KR20100086844A - Bonding apparatus for printed circuit on fpd panel - Google Patents

Abstract

PURPOSE: A device for bonding a driving circuit board on a flat panel display device is provided to prevent the flat panel display from being cracked or damaged by locally heating the bonding part of the flat panel display device in a bonding process. CONSTITUTION: A stage unit(10) supports a flat panel display. A quartz part(20) provides a bonding area between a driving circuit board and the flat panel display device. An image information obtaining unit(30) obtains image information about the arrangement state of the flat panel display device and the driving circuit board. A bonding unit(40) bonds the driving circuit board with the flat panel display with thermo-compression or ultrasonic bonding. An auxiliary heating unit(50) heats the lower side of the flat panel display.

Description

Bonding device of driving circuit board {BONDING APPARATUS FOR PRINTED CIRCUIT ON FPD PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for a driving circuit board, and more particularly, to a plate that may be generated in an ultrasonic bonding process by heating a portion for bonding the driving circuit board and the flat panel display element by using auxiliary heating means. The present invention relates to a bonding apparatus for a driving circuit board capable of preventing cracks or breakage of a display element.

In general, a flat panel display (FPD) is a display device that collectively refers to a plasma display panel (PDP), a liquid crystal display (LCD), and an organic light emitting diode (OLED). to be.

In recent years, with the development of technology, flat panel display devices are gradually becoming thin and short, and accordingly, various driving circuit boards are directly attached to the flat panel display devices to manufacture them as a single component.

The driving circuit board may include a flexible printed circuit (FPC), a tape carrier package (TCP), a common block flexible printed circuit (CBF), a driver integrated circuit (Drive IC), and the like.

Since the driving circuit boards are directly attached to the flat panel display device, there is no need for complicated wiring, so assembly and maintenance are easy, and there is no need to secure a separate wiring space, which is suitable for miniaturization and thinning of the product. Can have

In addition, since the compatibility of various wirings is maintained, the driving circuit board is widely used without being limited to the use and specification of the flat panel display device. Accordingly, the driving circuit board directly bonds the driving circuit board to the flat panel display device. Research on the driving circuit board bonding process is steadily being made.

In the conventional joining process, a method is used in which the flat panel display element and the driving circuit board are aligned in the joining work area, and the joining portions located in the joining work area are joined by thermocompression bonding or thermocompression ultrasonic bonding.

After that, when the bonding process is completed, an indentation test for confirming the bonding state and a microscopic test for checking whether cracks have occurred on the flat panel display device are performed.

When the bonding process is completed, the final packaging process is performed after a secondary process such as an electrical test, thereby completing the bonding of the driving circuit board and the flat panel display device.

However, in the conventional bonding process, the thermocompression ultrasonic bonding joins the driving circuit board and the flat panel display device using predetermined heat, vibration, and pressure, and thus cracks in the flat panel display device due to heat, vibration, and pressure applied during the bonding process. Or there was a problem that breakage occurs.

In addition, the abnormal phenomenon of the flat panel display device caused by the above factors has a problem that increases the time required for the various inspection of the bonded product, thereby lowering the production rate of the final product.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to assist in locally heating a junction portion of a flat panel display device before or during the joining process of the flat panel display device and the driving circuit board. It is to provide a driving circuit board bonding apparatus having a heating means. An auxiliary heating device is to provide a circuit board bonding device for driving that can prevent thermal damage and cracks of the flat panel display device that may occur during the bonding process of the flat panel display device and the driving circuit board.

It is still another object of the present invention to provide a driving circuit board joining apparatus which can shorten the heating time and increase the production yield of the final product by smoothly performing the joining process of the flat panel display element and the driving circuit board. have.

The above object is, according to the present invention, a stage unit for supporting a flat panel display (Flat Panel Display) to be bonded to the driving circuit board; A quartz unit disposed adjacent the stage unit to provide a joining work area between the flat panel display element and the driving circuit board; An image information acquisition unit for acquiring image information on an alignment state between the flat panel display element and the driving circuit board; A junction part for joining the aligned flat panel display element and a driving circuit board by an ultrasonic bonding method; Auxiliary heating means for heating the bottom of the flat panel display element; And a control unit for controlling an operation of the auxiliary heating means, wherein the flat panel display device includes a display unit for displaying input and output information and a terminal unit connected to the driving circuit board, and the terminal unit is connected to the flat panel display device. And at least one device alignment mark as a reference for bonding the driving circuit board, wherein the driving circuit board includes at least one chip alignment mark provided at a portion corresponding to the device alignment mark of the terminal unit, and the image information. The acquiring unit is provided with at least one refracting part installed under the quartz part, and a camera part installed on the side of the refracting part for capturing image information regarding the alignment state of the flat panel display element and the driving circuit board. Is for temporarily heating a portion where the flat panel display element and the driving circuit board are joined. There the drive circuit comprising an oscillation may be achieved by a welding device of the substrate.

