KR20090039784A - 고순도 물질을 처리하기 위한 시스템 및 방법 - Google Patents

고순도 물질을 처리하기 위한 시스템 및 방법 Download PDF

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Publication number
KR20090039784A
KR20090039784A KR1020097003109A KR20097003109A KR20090039784A KR 20090039784 A KR20090039784 A KR 20090039784A KR 1020097003109 A KR1020097003109 A KR 1020097003109A KR 20097003109 A KR20097003109 A KR 20097003109A KR 20090039784 A KR20090039784 A KR 20090039784A
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KR
South Korea
Prior art keywords
unit
unit operation
flow
pressurized gas
operation unit
Prior art date
Application number
KR1020097003109A
Other languages
English (en)
Korean (ko)
Inventor
데이비드 칸디옐리
토드 그레이브스
레이 양
Original Assignee
셀레리티 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 셀레리티 인크. filed Critical 셀레리티 인크.
Publication of KR20090039784A publication Critical patent/KR20090039784A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
KR1020097003109A 2006-07-17 2007-07-17 고순도 물질을 처리하기 위한 시스템 및 방법 KR20090039784A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83135706P 2006-07-17 2006-07-17
US60/831,357 2006-07-17

Publications (1)

Publication Number Publication Date
KR20090039784A true KR20090039784A (ko) 2009-04-22

Family

ID=38957317

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097003109A KR20090039784A (ko) 2006-07-17 2007-07-17 고순도 물질을 처리하기 위한 시스템 및 방법

Country Status (6)

Country Link
EP (1) EP2046531A2 (zh)
JP (1) JP2009543691A (zh)
KR (1) KR20090039784A (zh)
CN (1) CN101489724A (zh)
TW (1) TW200822960A (zh)
WO (1) WO2008011014A2 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999029505A1 (fr) * 1997-12-08 1999-06-17 Ebara Corporation Distributeur de solution de polissage
CN1713967B (zh) * 2003-06-20 2011-10-19 富士通半导体股份有限公司 药液供给装置
CN1914004B (zh) * 2004-01-26 2010-06-02 Tbw工业有限公司 用于化学机械平面化的多步骤、原位垫修整方法

Also Published As

Publication number Publication date
WO2008011014A2 (en) 2008-01-24
TW200822960A (en) 2008-06-01
EP2046531A2 (en) 2009-04-15
WO2008011014A3 (en) 2008-03-20
CN101489724A (zh) 2009-07-22
JP2009543691A (ja) 2009-12-10

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