KR20090093672A - Printed circuit board assembly - Google Patents

Abstract

A printed circuit board assembly is provided to improve adhesive force between a protective layer and an insulating member by including the same resin elements in the protective layer and the insulating member. A printed circuit board assembly includes an insulating member(110), a connection terminal(120), an electronic element(130), and a connection member(140). The electric component is mounted on one side of the insulating member. The insulating member has a penetration hole(111). The connection member passes through the penetration hole of the insulating member. The connection member electrically connects the connection terminal and the electronic component. The connection terminal is buried in the other side of the insulating member to reduce the length of the connection member. The connection terminal includes a conductive layer and an oxidation preventing layer. The conductive layer is reclaimed in the insulating member. The oxidation preventing layer is formed on the conductive layer in order to prevent the oxidation of the conductive layer.

Description

Printed Circuit Board Assembly {PRINTED CIRCUIT BOARD ASSEMBLY}

The present invention relates to a printed circuit board assembly that can reduce the length of the connecting member for connecting the printed circuit board and the electronic device.

Printed Circuit Boards (PCBs) are components that are wired and integrated so that various devices can be mounted or electrical connections between them.

Electronic devices (for example, electronic chips) are mounted on a printed circuit board to form a printed circuit board assembly. As the technology develops, printed circuit board assemblies having various shapes and various functions are manufactured. RAM, motherboard, LAN card and the like.

Due to the rapid development of information and communication, electronic devices such as portable terminals and notebook computers are required to be miniaturized, light weighted, and high speeded. In order to realize such demands, miniaturization and high integration of electronic components mounted thereon are required.

Accordingly, in the field of electronic chip manufacturing, researches for miniaturizing and integrating the electronic chip itself are being conducted. In the field of manufacturing printed circuit boards, slimming and new mounting methods of printed circuit boards are made to reduce the thickness of printed circuit board assemblies more thinly. Research is ongoing. At the same time, as the price competition of electronic devices is fierce, there is a need for a method for reducing the manufacturing cost of a printed circuit board assembly.

The present invention relates to a printed circuit board assembly that can reduce the manufacturing cost by reducing the length of the connecting member connecting the electronic device and the printed circuit board and at the same time increase the degree of freedom of design of the printed circuit board.

In order to achieve the above object, the present invention provides an insulating member having a connection terminal made of a conductive material on one surface thereof, an electronic device mounted on the other surface of the insulating member, and the insulating member penetrating through the connection terminal and the electronic device. And a connection member electrically connecting the connection terminal, wherein the connection terminal is embedded in the insulating member so as to reduce the length of the connection member.

The connection terminal may be embedded in the insulating member so that at least one surface thereof is exposed to the outside so as to be connected to the connection member.

The insulating member may have a through hole facing the electronic device, and the connection member may include a wire made of a conductive material penetrating the through hole.

The connection terminal may include a conductive layer embedded in the insulating member and an oxidation prevention layer formed on an outer surface of the conductive layer and preventing oxidation of the conductive layer.

The insulating member may further include an external connection terminal for electrically connecting the printed circuit board assembly to an external substrate.

The display device may further include a protective layer covering the connection terminal and the electronic device to protect the connection terminal and the electronic device from the outside.

The protective layer and the insulating member may be configured to include a common resin-based component.

The present invention can reduce the length of the connection member and increase the degree of freedom in the design of the printed circuit board by embedding the connection terminal in the insulating member to save space on the printed circuit board.

In addition, by configuring the protective layer and the insulating member to include a common resin-based component to make the protective layer more firmly bonded to the insulating member, it is possible to improve the reliability of the printed circuit board assembly.

1 is a cross-sectional view of a printed circuit board assembly according to an embodiment of the present invention.

2a to 2c are views showing a processing method for embedding the connection terminal in the insulating member.

3 is an enlarged view of a portion A of FIG. 1.

4 is a diagram illustrating a configuration of a connection terminal in a state where it is not embedded.

5 is a cross-sectional view of a printed circuit board assembly according to another embodiment of the present invention.

Hereinafter, a printed circuit board assembly according to the present invention will be described in more detail with reference to the accompanying drawings. The components shown in the drawings described below are exaggerated for clarity.

1 is a cross-sectional view of a printed circuit board assembly 100 according to an embodiment of the present invention.

