KR20090105933A - 모바일 어플리케이션에 사용되는 마이크로 메카니칼 및 마이크로 광학 부품용 하우징 - Google Patents

모바일 어플리케이션에 사용되는 마이크로 메카니칼 및 마이크로 광학 부품용 하우징 Download PDF

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Publication number
KR20090105933A
KR20090105933A KR1020097015082A KR20097015082A KR20090105933A KR 20090105933 A KR20090105933 A KR 20090105933A KR 1020097015082 A KR1020097015082 A KR 1020097015082A KR 20097015082 A KR20097015082 A KR 20097015082A KR 20090105933 A KR20090105933 A KR 20090105933A
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KR
South Korea
Prior art keywords
housing
substrate
cover substrate
wafer
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020097015082A
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English (en)
Korean (ko)
Inventor
마르텐 올드센
율리히 호프만
Original Assignee
프라운호퍼-게젤샤프트 츄어 푀르더룽 데어 안게반텐 포르슝에.파우.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of KR20090105933A publication Critical patent/KR20090105933A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
KR1020097015082A 2007-01-18 2008-01-17 모바일 어플리케이션에 사용되는 마이크로 메카니칼 및 마이크로 광학 부품용 하우징 Withdrawn KR20090105933A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007002725.9 2007-01-18
DE102007002725A DE102007002725A1 (de) 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente
PCT/EP2008/000321 WO2008087022A1 (de) 2007-01-18 2008-01-17 Gehäuse für in mobilen anwendungen eingesetzte mikromechanische und mikrooptische bauelemente

Publications (1)

Publication Number Publication Date
KR20090105933A true KR20090105933A (ko) 2009-10-07

Family

ID=39471629

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097015082A Withdrawn KR20090105933A (ko) 2007-01-18 2008-01-17 모바일 어플리케이션에 사용되는 마이크로 메카니칼 및 마이크로 광학 부품용 하우징

Country Status (7)

Country Link
US (1) US8201452B2 (https=)
EP (1) EP2102096B1 (https=)
JP (1) JP2010517064A (https=)
KR (1) KR20090105933A (https=)
CA (1) CA2675501A1 (https=)
DE (1) DE102007002725A1 (https=)
WO (1) WO2008087022A1 (https=)

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US9726862B2 (en) 2012-11-08 2017-08-08 DynaOptics LTD, A Public Limited CO. Lens assemblies and actuators for optical systems and methods therefor
ITTO20130225A1 (it) 2013-03-21 2014-09-22 St Microelectronics Srl Struttura sensibile microelettromeccanica per un trasduttore acustico capacitivo includente un elemento di limitazione delle oscillazioni di una membrana, e relativo processo di fabbricazione
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JP6511368B2 (ja) * 2015-09-01 2019-05-15 アズビル株式会社 微細機械装置
JP2017053742A (ja) * 2015-09-10 2017-03-16 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、および移動体
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CN108249381B (zh) * 2016-12-29 2020-03-17 财团法人工业技术研究院 具冲击吸收器的微机电装置
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DE102018200371A1 (de) * 2018-01-11 2019-07-11 Robert Bosch Gmbh Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren
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Also Published As

Publication number Publication date
WO2008087022A1 (de) 2008-07-24
US8201452B2 (en) 2012-06-19
US20100061073A1 (en) 2010-03-11
WO2008087022A8 (de) 2009-08-13
EP2102096A1 (de) 2009-09-23
CA2675501A1 (en) 2008-07-24
JP2010517064A (ja) 2010-05-20
DE102007002725A1 (de) 2008-07-31
EP2102096B1 (de) 2016-08-24

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090717

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid