KR20100008686A - Printed circuit board and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase the degree of freedom of circuit pattern configuration by supplying a manufacturing method which can serially connect wires between layers. CONSTITUTION: Conductive rods(121,122), first circuit patterns(131,132) connected to the conductive load are formed on one side of a base. An insulator(140) is formed on one side of the base. Second circuit patterns(151,152) connected to the conductive load are formed on one side of the insulator. In the insulator, the base is removed. The first and the second circuit pattern are formed by lithography. The second circuit pattern is embedded in the insulator. The conductive load and the second circuit pattern are connected to the connecting members(161,162) of the conductive material.

Description

Printed circuit board and its manufacturing method {PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a printed circuit board having a double-sided or multi-layered structure and a method of manufacturing the same.

Printed Circuit Boards (PCBs) are components that are wired and integrated so that various devices can be mounted or electrical connections between them. BACKGROUND ART With the development of technology, printed circuit boards having various shapes and various functions have been manufactured, and examples thereof include a RAM, a main board, and a LAN card.

Due to the rapid development of information and communication, electronic devices such as portable terminals and notebook computers are required to be miniaturized, light weighted, and high speeded. In order to realize such demands, miniaturization and high integration of electronic components mounted thereon are required.

To this end, a printed circuit board is manufactured to have a double-sided structure having a circuit pattern on both sides or a multi-layered structure formed by a plurality of layers.

1A to 1D are views illustrating a general manufacturing method of a multilayer printed circuit board.

1A has shown the step of providing the copper foil laminate 10. The copper foil laminated plate 10 has a structure in which copper foil 12 is laminated on both surfaces of the insulating member 11. Here, the insulating member 11 may be formed of a material such as epoxy resin, phenol resin, and the like.

1B illustrates a step of forming the via holes 13 in the copper foil laminate 10. The via hole 13 is formed to penetrate the copper foil laminate 10, and may be formed by mechanical or laser drilling.

The plating layer 13a is formed on the inner wall of the via hole 13, and the copper foil 12 is etched to form the circuit pattern 14.

1C illustrates a step of stacking a plurality of insulating layers 16a and 16b on both sides of the insulating member 11. The inside of the via hole 13 is filled with the conductive filler 15, and a pair of insulating layers 16a and 16b are laminated on the upper surface of the insulating member 11. Here, copper foils 17a and 17b are coated on the outer surface of the insulating layers 16a and 16b. One region of the copper foils 17a and 17b is etched to expose one region of the insulating layers 16a and 16b.

As shown in FIG. 1D, drilling is performed in the exposed areas of the insulating layers 16a and 16b to form the via holes 19a and 19b. Here, plating layers 20a and 20b are formed on inner surfaces of the via holes 19a and 19b to connect the circuit pattern 14 of the insulating member 11 and the copper foils 17a and 17b of the insulating layers 16a and 16b.

Next, the copper foils 17a and 17b are etched to form circuit patterns 18a and 18b of desired shapes. Solder resists may be additionally applied to the outer surfaces of the insulating layers 16a and 16b.

The multilayer printed circuit board configured as described above is limited in the positioning of the via hole 13 of the insulating member 11 and the via holes 19a and 19b of the insulating layers 16a and 16b. That is, since the via holes 19a and 19b of the insulating layers 16a and 16b cannot be formed vertically in the upper or lower portion of the via hole 13 of the insulating member 11, the via hole of the insulating member 11 is formed. 13 and the via holes 19a and 19b of the insulating layers 16a and 16b are spaced apart from each other by a predetermined interval.

This structure counters the increase in density of the multilayer printed circuit board, and reduces the degree of freedom in circuit configuration of the printed circuit board.

In addition, according to the trend of miniaturization and thinning of printed circuit boards, a technology for manufacturing a printed circuit board having a thinner thickness has been developed. However, as the thickness of the printed circuit board becomes thinner, the depths of the via holes 13, 19a, and 19b also decrease, and the plating layers 13a, 20a, and 20b are formed on the inner walls of the via holes 13, 19a, and 19b. There is a problem that it is technically difficult.

The present invention is to solve the above problems, to provide a new structure that can connect the circuit patterns formed on both sides of the substrate even in a thin thickness printed circuit board that can not form a plating layer in the via hole.