Here, the heating oscillation portion may be provided with a reflecting plate provided in a concave shape and a nichrome line provided on the upper portion of the reflecting plate.

The heating oscillation unit may be disposed below the quartz unit, and may be provided to heat a portion where the flat panel display device and the driving circuit board are joined by the radiant heat generated by the heat of the nichrome wire.

Here, the bonding device of the driving circuit board may further include a driving means for driving the auxiliary heating means forward, backward, left, right and rotation.

In addition, the driving means may be provided to adjust the heating range of the auxiliary heating means.

Here, the camera unit may be provided as a charged coupled device (CCD) camera.

The camera unit may be provided to check the alignment or heating range of the flat panel display device and the driving circuit board through the photographed image information.

On the other hand, the control unit may be provided to adjust the heating temperature and the heating time of the heating oscillation unit according to the size and thickness of the terminal portion.

Here, the bonding part may be provided to perform the bonding of the flat panel display element and the driving circuit board after the junction portion of the flat panel display element and the driving circuit board is heated to a predetermined temperature by the auxiliary heating means.

In addition, the bonding portion may be provided to heat the bonding portion of the flat panel display element and the driving circuit board by the auxiliary heating means and to perform the bonding of the flat panel display element and the driving circuit board.

According to the present invention, cracking of a flat panel display element that may occur during the joining process is performed by locally heating the joining portion of the flat panel display element before or during the joining process of the flat panel display element and the driving circuit board. Or damage can be prevented.

In addition, by smoothly performing the bonding process between the flat panel display element and the driving circuit board, the bonding time can be shortened and the quality of the product can be improved.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the present invention.

Prior to this, terms used in the present specification and claims should not be construed in a dictionary sense, and the inventors may properly define the concept of terms in order to explain their invention in the best way. It should be construed as meaning and concept consistent with the technical spirit of the present invention.

Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

1 is a perspective view schematically showing a bonding apparatus for a driving circuit board according to the present invention, FIG. 2 is a front view of a bonding apparatus for a driving circuit board according to the present invention, and FIG. 3 is a driving circuit according to the present invention. It is a side view of the bonding apparatus of a board | substrate.

1 to 3, a bonding apparatus for a driving circuit board according to the present invention includes a stage unit 10 on which a flat panel display 100 to which the driving circuit board 200 is to be bonded is supported. Wow; A quartz unit 20 provided adjacent to the stage unit 10 to provide a bonding work area between the flat panel display device 100 and the driving circuit board 200; An image information acquisition unit 30 for acquiring image information about the alignment state of the flat panel display device 100 and the driving circuit board 200; A junction part (40) for joining the aligned flat panel display elements (100) to a driving circuit board (200); Auxiliary heating means (50) for heating the bottom of the flat panel display (100); And a controller for controlling the operation of the auxiliary heating means 50, wherein the auxiliary heating means 50 locally connects the portion A to which the flat panel display device 100 and the driving circuit board 200 are bonded. It includes a heating oscillation unit 52 for heating.

The flat panel display device 100 is an information display device such as a plasma display panel (PDP), a liquid crystal display (LCD), and an organic light emitting diode (OLED).

In addition, the driving circuit board 200 may be formed of a circuit board such as a flexible printed circuit (FPC), a tape carrier package (TCP), a common block flexible printed circuit (CBF), and a driver integrated circuit (Driver IC). Can be.

The bonding device for a driving circuit board according to the present invention is a device for bonding the aforementioned flat panel display device 100 and the driving circuit board 200 to each other. The bonding of the driving chip (drive circuit board) 200 to the LCD substrate (flat display element) 100 will be described.

