JP2009545753A - 調整機構 - Google Patents

調整機構 Download PDF

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Publication number
JP2009545753A
JP2009545753A JP2009523032A JP2009523032A JP2009545753A JP 2009545753 A JP2009545753 A JP 2009545753A JP 2009523032 A JP2009523032 A JP 2009523032A JP 2009523032 A JP2009523032 A JP 2009523032A JP 2009545753 A JP2009545753 A JP 2009545753A
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JP
Japan
Prior art keywords
support structure
compliant
assembly
probe card
relative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009523032A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009545753A5 (enExample
Inventor
ホッブス，エリック，ディー．
マッコイ，クリストファー，ディー．
ポーター，ジェームス，エム，ジュニア．
スロカム，アレキサンダー，エイチ．
Original Assignee
フォームファクター， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by フォームファクター， インコーポレイテッド filed Critical フォームファクター， インコーポレイテッド
Publication of JP2009545753A publication Critical patent/JP2009545753A/ja
Publication of JP2009545753A5 publication Critical patent/JP2009545753A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2009523032A 2006-08-04 2007-08-01 調整機構 Pending JP2009545753A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82147106P 2006-08-04 2006-08-04
US11/464,593 US7368930B2 (en) 2006-08-04 2006-08-15 Adjustment mechanism
PCT/US2007/074908 WO2008019263A2 (en) 2006-08-04 2007-08-01 Adjustment mechanism

Publications (2)

Publication Number Publication Date
JP2009545753A true JP2009545753A (ja) 2009-12-24
JP2009545753A5 JP2009545753A5 (enExample) 2010-09-16

Family

ID=39033567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009523032A Pending JP2009545753A (ja) 2006-08-04 2007-08-01 調整機構

Country Status (6)

Country Link
US (2) US7368930B2 (enExample)
EP (1) EP2054731A4 (enExample)
JP (1) JP2009545753A (enExample)
KR (1) KR20090057003A (enExample)
TW (1) TW200815765A (enExample)
WO (1) WO2008019263A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024516083A (ja) * 2021-03-23 2024-04-12 ニールソン サイエンティフィック，エルエルシー 極低温プローブカード

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US7319335B2 (en) * 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4860242B2 (ja) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
JP2007139712A (ja) * 2005-11-22 2007-06-07 Nhk Spring Co Ltd プローブホルダおよびプローブユニット
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7746089B2 (en) * 2006-09-29 2010-06-29 Formfactor, Inc. Method and apparatus for indirect planarization
US7884627B2 (en) * 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
DE102007032557B4 (de) * 2007-07-12 2010-09-16 Multitest Elektronische Systeme Gmbh Vorrichtung zum Testen von elektronischen Bauelementen, insbesondere IC's, mit innerhalb einer Drucktestkammer angeordnetem Abdichtboard
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
US8004296B2 (en) * 2008-08-19 2011-08-23 Centipede Systems, Inc. Probe head apparatus for testing semiconductors
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US8736294B2 (en) * 2010-12-14 2014-05-27 Formfactor, Inc. Probe card stiffener with decoupling
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
WO2012166686A2 (en) 2011-05-27 2012-12-06 Mc10, Inc. Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
TWI474444B (zh) * 2011-12-28 2015-02-21 巨擘科技股份有限公司 超薄多層基板之封裝方法
TWI433621B (zh) * 2011-12-28 2014-04-01 巨擘科技股份有限公司 超薄多層基板之封裝方法
US9364925B2 (en) * 2012-04-30 2016-06-14 Globalfoundries Inc. Assembly of electronic and optical devices
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
KR101780935B1 (ko) * 2016-03-30 2017-09-27 리노공업주식회사 검사소켓유니트
US10190216B1 (en) 2017-07-25 2019-01-29 Lam Research Corporation Showerhead tilt mechanism
TWI765312B (zh) * 2019-11-04 2022-05-21 旺矽科技股份有限公司 邊緣感測器及其點測方法
KR20210103953A (ko) * 2020-02-13 2021-08-24 에이에스엠 아이피 홀딩 비.브이. 가스 분배 어셈블리 및 이를 사용하는 방법
IT202100020321A1 (it) 2021-07-29 2023-01-29 Spea Spa Macchina automatica per il collaudo di wafer a semiconduttore
CN114985359B (zh) * 2022-08-02 2022-11-08 苏州米洛微纳电子科技有限公司 应用于加速度传感芯片生产的晶圆清洗设备
CN116592221B (zh) * 2023-04-27 2026-02-17 深圳市中图仪器股份有限公司 测量仪器的锁紧装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138575U (ja) * 1984-08-14 1986-03-11 日立電子エンジニアリング株式会社 プロ−ブ位置の調節装置

Family Cites Families (18)

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US4751457A (en) * 1986-09-08 1988-06-14 Tektronix, Inc. Integrated circuit probe parallelism establishing method and apparatus
SG55211A1 (en) * 1995-07-05 1998-12-21 Tokyo Electron Ltd Testing apparatus
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6677771B2 (en) * 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
JP4123408B2 (ja) * 2001-12-13 2008-07-23 東京エレクトロン株式会社 プローブカード交換装置
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
TWI292196B (en) * 2002-09-30 2008-01-01 Via Tech Inc Flip chip test structure
DE10334548A1 (de) * 2003-07-29 2005-03-03 Infineon Technologies Ag Verfahren zum Kontaktieren von zu testenden Schaltungseinheiten und selbstplanarisierende Prüfkarteneinrichtung zur Durchführung des Verfahrens
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
JP4545742B2 (ja) * 2004-04-27 2010-09-15 株式会社日本マイクロニクス 電気的接続装置
US7362611B2 (en) * 2005-08-30 2008-04-22 Micron Technology, Inc. Non-volatile memory copy back
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138575U (ja) * 1984-08-14 1986-03-11 日立電子エンジニアリング株式会社 プロ−ブ位置の調節装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024516083A (ja) * 2021-03-23 2024-04-12 ニールソン サイエンティフィック，エルエルシー 極低温プローブカード
JP7743104B2 (ja) 2021-03-23 2025-09-24 ニールソン サイエンティフィック，エルエルシー 極低温プローブカード

Also Published As

Publication number Publication date
TW200815765A (en) 2008-04-01
WO2008019263A2 (en) 2008-02-14
EP2054731A4 (en) 2012-05-23
EP2054731A2 (en) 2009-05-06
KR20090057003A (ko) 2009-06-03
US20080036480A1 (en) 2008-02-14
US20080203268A1 (en) 2008-08-28
WO2008019263A3 (en) 2008-10-16
US7368930B2 (en) 2008-05-06

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