KR20090050082A - 탄소 나노튜브 콘택트 구조체 - Google Patents

탄소 나노튜브 콘택트 구조체 Download PDF

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Publication number
KR20090050082A
KR20090050082A KR1020097005816A KR20097005816A KR20090050082A KR 20090050082 A KR20090050082 A KR 20090050082A KR 1020097005816 A KR1020097005816 A KR 1020097005816A KR 20097005816 A KR20097005816 A KR 20097005816A KR 20090050082 A KR20090050082 A KR 20090050082A
Authority
KR
South Korea
Prior art keywords
contact
contact structure
carbon nanotubes
substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097005816A
Other languages
English (en)
Korean (ko)
Inventor
벤자민 엔 엘드리지
존 케이 그리터스
이고르 케이 칸드로스
로드 마텐스
가에탄 엘 마티우
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20090050082A publication Critical patent/KR20090050082A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/001—Devices without movable or flexible elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/008—Nanostructures not provided for in groups B82B1/001 - B82B1/007
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Contacts (AREA)
KR1020097005816A 2006-08-21 2007-08-21 탄소 나노튜브 콘택트 구조체 Ceased KR20090050082A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/466,039 2006-08-21
US11/466,039 US7731503B2 (en) 2006-08-21 2006-08-21 Carbon nanotube contact structures

Publications (1)

Publication Number Publication Date
KR20090050082A true KR20090050082A (ko) 2009-05-19

Family

ID=39107572

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097005816A Ceased KR20090050082A (ko) 2006-08-21 2007-08-21 탄소 나노튜브 콘택트 구조체

Country Status (8)

Country Link
US (1) US7731503B2 (enExample)
EP (1) EP2059977A2 (enExample)
JP (1) JP5139432B2 (enExample)
KR (1) KR20090050082A (enExample)
CN (1) CN101652901A (enExample)
SG (1) SG177999A1 (enExample)
TW (1) TWI429581B (enExample)
WO (1) WO2008024726A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120082427A (ko) * 2009-09-14 2012-07-23 폼팩터, 인크. 탄소 나노튜브 칼럼 및 프로브로서의 탄소 나노튜브 칼럼 제조방법과 사용방법
KR101467390B1 (ko) * 2013-04-11 2014-12-03 (주)엠프리시젼 접촉 패드의 제조 방법

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US7439731B2 (en) 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US8130007B2 (en) * 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
US8149007B2 (en) 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
KR101097217B1 (ko) * 2008-09-17 2011-12-22 한국기계연구원 카본 나노 튜브가 코팅된 프로브 카드용 미세 접촉 프로브 및 그 제조방법
WO2010037097A1 (en) 2008-09-29 2010-04-01 Wentworth Laboratories, Inc. Probe cards including nanotube probes and methods of fabricating
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
JP5465516B2 (ja) * 2009-12-08 2014-04-09 日本電子材料株式会社 プローブ及びプローブの製造方法
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
CN102073199B (zh) * 2010-12-07 2013-11-06 北京富纳特创新科技有限公司 垫片
JP5827889B2 (ja) * 2011-12-27 2015-12-02 株式会社フジクラ カーボンナノファイバ構造体、カーボンナノファイバ電極及びカーボンナノファイバ構造体の製造方法
DE102012102210A1 (de) * 2012-03-15 2013-09-19 Solibro Gmbh Heizsystem für eine Vakuumabscheidequelle und Vakuumabscheidevorrichtung
TWI539164B (zh) * 2013-11-22 2016-06-21 財團法人工業技術研究院 塗佈探針及其製作方法
US20160106004A1 (en) 2014-10-13 2016-04-14 Ntherma Corporation Carbon nanotubes disposed on metal substrates with one or more cavities
JPWO2018173884A1 (ja) * 2017-03-21 2020-01-30 日本電産リード株式会社 プローブ構造体、及びプローブ構造体の製造方法
KR102148330B1 (ko) * 2018-11-13 2020-08-26 주식회사 아이에스시 전기접속용 커넥터
US20200194341A1 (en) * 2018-12-18 2020-06-18 Tien-Chien Cheng Semiconductor Package and Fabricating Method thereof
TW202217326A (zh) * 2020-06-22 2022-05-01 日商友華股份有限公司 柱塞及柱塞的製造方法

