以按紐體2221與多數個突出構件2222來構成。在此說 明’第11a圖係按鈕與閂扣的分離放大立體圖，第llb圖係 顯不第11a圖所示之按鈕之另一實施例的立體圖。 按紐體2221設置於載置體2210的收納部2212，上部形 成用以連絡彈性構件2250的溝2221a，下部形成插入溝 2221b。多數個突出構件2222形成與按鈕體2221的下部對 向。即，形成位於已形成在按鈕體2221下部之插入溝2221b 的兩側。如此多數個突出構件2222分別一體形成於按鈕體 2221的下部，並形成用以嵌合導引銷223〇的固定孔2222&。 於多數個大出構件2222之間，閂扣2240可被導引銷2230嵌 合並插设，其上部即按鈕體2221的上部可形成一個溝 或形成多數個溝2221a。形成一個溝2221&的情形下，多數 個彈I1生構件2250分別如第iia圖所示運用一個彈簧而連 結’反之’形成多數個溝2221a的情形下，如第m圖所示 多數個彈‘輯件咖分別與錄㈣料結，而多數個彈 普分別連結於多數個溝2221a。 多數個彈簣連結於按紐體2221的情形下，可提供較僅 連結-個彈簧的情形更大的彈力。即，藉由彈性構件㈣ 的彈力使触2220下降時，❹多數_簀的情形可提供 15 201040556 較一個彈簧的情形更大的彈力’因此閃扣2240能更牢固地 將半導體元件P把持在載置體2210的空間部2211。 多數個閂扣2240如第10圖、第11a圖及第lib圖所示’ 於第1方向X形成第1導引孔2240a ’而於與第1方向X不同的 第2方向Y形成與第1導引孔2240a連通的第2導引孔2240b， 第1方向X與第2方向Y相互以60至120度（degree)的角度交 叉。如此多數個閂扣2240分別以閂扣固定銷2241與閂扣體 2242來構成。 閂扣固定銷2241固定設置於閂扣體之收納部2212，閂 扣體2242被閂扣固定銷2241插設而設置成可旋轉，第1導引 孔224〇a形成於第1方向X，而第2導引孔224〇b與第1導引孔 2240a連通而形成於與第1方向X不同的第2方向γ。如此一 來’形成在閂扣體2242的第1導引孔2240a與第2導引孔 2240b形成於相互不同的方向（χ、γ)，因此按鈕222〇藉由彈 性構件2250而移動時，導引銷2230被第1導引孔2240a與第2 導引孔2240b導引而移動，藉此，閂扣224〇不會自由落下。 如此一來，以閂扣2240藉由彈性構件2250的彈力而不會自 由落下的狀態，形成於半導體元件P下部的引線或焊點（未 以圖式顯示）不會損傷而能穩定地把持。 被閂扣固定銷2241插設而可轉動的閂扣體2242形成有 導引曲面2242a、平坦面2242b及反轉防止凸起2242c。導引 曲面2242a被形成於閂扣體2242的—側且係形成於按鈕 2220的下部的插入溝2221b導引’ g卩，被形成在按叙體2221 的插入溝2221b導引而能轉動，平坦面2242b形成延長於導 16 201040556 引曲面2242a的狀態而能安置於已形成在按紐2220下部的 插入溝2221b。如此的閂扣體2242形成有可被閂扣固定銷 2241插設的孔2242d。 反轉防止凸起2242c係用以防止閂扣2240的反轉而形 成於導引曲面2242a與平坦面2242b之間，反轉防止凸起 2242c的高度hi形成較閂扣體2242的下部高度h2小。在此， 反轉防止凸起2242c的高度hi最好為〇.3〜〇.4mm，下部高度 h2最好為0.55〜0_7mm’然而，反轉防止凸起2242c的高度 hi運用0.4mm，下部高度h2運用〇.6mm。 多數個彈性構件2250分別運用一個彈簧。如此的彈性 構件2250可運用多數個彈簧。彈性構件225〇由一個彈簧構 成的情形為一個彈簧連結於按鈕2220，彈性構件2250由多 數個彈簧構成，即，由兩個彈簧構成的情形係分別連結於 按鈕2220而能對按紐2220提供彈力。 說明參照所附第1 〇圖至第12圖來說明依據具有前述構 成之本發明的另外一實施例所構成的測試處理機之載置模 組的動作。 首先’如第10圖所示，當多數個閂扣2240把持半導體 兀件P時，多數個閂扣2240分別以維持與第1方向X略水平狀 態的狀態來把持半導體元件P。即，當多數個閂扣2240把持 半導體元件P時，閂扣2240的平坦面2242b密接地插入已形 成在按紐2220下部的插入溝2221 b，閂扣2240的反轉防止凸 起2242c藉由按鈕2220而被適切地推壓。而，按鈕2220藉由 已設置於按鈕2220上部的彈性構件225 0而適切地接受彈力 17 201040556 那般地被推壓。 在閂扣2240把持著半導體元件p的狀態下，當驅動源 (未以圖式顯示）將按鈕2220的下部朝第12圖所示的箭頭方 向a2推壓時，導引銷2230被第2導引孔224〇b導引而朝垂直 方向移動，以達到解除按鈕2220推壓閂扣2240的力量。即， 達到按鈕2220脫離閂扣2240的反轉防止凸起2242c，並達到 閃扣2240僅接著於半導體元件p表面的狀態。在按姐222〇 脫離反轉防止凸起2242c的狀態下連續地按下按紐2220 時，導引销2230由第2導引孔 以達到推壓閂扣2240。 當導引銷2230推壓閃扣2240時，閂扣224〇以固定銷 2241作為旋轉軸而朝順時針方向旋轉，閃扣224〇之導引曲 面2242a與按鈕2220的下部接觸。在導引曲面2242a與按鈕 2220的下部接觸的狀態下進一步連續地按壓按壓222〇時， 導引曲面2242a更朝向順時針方向旋轉而朝向已形成在按 鈕2220下部的插入溝2221b移動，閂扣224〇如第12圖所示朝 順時針方向旋轉以完全解除半導體元件p的把持。以此狀態 下’藉由撿出器（未以圖式顯示）或其他吸著機構能使半導體 元件P由載置體2210的空間部脫離。 當在載置體2210的空間部2211收納新的半導體元件p 時’解除按叙2220的推壓力之後’按鈕222〇藉由彈性構件 2250朝第10圖所示的箭頭al方向，即，朝垂直方向下降。 當按鈕2220下降時，導引銷2230被第1導引孔224〇a導引而 下降以達到推壓問扣2240。當閂扣2240被導引銷2230推壓 18 201040556 時’閂扣2240朝逆時針方向旋轉，閂扣2240的導引曲面 2242a由已形成在按鈕222〇下部的插入溝2221b脫離，導引 銷2230與按鈕222〇連動而由第1導引孔224〇a朝第2導引孔 2240b移動。 當導引銷2230如第10圖所示完全移動至第2導引孔 2240b的下側時，按鈕222〇的下部安置於閂扣224〇的平坦面 224213而達到停止旋轉。即，當按鈕2220超過閂扣2240的反 轉防止凸起2242c而緊密地安置於平坦面2242b時，閂扣 2240再度把持半導體元件p。 如此為了把持半導體元件P而將閂扣2240朝逆時鐘方 向旋轉時，藉由導引銷2230被第！導引孔224〇a與第2導引孔 2240導引而移動，以達到閂扣224〇不會自由落下而能把持 半導體元件P。藉此，能降低閂扣2240把持半導體元件p時 加諸於半導體元件p的衝擊，而藉由閂扣224〇能降低形成在 半導體兀件P下部的引線或焊點（未以圖式顯示）等的損傷。 產業之可利用性 本發月之測试處理機之載置模組可運用於測試半導體 元件之測減處理機的領域，且能廣泛運用於把持(握緊）半導 體元件或其他零件的半導體元件領域。 【圖式簡單說明】 第1a圖至第Id圖係顯示習知載置模組的剖面圖。 第2 a圖及第2 b圖係本發明之排除了 一實施例所構成測 試處理機之载置模組之問扣開啟塊，而顯示分別載置插入 體與閂扣之重要部分的分解立體圖。 201040556 =圖_示將本發明之職處理機之載置模組之問 扣§ 又成閉鎖狀態的剖面圖。 第4圖係顯示將本發明之測試處理機之載置模組之問 扣设成敞開狀態的剖面圖。 第5圖係顯示將本發明之另一實施例所構成之測試處 理機之載置模組的上面圖。 ，第6圖係顯示將本發明之職處理機之载置模組之問 扣設成閉鎖狀態的剖面圖。 第7a圖及第7b_'本發明之職處理機之載置模組之 作為重要部分的問扣’與將按紐分離來顯示之個別不同實 施例的立體圖。 第8圖係顯示將本發明之測試處理機之載置模組之閃 扣設成敞開狀態的剖面圖。 第9圖係顯示將本發明之另外一實施例所構成之測試 處理機之载置模組的上面圖。 第1 〇圖係顯示第9圖所示之閃扣為閉鎖狀態之載置模 組的剖面圖。 離 第11a圖及第lib圖係第1〇圖所示之按鈕與閂扣的分 放大立體圖。 模組 第12圖係顯示第1〇圖所示閂扣為敞開狀態之裁置 的剖面圖。 12a···賢起部 12b···登起部 【主要元件符號說明】 11···盤 12·.·框 20 201040556201040556 6. INSTRUCTION DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to the invention of a mounting module for a test processor, and more particularly to the performance of a semiconductor component that has been produced, The invention relates to a mounting module of a test processor which can form a lead wire or a solder joint formed on the bottom surface of a semiconductor element and can be brought into contact with the test socket correctly. [Previous winter rape; 3 invention background in general and a 'in the production process, one or more components that have been produced are transferred to the test part of the processor, and the electrical contacts of the leads or solder joints of the components have been set in the test The connector of the part is used to identify the characteristics of the component by the tester, and the component is selected as a good product and a defective product according to the result of the test, and the good component can be shipped and the defective product is discarded. Fig. 1 is a perspective view showing a conventional mounting module for use in a test processor, and Figs. 1b to 1d are partial perspective views showing a plurality of types of components used in a test processor for a fixed state. The disk 11 is formed in a plurality of phases (predetermined frame shape) 13 in parallel and at equal intervals in a square frame 12 which is attached to each of the rising portions 12a and 12b of the frame 12 opposed to the two side faces 13 Each of the placement storage units 15 accommodates a 1C carrier 16 that is fixed to each of the two attachment sheets 14 by fastening bolts 17 . Each of the 1C carriers 16 has the same outer shape and is formed by a gap of 3 201040556. The 1C carrier 16 can accommodate the 1C element 18. The