As shown in FIGS. 1 to 3, the LCD substrate 100 may be provided with a display unit 110 for displaying input / output information and a terminal unit 120 bonded to the driving chip 200.

Here, the LCD substrate 100 may be provided by stacking terminal portions 120 formed larger than an area of the display portion 110 on the bottom surface of the display portion 110 provided with a substantially constant area.

However, hereinafter, a portion in which the terminal portion 120 and the display portion 110 overlap with each other will be described as the display portion 110 and a portion not overlapping with the terminal portion 120 in order to clearly distinguish the components.

The terminal unit 120 may include one or more device alignment marks 121 as a reference for bonding the LCD substrate 100 and the driving chip 200, and the driving chip 200 may include the device alignment mark ( One or more chip alignment marks 221 provided at a portion corresponding to 121 may be included.

The device alignment mark 121 and the chip alignment mark 221 are components for implementing the accurate alignment of the LCD substrate and the driving chip. As shown in FIG. 1, the device alignment mark 121 and the chip alignment mark 221 may be provided as marks of '+'. The present invention is not limited thereto, and may be provided as various identifiers capable of aligning the positions of the LCD substrate 100 and the driving chip 200.

In addition, although the chip alignment mark 221 is formed on the upper surface of the driving chip 200 in FIG. 1, the formation position of the chip alignment mark 221 is not limited thereto.

Meanwhile, the LCD substrate 100 is supported by the stage unit 10 and the quartz unit 20 to perform bonding with the driving chip 200.

Here, the stage unit 10 is provided as a metal material of the hexahedron, the quartz unit 20 is processed into a cube of transparent single crystal quartz for vision inspection of the LCD substrate 100 and the driving chip 200. It can be prepared by.

Here, the bonding apparatus includes a housing (not shown) having a seating portion for seating the quartz portion 20 and a lower portion thereof, but in FIGS. 1 to 3, the housing of the housing is conceptually illustrated in FIGS. The illustration is omitted.

The bonding apparatus for a driving circuit board according to the present invention includes a driving chip 200 positioned at a bonding portion of the LCD substrate 100 and the LCD substrate 100 positioned at the stage unit 10 and the quartz unit 20. It may include an image information acquisition unit 30 for checking the alignment of the).

Here, the image information acquisition unit 30 is installed at one side of the refracting portion 32 and the refracting portion 32 is provided below the quartz portion 20 to drive the LCD substrate 100 It may be provided with a camera unit 34 for photographing the image information on the alignment state of the chip 200.

Here, the LCD substrate 100 and the driving chip 200 may be automatically loaded or unloaded on the upper surface of the stage unit 10 and the quartz unit 20 by separate transfer means (not shown). Afterwards, the alignment state is photographed by the image information acquisition unit 30.

Here, the refraction portion 32 may be preferably provided as a mirror, and may be provided by various refraction means (prisms, etc.) that do not lose information on imaging.

In addition, the camera unit 34 is a component for photographing the alignment state information of the LCD substrate 100 and the driving chip 200, the user is the element alignment mark 121 photographed by the camera 34. And the alignment of the chip alignment mark 221 can be confirmed.

In addition, the camera unit 34 may check the bonding portion of the LCD substrate 100 and the heating portion of the heating oscillation unit 52 to be described later.

Here, the camera unit 34 may be provided as a CCD (charged coupled device) camera, the CCD camera recognizes the light received through the lens by each sensor of the CCD to convert the analog data into digital data image information As a camera for photographing, it can be exposed to ultraviolet light, visible light and infrared light.

Accordingly, the camera unit 34 may identify the thermal infrared rays oscillated by the heating oscillation unit 52, and the element identification mark () of the LCD substrate 100 through the image information captured by the camera unit 34. 121) and the portion heated by the heat oscillation unit 52 can be confirmed.

The image information acquisition unit 30 may be provided to check whether the device alignment mark 121 and the chip alignment mark 221 correspond to each other by adjusting the angle of refraction of the refraction unit 32.

In addition, the image information acquisition unit 30 may be provided to check whether the device alignment mark 121 and the chip alignment mark 221 correspond to each other by adjusting the photographing angle of the camera unit 34.

Here, the control of the refraction unit 32 and the camera unit 34 may be connected to the image information acquisition unit 30 as a separate controller, and is connected to the transfer means to drive the LCD substrate 100 according to the image information. It may be provided to adjust the position of the chip 200.