In addition, the present invention is to provide a structure of a printed circuit board and a method of manufacturing the same for connecting the interlayer wiring connection of the multilayer printed circuit board in series.

In order to achieve the above object, the present invention provides a method for forming a conductive rod and a first circuit pattern connected to the conductive rod, and an insulator forming step of forming an insulator on one surface of the base. And a second patterning step of forming a second circuit pattern connected to the conductive rod on one surface of the insulator, and a base removing step of removing the base from the insulator.

The second circuit pattern may be formed to be embedded in the insulator.

The second patterning step may further include a circuit connection step of connecting the conductive rod and the second circuit pattern by a connection member made of a conductive material.

The circuit connecting step may include forming an opening in an area between the conductive rod and the second circuit pattern, and forming the connecting member in the opening.

The method of manufacturing a printed circuit board according to the present invention includes forming a multilayer printed circuit board by performing at least one of the first patterning step, the insulating material forming step, and the second patterning step on one surface of the insulating member. It may further include.

Meanwhile, the present invention provides an insulator having first and second circuit patterns formed on both surfaces thereof, a conductive rod connected to the first circuit pattern and disposed to penetrate the insulator, and between the conductive rod and the second circuit pattern. Disclosed is a printed circuit board disposed in an opening formed in an opening, the printed circuit board including a connecting member connecting the conductive rod and the second circuit pattern.

The insulator may be configured to form a plurality of layers, and the conductive rods disposed in each layer may be configured to conduct circuit patterns disposed between the layers.

The present invention has a structure in which circuit patterns on both sides of a substrate are connected by conductive rods, thereby providing a structure in which the circuit patterns can be connected even in a printed circuit board having a thin thickness in which a plating layer cannot be formed in a via hole.

In addition, the present invention provides a structure in which an electronic device can be directly mounted on a circuit pattern without forming a separate pad on the circuit pattern.

In addition, the present invention provides a structure of a printed circuit board and a method of manufacturing the same by connecting the interlayer wiring connection of the multilayer printed circuit board in series, thereby providing a wider electronic device and circuit taton area and increasing the degree of freedom of circuit pattern construction. Let's do it.

Hereinafter, a method of manufacturing a printed circuit board according to the present invention will be described in more detail with reference to the accompanying drawings. The components shown in the drawings described below are exaggerated for clarity.

2A through 2F are cross-sectional views sequentially illustrating a manufacturing process of a printed circuit board according to an exemplary embodiment of the present invention.

2A illustrates a first patterning step of forming conductive rods 121 and 122 and first circuit patterns 131 and 132 on one surface of the base 110.

The base 110 may be made of a material that can be removed in a later step of the present step. For example, as an example of the base 110, a material dissolved in water, an aqueous solution, or a solution of a specific component or physically peelable may be used.

In addition, the base 110 may be a material that can be removed by light. For example, a material that loses adhesive strength or decomposes into gas may be used by light having a specific wavelength such as ultraviolet rays or X-rays. have.

The conductive rods 121 and 122 and the first circuit patterns 131 and 132 may be formed of a conductive material, for example, copper or a copper alloy. The conductive rods 121 and 122 may have a direction perpendicular to one surface of the base 110 in the length direction. The conductive rods 121 and 122 and the first circuit patterns 131 and 132 may be formed through a process such as lithography, printing, or plating.

Here, the first circuit patterns 131 and 132 are formed to be electrically connected to the conductive rods 121 and 122. The first circuit patterns 131 and 132 may be patterned to be connected to the conductive rods 121 and 122 while the conductive rods 121 and 122 are formed, or may be patterned at the same time as the conductive rods 121 and 122 are formed.

2B illustrates an insulator formation step of forming an insulator on one surface of the base.

The insulator 140 is formed of an insulating material for interlayer insulation of a printed circuit board. Examples of the insulator 140 may include an epoxy resin, a phenol resin, or the like including glass fibers. The insulator 140 not only enables interlayer insulation, but also forms an appearance of a printed circuit board and functions as a base member that provides durability to the printed circuit board.

After the insulator 140 in the liquid state is disposed on the upper surface of the base 110 in the state of FIG. 2A, the insulator 140 is cooled and cured. In addition, a second patterning step of forming second circuit patterns 151 and 152 on the upper surface of the insulator 140 is performed.