shape of the 1C housing portion 19 of the 1C carrier 16 can be determined in accordance with the shape of the 1C element 18 thus accommodated. Here, the 1C housing portion 19 is formed as a rectangular recess. Adhesive holes 21 and guide pin insertion holes 22 of the attachment sheet 14 are formed at both end portions of the 1C carrier 16, respectively. When the disk 11 on which the 1C carrier 16 is mounted passes through the center of the 1C carrier transfer device, the 1C element 18 is housed and mounted on the 1C carrier 16, and then a predetermined test temperature is applied. Thereafter, after the test corresponding to the 1C element was carried out, the 1C element 18 was housed in the take-out disk in response to the test result. In order to prevent it from escaping from the position of the 1C element 18 in the 1C carrier 16, conventional techniques such as those shown in Figures 1b and 1d have a corresponding latch 23 disposed in the body 27 of the IC carrier 16. The latch 23 corresponding to the conventional latch 23 and the upper body 27 integrally protrude from the bottom surface of the 1C housing portion 19, and the 1C element 18 is housed in the 1C housing portion by the resin material constituting the body 27 of the 1C carrier 16. 19, which can be taken out from the 1C accommodating portion 19, and the latch unlocking mechanism 25 that moves simultaneously with the 1C absorbing pad 24 that sucks the 1C element 18, and the interval between the two latches 23 is set to be wide, and then stored or The 1C element 18 is taken out. After the latch release mechanism 25 is separated from the latch 23, the latch 23 is returned to the original state by the aforementioned elastic force, and the upper surface of the accommodated 1C element 18 is fixed by both sides. In other embodiments, as shown in FIG. Id, one end of the latch 23 corresponding to the side wall of the 1C housing portion 19 is integrally formed, and the opposite ends are disposed such that the ends thereof are movable on both sides of the accommodated 1C. 'And' has a control sheet 26 opposite to the 1C element 201040556 piece 18. SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, in order to cope with various sizes and sizes of components, the conventional mounting module must have a mounting module suitable for an individual component. Therefore, in order to There is a problem that it takes a lot of time to replace the mounting module suitable for each component. However, when the element is in contact with the latch, the element may be scratched or broken due to the latch, so that there is a problem that the reliability of the product is lowered. Therefore, the mounting module of the test processor of the present invention is an invention developed to solve such a problem, and its object is to provide an element that can be adapted to have various thicknesses and sizes, and can The mounting module of the test processor that reduces the time required to replace the mounting module due to component size. Another object of the present invention is to provide a mounting module for a test processor capable of efficiently holding/unlocking a semiconductor element by simply arranging a mounting insert and a latch. Another object of the present invention is to provide a mounting module for a test processor that can easily open/unlock a flash button in conjunction with a latch open block. Another object of the present invention is to provide a mounting module for a test processor in which a latch is formed with an inversion preventing projection to prevent reverse rotation of the latch, and the latch is stably opened and unlocked. Another object of the present invention is to provide a first guide hole and a second guide hole formed in different directions by the insertable guide pin 5 201040556, so that the latch can be correctly held so as not to fall freely. Further, it is possible to prevent the mounting module of the test processor which has been damaged by the lead wire or the solder joint formed in the lower portion of the semiconductor element due to the free fall of the latch. Means for Solving the Problem The mounting module of the test processor of the present invention is characterized in that the mounting insert is provided with a latch for accommodating the latch on both sides of the semiconductor element that is accommodated. And a buckle receiving portion; and at least one or more latches for forming a long hole and a guide hole for accommodating the first guiding member, wherein the first guiding member is for accommodating a semiconductor element is inserted into the flash lock receiving portion of the mounting insert, and the guiding hole is formed at a rear side thereof for inserting the elastic member; and the latch is formed by inserting the guide pin on both sides thereof It can be opened (opened) with a plurality of latch open pins that are separated by the aforementioned latch open pins of the latch open blocks. The mounting module of the test processor of the present invention is characterized in that it comprises: a mounting insert having a latch receiving portion for accommodating a latch; and a latch having a plurality of inclined faces, and a cushioning material is disposed at an end portion of one inclined surface, and a side surface thereof is formed to receive an elongated hole for accommodating the first guiding member, and a guiding hole is formed at a rear surface