On the other hand, the bonding portion 40 is a component provided to bond the LCD substrate 100 and the driving chip 200 by thermal compression, ultrasonic bonding.

Here, the thermocompression bonding and the ultrasonic bonding are methods for bonding the products by pressurizing them by converting electrical energy into physical up and down vibration energy to generate frictional heat on the contact surface between the product and the product.

Therefore, when the bonding process is performed on the LCD substrate 100 without pretreatment, the LCD substrate 100 may be cracked or broken by vibrating energy and heat and pressure generated by the thermocompression bonding and ultrasonic bonding. Can be.

Accordingly, the bonding apparatus for a driving circuit board according to the present invention includes auxiliary heating means 50 for preventing the occurrence of cracking or damage in the LCD substrate 100 during the bonding process.

Here, the auxiliary heating means 50 is a component for locally heating the terminal portion 120 of the LCD substrate 100, may include a heating oscillation portion (52).

Here, the heating oscillation unit 52 may be provided with a reflecting plate 53 provided in a concave shape and a nichrome line 51 provided on an upper portion of the reflecting plate 53.

Here, the nichrome wire 51 may be provided as an electrical resistance wire which is generally used, and may be provided to transmit heat generated and oscillated on the reflective plate 53 to the terminal unit 120.

In addition, the nichrome wire 51, as shown in Figure 1, may be provided in a continuous uneven shape, the shape of the nichrome wire 51 is not limited to this, so that the required heat oscillation is made smoothly Various shapes, such as a coil shape, may be selectively adopted and installed on the reflector plate 53.

In addition, the reflecting plate 53 may be provided in a concave shape as a component for efficiently transferring heat generated from the nichrome wire 51 to the heating portion.

On the other hand, the heating oscillation unit 52 is disposed under the quartz portion 20, the portion of the LCD substrate 100 and the driving chip 200 is bonded by the radiant heat generated by the heat of the nichrome wire 51 It may be provided to heat (A).

Preferably, the heating oscillator 52 may be disposed between the lower portion of the refracting portion 32, as shown in Figs.

Here, the bonding apparatus for a driving circuit board according to the present invention may further include a driving means (not shown) for driving the auxiliary heating means 50 before, after, left, right and rotationally.

Here, the driving means, if the position correction of the auxiliary heating means 50 according to the image information (alignment state of the LCD substrate and the irradiation portion) obtained through the image information acquisition unit 30, the auxiliary heating means ( 50) may be provided to adjust the heating range.

That is, when the heating range of the element alignment mark 121 formed on the LCD substrate 100 and the thermal infrared rays oscillated by the heating oscillation unit 52 do not correspond to each other, the auxiliary heating means 50 is provided by the driving means. ), The element alignment mark 121 and the thermal infrared heating range may correspond to each other.

On the other hand, the control unit (not shown) may be provided to control the heating temperature, heating time and the like of the heating oscillator 52.

Here, the control unit may be provided as a manual type for performing the control of the thermal oscillation unit 52 according to the user's input, the heating intensity and heating of the heating oscillation unit 52 according to the size and thickness of the terminal unit 120 It may be provided as a full auto type that performs control over time.

Therefore, even when the bonding portion A is heated, even when the ultrasonic output of the bonding portion 40 is reduced (reduced vibration energy and heat generation), the bonding between the LCD substrate 100 and the driving chip 200 can proceed smoothly. .

When the bonding portion A is heated to a predetermined temperature by the auxiliary heating means 50, the bonding process of the LCD substrate 100 and the driving chip 200 is started by the operation of the bonding portion 40.

That is, the junction part 40 is to be bonded to the LCD substrate 100 and the driving chip 200 after the bottom surface of the LCD substrate 100 is heated to a predetermined temperature by the auxiliary heating means 50. Can be prepared.

Therefore, before the thermocompression bonding and the ultrasonic bonding process of the LCD substrate 100 and the driving chip 200 are performed, the bonding part A of the terminal part 120 is pre-heated, thereby occurring in the bonding process. It is possible to prevent the occurrence and cracking of the LCD substrate 100 that can be.

In addition, the junction portion 40 is the junction portion of the LCD substrate 100 and the driving chip 200 is heated by the auxiliary heating means 50 and at the same time, the bonding of the LCD substrate 100 and the driving chip 200 It may be arranged to perform the bonding.