The second circuit patterns 151 and 152 may be formed of a conductive material, for example, copper or a copper alloy, similarly to the first circuit patterns 131 and 132, and may be formed through a process such as lithography, printing, or plating. Can be.

The second circuit patterns 151 and 152 may be formed to be buried on the insulator 140 during patterning. The second circuit patterns 151 and 152 are pressed in a state where the insulator 140 is not completely cured and is embedded in the insulator 140. Since the first circuit patterns 131 and 132 and the second circuit patterns 151 and 152 are embedded in the insulator 140, the thickness of the printed circuit board may be more slim.

2C and 2D illustrate a circuit connection step of connecting the conductive rod and the second circuit pattern.

As illustrated in FIG. 2C, openings 121a and 122a may be formed in a region between the conductive rods 121 and 122 and the second circuit patterns 151 and 152. The openings 121a and 122a may be formed by removing partial regions of the conductive rods 121 and 122 and partial regions of the insulator 140.

The openings 121a and 122a are used to define an area for connecting the conductive rods 121 and 122 and the second circuit patterns 151 and 152. The openings 121a and 122a are positions and shapes of the second circuit patterns 151 and 152 and the second circuit patterns 151 and 152. And the arrangement of the conductive rods 121 and 122 may have various forms.

The openings 121a and 122a may be formed using a photo mask in which a region to be removed is patterned. After irradiating light to the insulator 140 on which the photomask is disposed, when the patterned region is etched using the etching solution, openings 121a and 122a are formed in the region.

As shown in FIG. 2D, connection members 161 and 162 made of a conductive material are formed in the openings 121a and 122a. The connection members 161 and 162 may be formed of a conductive material such as copper or a copper alloy, and may be formed on the openings 121a and 122a by plating or printing.

The connection members 161 and 162 are formed to correspond to the shape of the openings 121a and 122a in the openings 121a and 122a. That is, the openings 121a and 122a define the shape of the connecting members 161 and 162.

The conductive rods 121 and 122 and the second circuit pattern are electrically connected to each other by the connecting members 161 and 162, and the first circuit patterns 131 and 132 and the second circuit patterns (131 and 132) disposed on both surfaces of the insulator 140 are thus formed. 151 and 152 are electrically connected to each other.

2E illustrates a base removal step of removing a base from an insulator.

The base 110 may be physically peeled off from the insulator or removed in response to a chemical. Accordingly, the first circuit patterns 131 and 132 and the conductive rods 121 and 122 are exposed to the outside.

As illustrated in FIG. 2F, solder resist layers 171 and 172 may be further stacked on the outer surface of the insulator 140. The solder resist layers 171 and 172 prevent oxidation of the first circuit patterns 131 and 132 and the second circuit patterns 151 and 152, or the first circuit patterns 131 and 132 and the second circuit patterns 151 and 152 when the electronic device is mounted. Prevent it from being affected. In addition, a plurality of electronic devices may be mounted on one surface of the first circuit patterns 131 and 132 and the second circuit patterns 151 and 152.

As shown in FIG. 2F, the printed circuit board manufactured by the above process includes an insulator 140 having first circuit patterns 131 and 132 and second circuit patterns 151 and 152 formed on both surfaces thereof, and first circuit patterns 131 and 132. Conductive rods 151 and 152 connected to the insulator 140 and disposed to penetrate the insulator 140, and openings 121a and 122a formed between the conductive rods 151 and 152 and the second circuit patterns 151 and 152, respectively. And connecting members 161 and 162 connecting the second circuit patterns 151 and 152.

The present invention has a structure in which the conductive rods 121 and 122 and the second circuit patterns 151 and 152 are connected by the connecting members 161 and 162, so that a separate pad is not formed on one surface of the second circuit patterns 151 and 152. It may be directly mounted on one surface of the two circuit patterns (151, 152).

3A and 3B are cross-sectional views illustrating a manufacturing process of a printed circuit board according to another exemplary embodiment of the present invention.

This embodiment shows that at least one of the first patterning step, the insulation forming step, and the second patterning step is further performed in the state of FIG. 2E of the previous embodiment to manufacture the multilayer printed circuit board. In the following description, the insulator 140, the conductive rods 121 and 122, and the connecting members 161 and 162 of the previous embodiment are referred to as the first insulator 140, the first conductive rods 121 and 122, and the first connecting members 161 and 162, respectively. It will be referred to.