thereof; and an elastic member is disposed in the latch receiving portion a resiliently supporting latch and inserted into the latch guiding hole; and an auxiliary guiding pin for supporting and guiding the latch within the latch receiving portion; The aforementioned latch opening pin of the latch opening block of the latch opening pin and the latch opening pin can be opened (opened). The mounting module of the test processor of the present invention is characterized in that it includes 201040556: a mounting insert having a space portion for accommodating a semiconductor element in the center and a housing portion on both sides of the space portion At least one or more latches are formed on one side thereof to form a latch fixing hole for fitting the latch fixing pin, and on the other side, a long hole is formed in the longitudinal direction, and is formed on the upper side thereof to prevent The reverse of the latch reverse rotation prevents the protrusion; and the button is formed on one side thereof to form a button fixing hole for fitting the button fixing pin, and the other side is formed to insert at least one of the elastic members The above groove has at least one or more elastic members provided to the groove and for providing elastic force. The mounting module of the test processor of the present invention includes a mounting body that forms a space portion for accommodating the semiconductor element, and a housing portion formed on one side and the other side of the space portion. A plurality of buttons are respectively disposed in the storage portion of the carrier; a plurality of guide pins are respectively inserted into the buttons; and a plurality of latches are attached to the latches. a first guide hole into which the guide pin can be inserted is formed in the first direction, and a second guide hole that can communicate with the first guide hole is formed in the second direction different from the first direction; and The elastic members are respectively connected to the accommodating portion and the plurality of buttons, and provide elastic force to the buttons; the guide pins are moved along the first guiding holes and the second guiding holes by the movement of the buttons to latch the buttons Open/close. Advantageous Effects of Invention As described above, the mounting module of the test processor of the present invention also has the advantage that it can be easily used without using a separately placed mounting module in the case where the thickness and size of the components are different. It also has the advantage of not needing 7 201040556 to find replacement time. Moreover, since the mounting module of the test processor of the present invention has a very simple structure for placing the insertion body and having the latch, it is easy to connect the semiconductor element and can be unlocked after the test, thereby saving the overall working time. , has the advantage of improving work efficiency. The mounting module of the test processor of the present invention has a first guiding hole and a second guiding hole that can be inserted into the guiding pin in mutually different directions, and can correctly hold the latch so that it does not fall freely. Further, it is possible to prevent the lead wire or the solder joint which has been formed in the lower portion of the semiconductor element from being damaged by the drop of the latch. [Embodiment 3] Specific contents for carrying out the invention A mounting module of a test processor constructed by an embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, the mounting module of the test processor of the present invention is configured by placing the insertion body 220 and the latch 270 as shown in FIGS. 2a and 2b, and further has the latch 270 opened/unlocked. The latch open block 300 (refer to FIG. 4). The placement insert 220 has a rectangular portion 208 formed at its center. On both sides of the space portion 208 and on the side on which the insertion body 220 is placed, that is, the longitudinal side walls 212 are formed on the inner side of the placement insertion body 220. Further, the side wall 212 is formed with a latch housing portion 210 for accommodating the respective latches 270. Further, the mounting insert 220 has a projecting portion 222 formed on both sides of the outer side in the diagonal direction, and the protruding portion 222 has a rectangular parallelepiped shape. Further, the protruding portion 222 is formed with a through hole 224 for inserting a guide pin 201040556 to be described later. Further, the step portion 225 having a much lower height than the protruding portion 222 is formed and coupled to the protruding portion 222. The latch 270 has an arch shape as shown in Fig. 2b, and forms a first inclined surface 272, a second inclined surface 274, and a third inclined surface 276 in this order. On the other hand, the inclinations of the first to third inclined surfaces (272, 274, and 276) are increased in order. In other words, in the state in which the first to third inclined faces (272, 274, and 276) are placed on the horizontal plane, the first to third inclined faces (272, 274, and the formed inclined faces) are preferably formed. The corners (not shown in the drawings) become larger in order. The front end portion 275 coupled to the i-th inclined surface 272 is provided with a cushioning material 277' of a silicone rubber to be constructed to avoid