JP2010517064A - モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ - Google Patents

モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ Download PDF

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Publication number
JP2010517064A
JP2010517064A JP2009545870A JP2009545870A JP2010517064A JP 2010517064 A JP2010517064 A JP 2010517064A JP 2009545870 A JP2009545870 A JP 2009545870A JP 2009545870 A JP2009545870 A JP 2009545870A JP 2010517064 A JP2010517064 A JP 2010517064A
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Prior art keywords
micromachining
package
optical
package according
cover substrate
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JP2009545870A
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Japanese (ja)
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JP2010517064A5 (https=
Inventor
オルトゼン マルテン
ホーフマン ウルリヒ
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Publication of JP2010517064A publication Critical patent/JP2010517064A/ja
Publication of JP2010517064A5 publication Critical patent/JP2010517064A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
JP2009545870A 2007-01-18 2008-01-17 モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ Pending JP2010517064A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007002725A DE102007002725A1 (de) 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente
PCT/EP2008/000321 WO2008087022A1 (de) 2007-01-18 2008-01-17 Gehäuse für in mobilen anwendungen eingesetzte mikromechanische und mikrooptische bauelemente

Publications (2)

Publication Number Publication Date
JP2010517064A true JP2010517064A (ja) 2010-05-20
JP2010517064A5 JP2010517064A5 (https=) 2011-02-10

Family

ID=39471629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009545870A Pending JP2010517064A (ja) 2007-01-18 2008-01-17 モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ

Country Status (7)

Country Link
US (1) US8201452B2 (https=)
EP (1) EP2102096B1 (https=)
JP (1) JP2010517064A (https=)
KR (1) KR20090105933A (https=)
CA (1) CA2675501A1 (https=)
DE (1) DE102007002725A1 (https=)
WO (1) WO2008087022A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR101876048B1 (ko) * 2015-09-01 2018-07-06 아즈빌주식회사 미세 기계 장치
JP2019060940A (ja) * 2017-09-25 2019-04-18 スタンレー電気株式会社 電子部品

