CN101652901A - 碳纳米管接触结构 - Google Patents

碳纳米管接触结构 Download PDF

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Publication number
CN101652901A
CN101652901A CN200780031193A CN200780031193A CN101652901A CN 101652901 A CN101652901 A CN 101652901A CN 200780031193 A CN200780031193 A CN 200780031193A CN 200780031193 A CN200780031193 A CN 200780031193A CN 101652901 A CN101652901 A CN 101652901A
Authority
CN
China
Prior art keywords
substrate
tube
carbon nano
contact
contact structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200780031193A
Other languages
English (en)
Chinese (zh)
Inventor
B·N·埃尔德里奇
J·K·格里特斯
I·K·汉德罗斯
R·马滕森
G·L·马蒂厄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN101652901A publication Critical patent/CN101652901A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/001—Devices without movable or flexible elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/008—Nanostructures not provided for in groups B82B1/001 - B82B1/007
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Contacts (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
CN200780031193A 2006-08-21 2007-08-21 碳纳米管接触结构 Pending CN101652901A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/466,039 US7731503B2 (en) 2006-08-21 2006-08-21 Carbon nanotube contact structures
US11/466,039 2006-08-21

Publications (1)

Publication Number Publication Date
CN101652901A true CN101652901A (zh) 2010-02-17

Family

ID=39107572

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780031193A Pending CN101652901A (zh) 2006-08-21 2007-08-21 碳纳米管接触结构

Country Status (8)

Country Link
US (1) US7731503B2 (enExample)
EP (1) EP2059977A2 (enExample)
JP (1) JP5139432B2 (enExample)
KR (1) KR20090050082A (enExample)
CN (1) CN101652901A (enExample)
SG (1) SG177999A1 (enExample)
TW (1) TWI429581B (enExample)
WO (1) WO2008024726A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104302806A (zh) * 2012-03-15 2015-01-21 北京精诚铂阳光电设备有限公司 真空蒸镀源加热系统和真空蒸镀系统
CN110446931A (zh) * 2017-03-21 2019-11-12 日本电产理德股份有限公司 探针构造体以及探针构造体的制造方法
CN113015914A (zh) * 2018-11-13 2021-06-22 株式会社Isc 用于电连接的连接器