the semiconductor element 202 (see FIG. 3). Damage caused by contact. Further, the latch 270 has a long hole 240' for accommodating the first guiding member 230 on the side surface 245, and the first guiding member 230 is for fitting the semiconductor element 202. The first guiding member 230 is a guide pin that can be coupled to the long hole 240 of the latch 270. The latter is formed at the rear face 23 of the flash button 270. The guide hole 250 for inserting the elastic member 260. On the other hand, the latch open block 300 for opening (opening) the aforementioned latch 270 is provided with an insertion guide at intervals on both sides thereof as shown in FIG. The pin 28〇 and the plurality of latch opening pins (282, 282). The latch 270 is constructed to be opened by a latch ( 282, 282) can be opened (open). The insertion guide pin 28 is preferably formed to be much larger than the latch opening pin (282, 282). Further, the latch receiving portion 210 of the insertion insertion body 220 can be An auxiliary guide pin 216 for supporting the rear face 232 of the latch 27 is inserted. The auxiliary guide pin 216 is moved along a long hole (not shown) formed in the buckle receiving portion 210 of the flash 9 201040556. The operation relationship of the mounting module of the test processor constructed in accordance with an embodiment of the present invention configured as described above will be described with reference to the drawings. As shown in Figs. 2a, 3, and 4, the mounting is performed. When the insertion body 22A and the question button opening block 300 are separated from each other, when the head (not shown) is inserted into the space portion 208 of the placement insertion body 220, the state in which the latch 270 holds the semiconductor element 202 is formed. The buffer member 277 constituting the end portion 275 provided before the latch 270 holds the semiconductor element 202. At this time, the first guiding member 23 is located behind the long hole 240 of the latch 270 as shown in Fig. 3. The elastic member 260 that has been fitted into the guide hole 250 of the rear portion 232 of the latch 270 has a suitable elastic The latch 270 is pushed by the force. Moreover, the auxiliary guide pin 216 located at the lower side of the rear portion 232 of the latch 270 has a function of guiding the rear face 232 of the latch 270 in the buckle receiving portion 210. Thus, In a state in which the insertion body 220 and the latch opening block 300 are separated from each other (refer to FIG. 3), the latch opening block 300, as shown in FIG. 4, constitutes that the semiconductor element 202 can be unlocked when the placement insertion body 220 is inserted. That is, one of the latch-opening blocks 300 is fitted to the through-holes (224, 224) of the insertion insertion body 220, and the two pairs of the latch-opening pins 282 of the latch-opening block 300 are pushed. When pressed against a predetermined portion of the face portion that has been inserted under the first to third inclined faces (272, 274, 276) of the latch 270 on which the insertion body 220 is placed, the latch 270 is opened to the side to enable the semiconductor component 202 to unlock. At this time, the first guiding member 230 is moved forward by the rear of the long hole 240 of the latch 270 (that is, in the long hole 240, the first guiding member 230 is changed from the state of Fig. 3 to the state of Fig. 4). Moreover, the resilient member 260 that has been fitted to the guide 10 201040556 孑L 250 of the rear portion 232 of the latch 270 further compresses the latch 270 to push the flash button 270. That is, it corresponds to the force compressing elastic member 260 which is provided on one of both sides of the latch open block 300 and urges the flash lock opening pin 282 against the lower surface of the first to third inclined faces (272, 274, 276). Since the contraction elastic member 260 is fitted into the guide hole 250, it cannot be detached by being compressed. Further, the auxiliary guide pin 216 on the lower side of the rear surface 232 of the latch 270 has a function of guiding the rear surface 232 of the latch 270 in the latch housing portion 210. The auxiliary guide pin 216 is further moved forward as in Fig. 4 to support and guide the portion of the rear face 232 of the latch 270. A mounting module of a test processor constructed in accordance with another embodiment of the present invention will be described with reference to the drawings. First, the mounting module of the test processor of the present invention is substantially mounted; the insertion body 1250, the latch 1300, and the reference 1350. The mounting body 1250 has a space portion 1210 for accommodating the semiconductor element 1200 and a housing portion 1220 formed on both sides of the space portion 1210 as shown in Figs. 5 and 6 . Here, Fig. 6 is a cross-sectional view taken along line A-A of the mounting module shown in Fig. 5. The space portion 1210 is mainly a semiconductor element 1200 for accommodating a quadrangular shape, and is preferably formed in a rectangular shape. On the both sides of the space portion 1210, a accommodating portion 1220 formed in a rectangular shape in the longitudinal direction is formed, and the accommodating portion 1220 can accommodate a latch 1300, a button 1350, and the like which will be described later. As shown in FIG. 6, FIG. 7a and FIG. 7b, the latch 1300 is formed on