The printed circuit board assembly 100 according to the present invention includes an insulating member 110, a connection terminal 120 and an electronic device 130 disposed on one surface and the other surface of the insulating member 110, respectively.

The insulating member 110 forms an appearance of the printed circuit board assembly 100 and functions as a base member that provides durability to the printed circuit board assembly 100. The insulating member 110 may be formed of a material such as epoxy resin or phenol resin containing glass fiber. Circuit patterns constituting the circuit of the printed circuit board assembly 110 may be formed on the insulating member 110.

The electronic device 130 is mounted on one surface of the insulating member 110, and the electronic device 130 includes various types of electronic chips according to design specifications.

The other surface of the insulating member 110 is provided with a connection terminal 120 for electrically connecting the electronic device 130 and the circuit patterns. The connection terminal 120 may be formed of a conductive material and may be connected to a circuit pattern of a conductive material or integrally formed with the circuit pattern.

The electronic device 130 and the connection terminal 120 are electrically connected by the connection member 140, and the connection member 140 is configured to penetrate one region of the insulating member 110. To this end, the through hole 111 for passing the connecting member 140 may be formed in the insulating member 110.

An example of the connection member 140 may include a wire 140 formed of a conductive material, and the wire 140 may be formed of gold (Au), copper (Cu), or the like.

The connection terminal 120 according to the present invention is configured to be embedded in the insulating member 110 to reduce the length of the wire 140 connecting the electronic device 130 and the connection terminal 120. The connection terminal 120 is embedded in the insulating member 110 with at least one surface exposed to the outside so that the wire 140 can be connected. In FIG. 1, a portion corresponding to the entire height of the connection terminal 120 is embedded so that only one surface of the connection terminal 120 is exposed, but a portion corresponding to a part of the height of the connection terminal 120 is embedded. Can be.

Here, since the length of the wire 140 can be reduced by the depth at which the connection terminal 120 is embedded, the manufacturing cost can be reduced.

2A to 2C are diagrams illustrating a processing method of embedding the connection terminal 120 into the insulating member 110.

The connection terminal 120, the external connection terminal 125, and a circuit pattern (not shown) connected thereto may be formed by processing the copper foil laminate shown in FIG. 2A. The copper foil laminate has a structure in which conductive films 120a and 124 made of a conductive material (generally copper) are stacked on both surfaces of the insulating member 110 formed of an epoxy resin material.

As illustrated in FIG. 2B, the connection terminal 120, the external connection terminal 125, and the circuit pattern may be formed by etching the conductive film 120a of any one of the conductive layers 120a and 124. The etching process may be performed by various processes such as dry etching and wet etching.

When the connection terminal 120, the external connection terminal 125 and the circuit pattern are formed, they may be embedded into the insulating member 110 by thermocompression as shown in FIG. 2C.

Place the insulating member 110 in FIG. 2B state on the mold, apply heat to melt the insulating member 120 so as to be deformable, and apply pressure to the connecting terminal 120 and the external connecting terminal 125. . Accordingly, the connection terminal 120 and the external connection terminal 125 is embedded into the insulating member 110, the curing process is completed when the insulating member 110 is cured.

FIG. 3 is an enlarged view of portion A of FIG. 1 and illustrates the structure of the connection terminal 120. 4 is a diagram showing the configuration of the connection terminal 120a in an unembedded state, which is a diagram for comparison with the connection terminal 120 of FIG. 3.

Referring to FIG. 3, the connection terminal 120 may be disposed on the outer surface of the conductive layer 121 and the conductive layer 121, and may include antioxidant layers 122 and 123 for preventing oxidation of the base 121.

The conductive layer 121 is generally formed of a copper (Cu) material, and the anti-oxidation layers 122 and 123 according to the present embodiment may be formed by sequentially plating nickel (Ni) and gold (Au).

4 is a view showing a state in which the conductive layer 121a formed by etching the copper foil of the copper foil laminate is protruded to the outside without undergoing a process of being embedded into the insulating member 110a.

Antioxidation layers 122a and 123a are plated on the outer surface of the conductive layer 121a, and antioxidation layers 122a and 123a are formed along the top and side surfaces of the conductive layer 121a. That is, a space corresponding to the length of D is formed on the side surface of the conductive layer 121a, and a space corresponding to the length of H is formed on the outer surface of the insulating member 110a.