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439731B2 (en) 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US8354855B2 (en) * 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US8130007B2 (en) * 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
US8149007B2 (en) 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
KR101097217B1 (ko) * 2008-09-17 2011-12-22 한국기계연구원 카본 나노 튜브가 코팅된 프로브 카드용 미세 접촉 프로브 및 그 제조방법
SG193876A1 (en) 2008-09-29 2013-10-30 Wentworth Lab Inc Probe cards including nanotube probes and methods of fabricating
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
JP5465516B2 (ja) * 2009-12-08 2014-04-09 日本電子材料株式会社 プローブ及びプローブの製造方法
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
CN102073199B (zh) * 2010-12-07 2013-11-06 北京富纳特创新科技有限公司 垫片
JP5827889B2 (ja) * 2011-12-27 2015-12-02 株式会社フジクラ カーボンナノファイバ構造体、カーボンナノファイバ電極及びカーボンナノファイバ構造体の製造方法
KR101467390B1 (ko) * 2013-04-11 2014-12-03 (주)엠프리시젼 접촉 패드의 제조 방법
TWI539164B (zh) 2013-11-22 2016-06-21 財團法人工業技術研究院 塗佈探針及其製作方法
US20160106004A1 (en) 2014-10-13 2016-04-14 Ntherma Corporation Carbon nanotubes disposed on metal substrates with one or more cavities
US11243231B2 (en) * 2018-12-18 2022-02-08 Tien-Chien Cheng Vertical probe card
TW202217326A (zh) * 2020-06-22 2022-05-01 日商友華股份有限公司 柱塞及柱塞的製造方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4055297A (en) * 1996-08-08 1998-02-25 William Marsh Rice University Macroscopically manipulable nanoscale devices made from nanotube assemblies
JP3740295B2 (ja) * 1997-10-30 2006-02-01 キヤノン株式会社 カーボンナノチューブデバイス、その製造方法及び電子放出素子
US6020747A (en) * 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe
US7137830B2 (en) * 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
JP4260310B2 (ja) * 1999-10-26 2009-04-30 エスアイアイ・ナノテクノロジー株式会社 微小接触式プローバー
US6709566B2 (en) * 2000-07-25 2004-03-23 The Regents Of The University Of California Method for shaping a nanotube and a nanotube shaped thereby
DE60301582T2 (de) * 2002-02-09 2006-06-22 Samsung Electronics Co., Ltd., Suwon Speicheranordnung mit Kohlenstoffnanoröhre und Verfahren zur Herstellung der Speicheranordnung
US20040208788A1 (en) * 2003-04-15 2004-10-21 Colton Jonathan S. Polymer micro-cantilevers and their methods of manufacture
US6626684B1 (en) * 2002-06-24 2003-09-30 Hewlett-Packard Development Company, L.P. Nanotube socket system and method
TWI220162B (en) * 2002-11-29 2004-08-11 Ind Tech Res Inst Integrated compound nano probe card and method of making same
US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
US6933222B2 (en) * 2003-01-02 2005-08-23 Intel Corporation Microcircuit fabrication and interconnection
US7082683B2 (en) * 2003-04-24 2006-08-01 Korea Institute Of Machinery & Materials Method for attaching rod-shaped nano structure to probe holder
TWI220163B (en) * 2003-04-24 2004-08-11 Ind Tech Res Inst Manufacturing method of high-conductivity nanometer thin-film probe card
EP1721173B1 (en) * 2004-03-02 2008-05-07 ETH Zürich Force sensor
JP4723195B2 (ja) * 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
EP1831703A1 (en) * 2004-07-21 2007-09-12 SV Probe Pte Ltd. Reinforced probes for testing semiconductor devices
JP4167212B2 (ja) * 2004-10-05 2008-10-15 富士通株式会社 カーボンナノチューブ構造体、半導体装置、および半導体パッケージ
JP2006125846A (ja) * 2004-10-26 2006-05-18 Olympus Corp カンチレバー
CN100501413C (zh) * 2005-01-22 2009-06-17 鸿富锦精密工业（深圳）有限公司 集成电路检测装置及其制备方法
US7439731B2 (en) * 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
DE102006039651A1 (de) * 2005-08-31 2007-03-22 Hitachi Kenki Finetech Co., Ltd. Cantilever und Prüfvorrichtung
US7625817B2 (en) * 2005-12-30 2009-12-01 Intel Corporation Method of fabricating a carbon nanotube interconnect structures
US20070158768A1 (en) * 2006-01-06 2007-07-12 Honeywell International, Inc. Electrical contacts formed of carbon nanotubes
KR101159074B1 (ko) * 2006-01-14 2012-06-25 삼성전자주식회사 도전성 탄소나노튜브 팁, 이를 구비한 스캐닝 프로브마이크로스코프의 탐침 및 상기 도전성 탄소나노튜브 팁의제조 방법
US20070235713A1 (en) * 2006-04-03 2007-10-11 Motorola, Inc. Semiconductor device having carbon nanotube interconnects and method of fabrication
US8130007B2 (en) * 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
TWI360182B (en) * 2007-10-05 2012-03-11 Ind Tech Res Inst Method for making a conductive film
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104302806A (zh) * 2012-03-15 2015-01-21 北京精诚铂阳光电设备有限公司 真空蒸镀源加热系统和真空蒸镀系统
CN104302806B (zh) * 2012-03-15 2016-04-27 北京铂阳顶荣光伏科技有限公司 真空蒸镀源加热系统和真空蒸镀系统
CN110446931A (zh) * 2017-03-21 2019-11-12 日本电产理德股份有限公司 探针构造体以及探针构造体的制造方法
CN113015914A (zh) * 2018-11-13 2021-06-22 株式会社Isc 用于电连接的连接器

Also Published As

Publication number Publication date
US7731503B2 (en) 2010-06-08
JP2010515010A (ja) 2010-05-06
US20100112828A1 (en) 2010-05-06
TWI429581B (zh) 2014-03-11
SG177999A1 (en) 2012-02-28
KR20090050082A (ko) 2009-05-19
JP5139432B2 (ja) 2013-02-06
EP2059977A2 (en) 2009-05-20
TW200831396A (en) 2008-08-01
WO2008024726A3 (en) 2008-07-10
WO2008024726A2 (en) 2008-02-28

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20100217