one side thereof to form a latch fixing hole 1232 for engaging the latch fixing pin 1230, and on the other side of the 11 201040556 side. The long hole 1242 is formed, and an inversion preventing protrusion 1260 for preventing the latch from being reversed is formed on the upper side thereof. Further, a flat surface 1280 extending from the reverse rotation preventing projection 1260 is formed on the upper portion of the latch 1300, and the flat surface 1280 constitutes an insertion portion 1330 which is insertable and disposed on the button 1350. The one side of the reverse rotation preventing projection 1260 forms a guiding portion 1288, and the other side of the reverse rotation preventing projection 1260 forms a flat surface 1280 which is slightly planar. On the other hand, the arch portion 1284 is formed on the surface facing the flat surface 1280, and the arch portion 1284 is formed to be more recessed as it enters the inside of the latch 1300. The reverse rotation preventing projection 1260 serves to prevent the latch from being reversed. Preferably, the height d1 of the reverse rotation preventing projection 1260 is formed smaller than the height d2 of the lower portion of the latch. In this description, it is preferable that dl is 0.3 to 0.4 mm ′ d2 is 0.55 to 0.7 mm, whereas ' dl is 0.4 mm and d2 is 0.6 mm. As shown in FIGS. 7a and 7b, the button 1350 has a button fixing hole 1252 for fitting the button fixing pin 1240 on one side thereof and at least one or more of the elastic members 1310 for inserting the other side thereof. Ditch 1272. Further, in order to provide the elastic force when the button 1350 is moved, one or more elastic members 1310 are provided in the groove 1272. The groove 1272 and the elastic member 1310 may be provided as shown in Fig. 7a in accordance with the requirements of the user, or may be provided as shown in Fig. 7b. The operational relationship of the mounting module of the test processor constructed in accordance with another embodiment of the present invention constructed as described above will be described with reference to Figs. 6 to 8. First, the state in which the semiconductor element 1200 is held by the latch 1300 will be described. When the semiconductor element 1200 is held by the latch 1300, as shown in Fig. 6, 201040556 - the latch 1200 is held in a state of maintaining a slightly water-flat state with respect to the semiconductor element 12A. Moreover, when the semiconductor element 1200 is held by the latch 1300, the flat surface 128 of the latch 1300 is inserted into the insertion portion 1330 of the button 135A in an intimate state, and the reverse rotation preventing protrusion 126 of the latch 13 is closed by the button 1350. And can be pushed appropriately. On the other hand, the button 135 能 can be pressed by appropriately receiving the elastic state by at least one or more elastic members 131 provided on the upper portion of the button 135 . Q In this state, when the driving source (not shown) pushes the lower part of the button 1350 toward the arrow shown in Fig. 8, the button pin pushes the button 1300 while pushing along the button. The arched portion 1284 of the flash button 13 turns. When the heart fixing pin 1240 continues to push the flash button, the inversion preventing protrusion 1260 with respect to the flash button 13 is gradually increased with the force of the button fixing pin mo pressing the button 1350. 13(8)—The face is turned clockwise and the I turn surface is unlocked from the button 1350. In this way, the flash button 13 is not in the state of Figure 8 by means of a pull-out || (not shown) or other absorbing mechanism to hold the semi-❹ conductor to read the job, when 卩-1 When the thin guide (4) I288 is turned into a vertical state, the semiconductor element 12 (10) can be unlocked. On the other hand, in the state shown in Fig. 8, the latch 13 is again rotated in the counterclockwise direction, and the button fixing pin 1240 is freely dropped in the accommodating portion 1220 toward the front end of the sixth drawing. At this time, the flash button 1300 is rotated along the button 1350 and is inserted into the reading towel ─ ─ ─ ─ ─ ─ 丨 10 10 10 10 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 That is, the button 1: ^50 exceeds the reversal of the flash button 1300. The projection s is prevented from being closely placed on the flat surface 1280 and the latch 1300 is again _ semiconductor tree 12 〇〇. 13 201040556 A mounting module of a test processor constructed in accordance with another embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 9 is a plan view showing a mounting module of the test processor of the present invention, and Fig. 10 is a cross-sectional view showing the mounting module in which the latch shown in Fig. 9 is in a locked state. In particular, Fig. 10 is a cross-sectional view showing the A-A of the mounting module shown in Fig. 9. The mounting module of the test processor of the present invention has a mounting body 2210, a plurality of buttons 2220, a plurality of guide pins 2230, a plurality of latches 2240, and a plurality of mounting modules as shown in FIG. 9 and FIG. The elastic member 2250 is constructed. The carrier 2210 is for integrally supporting the member ’ of the mounting module of the present invention and forms a space portion 2211 for accommodating the semiconductor element, and the accommodating portion 2212 is formed on one side