KR20090057003A - 조정 기구 - Google Patents

조정 기구 Download PDF

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Publication number
KR20090057003A
KR20090057003A KR1020097004500A KR20097004500A KR20090057003A KR 20090057003 A KR20090057003 A KR 20090057003A KR 1020097004500 A KR1020097004500 A KR 1020097004500A KR 20097004500 A KR20097004500 A KR 20097004500A KR 20090057003 A KR20090057003 A KR 20090057003A
Authority
KR
South Korea
Prior art keywords
support structure
compliant
rockable
assembly
attitude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097004500A
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English (en)
Korean (ko)
Inventor
에릭 디 호브스
크리스토퍼 디 매코이
제임스 엠 쥬니어 포터
알랙산더 에이취 슬로컴
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20090057003A publication Critical patent/KR20090057003A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020097004500A 2006-08-04 2007-08-01 조정 기구 Ceased KR20090057003A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US82147106P 2006-08-04 2006-08-04
US60/821,471 2006-08-04
US11/464,593 2006-08-15
US11/464,593 US7368930B2 (en) 2006-08-04 2006-08-15 Adjustment mechanism

Publications (1)

Publication Number Publication Date
KR20090057003A true KR20090057003A (ko) 2009-06-03

Family

ID=39033567

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097004500A Ceased KR20090057003A (ko) 2006-08-04 2007-08-01 조정 기구

Country Status (6)

Country Link
US (2) US7368930B2 (enExample)
EP (1) EP2054731A4 (enExample)
JP (1) JP2009545753A (enExample)
KR (1) KR20090057003A (enExample)
TW (1) TW200815765A (enExample)
WO (1) WO2008019263A2 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
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US7319335B2 (en) * 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4860242B2 (ja) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
JP2007139712A (ja) * 2005-11-22 2007-06-07 Nhk Spring Co Ltd プローブホルダおよびプローブユニット
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7746089B2 (en) * 2006-09-29 2010-06-29 Formfactor, Inc. Method and apparatus for indirect planarization
US7884627B2 (en) * 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
DE102007032557B4 (de) * 2007-07-12 2010-09-16 Multitest Elektronische Systeme Gmbh Vorrichtung zum Testen von elektronischen Bauelementen, insbesondere IC's, mit innerhalb einer Drucktestkammer angeordnetem Abdichtboard
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
US8004296B2 (en) * 2008-08-19 2011-08-23 Centipede Systems, Inc. Probe head apparatus for testing semiconductors
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US8736294B2 (en) * 2010-12-14 2014-05-27 Formfactor, Inc. Probe card stiffener with decoupling
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
WO2012166686A2 (en) 2011-05-27 2012-12-06 Mc10, Inc. Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
TWI474444B (zh) * 2011-12-28 2015-02-21 巨擘科技股份有限公司 超薄多層基板之封裝方法
TWI433621B (zh) * 2011-12-28 2014-04-01 巨擘科技股份有限公司 超薄多層基板之封裝方法
US9364925B2 (en) * 2012-04-30 2016-06-14 Globalfoundries Inc. Assembly of electronic and optical devices
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
KR101780935B1 (ko) * 2016-03-30 2017-09-27 리노공업주식회사 검사소켓유니트
US10190216B1 (en) 2017-07-25 2019-01-29 Lam Research Corporation Showerhead tilt mechanism
TWI765312B (zh) * 2019-11-04 2022-05-21 旺矽科技股份有限公司 邊緣感測器及其點測方法
KR20210103953A (ko) * 2020-02-13 2021-08-24 에이에스엠 아이피 홀딩 비.브이. 가스 분배 어셈블리 및 이를 사용하는 방법
EP4314847A4 (en) * 2021-03-23 2025-03-05 Nielson Scientific, LLC CRYOGENIC PROBE CARD
IT202100020321A1 (it) 2021-07-29 2023-01-29 Spea Spa Macchina automatica per il collaudo di wafer a semiconduttore
CN114985359B (zh) * 2022-08-02 2022-11-08 苏州米洛微纳电子科技有限公司 应用于加速度传感芯片生产的晶圆清洗设备
CN116592221B (zh) * 2023-04-27 2026-02-17 深圳市中图仪器股份有限公司 测量仪器的锁紧装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138575U (ja) * 1984-08-14 1986-03-11 日立電子エンジニアリング株式会社 プロ−ブ位置の調節装置
US4751457A (en) * 1986-09-08 1988-06-14 Tektronix, Inc. Integrated circuit probe parallelism establishing method and apparatus
SG55211A1 (en) * 1995-07-05 1998-12-21 Tokyo Electron Ltd Testing apparatus
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6677771B2 (en) * 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
JP4123408B2 (ja) * 2001-12-13 2008-07-23 東京エレクトロン株式会社 プローブカード交換装置
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
TWI292196B (en) * 2002-09-30 2008-01-01 Via Tech Inc Flip chip test structure
DE10334548A1 (de) * 2003-07-29 2005-03-03 Infineon Technologies Ag Verfahren zum Kontaktieren von zu testenden Schaltungseinheiten und selbstplanarisierende Prüfkarteneinrichtung zur Durchführung des Verfahrens
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
JP4545742B2 (ja) * 2004-04-27 2010-09-15 株式会社日本マイクロニクス 電気的接続装置
US7362611B2 (en) * 2005-08-30 2008-04-22 Micron Technology, Inc. Non-volatile memory copy back
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism

Also Published As

Publication number Publication date
TW200815765A (en) 2008-04-01
WO2008019263A2 (en) 2008-02-14
EP2054731A4 (en) 2012-05-23
EP2054731A2 (en) 2009-05-06
JP2009545753A (ja) 2009-12-24
US20080036480A1 (en) 2008-02-14
US20080203268A1 (en) 2008-08-28
WO2008019263A3 (en) 2008-10-16
US7368930B2 (en) 2008-05-06

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