DE102007002725A1 - Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente - Google Patents

Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente Download PDF

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Publication number
DE102007002725A1
DE102007002725A1 DE102007002725A DE102007002725A DE102007002725A1 DE 102007002725 A1 DE102007002725 A1 DE 102007002725A1 DE 102007002725 A DE102007002725 A DE 102007002725A DE 102007002725 A DE102007002725 A DE 102007002725A DE 102007002725 A1 DE102007002725 A1 DE 102007002725A1
Authority
DE
Germany
Prior art keywords
substrate
housing according
wafer
micromechanical
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102007002725A
Other languages
German (de)
English (en)
Inventor
Marten Dipl.-Ing. Oldsen
Ulrich Dipl.-Phys. Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority to DE102007002725A priority Critical patent/DE102007002725A1/de
Priority to CA002675501A priority patent/CA2675501A1/en
Priority to PCT/EP2008/000321 priority patent/WO2008087022A1/de
Priority to EP08707087.6A priority patent/EP2102096B1/de
Priority to US12/448,911 priority patent/US8201452B2/en
Priority to JP2009545870A priority patent/JP2010517064A/ja
Priority to KR1020097015082A priority patent/KR20090105933A/ko
Publication of DE102007002725A1 publication Critical patent/DE102007002725A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
DE102007002725A 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente Ceased DE102007002725A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102007002725A DE102007002725A1 (de) 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente
CA002675501A CA2675501A1 (en) 2007-01-18 2008-01-17 Housing for micromechanical and micro-optic components used in mobile applications
PCT/EP2008/000321 WO2008087022A1 (de) 2007-01-18 2008-01-17 Gehäuse für in mobilen anwendungen eingesetzte mikromechanische und mikrooptische bauelemente
EP08707087.6A EP2102096B1 (de) 2007-01-18 2008-01-17 Gehäuse für in mobilen anwendungen eingesetzte mikromechanische und mikrooptische bauelemente
US12/448,911 US8201452B2 (en) 2007-01-18 2008-01-17 Housing for micro-mechanical and micro-optical components used in mobile applications
JP2009545870A JP2010517064A (ja) 2007-01-18 2008-01-17 モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ
KR1020097015082A KR20090105933A (ko) 2007-01-18 2008-01-17 모바일 어플리케이션에 사용되는 마이크로 메카니칼 및 마이크로 광학 부품용 하우징

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007002725A DE102007002725A1 (de) 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente

Publications (1)

Publication Number Publication Date
DE102007002725A1 true DE102007002725A1 (de) 2008-07-31

Family

ID=39471629

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007002725A Ceased DE102007002725A1 (de) 2007-01-18 2007-01-18 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente

Country Status (7)

Country Link
US (1) US8201452B2 (https=)
EP (1) EP2102096B1 (https=)
JP (1) JP2010517064A (https=)
KR (1) KR20090105933A (https=)
CA (1) CA2675501A1 (https=)
DE (1) DE102007002725A1 (https=)
WO (1) WO2008087022A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8201452B2 (en) 2007-01-18 2012-06-19 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Housing for micro-mechanical and micro-optical components used in mobile applications
WO2014023320A1 (de) 2012-08-10 2014-02-13 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum herstellen eines hermetisch abgeschlossenen gehäuses
DE102009045541B4 (de) 2009-10-09 2019-03-14 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung
DE102018219380A1 (de) * 2017-11-13 2019-05-16 Murata Manufacturing Co., Ltd. MEMS-Reflektor mit Mittelhalterung
DE102018219524A1 (de) * 2018-11-15 2020-05-20 Robert Bosch Gmbh Verfahren zur Herstellung eines mikroelektromechanischen Sensors und mikroelektromechanischer Sensor
DE102024202157A1 (de) 2024-03-07 2025-09-11 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines MEMS-Arrays