and the other side of the space portion 2211. A plurality of buttons 2220 are respectively disposed in the housing portion 2212 of the carrier 2210, and a plurality of guide pins 2230 are respectively inserted in the button 2220. The guide pin 2230 is moved along the first guide hole 2240a and the second guide hole 2240b by the movement of the button 2220 to open/close the latch 2240. The plurality of latches 2240 respectively form a first guide hole 2240 into which the guide pin 2230 can be inserted. In the direction X, the second guiding hole 2240b that can communicate with the i-th guiding hole 224a is formed in the second direction γ different from the first direction X. A plurality of elastic members 225 are coupled to the accommodating portion 2212 and the plurality of buttons 2220, respectively, to provide an elastic force to the button 222A. The configuration of the mounting module constructed in accordance with another embodiment of the present invention having the above-described configuration will be described in more detail below. The mounting body 2210 has two sides of the space portion 2211' of the space portion 2211 for accommodating the semiconductor element (p), that is, the 201040556 accommodating portion 2212 is formed on one side and the other side, respectively. Since the space portion 2211 is mainly for accommodating the semiconductor element (P) having a square shape, it is preferably formed in a rectangular shape. Each of the accommodating portions 2212 formed on both sides of the space portion 2211 can be provided with a button 2220, a guide pin 2230, a latch 2240, and an elastic member 2250 which will be described later. The plurality of buttons 2220 are constituted by the button body 2221 and the plurality of protruding members 2222 as shown in Fig. 10, the nath diagram, and the lib diagram, respectively. Here, the 11A is a separate enlarged perspective view of the button and the latch, and the 11th is a perspective view of another embodiment of the button shown in Fig. 11a. The button body 2221 is provided in the housing portion 2212 of the carrier 2210, the upper portion is formed with a groove 2221a for connecting the elastic member 2250, and the lower portion is formed with the insertion groove 2221b. A plurality of protruding members 2222 are formed to face the lower portion of the button body 2221. That is, both sides of the insertion groove 2221b which has been formed in the lower portion of the button body 2221 are formed. Thus, a plurality of projecting members 2222 are integrally formed at the lower portion of the button body 2221, and a fixing hole 2222& for fitting the guide pin 223b is formed. Between the plurality of ejecting members 2222, the latch 2240 can be inserted and inserted by the guiding pin 2230, and the upper portion thereof, that is, the upper portion of the button body 2221 can form a groove or form a plurality of grooves 2221a. In the case where a groove 2221& is formed, a plurality of elastic members 1250 respectively use a spring as shown in the iia diagram to connect 'oppositely' to form a plurality of grooves 2221a, as shown in the mth figure. The pieces of coffee are separately recorded from the record (4), and most of the pieces are connected to the majority of the grooves 2221a. Most of the magazines are attached to the button body 2221 to provide greater spring force than if only one spring is connected. That is, when the contact 2220 is lowered by the elastic force of the elastic member (4), the case of most 箦 can provide 15 201040556 with a larger elastic force than the case of one spring. Therefore, the flash button 2240 can hold the semiconductor component P more firmly. The space portion 2211 of the body 2210. As shown in FIG. 10, FIG. 11a, and lib diagram, the plurality of latches 2240 form the first guide hole 2240a' in the first direction X and form the first direction Y in the second direction Y different from the first direction X. The second guiding hole 2240b through which the guiding hole 2240a communicates intersects the first direction X and the second direction Y at an angle of 60 to 120 degrees. Thus, the plurality of latches 2240 are respectively configured by a latch fixing pin 2241 and a latch body 2242. The latch fixing pin 2241 is fixed to the accommodating portion 2212 of the latch body, and the latch body 2242 is inserted and fixed by the latch fixing pin 2241, and the first guiding hole 224 〇 a is formed in the first direction X, and The second guiding hole 224 〇 b is in communication with the first guiding hole 2240 a and is formed in the second direction γ different from the first direction X. In this way, the first guide hole 2240a and the second guide hole 2240b formed in the latch body 2242 are formed in mutually different directions (χ, γ), so that when the button 222 is moved by the elastic member 2250, the guide The lead pin 2230 is guided by the first guide hole 2240a and the second guide hole 2240b to move, whereby the latch 224 is not free to fall. In this way, the latch 2240 is not freely dropped by the elastic force of the elastic member 2250, and the lead or the solder joint (not shown) formed in the lower portion of the semiconductor element P can be stably held without being damaged. The latch body 2242 which is inserted and rotated by the latch fixing pin 2241 is formed with a guide curved surface 2242a, a flat surface 2242b, and a reverse rotation preventing