This is because when the thickness of the terminal portion 120 of the LCD substrate 100 is less than a predetermined level and preheating of the bonding portion A is not necessary, the ultrasonic output is reduced by heating the terminal portion 120 during the bonding process. This is because the ultrasonic bonding process can be easily performed.

As described above, the bonding apparatus of the driving circuit board according to the present invention performs the bonding process by locally heating the bonding portion of the flat panel display element during the bonding process of the flat panel display element and the driving circuit board. It is possible to improve the quality of the joint at the same time as preventing cracks or breakage of the flat panel display device that may occur during the process, and the productivity of the final product can be increased by smoothly performing the joining process of the flat panel display device and the driving circuit board. .

As mentioned above, although the present invention has been described by way of limited embodiments and drawings, the technical idea of the present invention is not limited thereto, and a person having ordinary skill in the art to which the present invention pertains, Various modifications and variations may be made without departing from the scope of the appended claims.

Since the accompanying drawings are for understanding the technical spirit of the present invention together with the detailed description of the above-described invention, the present invention should not be construed as limited to the matters shown in the following drawings.

1 is a perspective view schematically showing a bonding device for a driving circuit board according to the present invention;

2 is a front view of a bonding apparatus for a driving circuit board according to the present invention;

3 is a side view of a bonding apparatus for a driving circuit board according to the present invention.

* Description of the symbols for the main parts of the drawings *

10: stage part 20: quartz part

30: image information acquisition part 40: junction

50: auxiliary heating means

Claims (10)

A stage unit supporting a flat panel display to which a driving circuit board is bonded; A quartz unit disposed adjacent the stage unit to provide a joining work area between the flat panel display element and the driving circuit board; An image information acquisition unit for acquiring image information on an alignment state between the flat panel display element and the driving circuit board; A junction part for bonding the aligned flat panel display element and the driving circuit board to each other by thermocompression bonding or ultrasonic bonding; Auxiliary heating means for heating the bottom of the flat panel display element; And a control unit controlling an operation of the auxiliary heating means. The flat panel display device includes a display unit for displaying input and output information and a terminal unit bonded to the driving circuit board. The terminal unit includes one or more element alignment marks as a reference for bonding the flat panel display element and the driving circuit board. The driving circuit board may include at least one chip alignment mark provided at a portion corresponding to an element alignment mark of the terminal unit. The image information acquisition unit is provided with one or more refraction units provided below the quartz unit, and a camera unit provided on the side of the refraction unit for capturing image information about the alignment state of the flat panel display element and the driving circuit board. And the auxiliary heating means comprises a heating oscillation unit for locally heating a portion where the flat panel display element and the driving circuit board are joined. The method of claim 1, The heating oscillation unit bonding apparatus for a driving circuit board, characterized in that provided with a reflecting plate provided in a concave shape and a nichrome line provided on the upper portion of the reflecting plate. The method of claim 2, And the heating oscillation unit is disposed under the quartz unit, and heats a portion where the flat panel display element and the driving circuit board are joined by radiant heat generated by the heat of the nichrome wire. The method of claim 1, The bonding apparatus of the driving circuit board further comprises a driving means for driving the auxiliary heating means forward, backward, left, right and rotationally. The method of claim 4, wherein The driving means is a bonding device for a driving circuit board, characterized in that for adjusting the heating range of the auxiliary heating means. The method of claim 1, Wherein the camera unit is a bonding device of the driving circuit board, characterized in that provided with a CCD (charged coupled device) camera. The method of claim 6, And the camera unit checks the alignment or heating range of the flat panel display device and the driving circuit board through the photographed image information. The method of claim 1, And the control unit controls a heating temperature and a heating time of the heating oscillation unit according to the size and thickness of the terminal unit. The method of claim 1, The junction portion is a drive circuit, characterized in that for performing the bonding of the flat panel display element and the driving circuit board after the junction portion of the flat panel display element and the driving circuit board is heated to a predetermined temperature by the auxiliary heating means. Bonding device of the substrate. The method of claim 1, Wherein the bonding portion is bonded to the driving circuit board, characterized in that the bonding portion of the flat panel display element and the driving circuit board is heated by the auxiliary heating means, and the bonding of the flat panel display element and the driving circuit board. Device.

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