The manufacturing process of the multilayer printed circuit board will be described in detail. In the state of FIG. 2E, the second conductive rods 123 and 124 are formed on the upper surface of the first insulator 140. Here, the second conductive rods 123 and 124 may be formed at the same position as the first conductive rods 121 and 122. This is to increase the degree of freedom of circuit configuration while increasing the arrangement area of the circuit pattern by connecting the interlayer wiring connections of the multilayer printed circuit board in series.

After the second conductive rods 123 and 124 are formed, the second insulator 140 is formed in the same manner as in the previous embodiment. After the third circuit patterns 153 and 154 are formed on the upper surface of the second insulator 141, second connection members 163 and 164 are formed to connect the second conductive rods 123 and 124 to the third circuit patterns 153 and 154. In this case, the state of FIG. 3E is obtained. This process is performed in the same manner as the previous embodiment, the description thereof will be replaced by the previous description.

As shown in FIG. 3B, another insulator, that is, a third insulator 142 may be additionally formed on the bottom surface of the first insulator 140.

In the state of FIG. 3A, after forming the third conductive rods 125 and 126 on the lower surface of the first insulator 140, the third insulator 142 is further formed. Here, the first to third conductive rods 121 to 126 are arranged in series to connect the interlayer wiring of the printed circuit board in series.

Further, third connection members 165 and 166 for connecting the fourth circuit patterns 155 and 156 and the fourth circuit patterns 155 and 156 and the third conductive rods 125 and 126 are further formed on the bottom surface of the third insulator 142. Can be. Circuit patterns of each layer may be electrically connected by the first to third connection members 161 to 166.

Solder resist layers may be formed on both sides of the printed circuit board as in the previous embodiment, and electronic devices may be mounted on the circuit patterns.

In the above description, the multilayered printed circuit board having three layers has been described. However, the multilayered printed circuit board having more layers may be manufactured by additionally implementing the processes of the foregoing embodiments.

The manufacturing process of the printed circuit board described above may be performed by selectively mixing the steps of each process according to design specifications. Therefore, configurations of a printed circuit board that can be manufactured through a process in which the above processes are mixed may also include various modifications within the scope of the technical idea of the present invention.

1A to 1D are views illustrating a general manufacturing method of a multilayer printed circuit board.

2A through 2F are cross-sectional views sequentially illustrating a manufacturing process of a printed circuit board according to an exemplary embodiment of the present invention.

3A and 3B are cross-sectional views illustrating a manufacturing process of a printed circuit board according to another exemplary embodiment of the present invention.

Claims (9)

A first patterning step of forming a conductive rod and a first circuit pattern connected to the conductive rod on one surface of the base; An insulator forming step of forming an insulator on one surface of the base; A second patterning step of forming a second circuit pattern connected to the conductive rod on one surface of the insulator; And A method of manufacturing a printed circuit board comprising a base removing step of removing the base from the insulator. The method of claim 1, Wherein the first and second circuit patterns are formed by lithography. The method of claim 1, And the second circuit pattern is formed to be embedded in the insulator. The method of claim 1, The second patterning step further comprises a circuit connection step of connecting the conductive rod and the second circuit pattern by a connection member of a conductive material. The method of claim 4, wherein the circuit connection step, Forming an opening in an area between the conductive rod and the second circuit pattern; And And forming the connection member in the opening. The method of claim 5, The connecting member is a manufacturing method of a printed circuit board, characterized in that formed by plating or printing. The method of claim 1, The method may further include forming a multi-layer printed circuit board by performing at least one of the first patterning step, the insulating material forming step, and the second patterning step on one surface of the insulating member. Manufacturing method. An insulator having first and second circuit patterns formed on both surfaces thereof; A conductive rod connected to the first circuit pattern and disposed to penetrate the insulator; And A printed circuit board disposed in an opening formed between the conductive rod and the second circuit pattern, the connection member connecting the conductive rod and the second circuit pattern. The method of claim 8, The insulator is configured to form a plurality of layers, and the conductive rod disposed in each layer is configured to conduct the circuit patterns disposed between the layers.

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