KR20100034742A - 기판을 핸들링하기 위한 기술 - Google Patents

기판을 핸들링하기 위한 기술 Download PDF

Info

Publication number
KR20100034742A
KR20100034742A KR1020107000338A KR20107000338A KR20100034742A KR 20100034742 A KR20100034742 A KR 20100034742A KR 1020107000338 A KR1020107000338 A KR 1020107000338A KR 20107000338 A KR20107000338 A KR 20107000338A KR 20100034742 A KR20100034742 A KR 20100034742A
Authority
KR
South Korea
Prior art keywords
substrate
substrate support
mounting portion
wall
handler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107000338A
Other languages
English (en)
Korean (ko)
Inventor
데일 케이. 스톤
루드밀라 스톤
줄리앙 지. 브레이크
써니티 구다파티
Original Assignee
베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. filed Critical 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Publication of KR20100034742A publication Critical patent/KR20100034742A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020107000338A 2007-06-29 2008-06-09 기판을 핸들링하기 위한 기술 Withdrawn KR20100034742A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/770,805 2007-06-29
US11/770,805 US20090003979A1 (en) 2007-06-29 2007-06-29 Techniques for handling substrates

Publications (1)

Publication Number Publication Date
KR20100034742A true KR20100034742A (ko) 2010-04-01

Family

ID=40160742

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107000338A Withdrawn KR20100034742A (ko) 2007-06-29 2008-06-09 기판을 핸들링하기 위한 기술

Country Status (6)

Country Link
US (1) US20090003979A1 (enExample)
JP (1) JP2010532580A (enExample)
KR (1) KR20100034742A (enExample)
CN (1) CN101689529A (enExample)
TW (1) TW200903707A (enExample)
WO (1) WO2009005959A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441317B1 (ko) * 2012-01-10 2014-09-18 씨에스텍 주식회사 웨이퍼 이송용 피크 패드
KR20210052247A (ko) * 2019-10-30 2021-05-10 니혼 덴산 산쿄 가부시키가이샤 산업용 로봇의 핸드 및 산업용 로봇

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8900982B2 (en) * 2009-04-08 2014-12-02 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate
US8531042B2 (en) * 2009-06-30 2013-09-10 Oracle America, Inc. Technique for fabricating microsprings on non-planar surfaces
WO2012070496A1 (ja) * 2010-11-25 2012-05-31 シャープ株式会社 基板搬送装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547899A (ja) * 1991-08-20 1993-02-26 Sharp Corp ウエハー搬送用アーム
JPH1022360A (ja) * 1996-07-02 1998-01-23 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH1140646A (ja) * 1997-07-18 1999-02-12 Fujitsu Ltd ピックアップツール
JPH11188681A (ja) * 1997-12-24 1999-07-13 Canon Inc 基板搬送用ハンド及びその吸着機構
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6322116B1 (en) * 1999-07-23 2001-11-27 Asm America, Inc. Non-contact end effector
JP4346765B2 (ja) * 2000-01-04 2009-10-21 株式会社アルバック 基板搬送ロボット
JP4043009B2 (ja) * 2001-06-11 2008-02-06 大日本スクリーン製造株式会社 基板処理装置、基板処理方法および基板処理システム
JP3810714B2 (ja) * 2002-07-29 2006-08-16 エスペック株式会社 薄層基板製造方法、薄層基板移載装置及び薄層基板移載用吸着パッド
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
JP4740656B2 (ja) * 2005-06-21 2011-08-03 シーケーディ株式会社 多孔質板及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441317B1 (ko) * 2012-01-10 2014-09-18 씨에스텍 주식회사 웨이퍼 이송용 피크 패드
KR20210052247A (ko) * 2019-10-30 2021-05-10 니혼 덴산 산쿄 가부시키가이샤 산업용 로봇의 핸드 및 산업용 로봇

Also Published As

Publication number Publication date
WO2009005959A1 (en) 2009-01-08
CN101689529A (zh) 2010-03-31
US20090003979A1 (en) 2009-01-01
JP2010532580A (ja) 2010-10-07
TW200903707A (en) 2009-01-16

Similar Documents

Publication Publication Date Title
JP5258981B2 (ja) 基板保持具及び基板搬送装置及び基板処理装置
JP6942121B2 (ja) 基板キャリアシステム
US7290813B2 (en) Active edge grip rest pad
JP7301260B2 (ja) エンドエフェクターを供給するための器具、システム、及び方法
JP2021048406A (ja) 基板移送ロボットエンドエフェクタ
KR102124219B1 (ko) 반도체 웨이퍼 핸들링 엔드 이펙터를 위한 매쓰 댐퍼
CN104690641A (zh) 用于弯曲晶圆的传送模块
KR20100034742A (ko) 기판을 핸들링하기 위한 기술
KR20110104993A (ko) 기판 이동 시스템, 장치 및 방법
WO2018177341A1 (zh) 硅片吸附装置、硅片传送装置、硅片传输系统及传送方法
JPH024144B2 (enExample)
CN111244019B (zh) 基板支承装置、基板运送机器人以及对准装置
CN105009271B (zh) 晶片支撑及校准设备
KR20140120822A (ko) 척 테이블
WO2014110944A1 (zh) 机械手和半导体设备
JP2003245886A (ja) 吸着機構
KR20240073118A (ko) 보우 웨이퍼들을 위한 엔드 이펙터 패드 설계
CN216054630U (zh) 一种晶圆取放机构
KR100777201B1 (ko) 엔드 이펙터
JP2025094918A (ja) 基板搬送アームおよびそれを使用する装置
KR100219797B1 (ko) 반도체 제조용의 로봇로딩시스템의 픽업아암
KR20250139773A (ko) 박리 장치, 및 박리 방법
KR20060035467A (ko) 웨이퍼 이송 로봇 블레이드
CN111687788A (zh) 用于组装光学装置的设备

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20100107

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid