KR20090082378A - 광 모듈 패키지 - Google Patents

광 모듈 패키지 Download PDF

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Publication number
KR20090082378A
KR20090082378A KR1020097009098A KR20097009098A KR20090082378A KR 20090082378 A KR20090082378 A KR 20090082378A KR 1020097009098 A KR1020097009098 A KR 1020097009098A KR 20097009098 A KR20097009098 A KR 20097009098A KR 20090082378 A KR20090082378 A KR 20090082378A
Authority
KR
South Korea
Prior art keywords
ceramic layer
light
optical module
module package
optical sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020097009098A
Other languages
English (en)
Korean (ko)
Inventor
베른드 애커만
한스-헬무트 벡텔
아킴 힐거스
마티아스 웬디트
Original Assignee
코닌클리즈케 필립스 일렉트로닉스 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닌클리즈케 필립스 일렉트로닉스 엔.브이. filed Critical 코닌클리즈케 필립스 일렉트로닉스 엔.브이.
Publication of KR20090082378A publication Critical patent/KR20090082378A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/496—Luminescent members, e.g. fluorescent sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/35—Non-linear optics
    • G02F1/355—Non-linear optics characterised by the materials used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
KR1020097009098A 2006-10-05 2007-09-20 광 모듈 패키지 Withdrawn KR20090082378A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06121788.1 2006-10-05
EP06121788 2006-10-05

Publications (1)

Publication Number Publication Date
KR20090082378A true KR20090082378A (ko) 2009-07-30

Family

ID=39148559

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097009098A Withdrawn KR20090082378A (ko) 2006-10-05 2007-09-20 광 모듈 패키지

Country Status (9)

Country Link
US (1) US7947947B2 (enExample)
EP (1) EP2074656A2 (enExample)
JP (1) JP2011502341A (enExample)
KR (1) KR20090082378A (enExample)
CN (1) CN101523599B (enExample)
BR (1) BRPI0718194A2 (enExample)
RU (1) RU2437182C2 (enExample)
TW (1) TW200824160A (enExample)
WO (1) WO2008041150A2 (enExample)

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US9326346B2 (en) 2009-01-13 2016-04-26 Terralux, Inc. Method and device for remote sensing and control of LED lights
US8358085B2 (en) 2009-01-13 2013-01-22 Terralux, Inc. Method and device for remote sensing and control of LED lights
WO2010141235A1 (en) * 2009-06-01 2010-12-09 Nitto Denko Corporation Light-emitting divice comprising a dome-shaped ceramic phosphor
CA2781077A1 (en) * 2009-11-17 2012-06-28 Terralux, Inc. Led power-supply detection and control
US8286886B2 (en) * 2009-12-23 2012-10-16 Hynix Semiconductor Inc. LED package and RFID system including the same
EP2617266A1 (en) 2010-09-16 2013-07-24 Terralux, Inc. Communication with lighting units over a power bus
US9596738B2 (en) 2010-09-16 2017-03-14 Terralux, Inc. Communication with lighting units over a power bus
US9357592B2 (en) * 2010-11-18 2016-05-31 Phoseon Technology, Inc. Light source temperature monitor and control
US8515289B2 (en) * 2011-11-21 2013-08-20 Environmental Light Technologies Corp. Wavelength sensing lighting system and associated methods for national security application
US8896231B2 (en) 2011-12-16 2014-11-25 Terralux, Inc. Systems and methods of applying bleed circuits in LED lamps
US9265119B2 (en) 2013-06-17 2016-02-16 Terralux, Inc. Systems and methods for providing thermal fold-back to LED lights
KR102246296B1 (ko) * 2014-12-19 2021-04-30 삼성디스플레이 주식회사 표시 장치
EP3131077B1 (de) * 2015-08-13 2017-10-18 Siemens Schweiz AG Optische rauchdetektionseinheit für einen rauchmelder mit zwei miteinander optisch gekoppelten leuchtdioden und mit einer damit verbundenen steuereinheit zur ableitung einer alterungsinformation sowie rauchmelder
US10368411B2 (en) * 2016-09-20 2019-07-30 Bolb Inc. Ultraviolet light module having output power control mechanism
KR101989027B1 (ko) * 2018-08-31 2019-06-14 주식회사 아이씨에이치 고유전성 점착 필름
US11412598B2 (en) * 2019-02-11 2022-08-09 Nanogrid Limited Systems and methods for adjusting light output
US11776460B2 (en) 2019-03-29 2023-10-03 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US12142716B2 (en) 2019-03-29 2024-11-12 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11790831B2 (en) 2019-03-29 2023-10-17 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11694601B2 (en) 2019-03-29 2023-07-04 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US12198605B2 (en) 2019-03-29 2025-01-14 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11727857B2 (en) 2019-03-29 2023-08-15 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11695102B2 (en) 2020-06-19 2023-07-04 Creeled, Inc. Active electrical elements with light-emitting diodes
CA3250996A1 (en) 2022-02-07 2023-08-10 Creeled Inc MIXED CLOCK DOMAIN SIGNALING LIGHT EMITTING DIODES
US12014673B2 (en) 2022-02-07 2024-06-18 Creeled, Inc. Light-emitting diodes with mixed clock domain signaling
US12014677B1 (en) 2023-04-10 2024-06-18 Creeled, Inc. Light-emitting diode packages with transformation and shifting of pulse width modulation signals and related methods
US12437707B2 (en) 2023-09-27 2025-10-07 Creeled, Inc. Pseudo-exponential encoding for light-emitting devices and related methods
CN117594586B (zh) * 2023-11-28 2025-07-29 杭州道铭微电子有限公司 一种多芯片dTOF封装结构及封装方法

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KR101370362B1 (ko) * 2005-03-14 2014-03-05 코닌클리케 필립스 엔.브이. 다결정 세라믹 구조 내의 인광체 및 이를 포함하는 발광 요소

Also Published As

Publication number Publication date
BRPI0718194A2 (pt) 2013-11-05
CN101523599B (zh) 2011-04-06
RU2437182C2 (ru) 2011-12-20
WO2008041150A3 (en) 2008-07-03
RU2009116458A (ru) 2010-11-10
US7947947B2 (en) 2011-05-24
WO2008041150A2 (en) 2008-04-10
EP2074656A2 (en) 2009-07-01
TW200824160A (en) 2008-06-01
JP2011502341A (ja) 2011-01-20
CN101523599A (zh) 2009-09-02
US20090278034A1 (en) 2009-11-12

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090430

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid