JP2010517064A5 - - Google Patents

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Publication number
JP2010517064A5
JP2010517064A5 JP2009545870A JP2009545870A JP2010517064A5 JP 2010517064 A5 JP2010517064 A5 JP 2010517064A5 JP 2009545870 A JP2009545870 A JP 2009545870A JP 2009545870 A JP2009545870 A JP 2009545870A JP 2010517064 A5 JP2010517064 A5 JP 2010517064A5
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JP
Japan
Prior art keywords
package
optical
micromachining
cover substrate
substrate
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Pending
Application number
JP2009545870A
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English (en)
Japanese (ja)
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JP2010517064A (ja
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Priority claimed from DE102007002725A external-priority patent/DE102007002725A1/de
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Publication of JP2010517064A publication Critical patent/JP2010517064A/ja
Publication of JP2010517064A5 publication Critical patent/JP2010517064A5/ja
Pending legal-status Critical Current

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JP2009545870A 2007-01-18 2008-01-17 モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ Pending JP2010517064A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007002725A DE102007002725A1 (de) 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente
PCT/EP2008/000321 WO2008087022A1 (de) 2007-01-18 2008-01-17 Gehäuse für in mobilen anwendungen eingesetzte mikromechanische und mikrooptische bauelemente

Publications (2)

Publication Number Publication Date
JP2010517064A JP2010517064A (ja) 2010-05-20
JP2010517064A5 true JP2010517064A5 (https=) 2011-02-10

Family

ID=39471629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009545870A Pending JP2010517064A (ja) 2007-01-18 2008-01-17 モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ

Country Status (7)

Country Link
US (1) US8201452B2 (https=)
EP (1) EP2102096B1 (https=)
JP (1) JP2010517064A (https=)
KR (1) KR20090105933A (https=)
CA (1) CA2675501A1 (https=)
DE (1) DE102007002725A1 (https=)
WO (1) WO2008087022A1 (https=)

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CN108249381B (zh) * 2016-12-29 2020-03-17 财团法人工业技术研究院 具冲击吸收器的微机电装置
JP6990547B2 (ja) * 2017-09-25 2022-01-12 スタンレー電気株式会社 電子部品
JP6825612B2 (ja) * 2017-11-13 2021-02-03 株式会社村田製作所 中央支持部を備えたｍｅｍｓ反射器
DE102018200371A1 (de) * 2018-01-11 2019-07-11 Robert Bosch Gmbh Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren
US10830787B2 (en) * 2018-02-20 2020-11-10 General Electric Company Optical accelerometers for use in navigation grade environments
US11220423B2 (en) * 2018-11-01 2022-01-11 Invensense, Inc. Reduced MEMS cavity gap
DE102018219524A1 (de) 2018-11-15 2020-05-20 Robert Bosch Gmbh Verfahren zur Herstellung eines mikroelektromechanischen Sensors und mikroelektromechanischer Sensor
EP3705451B1 (en) 2019-03-06 2026-04-29 Murata Manufacturing Co., Ltd. Mems structure including a cap with a via
US11079230B2 (en) 2019-05-10 2021-08-03 Northrop Grumman Systems Corporation Fiber-optic gyroscope (FOG) assembly
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