3 and 4, the structure in which the connection terminal 120 is embedded as shown in FIG. 3 can save a space corresponding to the lengths of D and H in FIG. 4. That is, as the space corresponding to D is saved, the space for forming another electronic element, the connection terminal, and the circuit pattern on the insulating member 110 increases. Therefore, the degree of freedom can be improved in the design of the printed circuit board.

In addition, the structure in which the connection terminal 120 is embedded may reduce the length of the wire 140 by saving a space corresponding to H of FIG. 4. In addition, by reducing the thickness of the printed circuit board assembly 100 by a thickness corresponding to H, or in the case of a design condition having the same thickness, by increasing the thickness of the insulating member 110 relatively to the bending deformation of the insulating member 110. Rigidity can be increased.

Referring to FIG. 1, an unprocessed conductive film 124 is stacked on a surface of both surfaces of the insulating member 110 where the connection terminal 120 is not formed, and a conductive film 124 is formed on an outer surface of the conductive film 124. The resist layer 127 may be stacked to prevent the () from being affected by oxidation or externally. An example of the resist layer 127 may include a solder resist layer for preventing oxidation of the conductive film 124.

A protective layer 150 may be further provided on the outer surface of the resist layer 124 to physically and electrically protect the electronic device 130 and the connection terminal 120 from the outside. The protective layer 150 may be formed to cover the electronic device 130 and the connection terminal 120, and may be formed of a resin material such as an epoxy resin.

The protective layer 150 is formed by coating a resin liquid on the upper surface of the electronic device 130, and the resin liquid passes through the through hole 111 to cover the wire 140 and the connection terminal 120.

Meanwhile, the insulating member 110 may further include an external connection terminal 125 for electrically connecting the printed circuit board assembly 100 to an external substrate (for example, a main board), and the external connection terminal 125. Like the connection terminal 120 may be configured to be embedded in the insulating member (110). The external connection terminal 125 may further include a solder ball 126 for soldering with the external substrate.

5 is a cross-sectional view of a printed circuit board assembly 200 according to another embodiment of the present invention.

The printed circuit board assembly 200 according to the present exemplary embodiment has the same configuration as the previous exemplary embodiment except for the configuration in which the conductive layer 124 and the resist layer 127 are removed from the previous exemplary embodiment. Therefore, the description of the same configuration will be replaced with the previous description.

Since the conductive layer 124 is not provided with a circuit pattern and a connection terminal, the conductive layer 124 may be removed to reduce the thickness of the printed circuit board assembly 200. In addition, the protective layer 250 and the insulating member 210 may include a common resin-based component for more firm adhesion of the protective layer 250. For example, when the insulating member 210 includes an epoxy resin-based component, the protective layer 250 may also include an epoxy resin-based component to enhance adhesion between the insulating member 210 and the protective layer 250. Can be.

The printed circuit board assembly described above is not limited to the configuration and method of the embodiments described above, but the embodiments may be configured by selectively combining all or some of the embodiments so that various modifications can be made.

Claims (7)

An insulating member having a connection terminal made of a conductive material on one surface thereof; An electronic device mounted on the other surface of the insulating member; And And a connection member penetrating the insulating member and electrically connecting the connection terminal and the electronic device. And the connection terminal is embedded in the insulating member so as to reduce the length of the connection member. The method of claim 1, And the connection terminal is embedded in the insulating member so that at least one surface thereof is exposed to the outside so as to be connected to the connection member. The method of claim 2, The insulating member has a through hole facing the electronic device, The connection member is a printed circuit board assembly, characterized in that it comprises a wire of conductive material passing through the through hole. The method of claim 2, wherein the connection terminal, A conductive layer embedded in the insulating member; And The printed circuit board assembly is formed on the outer surface of the conductive layer, and comprising an anti-oxidation layer to prevent oxidation of the conductive layer. The method of claim 2, Printed circuit board assembly, characterized in that the insulating member is further provided with an external connection terminal for electrically connecting to the external substrate. The method of claim 2, And a protective layer covering the connection terminal and the electronic device to protect the connection terminal and the electronic device from the outside. The method of claim 6, The protective layer and the insulating member is a printed circuit board assembly comprising a common resin-based component.