projection 2242c. The guide curved surface 2242a is formed on the side of the latch body 2242 and is formed in the lower portion of the button 2220 by the insertion groove 2221b. The guide groove 2242a is guided by the insertion groove 2221b of the body 2221 to be rotated. The face 2242b is formed to extend beyond the guide 16 201040556 lead curved surface 2242a and can be placed in the insertion groove 2221b which has been formed in the lower portion of the button 2220. Such a latch body 2242 is formed with a hole 2242d that can be inserted by the latch fixing pin 2241. The reverse rotation preventing projection 2242c is formed to prevent the reverse rotation of the latch 2240 from being formed between the guide curved surface 2242a and the flat surface 2242b, and the height hi of the reverse rotation preventing projection 2242c is formed smaller than the lower height h2 of the latch body 2242. . Here, the height hi of the inversion preventing protrusion 2242c is preferably 〇.3 to 〇.4 mm, and the lower height h2 is preferably 0.55 to 0_7 mm. However, the height hi of the inversion preventing protrusion 2242c is 0.4 mm, and the lower height is used. H2 uses 〇.6mm. A plurality of elastic members 2250 respectively apply a spring. Such a resilient member 2250 can utilize a plurality of springs. The elastic member 225 is composed of a spring, and a spring is coupled to the button 2220. The elastic member 2250 is composed of a plurality of springs, that is, the two springs are respectively coupled to the button 2220 to provide the elastic force to the button 2220. . DESCRIPTION OF THE PREFERRED EMBODIMENTS The operation of a mounting module of a test processor constructed in accordance with another embodiment of the present invention having the above-described configuration will be described with reference to the attached FIGS. 1 to 12. First, as shown in Fig. 10, when a plurality of latches 2240 hold the semiconductor element P, the plurality of latches 2240 hold the semiconductor element P in a state in which the first direction X is maintained in a horizontal state. That is, when the plurality of latches 2240 hold the semiconductor element P, the flat surface 2242b of the latch 2240 is closely inserted into the insertion groove 2221b formed at the lower portion of the button 2220, and the reverse rotation preventing protrusion 2242c of the latch 2240 is pressed by the button 2220 was properly pushed. On the other hand, the button 2220 is appropriately pressed by the elastic member 225 0 which has been provided on the upper portion of the button 2220, and is appropriately pushed by the elastic force 17 201040556. In a state where the latch 2240 holds the semiconductor element p, when the drive source (not shown) pushes the lower portion of the button 2220 toward the arrow direction a2 shown in FIG. 12, the guide pin 2230 is guided by the second guide. The pilot hole 224〇b is guided to move in the vertical direction to achieve the force of the release button 2220 to push the latch 2240. That is, the button 2220 is disengaged from the reverse rotation preventing projection 2242c of the latch 2240, and the state in which the flash button 2240 is only applied to the surface of the semiconductor element p is reached. When the button 2220 is continuously pressed in a state where the sister 222 脱离 is released from the reverse rotation preventing projection 2242c, the guide pin 2230 is pushed by the second guide hole to reach the push latch 2240. When the guide pin 2230 pushes the flash button 2240, the latch 224 is rotated clockwise with the fixing pin 2241 as a rotating shaft, and the guide curved surface 2242a of the flash button 224 is in contact with the lower portion of the button 2220. When the pressing surface 222 is further continuously pressed in a state where the guiding curved surface 2242a is in contact with the lower portion of the button 2220, the guiding curved surface 2242a is further rotated in the clockwise direction to move toward the insertion groove 2221b formed at the lower portion of the button 2220, and the latch 224 For example, as shown in Fig. 12, the clockwise rotation is performed to completely release the holding of the semiconductor element p. In this state, the semiconductor element P can be detached from the space portion of the carrier 2210 by the ejector (not shown) or other absorbing mechanism. When the new semiconductor element p is accommodated in the space portion 2211 of the carrier 2210, the 'button 222' is turned off by the elastic member 2250 toward the direction of the arrow a shown in FIG. 10, that is, perpendicular. The direction is down. When the button 2220 is lowered, the guide pin 2230 is guided by the first guide hole 224a to be lowered to reach the push button 2240. When the latch 2240 is pushed by the guide pin 2230 by 18 201040556, the latch 2240 is rotated counterclockwise, and the guiding curved surface 2242a of the latch 2240 is disengaged by the insertion groove 2221b formed at the lower portion of the button 222, the guide pin 2230 The first guide hole 224A is moved toward the second guide hole 2240b in conjunction with the button 222A. When the guide pin 2230 is completely moved to the lower side of the second guide hole 2240b as shown in Fig. 10, the lower portion of the button 222''' is disposed on the flat surface 224213 of the latch 224''' to stop the rotation. That is, when the button 2220 is tightly disposed