JP5139432B2 - カーボンナノチューブ・コンタクト構造 - Google Patents

カーボンナノチューブ・コンタクト構造 Download PDF

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Publication number
JP5139432B2
JP5139432B2 JP2009525721A JP2009525721A JP5139432B2 JP 5139432 B2 JP5139432 B2 JP 5139432B2 JP 2009525721 A JP2009525721 A JP 2009525721A JP 2009525721 A JP2009525721 A JP 2009525721A JP 5139432 B2 JP5139432 B2 JP 5139432B2
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JP
Japan
Prior art keywords
base
contact
carbon nanotube
substrate
nanotube film
Prior art date
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Expired - Fee Related
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JP2009525721A
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English (en)
Japanese (ja)
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JP2010515010A5 (enExample
JP2010515010A (ja
Inventor
エルドリッジ，ベンジャミン，エヌ．
ケイ． グリッターズ，ジョン
ハンドロス，イゴール，ケイ．
マーテンズ，ロッド
マシュー，ガエタン，エル．
Original Assignee
フォームファクター， インコーポレイテッド
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Publication date
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Publication of JP2010515010A publication Critical patent/JP2010515010A/ja
Publication of JP2010515010A5 publication Critical patent/JP2010515010A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/001—Devices without movable or flexible elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/008—Nanostructures not provided for in groups B82B1/001 - B82B1/007
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Contacts (AREA)
JP2009525721A 2006-08-21 2007-08-21 カーボンナノチューブ・コンタクト構造 Expired - Fee Related JP5139432B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/466,039 US7731503B2 (en) 2006-08-21 2006-08-21 Carbon nanotube contact structures
US11/466,039 2006-08-21
PCT/US2007/076345 WO2008024726A2 (en) 2006-08-21 2007-08-21 Carbon nanotube contact structures

Publications (3)

Publication Number Publication Date
JP2010515010A JP2010515010A (ja) 2010-05-06
JP2010515010A5 JP2010515010A5 (enExample) 2010-10-07
JP5139432B2 true JP5139432B2 (ja) 2013-02-06

Family

ID=39107572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009525721A Expired - Fee Related JP5139432B2 (ja) 2006-08-21 2007-08-21 カーボンナノチューブ・コンタクト構造

Country Status (8)

Country Link
US (1) US7731503B2 (enExample)
EP (1) EP2059977A2 (enExample)
JP (1) JP5139432B2 (enExample)
KR (1) KR20090050082A (enExample)
CN (1) CN101652901A (enExample)
SG (1) SG177999A1 (enExample)
TW (1) TWI429581B (enExample)
WO (1) WO2008024726A2 (enExample)

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WO2007002297A2 (en) 2005-06-24 2007-01-04 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US8130007B2 (en) * 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
US8354855B2 (en) * 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US8149007B2 (en) 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
KR101097217B1 (ko) * 2008-09-17 2011-12-22 한국기계연구원 카본 나노 튜브가 코팅된 프로브 카드용 미세 접촉 프로브 및 그 제조방법
SG193876A1 (en) 2008-09-29 2013-10-30 Wentworth Lab Inc Probe cards including nanotube probes and methods of fabricating
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
JP5465516B2 (ja) * 2009-12-08 2014-04-09 日本電子材料株式会社 プローブ及びプローブの製造方法
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
CN102073199B (zh) * 2010-12-07 2013-11-06 北京富纳特创新科技有限公司 垫片
JP5827889B2 (ja) * 2011-12-27 2015-12-02 株式会社フジクラ カーボンナノファイバ構造体、カーボンナノファイバ電極及びカーボンナノファイバ構造体の製造方法
DE102012102210A1 (de) * 2012-03-15 2013-09-19 Solibro Gmbh Heizsystem für eine Vakuumabscheidequelle und Vakuumabscheidevorrichtung
KR101467390B1 (ko) * 2013-04-11 2014-12-03 (주)엠프리시젼 접촉 패드의 제조 방법
TWI539164B (zh) * 2013-11-22 2016-06-21 財團法人工業技術研究院 塗佈探針及其製作方法
US20160106004A1 (en) 2014-10-13 2016-04-14 Ntherma Corporation Carbon nanotubes disposed on metal substrates with one or more cavities
JPWO2018173884A1 (ja) * 2017-03-21 2020-01-30 日本電産リード株式会社 プローブ構造体、及びプローブ構造体の製造方法
KR102148330B1 (ko) * 2018-11-13 2020-08-26 주식회사 아이에스시 전기접속용 커넥터
US11243231B2 (en) * 2018-12-18 2022-02-08 Tien-Chien Cheng Vertical probe card
US20230221349A1 (en) * 2020-06-22 2023-07-13 Yokowo Co., Ltd. Plunger and method of manufacturing plunger

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EP0927331B1 (en) * 1996-08-08 2004-03-31 William Marsh Rice University Macroscopically manipulable nanoscale devices made from nanotube assemblies
JP3740295B2 (ja) * 1997-10-30 2006-02-01 キヤノン株式会社 カーボンナノチューブデバイス、その製造方法及び電子放出素子
US6020747A (en) * 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe
US7126220B2 (en) * 2002-03-18 2006-10-24 Nanonexus, Inc. Miniaturized contact spring
JP4260310B2 (ja) * 1999-10-26 2009-04-30 エスアイアイ・ナノテクノロジー株式会社 微小接触式プローバー
US6709566B2 (en) * 2000-07-25 2004-03-23 The Regents Of The University Of California Method for shaping a nanotube and a nanotube shaped thereby
JP5165828B2 (ja) * 2002-02-09 2013-03-21 三星電子株式会社 炭素ナノチューブを用いるメモリ素子及びその製造方法
US20040208788A1 (en) * 2003-04-15 2004-10-21 Colton Jonathan S. Polymer micro-cantilevers and their methods of manufacture
US6626684B1 (en) * 2002-06-24 2003-09-30 Hewlett-Packard Development Company, L.P. Nanotube socket system and method
TWI220162B (en) * 2002-11-29 2004-08-11 Ind Tech Res Inst Integrated compound nano probe card and method of making same
US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
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US7404338B2 (en) * 2004-03-02 2008-07-29 Eth Zurich Force sensor
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JP4167212B2 (ja) * 2004-10-05 2008-10-15 富士通株式会社 カーボンナノチューブ構造体、半導体装置、および半導体パッケージ
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CN100501413C (zh) * 2005-01-22 2009-06-17 鸿富锦精密工业（深圳）有限公司 集成电路检测装置及其制备方法
WO2007002297A2 (en) * 2005-06-24 2007-01-04 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
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US7625817B2 (en) * 2005-12-30 2009-12-01 Intel Corporation Method of fabricating a carbon nanotube interconnect structures
US20070158768A1 (en) * 2006-01-06 2007-07-12 Honeywell International, Inc. Electrical contacts formed of carbon nanotubes
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US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components

Also Published As

Publication number Publication date
TWI429581B (zh) 2014-03-11
CN101652901A (zh) 2010-02-17
WO2008024726A2 (en) 2008-02-28
US7731503B2 (en) 2010-06-08
EP2059977A2 (en) 2009-05-20
KR20090050082A (ko) 2009-05-19
SG177999A1 (en) 2012-02-28
TW200831396A (en) 2008-08-01
WO2008024726A3 (en) 2008-07-10
US20100112828A1 (en) 2010-05-06
JP2010515010A (ja) 2010-05-06

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