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DE102007002725A1 (de) 2007-01-18 2008-07-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente
DE102009045541B4 (de) 2009-10-09 2019-03-14 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung
WO2011118786A1 (ja) * 2010-03-26 2011-09-29 パナソニック電工株式会社 ガラス埋込シリコン基板の製造方法
CN102261979B (zh) * 2010-05-26 2013-03-27 苏州敏芯微电子技术有限公司 用于真空测量的低量程压阻式压力传感器的制造方法
JP2014534462A (ja) 2011-10-07 2014-12-18 シンガポール国立大学Ｎａｔｉｏｎａｌ Ｕｎｉｖｅｒｓｉｔｙ Ｏｆ Ｓｉｎｇａｐｏｒｅ Ｍｅｍｓ型ズームレンズシステム
US9512029B2 (en) 2012-05-31 2016-12-06 Corning Incorporated Cover glass article
EP2859302B1 (en) * 2012-06-06 2020-07-01 Northrop Grumman Systems Corporation Optical accelerometer system
EP2883242A1 (de) 2012-08-10 2015-06-17 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum herstellen eines hermetisch abgeschlossenen gehäuses
US9726862B2 (en) 2012-11-08 2017-08-08 DynaOptics LTD, A Public Limited CO. Lens assemblies and actuators for optical systems and methods therefor
ITTO20130225A1 (it) 2013-03-21 2014-09-22 St Microelectronics Srl Struttura sensibile microelettromeccanica per un trasduttore acustico capacitivo includente un elemento di limitazione delle oscillazioni di una membrana, e relativo processo di fabbricazione
ITTO20130540A1 (it) 2013-06-28 2014-12-29 St Microelectronics Srl Dispositivo mems dotato di membrana sospesa e relativo procedimento di fabbricazione
DE102014202220B3 (de) 2013-12-03 2015-05-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Deckelsubstrats und gehäustes strahlungsemittierendes Bauelement
US9394161B2 (en) * 2014-11-14 2016-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS and CMOS integration with low-temperature bonding
CN105776121A (zh) * 2014-12-22 2016-07-20 立锜科技股份有限公司 微机电系统芯片
JP2017053742A (ja) * 2015-09-10 2017-03-16 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、および移動体
US9695039B1 (en) 2016-03-24 2017-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-pressure MEMS package
TWI638419B (zh) * 2016-04-18 2018-10-11 村田製作所股份有限公司 一種掃描鏡設備與其製造方法
CN108249381B (zh) * 2016-12-29 2020-03-17 财团法人工业技术研究院 具冲击吸收器的微机电装置
JP6825612B2 (ja) * 2017-11-13 2021-02-03 株式会社村田製作所 中央支持部を備えたｍｅｍｓ反射器
DE102018200371A1 (de) * 2018-01-11 2019-07-11 Robert Bosch Gmbh Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren
US10830787B2 (en) * 2018-02-20 2020-11-10 General Electric Company Optical accelerometers for use in navigation grade environments
US11220423B2 (en) * 2018-11-01 2022-01-11 Invensense, Inc. Reduced MEMS cavity gap
DE102018219524A1 (de) 2018-11-15 2020-05-20 Robert Bosch Gmbh Verfahren zur Herstellung eines mikroelektromechanischen Sensors und mikroelektromechanischer Sensor
EP3705451B1 (en) 2019-03-06 2026-04-29 Murata Manufacturing Co., Ltd. Mems structure including a cap with a via
US11079230B2 (en) 2019-05-10 2021-08-03 Northrop Grumman Systems Corporation Fiber-optic gyroscope (FOG) assembly
DE102019207073B4 (de) 2019-05-15 2021-02-18 OQmented GmbH Bilderzeugungseinrichtung für ein scannendes Projektionsverfahren mit Bessel-ähnlichen Strahlen
DE102019208373A1 (de) * 2019-06-07 2020-12-10 Infineon Technologies Ag Herstellen eines MEMS-Bauelements mit Glasabdeckung und MEMS-Bauelement
IT201900025042A1 (it) * 2019-12-20 2021-06-20 St Microelectronics Srl Procedimento di fabbricazione di un dispositivo microelettromeccanico di tipo ottico dotato di una struttura orientabile e una superficie antiriflettente
DE102024202157A1 (de) 2024-03-07 2025-09-11 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines MEMS-Arrays

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JPH0540815U (ja) * 1991-11-01 1993-06-01 レーザーテクノ株式会社 レ−ザ−式墨出し装置
JPH07175005A (ja) * 1993-12-20 1995-07-14 Nippon Signal Co Ltd:The プレーナー型ガルバノミラー及びその製造方法
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JPH0540815U (ja) * 1991-11-01 1993-06-01 レーザーテクノ株式会社 レ−ザ−式墨出し装置
JPH07175005A (ja) * 1993-12-20 1995-07-14 Nippon Signal Co Ltd:The プレーナー型ガルバノミラー及びその製造方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101876048B1 (ko) * 2015-09-01 2018-07-06 아즈빌주식회사 미세 기계 장치
JP2019060940A (ja) * 2017-09-25 2019-04-18 スタンレー電気株式会社 電子部品
JP6990547B2 (ja) 2017-09-25 2022-01-12 スタンレー電気株式会社 電子部品

Also Published As

Publication number Publication date
WO2008087022A1 (de) 2008-07-24
US8201452B2 (en) 2012-06-19
US20100061073A1 (en) 2010-03-11
WO2008087022A8 (de) 2009-08-13
EP2102096A1 (de) 2009-09-23
CA2675501A1 (en) 2008-07-24
KR20090105933A (ko) 2009-10-07
DE102007002725A1 (de) 2008-07-31
EP2102096B1 (de) 2016-08-24

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