on the flat surface 2242b beyond the reverse rotation prevention protrusion 2242c of the latch 2240, the latch 2240 holds the semiconductor element p again. When the latch 2240 is rotated in the counterclockwise direction in order to hold the semiconductor element P, the guide pin 2230 is replaced by the guide pin 2230! The guide hole 224A and the second guide hole 2240 are guided to move so that the latch 224 is not freely dropped and the semiconductor element P can be held. Thereby, the impact applied to the semiconductor element p when the latch 2240 holds the semiconductor element p can be reduced, and the lead or solder joint formed on the lower portion of the semiconductor element P can be lowered by the latch 224 ( (not shown) Such damage. Industrial Applicability The mounting module of the test processor of this month can be used in the field of testing and measuring processors for semiconductor components, and can be widely used for holding (holding) semiconductor components or other components of semiconductor components. field. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1a to Fig. Id show a cross-sectional view of a conventional mounting module. 2A and 2b are exploded perspective views of the mounting module of the mounting module of the test processor of the present invention, and showing the important portions of the insert and the latch respectively. . 201040556=图_ shows a cross-sectional view of the mounting module of the service processor of the present invention. Fig. 4 is a cross-sectional view showing the state in which the mounting module of the test processor of the present invention is buckled in an open state. Fig. 5 is a top view showing a mounting module of a test processor constructed by another embodiment of the present invention. Fig. 6 is a cross-sectional view showing the state in which the mounting module of the service processor of the present invention is buckled in a locked state. Fig. 7a and Fig. 7b are perspective views of a different embodiment of the mounting module of the service processor of the present invention as an important part of the problem. Fig. 8 is a cross-sectional view showing the flashing of the mounting module of the test processor of the present invention in an open state. Fig. 9 is a top view showing a mounting module of a test processor constructed by another embodiment of the present invention. The first diagram shows a cross-sectional view of the mounting module in which the flash button shown in Fig. 9 is in a locked state. The enlarged perspective view of the button and the latch shown in Fig. 11a and the lib diagram. Module Fig. 12 is a cross-sectional view showing the cutting of the latch shown in Fig. 1 in an open state. 12a······································································
13.··相 14.. .附著片 15.. .載置收納部 16.. . 1C 載體 17.. .緊固螺栓 18.. .1. 元件 19.. .1.收納部 21.. .附著用孔 22.. .導引銷插入孔 23.. .閂扣 24.. .1.吸著墊 25.. .閂扣解鎖機構 26.. .控制片 27.. .上方體 202.. .半導體元件 208.. .空間部 210.. .閂扣收納部 212.. .側壁 216.. .輔助導引銷 220.. .載置插入體 222.. .突出部 224.. .貫穿孔 225.. .落差部 230.. .第1導引構件 232.. .後面 240.. .長孔 245.. .側面 250.. .導引孔 260.. .彈性構件 270…閂扣 272.. .第1傾斜面 274…第2傾斜面 275.. .前端部 276…第3傾斜面 277···缓衝材 280.. .插入導引銷 282.. .閂扣開啟銷 300.. .閂扣開放塊 1200.. .半導體元件 1210.. .空間部 1220.. .收納部 1230.. .問扣固定銷 1232…閂扣固定孔 1240.. .按鈕固定銷 1242.. .長孔 1250.. .載置插入體 1252.. .按鈕固定孔 1260.. .反轉防止凸起 21 201040556 1272…溝 2222...突出構件 1280...平坦面 2230...導引銷 1284...拱形部 2240...閂扣 1288...導引部 2240a...第1導引孔 1300...閂扣 2240b.··第2導引孔 1310…彈性構件 2241…閂扣固定銷 1330...插入部 2242...閂扣體 1350...按鈕 2242a...導引曲面 2210··.載置體 2242b...平坦面 2211...空間部 2242c...反轉防止凸起 2212...收納部 2242d...孔 2220...按鈕 2250...彈性構件 2221...按鈕體 dl...反轉防止凸起的高度 2221a…溝 d2...閂扣下部的高度 2221b...插入溝 P...半導體元件 2213.·········································································· Attachment hole 22.. Guide pin insertion hole 23... Latch 24..1. Suction pad 25... Latch release mechanism 26.. Control piece 27.. Upper body 202. . Semiconductor component 208.. Space portion 210.. Latch storage portion 212.. Side wall 216.. Auxiliary guide pin 220.. Placement insert 222.. Projection 224.. Hole 225.. Drop portion 230... 1st guiding member 232.. Rear 240.. Long hole 245.. Side 250.. Guide hole 260.. Elastic member 270... Latch 272 The first inclined surface 274...the second inclined surface 275..the front end portion 276...the third inclined surface 277···the cushioning material 280.. the insertion guide pin 282.. the latch opening pin 300. .. latch open block 1200... semiconductor element 1210.. space portion 1220.. accommodating portion 1230... clasp fixing pin 1232... latch fixing hole 1240.. button fixing pin 1242.. long Hole 1250.. Mounting insert 1252.. Button fixing hole 1260.. Reverse rotation preventing projection 21 201040556 1272... Groove 2222... Projection member 1280... Flat surface 2230... Lead pin 1284...arc portion 2240...latch 1288...guide portion 2240a...first guide hole 1300...latch 2240b.....second guide hole 1310...elastic member 2241... Latch fixing pin 1330... Inserting portion 2242... Latching body 1350... Button 2242a... Guide curved surface 2210··. Carrier 2242b... Flat surface 2211... Space portion 2242c...reverse prevention projection 2212...receiving portion 2242d...hole 2220...button 2250...elastic member 2221...button body dl...reverse rotation preventing height 2221a... The groove d2...the height of the lower portion of the latch 2221b...insertion groove P...semiconductor element 22