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JP2000516708A (ja) 1996-08-08 2000-12-12 ウィリアム・マーシュ・ライス・ユニバーシティ ナノチューブ組立体から作製された巨視的操作可能なナノ規模の装置
JP3740295B2 (ja) 1997-10-30 2006-02-01 キヤノン株式会社 カーボンナノチューブデバイス、その製造方法及び電子放出素子
US6020747A (en) 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe
US7137830B2 (en) 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
JP4260310B2 (ja) * 1999-10-26 2009-04-30 エスアイアイ・ナノテクノロジー株式会社 微小接触式プローバー
US6709566B2 (en) 2000-07-25 2004-03-23 The Regents Of The University Of California Method for shaping a nanotube and a nanotube shaped thereby
EP1341184B1 (en) 2002-02-09 2005-09-14 Samsung Electronics Co., Ltd. Memory device utilizing carbon nanotubes and method of fabricating the memory device
US20040208788A1 (en) 2003-04-15 2004-10-21 Colton Jonathan S. Polymer micro-cantilevers and their methods of manufacture
US6626684B1 (en) 2002-06-24 2003-09-30 Hewlett-Packard Development Company, L.P. Nanotube socket system and method
TWI220162B (en) 2002-11-29 2004-08-11 Ind Tech Res Inst Integrated compound nano probe card and method of making same
US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
US6933222B2 (en) 2003-01-02 2005-08-23 Intel Corporation Microcircuit fabrication and interconnection
US7082683B2 (en) 2003-04-24 2006-08-01 Korea Institute Of Machinery & Materials Method for attaching rod-shaped nano structure to probe holder
TWI220163B (en) 2003-04-24 2004-08-11 Ind Tech Res Inst Manufacturing method of high-conductivity nanometer thin-film probe card
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JP4723195B2 (ja) * 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
KR20070083499A (ko) 2004-07-21 2007-08-24 에스브이 프로브 피티이 엘티디 반도체 장치 테스트용 보강 프로브
JP4167212B2 (ja) 2004-10-05 2008-10-15 富士通株式会社 カーボンナノチューブ構造体、半導体装置、および半導体パッケージ
JP2006125846A (ja) 2004-10-26 2006-05-18 Olympus Corp カンチレバー
CN100501413C (zh) 2005-01-22 2009-06-17 鸿富锦精密工业（深圳）有限公司 集成电路检测装置及其制备方法
US7439731B2 (en) 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
DE102006039651A1 (de) 2005-08-31 2007-03-22 Hitachi Kenki Finetech Co., Ltd. Cantilever und Prüfvorrichtung
US7625817B2 (en) 2005-12-30 2009-12-01 Intel Corporation Method of fabricating a carbon nanotube interconnect structures
US20070158768A1 (en) 2006-01-06 2007-07-12 Honeywell International, Inc. Electrical contacts formed of carbon nanotubes
KR101159074B1 (ko) 2006-01-14 2012-06-25 삼성전자주식회사 도전성 탄소나노튜브 팁, 이를 구비한 스캐닝 프로브마이크로스코프의 탐침 및 상기 도전성 탄소나노튜브 팁의제조 방법
US20070235713A1 (en) 2006-04-03 2007-10-11 Motorola, Inc. Semiconductor device having carbon nanotube interconnects and method of fabrication
US8130007B2 (en) 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
TWI360182B (en) 2007-10-05 2012-03-11 Ind Tech Res Inst Method for making a conductive film
US8149007B2 (en) 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120082427A (ko) * 2009-09-14 2012-07-23 폼팩터, 인크. 탄소 나노튜브 칼럼 및 프로브로서의 탄소 나노튜브 칼럼 제조방법과 사용방법
KR101467390B1 (ko) * 2013-04-11 2014-12-03 (주)엠프리시젼 접촉 패드의 제조 방법

Also Published As

Publication number Publication date
JP2010515010A (ja) 2010-05-06
US20100112828A1 (en) 2010-05-06
JP5139432B2 (ja) 2013-02-06
US7731503B2 (en) 2010-06-08
EP2059977A2 (en) 2009-05-20
TWI429581B (zh) 2014-03-11
WO2008024726A3 (en) 2008-07-10
CN101652901A (zh) 2010-02-17
SG177999A1 (en) 2012-02-28
TW200831396A (en) 2008-08-01
WO2008024726A2 (en) 2008-02-28

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