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WO2011118786A1 (ja) * 2010-03-26 2011-09-29 パナソニック電工株式会社 ガラス埋込シリコン基板の製造方法
CN102261979B (zh) * 2010-05-26 2013-03-27 苏州敏芯微电子技术有限公司 用于真空测量的低量程压阻式压力传感器的制造方法
JP2014534462A (ja) 2011-10-07 2014-12-18 シンガポール国立大学Ｎａｔｉｏｎａｌ Ｕｎｉｖｅｒｓｉｔｙ Ｏｆ Ｓｉｎｇａｐｏｒｅ Ｍｅｍｓ型ズームレンズシステム
US9512029B2 (en) 2012-05-31 2016-12-06 Corning Incorporated Cover glass article
EP2859302B1 (en) * 2012-06-06 2020-07-01 Northrop Grumman Systems Corporation Optical accelerometer system
US9726862B2 (en) 2012-11-08 2017-08-08 DynaOptics LTD, A Public Limited CO. Lens assemblies and actuators for optical systems and methods therefor
ITTO20130225A1 (it) 2013-03-21 2014-09-22 St Microelectronics Srl Struttura sensibile microelettromeccanica per un trasduttore acustico capacitivo includente un elemento di limitazione delle oscillazioni di una membrana, e relativo processo di fabbricazione
ITTO20130540A1 (it) 2013-06-28 2014-12-29 St Microelectronics Srl Dispositivo mems dotato di membrana sospesa e relativo procedimento di fabbricazione
DE102014202220B3 (de) 2013-12-03 2015-05-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Deckelsubstrats und gehäustes strahlungsemittierendes Bauelement
US9394161B2 (en) * 2014-11-14 2016-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS and CMOS integration with low-temperature bonding
CN105776121A (zh) * 2014-12-22 2016-07-20 立锜科技股份有限公司 微机电系统芯片
JP6511368B2 (ja) * 2015-09-01 2019-05-15 アズビル株式会社 微細機械装置
JP2017053742A (ja) * 2015-09-10 2017-03-16 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、および移動体
US9695039B1 (en) 2016-03-24 2017-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-pressure MEMS package
TWI638419B (zh) * 2016-04-18 2018-10-11 村田製作所股份有限公司 一種掃描鏡設備與其製造方法
CN108249381B (zh) * 2016-12-29 2020-03-17 财团法人工业技术研究院 具冲击吸收器的微机电装置
JP6990547B2 (ja) * 2017-09-25 2022-01-12 スタンレー電気株式会社 電子部品
DE102018200371A1 (de) * 2018-01-11 2019-07-11 Robert Bosch Gmbh Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren
US10830787B2 (en) * 2018-02-20 2020-11-10 General Electric Company Optical accelerometers for use in navigation grade environments
US11220423B2 (en) * 2018-11-01 2022-01-11 Invensense, Inc. Reduced MEMS cavity gap
EP3705451B1 (en) 2019-03-06 2026-04-29 Murata Manufacturing Co., Ltd. Mems structure including a cap with a via
US11079230B2 (en) 2019-05-10 2021-08-03 Northrop Grumman Systems Corporation Fiber-optic gyroscope (FOG) assembly
DE102019207073B4 (de) 2019-05-15 2021-02-18 OQmented GmbH Bilderzeugungseinrichtung für ein scannendes Projektionsverfahren mit Bessel-ähnlichen Strahlen
DE102019208373A1 (de) * 2019-06-07 2020-12-10 Infineon Technologies Ag Herstellen eines MEMS-Bauelements mit Glasabdeckung und MEMS-Bauelement
IT201900025042A1 (it) * 2019-12-20 2021-06-20 St Microelectronics Srl Procedimento di fabbricazione di un dispositivo microelettromeccanico di tipo ottico dotato di una struttura orientabile e una superficie antiriflettente

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US6146917A (en) 1997-03-03 2000-11-14 Ford Motor Company Fabrication method for encapsulated micromachined structures
US6743656B2 (en) 1999-10-04 2004-06-01 Texas Instruments Incorporated MEMS wafer level package
WO2004068665A2 (en) 2003-01-24 2004-08-12 The Board Of Trustees Of The University Of Arkansas Research And Sponsored Programs Wafer scale packaging technique for sealed optical elements and sealed packages produced thereby
US20050184304A1 (en) 2004-02-25 2005-08-25 Gupta Pavan O. Large cavity wafer-level package for MEMS
US6958846B2 (en) * 2002-11-26 2005-10-25 Reflectivity, Inc Spatial light modulators with light absorbing areas

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Publication number Priority date Publication date Assignee Title
US5591679A (en) 1995-04-12 1997-01-07 Sensonor A/S Sealed cavity arrangement method
US6146917A (en) 1997-03-03 2000-11-14 Ford Motor Company Fabrication method for encapsulated micromachined structures
US6743656B2 (en) 1999-10-04 2004-06-01 Texas Instruments Incorporated MEMS wafer level package
US6958846B2 (en) * 2002-11-26 2005-10-25 Reflectivity, Inc Spatial light modulators with light absorbing areas
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8201452B2 (en) 2007-01-18 2012-06-19 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Housing for micro-mechanical and micro-optical components used in mobile applications
DE102009045541B4 (de) 2009-10-09 2019-03-14 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung
WO2014023320A1 (de) 2012-08-10 2014-02-13 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum herstellen eines hermetisch abgeschlossenen gehäuses
DE102018219380A1 (de) * 2017-11-13 2019-05-16 Murata Manufacturing Co., Ltd. MEMS-Reflektor mit Mittelhalterung
DE102018219380B4 (de) * 2017-11-13 2019-11-21 Murata Manufacturing Co., Ltd. MEMS-Reflektor mit Mittelhalterung
US10969575B2 (en) 2017-11-13 2021-04-06 Murata Manufacturing Co., Ltd. MEMS reflector with center support
DE102018219524A1 (de) * 2018-11-15 2020-05-20 Robert Bosch Gmbh Verfahren zur Herstellung eines mikroelektromechanischen Sensors und mikroelektromechanischer Sensor
US11958740B2 (en) 2018-11-15 2024-04-16 Robert Bosch Gmbh Method for producing a microelectromechanical sensor and microelectromechanical sensor
DE102024202157A1 (de) 2024-03-07 2025-09-11 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines MEMS-Arrays

Also Published As

Publication number Publication date
WO2008087022A1 (de) 2008-07-24
US8201452B2 (en) 2012-06-19
US20100061073A1 (en) 2010-03-11
WO2008087022A8 (de) 2009-08-13
EP2102096A1 (de) 2009-09-23
CA2675501A1 (en) 2008-07-24
KR20090105933A (ko) 2009-10-07
JP2010517064A (ja) 2010-05-20
EP2102096B1 (de) 2016-08-24

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